Fracture strength of polysilicon at stress concentrations

Mechanical design of MEMS requires the ability to predict the strength of load-carrying components with stress concentrations. The majority of these microdevices are made of brittle materials such as polysilicon, which exhibit higher fracture strengths when smaller volumes or areas are involved. A review of the literature shows that the fracture strength of polysilicon increases as tensile specimens get smaller. Very limited results show that fracture strengths at stress concentrations are larger. This paper examines the capability of Weibull statistics to predict such localized strengths and proposes a methodology for design. Fracture loads were measured for three shapes of polysilicon tensile specimens - with uniform cross-section, with a central hole, and with symmetric double notches. All specimens were 3.5 /spl mu/m thick with gross widths of either 20 or 50 /spl mu/m. A total of 226 measurements were made to generate statistically significant information. Local stresses were computed at the stress concentrations, and the fracture strengths there were approximately 90% larger than would be predicted if there were no size effect (2600 MPa versus 1400 MPa). Predictions based on mean values are inadequate, but Weibull statistics are quite successful. One can predict the fracture strength of the four shapes with stress concentrations to within /spl plusmn/10% from the fracture strengths of the smooth uniaxial specimens. The specimens and test methods are described and the Weibull approach is reviewed and summarized. The CARES/Life probabilistic reliability program developed by NASA and a finite element analysis of the stress concentrations are required for complete analysis. Incorporating all this into a design methodology shows that one can take "baseline" material properties from uniaxial tensile tests and predict the overall strength of complicated components. This is commensurate with traditional mechanical design, but with the addition of Weibull statistics.     

Wafer-level mechanical characterization of silicon nitride MEMS

The mechanical and physical properties of silicon nitride thin films have been characterized, particularly for their application in load-bearing MEMS applications. Both stoichiometric (high-stress) and silicon-rich (low-stress) films deposited by LPCVD have been studied. Young's modulus, E, has been determined using conventional lateral resonators and by bulge testing of membranes, and tensile strength has been determined using a specially designed microtensile specimen. All microdevices have been fabricated using standard micromachining. We have also measured the thermal expansion coefficient of stoichiometric silicon nitride. Our best estimate of E is 325/spl plusmn/30 GPa for stoichiometric and 295/spl plusmn/30 GPa for silicon-rich silicon nitride. The average tensile strength for the stoichiometric material is 6.4/spl plusmn/0.6 GPa, while that for the silicon-rich material is 5.5/spl plusmn/0.8 GPa; the burst strength of membranes of the stoichiometric material is 7.1/spl plusmn/0.2 GPa.     

Two-axis single-crystal silicon micromirror arrays

This work presents the design, fabrication, and testing of a two-axis 320 pixel micromirror array. The mirror platform is constructed entirely of single-crystal silicon (SCS) minimizing residual and thermal stresses. The 14-/spl mu/m-thick rectangular (750/spl times/800 /spl mu/m/sup 2/) silicon platform is coated with a 0.1-/spl mu/m-thick metallic (Au) reflector. The mirrors are actuated electrostatically with shaped parallel plate electrodes with 86 /spl mu/m gaps. Large area 320-mirror arrays with fabrication yields of 90% per array have been fabricated using a combination of bulk micromachining of SOI wafers, anodic bonding, deep reactive ion etching, and surface micromachining. Several type of micromirror devices have been fabricated with rectangular and triangular electrodes. Triangular electrode devices displayed stable operation within a (/spl plusmn/5/spl deg/, /spl plusmn/5/spl deg/) (mechanical) angular range with voltage drives as low as 60 V.     

Mechanical characterization and design of flexible silicon microstructures

A variety of different silicon structures has been fabricated and characterized mechanically to optimize the design of silicon ribbon cables used in neural probes and multichip packaging structures. Boron-doped 3-/spl mu/m-thick silicon beams were tested in three modes: bending in plane, twisting (along beam axis), and pushing. Various cable configurations were investigated (straight beams, curved beams, meandered beams, etc.) as well the effects of length, width, cable termination, and the presence of reinforcing spans between multistranded cables. The results along with finite element modeling indicated that many simple modifications could be made to increase the strength and flexibility of silicon ribbon cables. One structure, a meandered beam 200-/spl mu/m wide and 2-mm long could be twisted up to 712/spl deg/. It also was seen that structures having multiple 20-/spl mu/m-wide beams were generally more robust than those with a single 500-/spl mu/m-wide beam. Finally, a method for easy determination of the bending fracture strain is analyzed and verified. It was seen that the silicon structures tested broke after a strain slightly above 2%.     

