Fabrication and electrical properties of a Cu-tetracyanoquinodimethane nanowire array in a porous anodic alumina template

A nanowire array of metal-organic complex copper-tetracyanoquinodimethane (CuTCNQ) was obtained by depositing a layer of copper in the bottom of anodic alumina template channels during a vapor-induced reaction method. SEM observation showed that the channel diameters of anodic alumina membranes prepared under 40?V and 200?V are about 60?nm and 200?nm, respectively, and CuTCNQ nanowire arrays were synthesized in these channels. Nanodevice prototypes with electrical switching characteristics based on a CuTCNQ nanowire array were fabricated, whose reproducible electrical switching and memory effects were observed. The on-off ratio for switching reaches 10(4). The potential applications in information storage devices are also discussed.     

A Strategy to Design High‐Density Nanoscale Devices utilizing Vapor Deposition of Metal Halide Perovskite Materials

The demand for high memory density has increased due to increasing needs of information storage, such as big data processing and the Internet of Things. Organic–inorganic perovskite materials that show nonvolatile resistive switching memory properties have potential applications as the resistive switching layer for next‐generation memory devices, but, for practical applications, these materials should be utilized in high‐density data‐storage devices. Here, nanoscale memory devices are fabricated by sequential vapor deposition of organolead halide perovskite (OHP) CH₃NH₃PbI₃ layers on wafers perforated with 250 nm via‐holes. These devices have bipolar resistive switching properties, and show low‐voltage operation, fast switching speed (200 ns), good endurance, and data‐retention time >10⁵ s. Moreover, the use of sequential vapor deposition is extended to deposit CH₃NH₃PbI₃ as the memory element in a cross‐point array structure. This method to fabricate high‐density memory devices could be used for memory cells that occupy large areas, and to overcome the scaling limit of existing methods; it also presents a way to use OHPs to increase memory storage capacity.     

Unipolar bistable switching of organic non-volatile memory devices with poly(styrene-co-styrenesulfonic acid Na)

We demonstrated unipolar organic bistable memory devices with 8 x 8 cross-bar array type structure. The active material for the organic non-volatile memory devices is poly(styrene-co-styrenesulfonic acid Na) (PSSANa). From the electrical measurements of the PSSANa organic memory devices, we observed rewritable unipolar switching behaviors with a stable endurance and narrow cumulative probability. Also the PSSANa memory devices exhibited a uniform cell-to-cell switching with a high ON/OFF ratio of approximately 10(5) and good retention time of approximately 10(4) seconds without significant degradation.     

Analysis of the Bipolar Resistive Switching Behavior of a Biocompatible Glucose Film for Resistive Random Access Memory

Resistive random access memory (RRAM) devices are fabricated through a simple solution process using glucose, which is a natural biomaterial for the switching layer of RRAM. The fabricated glucose‐based RRAM device shows nonvolatile bipolar resistive switching behavior, with a switching window of 10³. In addition, the endurance and data retention capability of glucose‐based RRAM exhibit stable characteristics up to 100 consecutive cycles and 10⁴ s under constant voltage stress at 0.3 V. The interface between the top electrode and the glucose film is carefully investigated to demonstrate the bipolar switching mechanism of the glucose‐based RRAM device. The glucose based‐RRAM is also evaluated on a polyimide film to verify the possibility of a flexible platform. Additionally, a cross‐bar array structure with a magnesium electrode is prepared on various substrates to assess the degradability and biocompatibility for the implantable bioelectronic devices, which are harmless and nontoxic to the human body. It is expected that this research can provide meaningful insights for developing the future bioelectronic devices.     

Organic nonvolatile memory devices with charge trapping multilayer graphene film

We fabricated an array-type organic nonvolatile memory device with multilayer graphene (MLG) film embedded in polyimide (PI) layers. The memory devices showed a high ON/OFF ratio (over 10(6)) and a long retention time (over 10(4)?s). The switching of the Al/PI/MLG/PI/Al memory devices was due to the presence of the MLG film inserted into the PI layers. The double-log current-voltage characteristics could be explained by the space-charge-limited current conduction based on a charge-trap model. A conductive atomic force microscopy found that the conduction paths in the low-resistance ON state were distributed in a highly localized area, which was associated with a carbon-rich filamentary switching mechanism.     

