Effect of local structural defects on the precipitation of as in the vicinity of InAs quantum dots in a GaAs matrix

Electron-microscopy studies of GaAs structures grown by the method of molecular-beam epitaxy and containing arrays of semiconductor InAs quantum dots and metallic As quantum dots are performed. An array of InAs quantum dots is formed using the Stranski-Krastanow mechanism and consists of five layers of vertically conjugated quantum dots divided by a 5-nm-thick GaAs spacer layer. The array of As quantum dots is formed in an As-enriched GaAs layer grown at a low temperature above an array of InAs quantum dots using postgrowth annealing at temperatures of 400–600°C for 15 min. It is found that, during the course of structure growth near the InAs quantum dots, misfit defects are formed; these defects are represented by 60° or edge dislocations located in the heterointerface plane of the semiconductor quantum dots and penetrating to the surface through a layer of “low-temperature” GaAs. The presence of such structural defects leads to the formation of As quantum dots in the vicinity of the middle of the InAs conjugated quantum dots beyond the layer of “low-temperature” GaAs.     

Electron microscopy of GaAs-based structures with InAs and As quantum dots separated by an AlAs barrier

Electron microscopy studies of GaAs-based structures grown by molecular beam epitaxy and containing arrays of semiconductor InAs quantum dots and metal As quantum dots are performed. The array of InAs quantum dots is formed by the Stranski-Krastanov mechanism and consists of vertically coupled pairs of quantum dots separated by a GaAs spacer 10 nm thick. To separate the arrays of semiconductor and metal quantum dots and to prevent diffusion-induced mixing, the array of InAs quantum dots is overgrown with an AlAs barrier layer 5 or 10 nm thick, after which a GaAs layer is grown at a comparatively low temperature (180°C). The array of As quantum dots is formed in an As-enriched layer of the low-temperature GaAs by means of post-growth annealing at 400–760°C for 15 min. It is established that the AlAs barrier layer has a surface profile corresponding to that of a subbarrier layer with InAs quantum dots. The presence of such a profile causes the formation of V-shaped structural defects upon subsequent overgrowth with the GaAs layer. Besides, it was obtained that AlAs layer is thinned over the InAs quantum dots tops. It is shown that the AlAs barrier layer in the regions between the InAs quantum dots effectively prevents the starting diffusion of excess As at annealing temperatures up to 600°C. However, the concentration of mechanical stresses and the reduced thickness of the AlAs barrier layer near the tops of the InAs quantum dots lead to local barrier breakthroughs and the diffusion of As quantum dots into the region of coupled pairs of InAs quantum dots at higher annealing temperatures.     

Arsenic cluster superlattice in gallium arsenide grown by low-temperature molecular-beam epitaxy

Molecular-beam epitaxy at 200 °C is used to grow an InAs/GaAs superlattice containing 30 InAs delta-layers with a nominal thickness of 1 monolayer, separated by GaAs layers of thickness 30 nm. It is found that the excess arsenic concentration in such a superlattice is 0.9×10²⁰ cm⁻³. Annealing the samples at 500 and 600 °C for 15 min leads to precipitation of the excess arsenic mainly into the InAs delta-layers. As a result, a superlattice of two-dimensional sheets of nanoscale arsenic clusters, which coincides with the superlattice of the InAs delta-layers in the GaAs matrix, is obtained. Fiz. Tekh. Poluprovodn. 32, 1161–1164 (October 1998)     

Formation mechanism of InxGa1−xAs ohmic contacts to n-type GaAs prepared by radio frequency sputtering