Fracture Properties of Silicon Carbide Thin Films by Bulge Test of Long Rectangular Membrane

This paper reports the mechanical properties and fracture behavior of silicon carbide (3C-SiC) thin films grown on silicon substrates. Using bulge testing combined with a refined load-deflection model of long rectangular membranes, which takes into account the bending stiffness and prestress of the membrane material, the Young's modulus, prestress, and fracture strength for the 3C-SiC thin films with thicknesses of 0.40 and 1.42 mum were extracted. The stress distribution in the membranes under a load was calculated analytically. The prestresses for the two films were 322 plusmn 47 and 201 plusmn 34 MPa, respectively. The thinner 3C-SiC film with a strong (111) orientation has a plane-gstrain moduli of 415 plusmn 61 GPa, whereas the thicker film with a mixture of both (111) and (110) orientations exhibited a plane-strain moduli of 329 plusmn 49 GPa. The corresponding fracture strengths for the two kinds of SiC films were 6.49 plusmn 0.88 and 3.16 plusmn 0.38 GPa, respectively. The reference stresses were computed by integrating the local stress of the membrane at the fracture over edge, surface, and volume of the specimens and were fitted with Weibull distribution function. For the 0.40-mum-thick membranes, the surface integration has a better agreement between the data and the model, implying that the surface flaws are the dominant fracture origin. For the 1.42-mum-thick membranes, the surface integration presented only a slightly better fitting quality than the other two, and therefore, it is difficult to rule out unambiguously the effects of the volume and edge flaws. [2007-0191].     

Arrays of hollow out-of-plane microneedles for drug delivery

Drug delivery based on MEMS technology requires an invasive interface such as microneedles, which connects the microsystem with the biological environment. Two-dimensional arrays of rigid hollow microneedles have been fabricated from single-crystal silicon using a combination of deep reactive ion etching and isotropic etching techniques. The fabricated needles are typically 200 /spl mu/m long with a wide base and a channel diameter of 40 /spl mu/m. The fabrication process allows creating either blunt needles or needles with sharp tips. Their shape and size make these needles extremely suitable for minimally invasive painless epidermal drug delivery. MEMS technology allows for batch fabrication and integration with complex microsystems. Fluid has been successfully injected 100 /spl mu/m deep into sample tissue through arrays of microneedles. Needle breakage did not occur during this procedure. Experiments have shown that the modified Bernoulli equation is a good model for liquid flowing through the narrow microneedle lumen.     

Development of AFM tensile test technique for evaluating mechanical properties of sub-micron thick DLC films

This paper describes mechanical properties of submicron thick diamond-like carbon (DLC) films used for surface modification in MEMS devices. A new compact tensile tester operating under an atomic force microscope (AFM) is developed to measure Young's modulus, Poisson's ratio and fracture strength of single crystal silicon (SCS) and DLC coated SCS (DLC/SCS) specimens. DLC films with a thickness ranging from 0.11 /spl mu/m to 0.58 /spl mu/m are deposited on 19-/spl mu/m-thick SCS substrate by plasma-enhanced chemical vapor deposition using a hot cathode penning ionization gauge discharge. Young's moduli of the DLC films deposited at bias voltages of -100 V and -300 V are found to be constant at 102 GPa and 121 GPa, respectively, regardless of film thickness. Poisson's ratio of DLC film is also independent of film thickness, whereas fracture strength of DLC/SCS specimens is inversely proportional to thickness. Raman spectroscopy analyses are performed to examine the effect of hydrogen content in DLC films on elastic properties. Raman spectra reveal that a reduction in hydrogen content in the films leads to better elastic properties. Finally, the proposed evaluation techniques are shown to be applicable to sub-micron thick DLC films by finite element analyses.     

The MEMSNAS process: microloading effect for micromachining 3-D structures of nearly all shapes

We propose a technological process for microfabrication of three-dimensional (3-D) structures with nearly all shapes. This is a one-mask process that uses equipment, widespread in the microelectronics laboratories and industry. The main idea is to take advantage from the microloading effect of reactive ion etching (RIE) in order to obtain multiple levels of heights in an array of microholes of different diameters. A 3-D profile results from an overlap of the neighboring microholes due to the isotropic nature of the etching. The final continuous and smooth 3-D structure is obtained after removal of the mask material and a second isotropic RIE step. This fabrication process was validated with the realization of various 3-D structures including microlenses, etched in a 30 /spl mu/m deep cavity, with 375 /spl mu/m in radius and 10 /spl mu/m in height (sag). The resulting structures have shown a roughness down to 25 nm. A quantitative experimental study led to the calibration of three different processes and to an empirical theoretical model, which can serve as a basis of design rules for further fabrication of 3-D microstructures.     

