浅析砂轮划片机划切工艺

介绍了砂轮划片机的划切原理以及砂轮刀具的构成,并对影响划切品质的因素进行了分析,结合以往实验结果,得到了砂轮划片机的常规划切工艺,既通过优化划切参数和对刀片的选择,达到减小崩裂,提高划切品质的效果。     

晶圆划切工艺与优化

在研究晶圆划片机划切工艺的基础上,分析了划切的质量缺陷和划切质量评估矩阵,阐述了影响划切质量的诸多因素。介绍了划片刀、承载薄膜、划切模式、划切冷却水的添加剂和划切参数的选择对划切质量的影响,通过对以上5个方面的优化来达到优化工艺的目的,同时还提出了将砂轮划片和微水导激光划片相结合的新划切工艺。     

砂轮划片机主轴系统装配精度对划切槽质量的影响

分析砂轮划片机主轴系统的装配精度,使得主轴刀盘面在工作台笛卡尔坐标系中的位置精度以及在安装砂轮刀片后,划切晶圆对划切槽质量造成的影响,如何调整刀盘的精度,降低崩边和裂角,提高划切槽的质量.     

划片机视觉识别系统设计原理分析

自动对准技术是集成电路后封装设备中的一项重要单元技术,是全自动划片机与普通划片机的最大区别之一。国际上主要划片机制造商的全自动设备都配有实时高效的图像识别对准单元。作为提高其设备性能的一种有力手段,长期以来在划片机的研制过程中我们已逐渐形成了适合划片机应用的视觉识别技术,取得了显著的阶段性成果。     

砂轮划片机划切技术的研究

砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。对划切中关键的参数主轴转速、划切速度、基片固定、刀片等进行了系统分析研究,具有指导性地提出了选择该类参数的方法。     

硅片划片加工

<正> 硅片制备后经过一系列半导体工艺,制成规则排列的器件。最后采用划片工艺,将器件切割分离,供线焊封装。划片方法有划裂、激光划片、金刚石划片。古老的划裂法无法得到整齐切缝,致使高速粘片机无法准确取放,并常常伴有裂纹倾向。划裂后还要作第二步裂片,生产率低。激光划片速度很快,但是设备投资、维修费用很高,划片中     

划片机运动性能对划切工艺的影响

通过对砂轮划片机的架构和工作原理研究,分析了X电机速度震动对崩边的影响,Y电机的比例、积分、微分调节对切割位置的影响,阐述了Z轴向电机测高的机理以及对整机的影响。结合工艺划切验证,减小了不良运动特性,减少了设备可能存在的隐患,改善设备的划切效果。     

划片机划切工艺研究

介绍了划片机的划切原理,对划切中影响划切质量的关键因素进行了系统分析研究,并提出指导性的建议。     

HP—602型精密自动划片机误差分析与精度分配

分析划片机各种精度误差对ＩＣ晶片划切质量的影响;分配划片机各功能部件精度。     

HP-602翟精密自动划片机

HP-602型精密自动划片机是半导体后封装中的关键设备，采用磨削原理，把晶片分割成小芯片。该设备涉及到精密机械、电气、计算机、光学、材料学、空气动力学、气动学、自动控制等各学科，是高技术含量的产品，主要应用于IC、分立器件、光电器件、热敏电阻、声表面波器件、传感器件、发光二极管（LED）等行业，对硬脆材料进行划切。     

砂轮划片机显微镜自动聚焦系统的设计与分析

阐述了砂轮划片机显微镜自动聚焦系统的硬件构成和软件设计,在砂轮划片机上开发了一套自动对焦搜索算法,控制CCD、镜头沿光轴移动以实现焦距的自动调节.在软件设计上采用了图像处理手段实现镜头聚焦位置的自动搜索和评价函数对图象清晰度的评价,并在砂轮划片机的现场测试中证明了此种方法的可行性.     

Study on the effects of wafer thinning and dicing on chip strength

Die cracking is an annoying problem in the packaging industry. In this paper, we identified the weak regions, in terms of mechanical strength, in chips in a semiconductor wafer using the three-point bending test. The weak regions were observed in two sectors approximately 45/spl deg/ wide, axisymmetric to the wafer center. The strength of the chips within these weak regions was about 30%-35% lower than the average chip strength of the whole wafer. The existence of these weak regions was related to spiral grinding marks, which, in turn, were formed by backside mechanical grinding. The probability distributions of the chip strength and the chip fragmentary pattern confirmed this relationship. When wafers were mechanically ground until they were 50-/spl mu/m thick, chip warpage was found to be oriented to the direction of the grinding marks. Meanwhile, by slowing the mechanical grinding speed by 50%, we were able to increase the average chip strength by 56%. Either plasma etching or polishing after mechanical grinding eliminated the weak regions, and the optimal amount of mechanical grinding and the polishing depths were observed, beyond which the chip strength would not increase. On the other hand, a preprocess for blunting a new saw blade for chip dicing was found to be essential as the chip strength increased five-fold, whereas increasing the dicing speed or using dual saw instead of a single saw had only small effects on the chip strength degradation.     

划片机空气静压电主轴材料选用及加工工艺研究

从划片机空气静压电主轴的结构出发,分析了主轴的技术要求,提出了主轴材料选用的基本原则,介绍了划片机主轴的常用材料,重点论述了划片机主轴的加工阶段划分、热处理安排和定位基准选择,给出了划片机主轴的加工工艺路线图,并在实践中进行了验证。     

切割机空气静压电主轴径向承载力及刚度的设计

径向承载力及刚度是影响切割机空气静压电主轴高转速下工作稳定性的重要因素,也是切割机空气静压电主轴重要的设计指标。本文采用工程计算方法,对切割机空气静压电主轴径向承载力及刚度进行设计计算。     

300-mm Low-${hbox {k}}$ Wafer Dicing Saw Development

With the further shrinking of IC dimensions, low- material has been widely used to replace the traditional SiO interlayer dielectric (ILD) in order to reduce the interconnect delay. The introduction of low- material into silicon imposed challenges on dicing saw process. ILD and metal layers peeling and its penetration into the sealing ring of the die during dicing saw are the most common defects. In this paper, the low- material structure and its impact on wafer dicing were elaborated. A practical dicing quality inspection matrix was developed to assess the cutting process variation. A 300-mm CMOS90-nm dual damascene low- wafer was chosen as a test vehicle to develop a robust low- dicing saw process. The critical factors (dicing blade, index speed, spindle speed, cut in depth, test pattern in the saw street, etc.) affecting cutting quality were studied and optimized. The selected C90 Dual damascene low- device passed package reliability tests with the optimized low- dicing saw recipe and process. The further improvement and solutions in eliminating the low- dicing saw peeling were also explored.     

全自动划片机的关键技术研究

根据微电子工业的发展现状,论述发展全自动划片机的必要性;从全自动划片机的工作机理出发,分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术;依据分析结果提出相应的解决措施。