Corrosion of aluminium in copper-aluminium couples under a marine environment: Influence of polyaniline deposited onto copper

In this study, we examined how aluminium corrosion in Al-Cu/PANI galvanic couples in a marine environment is influenced by deposition of polyaniline (PANI) on copper. Polarization curves and immersion assays in 0.1 M NaCl were performed. The morphologies of etched Al and corrosion products were observed by SEM, and the Al ions in solution were quantified by atomic absorption spectroscopy. A reduction in aluminium damage due to galvanic corrosion was observed as a result of decreased effective area for the oxygen reduction reaction on Cu/PANI electrode. Furthermore, an electrochemical reduction of PANI from leucoemeraldine to emeraldine base is proposed.     

Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer

A thin layer electrochemical cell was successfully developed to study the atmospheric corrosion behavior of copper film in printed circuit board (PCB-Cu) under thin electrolyte layer (TEL) and direct current electric field (DCEF) by electrochemical impedance and electrochemical noise analysis. The electrochemical measurements and SEM morphologies after corrosion test indicate that DCEF decreases the corrosion of PCB-Cu under TEL. The corrosion rate and probability of pitting corrosion of PCB-Cu under DCEF decrease due to the electric migration of aggressive Cl⁻ ion out of working electrode surface.     

The effect of purine on the corrosion of copper in chloride solutions

The influence of the concentration of purine (PU) on the corrosion and spontaneous dissolution of copper in 1.0 M NaCl solutions (pH 6.8) was studied. The investigations involved electrochemical polarization methods as well as weight-loss measurements, electrochemical quartz crystal microbalance (EQCM) techniques and scanning electron microscopy (SEM). The inhibition efficiency (IE) increases with an increase in the concentration of PU. An adherent layer of inhibitor is postulated to account for the protective effect. The adsorption of PU has been found to occur on the surface of copper according to the Langmuir isotherm. Purine is chemically adsorbed on the copper surface.     

Study on initiation of localised corrosion on copper thin film electrode by combinational use of an EQCM with a liquid-phase ion gun

A new method allowing simultaneous measurements of anodic currents and small mass changes during initiation and early growth of a single localised corrosion site was discussed. An electrochemical quartz crystal microbalance (EQCM) was combined with a liquid-phase ion gun consisting of an Ag/AgCl microelectrode which produces chloride ions, causing local breakdown of passive film and pit growth. The method was applied to copper thin films polarised anodically at 0.6 or 0.8 V (SHE) in pH 8.4 borate buffer solution. It was found from comparison between coulometry and gravimetry that copper dissolves as Cu²⁺ during the pit growth. The shape of the pit was almost circular and the average pit current density, i_p=25 A cm⁻² was evaluated from the kinetics of 2D pit growth.     

Use of SVET and SECM to study the galvanic corrosion of an iron-zinc cell

The work makes use of the scanning vibrating electrode technique (SVET) and the scanning electrochemical microscope (SECM) to investigate microscopic aspects of the electrochemical reactions that occur in an iron-zinc galvanic couple immersed in aqueous sodium chloride solution. Detection of the corrosion processes was made by sensing the phenomena occurring in solution. The SVET provided information on the distribution of ionic currents arising from the metal surface, whereas the SECM measured the concentration of chemical species relevant to the corrosion processes. The two techniques had comparable sensitivity for the corrosion of iron but significant differences were observed concerning the detection of corrosion of zinc.     

Corrosion inhibition of copper in chloride media by 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methylpyrazolyl)pentane

The efficiency of 1,5-bis(4-dithiocarboxylate-1-dodecyl-5-hydroxy-3-methyl-pyrazolyl)pentane (BDTCPP) as copper corrosion inhibitor in 3.5% NaCl solutions was studied by electrochemical polarization methods (Tafel extrapolation and polarization resistance method), electrochemical impedance spectroscopy and immersion assays. Results obtained in this study reveal that BDTCPP is a good inhibitor and the potentiodynamic polarization studies clearly show that BDTCPP is a mixed-type inhibitor for copper in chloride solutions. It decreases the anodic reaction rate more strongly than the cathodic reaction rate and it renders the open circuit potential of copper more positive in 3.5% NaCl solutions. The UV analysis of the protective layer of BDTCPP after corrosion experiments shows that the inhibitor prevents copper corrosion by physisorption on the metal surface, followed by chemisorption of a protective Cu(II)-complex. This Cu(II) is generated by oxidation of the Cu(I) ion formed at the beginning of the corrosion process in the aerated solution of NaCl.     

Inhibitive action of the purine and adenine for copper corrosion in sulphate solutions

The influence of the concentration of the purine (PU) and adenine (AD) on the corrosion of copper in 0.5 M Na₂SO₄ solutions (pH 6.8) was studied. The investigations involved electrochemical polarization methods as well as electrochemical quartz crystal microbalance (EQCM) techniques. The inhibition efficiency increases with an increase in the concentration of PU and AD. Adherent layers of inhibitors were postulated to account for the protective effect. The adsorptions of inhibitors were found to occur on the surface of copper according to the Langmuir isotherm. The values of standard free energies of adsorption suggest the chemical adsorption of PU and AD on the copper surface.     