Xurography: rapid prototyping of microstructures using a cutting plotter

This paper introduces xurography, or "razor writing," as a novel rapid prototyping technique for creating microstructures in various films. This technique uses a cutting plotter traditionally used in the sign industry for cutting graphics in adhesive vinyl films. A cutting plotter with an addressable resolution of 10 /spl mu/m was used to cut microstructures in various films with thicknesses ranging from 25 to 1000 /spl mu/m. Positive features down to 35 /spl mu/m and negative features down to 18 /spl mu/m were cut in a 25 /spl mu/m thick material. Higher aspect ratios of 5.2 for positive features and 8 for negative features were possible in a 360 /spl mu/m thick material. A simple model correlating material properties to minimum feature size is introduced. Multilayered microstructures cut from pressure sensitive and thermal activated adhesive films were laminated in less than 30 min without photolithographic processes or chemicals. Potential applications of these microstructures are explored including: shadow masking, electroplating, micromolds for PDMS, and multilayered three-dimensional (3-D) channels. This inexpensive method can rapidly prototype microfluidic devices or tertiary fluid connections for higher resolution devices. [1488].     

Characterizing fruit fly flight behavior using a microforce sensor with a new comb-drive configuration

This paper reports a MEMS microforce sensor with a novel configuration of bulk micromachined differential triplate comb drives that overcomes the difficulty of electrically isolating the two stationary capacitor comb sets in bulk micromachining. A high-yield fabrication process using deep-reactive ion etching (DRIE) on silicon-on-insulator (SOI) wafers and only three lithographic masks was utilized to construct the high aspect ratio devices. The process features dry release of both suspended structures and the entire device in order to protect fragile components. The sensor has a high sensitivity (1.35 mV//spl mu/N), good linearity (<4%), and a large bandwidth (7.8 kHz), and is therefore well suited for characterizing flight behavior of fruit flies (Drosophila melanogaster). The technique allows for the instantaneous measurement of flight forces, which result from a combination of aerodynamic forces and inertial forces generated by the wings, and demonstrates a novel experimental paradigm for exploring flight biomechanics in the fruit fly. The average lift force is determined to be 9.3 /spl mu/N (/spl plusmn/2.3 /spl mu/N), which is in the range of typical body weights of fruit flies. The potential impact of this research extends beyond gathering flight data on Drosophila melanogaster by demonstrating how MEMS technology can be used to provide valuable tools for biomechanical investigations.     

High-performance surface-micromachined inchworm actuator

This work demonstrates a polycrystalline silicon surface-micromachined inchworm actuator that exhibits high-performance characteristics such as large force (/spl plusmn/0.5 millinewtons), large velocity range (0 to /spl plusmn/4.4 mm/sec), large displacement range (/spl plusmn/100 microns), small step size (/spl plusmn/10, /spl plusmn/40 or /spl plusmn/100 nanometers), low power consumption (nanojoules per cycle), continuous bidirectional operation and relatively small area (600 /spl times/ 200/spl mu/m/sup 2/). An in situ load spring calibrated on a logarithmic scale from micronewtons to millinewtons, optical microscopy and Michelson interferometry are used to characterize its performance. The actuator consists of a force-amplifying plate that spans two voltage-controlled clamps, and walking is achieved by appropriately sequencing signals to these three components. In the clamps, normal force is borne by equipotential rubbing counterfaces, enabling friction to be measured against load. Using different monolayer coatings, we show that the static coefficient of friction can be changed from 0.14 to 1.04, and that it is load-independent over a broad range. We further find that the static coefficient of friction does not accurately predict the force generated by the actuator and attribute this to nanometer-scale presliding tangential deflections.     

Precision poly-(dimethyl siloxane) masking technology for high-resolution powder blasting

Powder blasting micro-erosion is a fast and flexible technique for the micropatterning of brittle materials. We have combined 10 /spl mu/m diameter Al/sub 2/O/sub 3/ eroding particles with a new masking technique to realize the smallest possible structures with the powder blasting process (30 /spl mu/m). Our masking technology is based on the sequential combination of two polymers: 1) the brittle epoxy resin SU8 for its photosensitivity and 2) the elastic and thermo-curable poly-(dimethyl siloxane) (PDMS) for its large erosion resistance. We have micropatterned glass microstructures with aspect ratio 1 and structural details down to 20 /spl mu/m. We compare the mask size-dependent etching rate using both 1.0 and 30 jam diameter Al/sub 2/O/sub 3/ particles and find a decreasing etching rate for structures that are smaller than about 10 times the particle size. Combining SU8 with PDMS proves to be a very easy and accurate masking technology that allows exploring the fundamental dimensional limits of the powder blasting micro-erosion process.     