The formation mechanisms of InAs/Ni/W ohmic contacts to n-type GaAs prepared by radio-frequency (rf) sputtering were studied by measuring contact resistances (R_c) using a transmission line method and by analyzing the interfacial structure mainly by x-ray diffraction and transmission electron microscopy. Current-voltage characteristics of the InAs/Ni/W contacts after annealing at temperatures above 600°C showed “ohmic-like behavior.” In order to obtain the “ohmic” behavior in the contacts, pre-heating at 300°C prior to high temperature annealing was found to be essential. The contacts showed ohmic behavior after annealing at temperatures in the range of 500∼850°C and contact resistance values of as low as ∼0.3Ω-mm were obtained. By analyzing the interfacial structures of these contacts, In_xGa_1−xAs layers with low density of misfit dislocations at the In_xGa_1−xAs and GaAs interface were observed to grow epitaxially on the GaAs substrate upon heating at high temperatures. This intermediate In_xGa_1−xAs layer is believed to divide the high energy barrier at the contact metal and GaAs interface into two low barriers, resulting in reduction of the contact resistance. In addition, Ni was found to play a key role to relax a strain in the In_xGa_1−xAs layer (introduced due to lattice mismatch between the In_xGa_1−xAs and GaAs) by forming an intermediate Ni_xGaAs layer on the GaAs surface prior to formation of the In_xGa_1−xxAs layer.     

GaAs基上的InAs量子环制备

在分子束外延系统中,利用3nmGaAs薄盖层将InAs自组装量子点部分覆盖,然后在500°C以及As2气氛中退火一分钟,制成纳米尺度的InAs量子环。这一形成敏感地依赖于退火时的生长条件和生长InAs自组装量子点时的淀积量。InAs在GaAs表面的扩散以及同时发生的In-Ga互混控制着InAs量子环的形成。     

Formation of a step-free InAs quantum well selectively grown on a GaAs (111)B substrate

We investigated the possibility of forming a step-free quantum well structure. A step-free InAs monolayer was grown on a selectively grown mesa by controlling surface phases with in-situ monitoring of surface photo-absorption. We selectively grew a GaAs buffer at 800°C and cooled the sample keeping the (2×2)-like As stabilized surface. Atomic force microscopy (AFM) observation demonstrated that fully step-free surfaces were formed on the 8 μm wide mesa. Then, a monolayer-thick InAs was formed on this step-free surface and this InAs layer was capped by GaAs under the (2×2)-like condition. The quantum level of the step-free InAs layer was evaluated by spatially resolved photoluminescence (μPL) measurement. Uniform PL intensity and the lack of a double layer peak indicated the formation of a step-free InAs quantum well, which was in good agreement with AFM observation.     

InAs/GaAs系列量子点研究

为了获得波长长、均匀性好和发光效率高的量子点,采用分子束外延(MBE)技术和S-K应变自组装模式,在GaAs(100)衬底上研究生长了三种InAs量子点。采用MBE配备的RHEED确定了工艺参数:As压维持在1.33×10-5Pa;InAs量子点和In0.2Ga0.8As的生长温度为500℃;565℃生长50nmGaAs覆盖层。生长了垂直耦合量子点(InAs1.8ML/GaAs5nm/InAs1.8ML)、阱内量子点(In0.2Ga0.8As5nm/InAs2.4ML/In0.2Ga0.8As5nm)和柱状岛量子点(InAs分别生长1.9、1.7、1.5ML,停顿20s后,生长间隔层GaAs2nm)。测得对应的室温光致发光(PL)谱峰值波长分别为1.038、1.201、1.087μm,半峰宽为119.6、128.0、72.2nm、相对发光强度为0.034、0.153、0.29。根据PL谱的峰位、半峰宽和相对发光强与量子点波长、均匀性和发光效率的对应关系,可知量子点波长有不同程度的增加、均匀性越来越好、发光效率显著增强。     

Quantum dot structures: Fabrication technology and control of parameters

Quantum dot (QD) semiconductor heterostructures for device applications are currently synthesized using the effect of spontaneous transformation of the growth surface at the initial stage of heteroepitaxy of lattice-mismatched layers. When a certain critical layer thickness is reached, the planar growth surface is transformed into an array of nanoscale islands, as was first demonstrated for an InAs/GaAs system. For various device applications, it is desirable to control the shape and size of individual QDs. This is achieved by variation of the effective thickness of the deposited InAs layer, deposition of several QD layers, the use of various matrix materials and a metamorphic buffer layer, and the addition of a small amount of nitrogen into QDs and the matrix material.     

