体硅热膜传感器单片集成工艺的研究

针对MEMS热膜式传感器的发展趋势和在实用化过程中存在的问题,提出了一种新型的单片电路和体硅MEMS热膜式传感器实现集成制造的嵌入式CMOS工艺技术,解决了MEMS制造工艺和CMOS集成电路工艺之间存在的兼容性问题。通过这种嵌入式CMOS工艺技术,可以实现具备最小体积、最低成本的MEMS器件。通过这种嵌入式热膜式传感器和CMOS处理电路的单片集成制造工艺,实现了一款热膜式传感器和IC放大电路的集成部件,并完成了相关基本电性能测试和传感器功能的演示验证,证明了设计的工艺路线的可行性。     

智能传感器技术发展综述

从智能传感器的概念和架构出发,研究了MEMS、CMOS、光谱学等主流技术智能传感器的基本发展情况。探讨了智能传感器的实现途径。列举了军用智能传感器的重点应用领域和技术。结合国内实际情况,提出关于智能传感器的发展建议。     

Micromachined thermally based CMOS microsensors

An integrated circuit (IC) approach to thermal microsensors is presented. The focus is on thermal sensors with on-chip bias and signal conditioning circuits made by industrial complementary metal-oxide-semiconductor (CMOS) IC technology in combination with post-CMOS micromachining or deposition techniques. CMOS materials and physical effects pertinent to thermal sensors are summarized together with basic structures used for microheaters, thermistors, thermocouples, thermal isolation, and heat sinks. As examples of sensors using temperature measurement, we present micromachined CMOS radiation sensors and thermal converters. Examples for sensors based on thermal actuation include thermal flow and pressure sensors, as well as thermally excited microresonators for position and chemical sensing. We also address sensors for the characterization of process-dependent thermal properties of CMOS materials, such as thermal conductivity, Seebeck coefficient, and heat capacity, whose knowledge is indispensable for thermal sensor design. Last, two complete packaged microsystems-a thermoelectric air-flow sensor and a thermoelectric infrared intrusion detector-are reported as demonstrators     

CMOS MEMS技术的现状及展望

简要介绍了MEMS的发展状况及CMOS工艺在MEMS中的地位。主要介绍了pre-CMOS，intermediate-CMOS和post-CMOS三种不同的CMOS MEMS工艺。详细讨论了CMOS MEMS今后将面临的挑战及其未来应用领域，最后，根据国内情况对我国CMOS MEMS的发展提出了建议。     

MEMS热膜式微型流量传感器的研制

针对微型流量传感器的应用问题,提出了一种可以准确测量各种气体微型流量、基于MEMS工艺的新型MEMS热膜式传感器。基于热量传递原理的热膜式流量传感器由一个加热器和一对微型温度传感器组成,只要测得两个温度传感器的温度差值,就能得到气体的流量。分析了该器件的原理并进行了ANSYS仿真,设计了器件的结构,进行MEMS工艺开发,制作出可实用化的产品。测试表明,该器件的测量量程达到0.5～200m3/h,精度1.5级,响应时间20ms,量程比1:400,显示该器件测量流量的功能达到了实用化水平。     

Highly Adaptive Transducer Interface Circuit for Multiparameter Microsystems

A reconfigurable transducer interface circuit that combines the communication and signal conditioning necessary to link a variety of sensors and actuators to a microsystem controller is reported. The adaptive readout circuitry supports high-resolution signal acquisition from capacitive, resistive, voltage and current mode sensors with programmable control of gain and offset to match sensor range and sensitivity. The chip accommodates sensor self test and self calibration and supports several power management schemes. It provides digital and analog outputs to control actuators and a standard interface to peripheral components. The 2.2times2.2 mm CMOS chip was fabricated in 0.5-mum, 3-metal, 2-poly process, dissipates ~50 muW at 3.3 V in a typical multisensor application utilizing periodic sleep mode, and can read out a wide range of sensors with high sensitivity. A prototype microsystem with a microcontroller and MEMS pressure, humidity, and temperature sensors has been implemented to characterize interface chip performance     