Single flux-quantum memory cells

Detailed investigations have been carried out on two-junction interferometers. These devices have potential as memory elements. Information is stored as single-flux quanta (SFQ cells) in overlapping vortex modes and is destructively read out by switching from a vortex to the voltage state. The devices are fabricated with a lead alloy and the junction oxide is formed by rf oxidation. Most investigations have been done on devices with an area of about 1000 μm², but storage and reading have also been demonstrated in our smallest interferometers having a size of about 150 μm². Computer studies of cell properties, especially of the vortex transitions, have given good agreement with experiments. It has also been found that the cell behavior is little affected by loads such as would exist in an array environment.     

Resistive switching characteristics of NiO films deposited on top of W or Cu pillar bottom electrodes

This paper demonstrates the feasibility of resistive switching memory elements integrating a nickel oxide film deposited on top of a pillar bottom electrode. The unipolar switching was investigated over a wide temperature range (25 to 125 °C) on samples integrating either W or Cu plugs with diameters ranging from 1 down to 0.18 μm. The switching characteristics and scaling trends of various fabricated memory elements were compared to select the best bottom electrode contact. It was shown that NiO layers deposited on top of W-plugs exhibited the most satisfactory electrical characteristics for future high density memory devices. Their reliability performances in terms of endurance and retention were subsequently studied by using either quasi-static or pulse programming modes. Set operations with short (10 to 20 ns) and low amplitude (around 2 V) voltage pulses were also demonstrated.     

Rectifying switching characteristics of Pt/ZnO/Pt structure based resistive memory

40 nm thick amorphous ZnO thin films were deposited by radio frequency magnetron sputtering at room temperature and asymmetric electrical switching characteristics are observed in the macroscopic symmetric Pt/ZnO/Pt structure. The crystal structure was examined by X-ray diffraction (XRD). The chemical bonding states of ZnO resistive switching layer was investigated by X-ray photoelectron spectroscopy (XPS). Keithley 4200 semiconductor characterization system was used to measure the current-voltage (I-V) characteristics of the fabricated devices. The results reveal that a reversible resistive switching behavior between the high resistance state and the low resistance state with rectifying effects can be repeated for more than 100 dc cycles. This asymmetric electrical behavior is thought to be related to the naturally self-formed PtOx between ZnO film and the Pt bottom electrode, which introduces an energy barrier when electrons flow from top electrode towards the bottom electrode. The model of Pt/ZnO/Pt memory cell is expected to be able to alleviate the misreading error in cross-point array for high density integrations.     

退火温度对TiO2基电阻开关器件性能的影响

采用直流磁控溅射法在n+-Si上制备了TiO2薄膜,采用电子束蒸发镀膜仪在TiO2薄膜上沉积Au电极,获得了Au/TiO2/n+-Si结构的器件.研究了退火温度对薄膜结晶性能及器件电阻开关特性的影响.Au/TiO2/n+-Si结构的器件具有单极性电阻开关特性,置位(set)电压,复位(reset)电压、reset电流及功率的大小随退火温度的不同而不同,并基于灯丝理论对器件的电阻开关效应的工作机理进行了探讨.研究结果表明,500℃退火的器件具有良好的非易失性.器件高低阻态的阻值比大于103,其信息保持特性可达10年之久.在读写次数为100次时,器件仍具有电阻开关效应.     