The interactions between Si/Co films and GaAs(001) substrates

Interfacial reactions of Si/Co films on (001) oriented GaAs substrate, in the temperature range 300–700°C for 30 min, have been investigated using a combination of x-ray diffraction, Auger electron spectroscopy, and transmission electron microscopy. Cobalt starts to react with GaAs and Si at 380°C by formation of Co₂GaAs, and Co₂Si phases, respectively. At 420°C, the entire layer of Co is consumed, and the layer structure is observed with the sequence Si/CoSi/CoGa(CoAs)/Co₂GaAs/GaAs. Contacts produced in this annealing regime are rectifying and the Schottky barrier heights increase from 0.69 eV(as-deposited state) up to 0.81 eV (420°C). In the subsequent reaction, CoSi grows at the expense of the decompositions of CoGa and CoAs at 460°C. In addition, the ternary phase also is decomposed and only the CoSi phase remains upon the GaAs surface at 600°C. Contacts produced at higher temperature regime (>460°C) have low barriers. The interface between CoSi and GaAs is stable up to 700°C. The results of interfacial reactions can be understood from the calculated Si−Co−Ga−As quaternary phase diagram.     

Cathodoluminescence spectroscopy of deep defect levels at the ZnSe/GaAs interface with a composition-control interface layer

In this work we investigate ZnSe/GaAs heterostructures with an additional 2 nm controlled interfacial layer (CIL) of Se- or Zn-rich composition to modify the band offset. The samples are analyzed as a function of annealing temperature by cathodoluminescence spectroscopy. The as-prepared samples show defect luminescence at ∼ 0.9 eV. With staged annealing at increasing temperatures, both the Zn-rich as well as the Se-rich interfacial layer exhibits luminescence at ∼ 1.9 eV, indicative of defect formation with an onset temperature of ∼400°C. Excitation-dependent spectroscopy provides evidence for defect formation near the interface, which extends into the ZnSe epilayer at higher temperatures. Compared to earlier work, where the threshold temperature for defect formation in bulk samples fabricated under Se-rich growth conditions occurs at temperatures as low as 325°C, the resistance to defect formation has now been improved to that of stoichiometric ZnSe. These results demonstrate that epitaxially grown CILs provide a means to alter ZnSe/GaAs band offsets without degrading the heterojunction’s resistance to defect formation at elevated temperatures.     

Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process

A technique for direct wafer bonding of III–V materials utilizing a dry sulfur passivation method is presented. Large-area bonding occurs for GaAs/GaAs and InP/InP at room temperature. Bulk fracture strength is achieved after annealing GaAs/GaAs at 400°C and InP/InP at 300°C for times less than 12 h without large compressive forces. X-ray photoelectron spectroscopy measurements of the treated, bonded, and subsequently delaminated surfaces of GaAs/GaAs confirm that sulfide is present at the interface and that the oxide components show a reduced concentration when compared with samples treated with only an oxide etch solution.     

Characteristics of the formation of (Al, Ga)Sb/InAs heterointerfaces in molecular-beam epitaxy

A thermodynamic model is given for the molecular-beam epitaxy formation of InSb, GaAs, and AlAs heterointerfaces in (Al, Ga)Sb/InAs heterostructures. The maximum critical temperature of formation of a planar InSb-type heterointerface on an (Al, Ga)Sb layer, T≈390 °C, is determined from a comparison of the pressure of Sb₄ molecules in the external flux with their equilibrium value above a stressed monolayer on a heterointerface and is found to be in good agreement with existing experimental data. In contrast, the critical temperature of formation of a heterointerface of the AlAs (GaAs) type, corresponding to the onset of rapid reevaporation of As, is much higher than the growth temperatures normally used in molecular-beam epitaxy (350–550 °C). Fiz. Tekh. Poluprovodn. 31, 1242–1245 (October 1997)     