MEMS湿度传感器信号采集与数字化处理研究

MEMS（微电子机械系统）湿度传感器是利用标准的CMOS技术加上MEMS的后处理技术制造,以其体积小、响应快等优点受到越来越多的重视,介绍了本实验室研制的MEMS压阻式湿度传感器的测试原理、硬件电路的设计和传输函数模型的建立,以及软件设计和封装设计,最后给出了样机的测试结果。     

Evaluation of MUMPS polysilicon structures for thermal flow sensors

The air flow measurement has been studied for its application in many fields. Among flow sensors, those operated under a thermal principle have occupied an important position. The application of micro-electro mechanical systems (MEMS) technologies for designing such devices will allow reducing its size, response time and to increase the sensitivity.In the community of MEMS’ designers it is well established a multi-user service for prototyping named multi-user MEMS processes (MUMPS). It is a general purpose surface micromachining process which employs polysilicon as structural material and silicon oxide as sacrificial layer. There are no reported, to the best of our knowledge, flow sensors developed using this technology.In this work the linear and quadratic temperature coefficients of polysilicon resistors are experimentally determined in anchored, suspended and stacked microstructures fabricated with this process to study their suitability for flow and temperature sensors. The thermal resistance of the three structures is also calculated, determining that suspended plates characteristics indicate their suitability for constant temperature anemometers.     

$G$-Band Distributed Microelectromechanical Components Based on CMOS Compatible Fabrication

Microelectromechanical systems (MEMS) technology has been used for realizing G-band (140-220 GHz) distributed MEMS transmission line components. Novel dielectric-less MEMS components, as well as switched MEMS capacitors, have been fabricated with CMOS compatible surface micromachining, and experimental results are presented up to 220 GHz.     

MEMS传感器现状及应用

MEMS传感器种类繁多,发展迅猛,应用广泛。首先,简单介绍了MEMS传感器的分类和典型应用。其次,对MEMS压力传感器、加速度计和陀螺仪三种最典型的MEMS传感器进行了详细阐述,包括类别、技术现状和性能指标、最新研究进展、产品,及应用情况。介绍MEMS压力传感器时,给出了国内外采用新型材料制作用于极端环境下压力传感器的研究情况。最后,从新材料、加工和组装技术方面对MEMS传感器的发展趋势进行了展望。     

Marvelous MEMS

Microelectromechanical systems (MEMS) are a foundation for a broad range of mechanical, chemical, optical, and biotech products (sensors, microstructures and actuators) fabricated as integrated circuits on (primarily) silicon wafers in a batch mode. Commercial MEMS products include pressure sensors, acceleration sensors, gyros, ink-jet nozzles, read-write head positioners in hard drives, and digital light processors (DLPs) in projectors and television sets. The first four decades of MEMS development created a US$8 billion market. During the next decade, the MEMS market is estimated to increase by US$32 billion. Based on the presented overview of emerging MEMS sensors and microstructures, such a magnitude of growth is definitely possible.     

MEMS惯性传感器可靠性试验方法研究

MEMS惯性传感器在军事与商业应用中的一个主要问题便是可靠性试验方法尚未标准化,因而目前绝大多数MEMS惯性传感器器件的可靠性试验依据的是傲电子的试验标准。但是,这些标准对于这类器件的适用性却受到许多机构的质疑,国外关于该问题的研究也已起步。汇总了MEMS惯性传感器器件的结构和工作原理等信息,重点总结了该类器件的典型环境失效机理,并将典型的环境载荷情况与失效机理进行了对比分析：从现有的微电子可靠性试验标准中选取了针对不同环境失效机理的试验方法。并对其适用性问题进行了讨论。     