Effect of specimen size on Young's modulus and fracture strength ofpolysilicon

The microstructure of polysilicon specimens of varying size was examined and tensile tests were conducted to determine if the measured modulus and strength depend on the size of the specimen. All specimens were from the same MUMP's 25 run at MCNC, and the thicknesses were 1.5, 2.0, and 3.5 μm. Microstructure was examined in specimens as narrow as 2 μm and ranging up to 20 μm in width. The tensile specimens tested were 6, 20, or 600 μm wide and 250, 1000, or 4000 μm long. Nothing in the transmission electron microscopy (TEM) observations indicates any effect of specimen size on the microstructure; the columnar grains are fine (0.2-0.5 μm) and uniformly distributed. The widths of all specimens were found to differ from the specified mask values, and a more pronounced variation was measured for the smaller specimens. Three different approaches are used to measure Young's modulus, and they all give a value of 158±10 GPa with no evidence of substantial effects of specimen size. However, the strength does increase somewhat as the total surface area of the test section decreases-from 1.21 GPa±0.08 GPa to 1.65±0.28 GPa-reflecting the fact that the larger specimens have more surface flaws. Test techniques and procedures are briefly presented along with detailed analyses of the results     

Surface tension driven formation of microstructures

The controlled formation of curved, three-dimensional (3-D) microstructures can be accomplished through solidification from a liquid phase. As a demonstration, we have placed objects in contact with the interface of a photopolymerizable liquid and air to create various liquid menisci that were subsequently solidified with ultraviolet radiation. Geometric control is achieved through variation of physical and environmental parameters; for example, solidified menisci formed at 25/spl deg/C were 300 /spl mu/m taller than those formed at 7/spl deg/C. Comparisons between the polymerized structures and theoretical predictions for liquid menisci indicate that the polymerization process results in repeatable changes in contact angle and meniscus size.     

Robust design and model validation of nonlinear compliant micromechanisms

Although the use of compliance or elastic flexibility in microelectromechanical systems (MEMS) helps eliminate friction, wear, and backlash, compliant MEMS are known to be sensitive to variations in material properties and feature geometry, resulting in large uncertainties in performance. This paper proposes an approach for design stage uncertainty analysis, model validation, and robust optimization of nonlinear MEMS to account for critical process uncertainties including residual stress, layer thicknesses, edge bias, and material stiffness. A fully compliant bistable micromechanism (FCBM) is used as an example, demonstrating that the approach can be used to handle complex devices involving nonlinear finite element models. The general shape of the force-displacement curve is validated by comparing the uncertainty predictions to measurements obtained from in situ force gauges. A robust design is presented, where simulations show that the estimated force variation at the point of interest may be reduced from /spl plusmn/47 /spl mu/N to /spl plusmn/3 /spl mu/N. The reduced sensitivity to process variations is experimentally validated by measuring the second stable position at multiple locations on a wafer.     

Polymer-based wide-bandwidth and high-sensitivity micromachined electron tunneling accelerometers using hot embossing

The first PMMA-based membrane tunneling accelerometers were fabricated by hot embossing replication with silicon molds. The silicon molds were prepared by a combinative etching technique involving anisotropic bulk etching and modified plasma dry etching. The constructed molds hold both pyramid pits and positive profile sidewalls with smooth surfaces and steep angles, which were necessary for the hot embossing demolding. After electrodes patterned on embossed PMMA structures, the accelerometers, 8 mm /spl times/8 mm /spl times/1 mm, were packaged and assembled on a measurement circuit board. The exponential relationship between tip currents and applied deflection voltages presented a tunneling barrier height of 0.17 eV. The natural frequency of sensors was about 128 Hz. The bandwidth of the feedback system was 6.3 kHz. The sensitivity of voltage over acceleration was 20.6 V/g, and the resolution was 0.2485 /spl mu/g//spl radic/Hz (g=9.8 m/s/sup 2/).     