Terahertz time-domain-spectroscopy system using a 1 micron wavelength laser and photoconductive components made from low-temperature-grown GaAs

A terahertz time-domain spectroscopy (TDS) system based on a femtosecond Yb:KGW laser, photoconductive emitters and detectors made from as-grown and from annealed at moderate temperatures (~400°C) low-temperature-grown GaAs (LTG GaAs) layers was demonstrated. The measured photoconductivity of these layers increased linearly with the optical power, showing that transitions from the defect band to the conduction band are dominant. The largest amplitude THz pulse with a useful signal bandwidth reaching 3 THz and its signal-to-noise ratio exceeding 50 dB was emitted by the device made from the LTG GaAs layer annealed at 420°C temperature. The detector made from this material was by an order of magnitude less sensitive than conventional GaBiAs detectors.     

Long-wavelength emission from single InAs quantum dots layer grown on porous GaAs substrate

In this paper, we present the growth and photoluminescence (PL) results of InAs quantum dots (QDs) on a p-type porous GaAs (001) substrate. It has been shown that critical layer thickness of InAs overgrowth on porous GaAs has been enhanced compared to that deposited on nominal GaAs. Using porous GaAs substrate, growth interruption and depositing 10 atomic monolayer (ML) In_0.4Ga_0.6As on InAs QDs, photoluminescence measured at 10 K exhibits an emission at 0.739 eV (∼1.67 μm) with an ultranarrow full width at half maximum (FWHM) of 16 meV. This emission represents the longer wavelength obtained up to date to our knowledge and has been attributed to the radiative transition in the InAs QDs.     

Novel Cu/Cr/Ge/Pd Ohmic Contacts on Highly Doped n-GaAs

The thermal stability of the Cu/Cr/Ge/Pd/n⁺-GaAs contact structure was evaluated. In this structure, a thin 40 nm layer of chromium was deposited as a diffusion barrier to block copper diffusion into GaAs. After thermal annealing at 350°C, the specific contact resistance of the copper-based ohmic contact Cu/Cr/Ge/Pd was measured to be (5.1 ± 0.6) × 10⁻⁷ Ω cm². Diffusion behaviors of these films at different annealing temperatures were characterized by metal sheet resistance, X-ray diffraction data, Auger electron spectroscopy, and transmission electron microscopy. The Cu/Cr/Ge/Pd contact structure was very stable after 350°C annealing. However, after 400°C annealing, the reaction of copper with the underlying layers started to occur and formed Cu₃Ga, Cu₃As, Cu₉Ga₄, and Ge₃Cu phases due to interfacial instability and copper diffusion.     

Solid-state phase formation between Pd thin films and GaSb

Knowledge of the interaction between a thin metal film and a compound semiconductor can be used to engineer electrical contacts to the semiconductor. In this study, we examine the reaction between a 50 nm layer of Pd and a GaSb substrate annealed at 100–350°C for 10–360 min using transmission electron microscopy (TEM) and x-ray diffraction (XRD). We report on the formation of Pd-rich nanocrystalline and polycrystalline ternary phases at temperatures below 200°C, followed by Pd-Ga and Pd-Sb binary phases above 200°C.     

Microstructural analysis of NiInGe ohmic contacts for n-type GaAs

NiInGe ohmic contact materials, which are attractive to use in future GaAs devices, were previously developed in our laboratories. Although the NiInGe contacts provided low contact resistances of about 0.3 Ω-mm and excellent thermal stability, further reduction of the contact resistance (R_C) of the NiInGe contacts was mandatory to use these contacts in submicron devices. In this paper, the microstructural parameters, which influence the R_C values, were investigated by correlating the R_C values with the microstructure at the interface between the contact materials and the GaAs substrate. The R_C values of the NiInGe contacts were found to depend strongly on the volume fraction and the In concentration (x) of the In_xGa_1−xAs compound semiconductor layers, which were formed at the metal/GaAs interface. Both the volume fraction and the In concentration of the In_xGa_1−xAs layers were found to depend on the thickness of the In layer used in the NiInGe contact and the annealing temperature to form the ohmic contact. A R_C value of 0.18 Ω-mm was obtained for the Ni (18 nm)/In (13 nm)/Ge (30 nm) contact (where a slash “/” indicates the deposition sequence) after annealing at temperature of 650°C for 5 sec.     