MEMS封装技术及设备

概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。     

应用于流动控制的MEMS传感器和执行器

出现于20世纪80年代后期的微机械技术可以制作出微米尺度的传感器和执行器。这些微器件与信号调节和处理电路集成后,组成了可执行分布式实时控制的微电子机械系统(MEMS)。这种性能为流动控制研究开辟了一个崭新的研究领域。利用MEMS技术设计和制作了一种传感器和一种执行器。实验证明,采用体硅腐蚀的工艺制作微流体器件是可行的,同时可以避免牺牲层腐蚀和释放的复杂工艺。     

Electrically Enhanced Readout System for a High‐Frequency CMOS‐MEMS Resonator

The design of a CMOS clamped‐clamped beam resonator along with a full custom integrated differential amplifier, monolithically fabricated with a commercial 0.35 μm CMOS technology, is presented. The implemented amplifier, which minimizes the negative effect of the parasitic capacitance, enhances the electrical MEMS characterization, obtaining a 48 × 10⁸ resonant frequency‐quality factor product (Q×f_res) in air conditions, which is quite competitive in comparison with existing CMOS‐MEMS resonators.     

A low-power low-phase-noise LC VCO with MEMS Cu inductors

A 2-3 GHz CMOS inductance-capacitance (LC) voltage-controlled oscillator (VCO) integrated with high-Q micro-electromechanical systems (MEMS) Cu inductors is reported. While dissipating only 6.3 mW, a phase noise of -121 dBc/Hz at 600 kHz offset from 2.78 GHz carrier is achieved. This MEMS VCO has the largest power-frequency normalized figure-of-merit (12.5 dB) among the Si bipolar and CMOS LC VCOs.     

CMOS与CCD性能及高清应用比较

互补金属氧化物半导体（CMOS）与电荷耦合器件（CCD）是目前主流的图像传感器件。CMOS与CCD图像传感器的研究几乎同时起步,但是CMOS的应用有相当一段时期落后于CCD。近些年,各个级别质量的图像采集领域,都有COMS图像传感器的应用。从CMOS和CCD图像传感器采用的技术手段和性能表现两大方面做了较为全面的比较和分析,给出了较为详细的对比参数表,并介绍了CMOS和CCD传感器在高清摄像方面的高端应用。     

激光对CCD及CMOS图像传感器的损伤阈值研究

针对激光对CCD及CMOS图像传感器的干扰损伤进行了理论分析和实验研究.实验测量出常压及真空条件下1064nm激光对CCD及CMOS图像传感器的干扰阈值、损伤阈值及完全损坏阈值.实验结果表明,CCD或CMOS图像传感器的各种阈值在常压和真空两种不同条件下的差别不明显.实验结果还显示,无论在常压还是在真空条件下,CCD比CMOS更容易受到激光的干扰和损伤甚至严重损坏;而CMOS相机具有很好的抗干扰和抗损伤能力.     

A 0.3-mW/Ch 1.25 V Piezo-Resistance Digital ROIC for Liquid-Dispensing MEMS

A low-power multichannel CMOS digital read-out IC (ROIC) for differential piezo-resistive sensing is presented as part of the positioning system of a liquid dispensing MEMS. New very low-voltage and single-battery compatible CMOS circuits are proposed for digital gain tuning, pre-amplification, and integrating A/D conversion. Overall low-power consumption is achieved by operating the key devices in subthreshold in order to prevent from heating the fluidic MEMS. A complete quad-channel ROIC has been integrated in 0.35- $mu{hbox {m}}$ CMOS 2-polySi 4-metal technology. The reported experimental results agree with the electrical simulations.      

MEMS传感器技术产业与我国发展路径研究

随着全球跨入万物互联时代,传感器产业迎来爆发式增长。MEMS传感器因其体积小、灵敏度高、可靠性强的优势逐渐占据主流。当前,我国在MEMS传感器设计、制造、封装、测试等关键产业链环节均取得了长足的进步,但与国际先进水平相比,仍存在诸多差距与短板。根据当前产业发展现状,建议我国在关键技术攻关、产业协同发展以及加大政策支持等方面发力,进一步带动我国MEMS传感器产业全面提升。