Behaviour of copper during alkaline corrosion of Al–Cu alloys

Enrichment of copper beneath amorphous anodic films on relatively dilute, solid-solution Al–Cu alloys is necessary before copper can be oxidized and incorporated into the oxide layer. A similar enrichment arises during electropolishing, which also develops an amorphous oxide. In these cases, external polarization is applied, usually generating a relatively high oxidation rate. In contrast, enrichment behaviour at the corrosion potential has received less attention. The present study examines the corrosion of Al–Cu alloys, containing up to 6.7 at.% Cu, in 0.1 M sodium hydroxide solution at 293 K. Copper is again found to enrich in the alloy, similarly to behaviour with anodic polarization. However, following enrichment, discrete copper-rich particles appear to be generated in the corrosion product. These are suggested to be nanoparticles of copper, since the corrosion potentials of the alloys are low relative to that required for oxidation of copper. The corrosion rate increases with increase of both time and copper content of the alloy, probably associated with a greater cathodic activity due to an increasing number of nanoparticles. The corrosion proceeds with loss of aluminium species to the sodium hydroxide solution, but with retention of copper in the layer of hydrated alumina corrosion product.     

Galvanic corrosion behaviour of iron coupled to aluminium in NaCl solution by scanning eectrochemical microscopy

Scanning electrochemical microscopy (SECM) was used to sense the concentration of ions in 0.1M NaCl aqueous solution at the iron-aluminium couple. The SECM measured the concentration of ions relevant to the corrosion processes. The electrochemical behaviour of galvanic Fe/Al coupling was investigated as a function of time using SECM microelectrode tip. SECM amperometric line scan curves were obtained over the Fe/Al at a constant distance. In the first case the chemical species participating in the corrosion reactions at the sample are detected at the SECM-tip by applying appropriate potential values to the microelectrode. The release of Al³⁺ into the solution from local anodic surface, as well as the consumption of dissolved oxygen at the corresponding cathodic surface was successfully monitored. The results revealed that the galvanic couple where Fe/Al is close to each other will show lower corrosion rate due to the formation of corrosion products on the metal surface with further increase in exposure times.     

Copper(II) 8-hydroxyquinolinate 3D network film with corrosion inhibitor embedded for self-healing corrosion protection

This work presents a self-healing protective coating for copper. The complex coating is composed of copper(II) 8-hydroxyquinolinate (Cu(8HQ)₂) 3D network film storing corrosion inhibitor as base layer and epoxy as top layer covering on the base layer. The results of EIS and polarization curves reveal the self-healing effect of Cu(8HQ)₂ 3D network film with corrosion inhibitor embedded. After being scratched with a knife-edge, the complex coating rapidly releases inhibitor embedded in 3D network structure to suppress the corrosion process. The scratch on the coating is covered with inhibitor adsorption film and the anodic activity is restrained.     

Corrosion behaviour of aluminium in copper containing environment

Corrosion behaviour of pure aluminium galvanically connected to metallic copper or in the presence of Cu²⁺ ions was investigated by electrochemical measurements in Na₂SO₄ and Na₂SO₄ + NaCl test solutions. It has been found that in aerated Cl⁻ ion containing solutions pitting corrosion of aluminium emerged immediately, while in the absence of oxygen this process was less violent. Effect of passivating pre-treatment of aluminium surface on corrosion behaviour Cu-Al bimetallic system is also demonstrated.     

Polyacrylic acid as a corrosion inhibitor for aluminium in weakly alkaline solutions. Part I: Weight loss, polarization, impedance EFM and EDX studies

This part is devoted to study the influence of three selected polyacrylic acids (PAAs) with different molecular weights (PAA1 = 1800, PAA2 = 11,000 and PAA3 = 14,000 g mol⁻¹) on the corrosion inhibition of Al in weakly alkaline solutions (pH 8 and 10) at 30 °C. Measurements were conducted under different experimental conditions using chemical (weight loss) and electrochemical (potentiodynamic polarization and impedance) techniques, complemented with ex situ energy dispersive X-ray (EDX) examinations of the electrode surface. Electrochemical frequency modulation (EFM), a non-destructive corrosion measurement technique that can directly give values of corrosion current without prior knowledge of Tafel constants, is also presented here. The results demonstrated that these polymers inhibit the alkaline corrosion of Al. The inhibition effect of these polymers is due to their adsorption on Al surface. The isoelectric point (IEP) of aluminium oxide (pH 9) seems to be an important factor controlling corrosion inhibition and adsorption of the three polymers. The three polymers inhibit the corrosion reaction of aluminium excellently at pH 8, but less effectively at pH 10. Polarization measurements showed that the three polymers act as mixed-type inhibitors. The inhibition efficiencies of these polymers increase with increasing concentration, molecular weight and immersion time. Results obtained from the chemical and electrochemical measurements are in good agreements.     