Lateral diffusion effects in AuGe based source-drain contacts to AllnAs/InGaAs/InP doped channel MODFETs

We have investigated the formation of source-drain AuGe/Au and Ni/AuGe/Ni/Au alloyed ohmic contacts to AlInAs/InGaAs/InP doped channel MODFETs, and observed lateral diffusion of the contact system after the standard annealing procedure at the temperature range of 185 to 400°C. Auger depth profiling of contacts annealed at 250°C, revealed that Au(Ge) diffused through the top InGaAs and AlInAs layers into the active InGaAs layer, but had reduced penetration into the AlInAs buffer layer. This reduction in diffusion along the depth axis at the AlInAs buffer layer boundary is believed to result in enhanced lateral diffusion and the observed lateral encroachment of the contacts. Both Au and Ni containing contact systems showed similar behavior in terms of lateral diffusion with encroachment extending between 0.25 and 0.5 μm at the periphery of the contacts for annealing temperatures between 300 and 400°C. A controlled ramp-to-peak temperature annealing procedure is developed to suppress such lateral diffusion effects. Low temperature annealing (250°C) using this procedure resulted in equally low contact resistance values (∼0.1Θ-mm) and no lateral diffusion. It is concluded that in thin multilayered structures the modified annealing procedure presented here, is necessary for optimal ohmic contact formation.     

Wavelength controlled InAs/InP quantum dots for telecom laser applications

This article reviews the recent progress in the growth and device applications of InAs/InP quantum dots (QDs) for telecom applications. Wavelength tuning of the metalorganic vapor-phase epitaxy grown single layer and stacked InAs QDs embedded in InGaAsP/InP (1 0 0) over the 1.55-μm region at room temperature (RT) is achieved using ultra-thin GaAs interlayers underneath the QDs. The GaAs interlayers, together with reduced growth temperature and V/III ratio, and extended growth interruption suppress As/P exchange to reduce the QD height in a controlled way. Device quality of the QDs is demonstrated by temperature-dependent photoluminescence (PL) measurements, revealing zero-dimensional carrier confinement and defect-free InAs QDs, and is highlighted by continuous-wave ground-state lasing at RT of narrow ridge-waveguide QD lasers, exhibiting a broad gain spectrum. Unpolarized PL from the cleaved side, important for realization of polarization insensitive semiconductor optical amplifiers, is obtained from closely stacked QDs due to vertical electronic coupling.     

Photoluminescence up to 1.6 μm of quantum dots with an increased effective thickness of the InAs layer

Multilayered InAs/GaAs quantum dot (QD) heterostructures are produced by metal-organic gas phase epitaxy. The structures exhibit photoluminescence around 1.55 μm at 300 K. The specific feature of the technology is the growth of an InAs layer with an increased effective thickness d _eff to form QDs, in combination with low-temperature overgrowth of the QDs with a thin (6-nm) GaAs layer and with the annelaing of defects. By X-ray diffraction analysis and PL studies, it is shown that, in a structure with the increased thickness d _eff, a secondary wetting InGaAs layer is produced on top of the QD layer from the growing relaxed large-sized InAs clusters on annealing. A new mechanism of formation of large-sized QDs characterized by a large “aspect ratio” is suggested. The mechanism involves the 2D–3D transformation of the secondary InGaAs layer in the field of elastic strains in previously formed QDs. The specific feature of the array of QDs is the coexistence of three populations of different-sized QDs responsible for the multimode photoluminescence in the range from 1 to 1.6 μm. The potentialities of such structures for infrared photoelectric detectors operating in the range from 1–2.5 μm at room temperature are analyzed.