Multiple-stage microfabricated preconcentrator-focuser for micro gas chromatography system

The design, fabrication, and characterization of a multiple-stage Si microfabricated preconcentrator-focuser (/spl mu/PCF) for a micro gas chromatography (/spl mu/GC) system that can provide real-time quantification and identification of complex organic vapor mixtures are presented. The /spl mu/PCF consists of a Si microheater loaded with Carbopack B, Carbopack X, and Carboxen 1000 carbon adsorbent granules, and a Si micromachined cover plate. Deep reactive ion etching is utilized to produce mechanically robust fluidic interconnection adapters hermetically sealed to fused silica capillary tubing for connection to the other components in the /spl mu/GC. This three-stage device is designed to capture compounds spanning up to 4 orders of magnitude in volatility. The dead volume, thermal mass, heating efficiency, and pressure drop of the three-stage /spl mu/PCF are improved significantly over its single-stage /spl mu/PCF predecessor. We demonstrate the successful capture, desorption, and high-resolution chromatographic separation of a mixture of 30 common organic vapors using our three-stage /spl mu/PCF in a conventional GC system. The peak width at half height is <2.05 s for all compounds after elution from the GC column.     

Polymer-based cantilevers with integrated electrodes

An innovative release method of polymer cantilevers with embedded integrated metal electrodes is presented. The fabrication is based on the lithographic patterning of the electrode layout on a wafer surface, covered by two layers of SU-8 polymer: a 10-/spl mu/m-thick photo-structured layer for the cantilever, and a 200-/spl mu/m-thick layer for the chip body. The releasing method is based on dry etching of a 2-/spl mu/m-thick sacrificial polysilicon layer. Devices with complex electrode layout embedded in free-standing 500-/spl mu/m-long and 100-/spl mu/m-wide SU-8 cantilever were fabricated and tested. We have optimized major fabrication steps such as the optimization of the SU-8 chip geometry for reduced residual stress and for enhanced underetching, and by defining multiple metal layers [titanium (Ti), aluminum (Al), bismuth (Bi)] for improved adhesion between metallic electrodes and polymer. The process was validated for a miniature 2/spl times/2 /spl mu/m/sup 2/ Hall-sensor integrated at the apex of a polymer microcantilever for scanning magnetic field sensing. The cantilever has a spring constant of /spl cong/1 N/m and a resonance frequency of /spl cong/17 kHz. Galvanometric characterization of the Hall sensor showed an input/output resistance of 200/spl Omega/, a device sensitivity of 0.05 V/AT and a minimum detectable magnetic flux density of 9 /spl mu/T/Hz/sup 1/2/ at frequencies above 1 kHz at room temperature. Quantitative magnetic field measurements of a microcoil were performed. The generic method allows for a stable integration of electrodes into polymers MEMS and it can readily be used for other types of microsensors where conducting metal electrodes are integrated in cantilevers for advanced scanning probe sensing applications.     

A micromechanical flow sensor for microfluidic applications

We fabricated a microfluidic flow meter and measured its response to fluid flow in a microfluidic channel. The flow meter consisted of a micromechanical plate, coupled to a laser deflection system to measure the deflection of the plate during fluid flow. The 100 /spl mu/m square plate was clamped on three sides and elevated 3 /spl mu/m above the bottom surface of the channel. The response of the flow meter was measured for flow rates, ranging from 2.1 to 41.7 /spl mu/L/min. Several fluids, with dynamic viscosities ranging from 0.8 to 4.5/spl times/10/sup -3/ N/m, were flowed through the channels. Flow was established in the microfluidic channel by means of a syringe pump, and the angular deflection of the plate monitored. The response of the plate to flow of a fluid with a viscosity of 4.5/spl times/10/sup -3/ N/m was linear for all flow rates, while the plate responded linearly to flow rates less than 4.2 /spl mu/L/min of solutions with lower dynamic viscosities. The sensitivity of the deflection of the plate to fluid flow was 12.5/spl plusmn/0.2 /spl mu/rad/(/spl mu/L/min), for a fluid with a viscosity of 4.5/spl times/10/sup -3/ N/m. The encapsulated plate provided local flow information along the length of a microfluidic channel.     

Low-voltage, large-scan angle MEMS analog micromirror arrays with hidden vertical comb-drive actuators

This paper reports on novel polysilicon surface-micromachined one-dimensional (1-D) analog micromirror arrays fabricated using Sandia's ultraplanar multilevel MEMS technology-V (SUMMiT-V) process. Large continuous DC scan angle (23.6/spl deg/ optical) and low-operating voltage (6 V) have been achieved using vertical comb-drive actuators. The actuators and torsion springs are placed underneath the mirror (137/spl times/120 /spl mu/m/sup 2/) to achieve high fill-factor (91%). The measured resonant frequency of the mirror ranges from 3.4 to 8.1 kHz. The measured DC scanning characteristics and resonant frequencies agree well with theoretical values. The rise time is 120 /spl mu/s and the fall time is 380 /spl mu/s. The static scanning characteristics show good uniformity (相似文献