SVET and SECM imaging of cathodic protection of aluminium by a Mg-rich coating

The mechanism of cathodic protection of an aluminium substrate by a Mg-rich coating was investigated using localized techniques. Both scanning vibrating electrode techniques (SVET) and scanning electrochemical microscopy (SECM) were used to investigate the processes occurring at the surface of exposed metal when electrically connected or disconnected in a galvanic couple with the Mg-rich coating. The SVET has shown the evolution of the pit activity with time under conditions of sacrificial protection, whereas the SECM allowed indirect sensing of the cathodic activity above the electrodes. It was shown that the cathodic protection provided by magnesium to aluminium substrates acts by both preventing pit nucleation and inhibiting the growth of the pre-existing pits.     

Electrochemical quartz crystal microbalance and electrochemical impedance spectroscopy study of copper corrosion inhibition by imidazoles

The aim of this work is to obtain deeper insight into the mechanism of the protective action of three imidazole-based corrosion inhibitors. Investigations were performed on copper in 3% NaCl, by electrochemical impedance spectroscopy and electrochemical quartz crystal microbalance measurements. The kinetic changes in the corrosion processes were monitored over time. In spite of similar molecular structure, differences in the inhibiting mechanism of three imidazole compounds were observed. The two inhibitors with a tolyl substituent decreased the copper corrosion rate due to the formation of a thin adsorbate layer; however, slow formation of a thick layer was observed for 4-methyl-1-phenyl imidazole. From electrochemical impedance spectroscopy studies, it was observed that all three inhibitors protected the copper efficiently, and in some cases, the degree of the protection increased with time.     

氮化铝基板与Cu和Al的接合及其表面改质效果

对ＡｌＮ陶瓷基板进行了减压直流等离子体喷涂镀Ａｌ,在基板表面形成厚度约２μｍ的金属Ａｌ薄层,实现了Ａｌ与ＡｌＮ中的良好接合。     

Effect of tin on the corrosion behavior of low-alloy steel in an acid chloride solution

This study examined the effect of Sn addition ranging from 0 to 0.1 wt.% on the electrochemical properties of low-alloy steel using electrochemical techniques in an acid chloride solution and surface analysis techniques. The potentiodynamic test showed the active corrosion behavior of all specimens and the corrosion rate decreased with increasing Sn addition. EIS showed that the Sn-containing steels had higher rust layer resistance. These results confirmed that the interaction of Sn with Cu and Sb improves the corrosion resistance of low-alloy steel due to the formation of the continuous tin oxide, copper oxide and antimony oxide layer.     

Numerical simulation of corrosion process with two-step charge transfer mechanism in the Cu/CuSO4 + H2SO4 system

The corrosion process in the Cu/CuSO₄ + H₂SO₄ system is considered as the sum of two coupled single-electron electrochemical reactions that occur simultaneously and independently on the surface of the copper electrode. Our numerical model incorporates diffusion and migration of solution species including cuprous ions, as well as the chemical equilibria for copper sulphate and sulphuric acid dissociation. Numerical simulations are compared with the trends discovered during experimental investigation of copper corrosion in similar systems.     

Corrosion and impressed current cathodic protection of copper-based materials using a bimetallic rotating cylinder electrode (BRCE)

A bimetallic rotating cylinder electrode (having individual electrode areas of 10 cm² and rotating at 200-1400 rpm) has been used to examine the corrosion and protection characteristics of copper/nickel aluminium bronze and 90-10 copper-nickel/nickel aluminium bronze galvanic couples in filtered seawater at 25 °C. The flow-influenced electrochemistry of the systems was determined using zero resistance ammetry, corrosion potential measurements and a potential step current transient technique. In each case, the galvanic corrosion potential and corrosion rate displayed a Reynolds number dependency where mass transport control of the anodic dissolution reaction partially controlled the reaction rate. Bimetallic impressed current cathodic protection (ICCP) has also been demonstrated for a range of applied protection potentials and Reynolds numbers. A comparison has been made between the directly measured bimetallic ICCP current demand and that determined from independent, single-metal rotating cylinder electrode measurements. In this case, the mixed charge and mass transport controlled rate of oxygen reduction was examined.     

Hydrogen entry into steel during atmospheric corrosion process

Hydrogen entry and permeation into iron were measured by an electrochemical method during atmospheric corrosion reaction. The hydrogen permeation was enhanced on passive films because the hydrogen adsorption increased by the hydrogen evolution mechanism which is different from that on a bear iron surface. The permeation rate during a wet and dry corrosion cycle showed a maximum in the drying process depending upon the surface pH and the corrosion potential. The pollutant such as Na₂SO₃ which decreases the pH and the corrosion potential causes an increase in the permeation rate. The mechanism of the change in the permeation rate during the wet and dry cycles is explained by the polarization diagram of the electrode covered by thin water layer.