Low power and stable resistive switching in graphene oxide-based RRAM embedded with ZnO nanoparticles for nonvolatile memory applications

The present study reports the role of zinc oxide nanoparticles (ZnO NPs) embedded in graphene oxide (GO)-based RRAM for non-volatile memory applications. GO thin film embedded with different concentrations of ZnO NPs was deposited on bottom electrode, i.e., indium tin oxide (ITO) coated glass. Thermal evaporation technique was used for the fabrication of top electrodes for electrical measurements. Structural and morphological studies of synthesized GO and ZnO NPs were done by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and Fourier transform infrared spectroscopy (FTIR). Switching characteristics of the RRAM devices were investigated using electrical measurements. It has been observed that the optimized concentration of ZnO NPs (20%) shows stable switching behavior with low SET (??0.61 V) and RESET (+?0.65 V) voltages as compared to pure GO devices. The switching of the fabricated memory devices from high resistance state (HRS) to low resistance state (LRS) has been found due to conductive filament formed between top and bottom electrodes. This conductive filament has been confirmed by the change in resistance as a function of temperature. The Al/GO-ZnO(20%)/ITO devices show stable endurance behavior for >?50 cycles and retention behavior for >?4?×?10³ s. In HRS, the dominated conduction mechanism was found to be space-charge limited conduction (SCLC), whereas in LRS, the Ohmic conduction mechanism was observed. The incorporation of ZnO NPs increased the number of oxygen vacancies in switching layer which eventually enhanced the formation of conductive filament. This phenomenon has been confirmed using XPS characterization of the switching layer. These optimized concentrations of ZnO embedded in GO switching layers provide a way for future low power non-volatile memory devices.

     

Diode-less bilayer oxide (WO(x)-NbO(x)) device for cross-point resistive memory applications

The combination of a threshold switching device and a resistive switching (RS) device was proposed to suppress the undesired sneak current for the integration of bipolar RS cells in a cross-point array type memory. A simulation for this hybrid-type device shows that the matching of key parameters between switch element and memory element is an important issue. Based on the threshold switching oxides, a conceptual structure with a simple metal-oxide?1-oxide?2-metal stack was provided to accommodate the evolution trend. We show that electroformed W-NbO(x)-Pt devices can simultaneously exhibit both threshold switching and memory switching. A qualitative model was suggested to elucidate the unique properties in a W-NbO(x)-Pt stack, where threshold switching is associated with a localized metal-insulator transition in the NbO(x) bulk, and the bipolar RS derives from a redox at the tip of the localized filament at the WO(x)-NbO(x) interface. Such a simple metal-oxide-metal structure, with functionally separated bulk and interface effects, provides a fabrication advantage for future high-density cross-point memory devices.     

Monolayer Graphene Film on ZnO Nanorod Array for High‐Performance Schottky Junction Ultraviolet Photodetectors

A new Schottky junction ultraviolet photodetector (UVPD) is fabricated by coating a free‐standing ZnO nanorod (ZnONR) array with a layer of transparent monolayer graphene (MLG) film. The single‐crystalline [0001]‐oriented ZnONR array has a length of about 8–11 μm, and a diameter of 100～600 nm. Finite element method (FEM) simulation results show that this novel nanostructure array/MLG heterojunction can trap UV photons effectively within the ZnONRs. By studying the I–V characteristics in the temperature range of 80–300 K, the barrier heights of the MLG film/ZnONR array Schottky barrier are estimated at different temperatures. Interestingly, the heterojunction diode with typical rectifying characteristics exhibits a high sensitivity to UV light illumination and a quick response of millisecond rise time/fall times with excellent reproducibility, whereas it is weakly sensitive to visible light irradiation. It is also observed that this UV photodetector (PD) is capable of monitoring a fast switching light with a frequency as high as 2250 Hz. The generality of the above results suggest that this MLG film/ZnONR array Schottky junction UVPD will have potential application in future optoelectronic devices.     

Resistive switching characteristics of Cu/ZnO0.4S0.6/Al devices constructed on plastic substrates

In this study, Cu/ZnO0.4S0.6Al devices are fabricated on plastic substrates using the sputtering method at room temperature. The ratio of O/S in the zinc oxysulfide thin film is confirmed to be 0.4/0.6 from the Auger depth profiling. The Cu/ZnO0.4S0.6/Al devices show unipolar resistive switching behaviors and the ratio of the measured resistance in the low-resistance state (LRS) to that in the high-resistance state (HRS) is above 10(4). The conduction mechanism of the LRS is governed by Ohm's law. On the other hand, in the HRS, the conduction mechanism at low voltages is controlled by Ohm's law, but that at high voltages results from the Poole-Frenkel emission mechanism. The Ohmic and Poole-Frenkel conduction mechanisms observed in the LRS and HRS support the filament model of unipolar resistive switching. The memory characteristics of the Cu/ZnO0.4S0.6/Al devices are retained for 10(4) sec without any change.     

Graphene oxide thin films for flexible nonvolatile memory applications

There has been strong demand for novel nonvolatile memory technology for low-cost, large-area, and low-power flexible electronics applications. Resistive memories based on metal oxide thin films have been extensively studied for application as next-generation nonvolatile memory devices. However, although the metal oxide based resistive memories have several advantages, such as good scalability, low-power consumption, and fast switching speed, their application to large-area flexible substrates has been limited due to their material characteristics and necessity of a high-temperature fabrication process. As a promising nonvolatile memory technology for large-area flexible applications, we present a graphene oxide based memory that can be easily fabricated using a room temperature spin-casting method on flexible substrates and has reliable memory performance in terms of retention and endurance. The microscopic origin of the bipolar resistive switching behavior was elucidated and is attributed to rupture and formation of conducting filaments at the top amorphous interface layer formed between the graphene oxide film and the top Al metal electrode, via high-resolution transmission electron microscopy and in situ X-ray photoemission spectroscopy. This work provides an important step for developing understanding of the fundamental physics of bipolar resistive switching in graphene oxide films, for the application to future flexible electronics.     

Non-volatile memory properties of metal/SrTiO3/SiO2/Si structures

Non-volatile MIOS-type semiconductor memory elements were fabricated on silicon using electron-beam-evaporated SrTiO₃ as the second insulator. The charge storage properties were characterized for Au/SrTiO₃/SiO₂/Si structures. Our results show that a short-time post-deposition oxygen annealing is essential to anneal out the radiation damage resulting from electron beam deposition. The devices on n-type silicon substrates show fast switching for a positive applied pulse and a much lower switching speed (longer than 20 ms) for a negative pulse, which is believed to be caused by the minority carrier restriction. The devices show a logarithmic decay of the flat-band voltage as a function of time, with a rate of 0.4 V decade^-1 for stored electrons and 0.5 V decade^-1 for stored holes. The devices can survive 10⁴ write-erase cycles of endurance testing. An inversion of the surface silicon layer is found for devices on p-type substrates subjected to high temperature oxygen annealing.     

Arrays of ultrasmall metal rings

In this paper, we present a simple method to fabricate ultra-high-density hexagonal arrays of ferromagnetic nanorings having 13?nm outer diameter, 5?nm inner diameter and 5 nm thickness. Cobalt magnetic nanorings were fabricated using a self-assembled diblock copolymer template with an angular evaporation of metal followed by an ion-beam etching. Magnetic measurements and theoretical calculations suggest that, at low fields, only the single domain and vortex states are important for rings of this size. The measured magnetization as a function of applied field shows a hysteresis that is consistent. These ultrasmall ferromagnetic rings have potential use in magnetic memory devices due to the simplicity of the preparation coupled with the ultra-high-density and geometry-controlled switching. This fabrication technique can be extended to other materials for applications in optics, sensing and nanoscale research.     

高均一性二维碲化钼忆阻器阵列及其神经形态计算应用

二维过渡金属硫化合物是构建纳米电子器件的理想材料, 基于该材料体系开发用于信息存储和神经形态计算的忆阻器, 受到了学术界的广泛关注。受制于低成品率和低均一性问题, 二维过渡金属硫化合物忆阻器阵列鲜见报道。本研究采用化学气相沉积得到厘米级二维碲化钼薄膜, 并通过湿法转移和剥离工艺制备得到碲化钼忆阻器件。该碲化钼器件表现出优异的保持性(保持时间>500 s)、快速的阻变(SET时间~60 ns, RESET时间~280 ns)和较好的循环寿命(阻变2000圈后仍可正常工作)。该器件具有高成品率(96%)、低阻变循环间差异性(SET过程为6.6%, RESET过程为5.2%)和低器件间差异性(SET过程为19.9%, RESET过程为15.6%)。本工作成功制备出基于MoTe₂的3×3忆阻器阵列。在此基础上, 将研制的MoTe₂器件用于手写体识别, 实现了91.3%的识别率。最后, 通过对MoTe₂器件高低阻态的电子输运机制进行拟合分析, 揭示了该器件阻变源于类金属导电细丝的通断过程。本项工作表明大尺寸二维过渡金属硫化合物在未来神经形态计算中具有巨大的应用潜力。     

Bipolar Resistive Switching of Single Gold-in-Ga(2)O(3) Nanowire

We have fabricated single nanowire chips on gold-in-Ga(2)O(3) core-shell nanowires using the electron-beam lithography techniques and realized bipolar resistive switching characteristics having invariable set and reset voltages. We attribute the unique property of invariance to the built-in conduction path of gold core. This invariance allows us to fabricate many resistive switching cells with the same operating voltage by simple depositing repetitive metal electrodes along a single nanowire. Other characteristics of these core-shell resistive switching nanowires include comparable driving electric field with other thin film and nanowire devices and a remarkable on/off ratio more than 3 orders of magnitude at a low driving voltage of 2 V. A smaller but still impressive on/off ratio of 10 can be obtained at an even lower bias of 0.2 V. These characteristics of gold-in-Ga(2)O(3) core-shell nanowires make fabrication of future high-density resistive memory devices possible.     

Substantial reduction of critical current for magnetization switching in an exchange-biased spin valve

Great interest in current-induced magnetic excitation and switching in a magnetic nanopillar has been caused by the theoretical predictions of these phenomena. The concept of using a spin-polarized current to switch the magnetization orientation of a magnetic layer provides a possible way to realize future 'current-driven' devices: in such devices, direct switching of the magnetic memory bits would be produced by a local current application, instead of by a magnetic field generated by attached wires. Until now, all the reported work on current-induced magnetization switching has been concentrated on a simple ferromagnet/Cu/ferromagnet trilayer. Here we report the observation of current-induced magnetization switching in exchange-biased spin valves (ESPVs) at room temperature. The ESPVs clearly show current-induced magnetization switching behaviour under a sweeping direct current with a very high density. We show that insertion of a ruthenium layer between an ESPV nanopillar and the top electrode effectively decreases the critical current density from about 10(8) to 10(7) A cm(-2). In a well-designed 'antisymmetric' ESPV structure, this critical current density can be further reduced to 2 x 10(6) A cm(-2). We believe that the substantial reduction of critical current could make it possible for current-induced magnetization switching to be directly applied in spintronic devices, such as magnetic random-access memory.     

High‐Performance Flexible Organic Nano‐Floating Gate Memory Devices Functionalized with Cobalt Ferrite Nanoparticles

Nano‐floating gate memory (NFGM) devices are transistor‐type memory devices that use nanostructured materials as charge trap sites. They have recently attracted a great deal of attention due to their excellent performance, capability for multilevel programming, and suitability as platforms for integrated circuits. Herein, novel NFGM devices have been fabricated using semiconducting cobalt ferrite (CoFe₂O₄) nanoparticles (NPs) as charge trap sites and pentacene as a p‐type semiconductor. Monodisperse CoFe₂O₄ NPs with different diameters have been synthesized by thermal decomposition and embedded in NFGM devices. The particle size effects on the memory performance have been investigated in terms of energy levels and particle–particle interactions. CoFe₂O₄ NP‐based memory devices exhibit a large memory window (≈73.84 V), a high read current on/off ratio (read I_on/I_off) of ≈2.98 × 10³_, and excellent data retention. Fast switching behaviors are observed due to the exceptional charge trapping/release capability of CoFe₂O₄ NPs surrounded by the oleate layer, which acts as an alternative tunneling dielectric layer and simplifies the device fabrication process. Furthermore, the NFGM devices show excellent thermal stability, and flexible memory devices fabricated on plastic substrates exhibit remarkable mechanical and electrical stability. This study demonstrates a viable means of fabricating highly flexible, high‐performance organic memory devices.