介质目标电磁散射特性的多层特征基函数法分析

特征基函数法是近几年提出的一种基于分块和高阶基函数概念求解电磁散射问题的快速算法.为了更有效地分析电大尺寸多目标的电磁散射问题,将基于Foldy-Lax多径散射方程的特征基函数法扩展为多层特征基函数法,通过对子域进行多层划分来控制生成矩阵维数的大小和计算精度.应用多层特征基函数法计算了介质目标的远区散射场,数值结果与传统特征基函数法的计算结果吻合良好,且计算效率明显提高.     

导通孔设计对高速信号完整性的影响

当今的高速数字电路设计中,印制板上传输线轻微的不连续问题都必须认真对待,特别是被广泛使用的导通孔。随着频率的增长和信号上升沿的变陡,导通孔带来的阻抗不连续会引起信号的反射,严重影响系统的性能和信号完整性。文章用全波电磁仿真软件HFSS,对多种导通孔结构进行了全面的研究。通过建模仿真,分析了导通孔直径,导通孔长度和多余的导通孔短柱几种关键设计参数对信号完整性的影响。此研究对高速数字设计者深入理解导通孔设计有一定意义。     

微波单片电路中通孔的建模

分析了理论公式在计算截圆锥通孔电感中的局限性.设计了频率在20 GHz以下GaAs基微波单片电路中通孔的专门测试结构并建立了其对应的等效电路,用去嵌入寄生参数的方法和安捷伦公司标准的IC-CAP建模系统提取了通孔的模型参数.发现对截圆锥结构的通孔,用公式计算出来的通孔的电感值比实验的结果大36%.设计了一个14-18 GHz、增益大于17 dB、输出功率为1W的GaAs基微波单片电路,验证了模型的准确性.     

微波多芯片组件中垂直通孔互连的矩阵束矩量法仿真

在微波多芯片组件中,处在不同层的信号传输线是通过通孔连接在一起的。由于通孔会导致信号传输的不连续性,对信号的传输至关重要。本文采用矩阵束矩量法仿真了多层电路中通孔的散射特性,并总结了通孔几何尺寸和平行导体板间距变化时通孔的散射特性所表现出来的规律。     

微波电路通孔结构的改进型矩阵束矩量法仿真

对多层微波电路通孔结构进行RWG片元建模,用矩量法求解通孔表面电流,并运用矩阵束方法提取通孔外部结构相关参数,进一步得到20GHz以内散射参数。为提高求解速度,应用了等效介电常数和高效的矢量化运算,大幅度地提高了算法的效率。通过与全波仿真软件HFSS对比,验证了算法的正确性和高效率。另外加工了一套电路板进行实验测试,实测结果与本文算法计算基本吻合,说明了算法的可靠性。     

柱状结构中多层各向异性吸波材料的电磁分析

通过对圆柱状结构中多层各向异性薄层吸波材料的电磁分析—柱体由金属柱芯和包围其外的多层各向同性介质材料组成,在各层之间和外表面涂覆各向异性薄层.考虑各薄层的输入阻抗,得出曲面结构内部及表面涂覆各向异性吸波材料散射场.根据级联矩阵和算法,在一定波段上进行RCS (Radar Cross Section)减缩,获令人满意的计算结果.     

多层微波集成电路中微带线层间互连仿真

针对多层微波集成电路设计的微带线层间互连问题,介绍了垂直通孔互连、垂直带条互连和层耦合过渡互连三种高性能的互连方法,并且采用三维电磁仿真软件HFSS对这三种互连结构进行了建模和仿真.仿真结果表明,垂直通孔互连和垂直带条互连在0.1~25 GHz的频宽范围内,回波损耗S11<-20 dB,插入损耗S21>-1 dB,互连性能优良,而层耦合过渡互连在20~68 GHz内回波损耗S11<-20 dB,插入损耗S21>-1 dB,具有在毫米波频段实现互连的潜力.     

柱状结构中多层各向异性吸波材料的电磁分析

通过对圆柱状结构中多层各向异性薄层吸波材料的电磁分析－柱体由金属柱芯和包围其外的多层各向同性介质材料组成,在各层之间和外表面涂覆各向异性薄层。考虑各薄层的输入阻抗,得出曲面结构内部及表面涂覆各向异性吸波材料散射场。根据级联矩阵和算法,在一定波段上进行ＲＣＳ（Ｒａｄａｒ Ｃｒｏｓｓ Ｓｅｃｔｉｏｎ）减缩,获令人满意的计算结果。     

新型微波毫米波单片三维垂直互连技术

近半个世纪以来,微波电路发展十分迅速,它经历了从低频到高频、从单层到多层的发展历程,最终导致了微波多芯片组件的产生。随着多芯片组件密度的不断提高,互连的不连续性成为制约整体性能的瓶颈。因此,对互连进行仿真和建模,对于微波多芯片组件的设计有着重要的意义。文章以MMIC芯片和介质基板的垂直互连结构作为研究对象,对不连续性结构的散射参数进行了软件仿真优化,并进行了装配、测试和结果分析。     

应用按层积分矢量单元法进行多层RAM电磁散射计算

对多层RAM结构进行电磁散射计算时,为了获得精确的计算结果,需要对每层RAM进行精细网格划分,这将大大增加网格数量和计算规模.为此,本文结合曲边四边形矢量单元,应用按层积分方法进行单元计算,以单层整体建模代替多层建模,大幅度减少了网格数量,降低了计算规模.通过算例证实了这种按层积分矢量单元方法计算精度高,具有较好的工程应用价值.     

Analysis of a large number of vias and differential signaling in multilayered structures

A method is presented for full-wave modeling of vertical vias in multilayered circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function. The multiple interaction among vertical vias is modeled by the Foldy-Lax scattering formula. Multilayered effects are included by using cascaded network of the single-layer components. The exterior problem of the via and the transmission line is analyzed using the method of moments approach. The exterior and interior problems are combined into a system of equations to facilitate the solution of a large number of vias. Using this approach, the scattering matrix of problems of several thousand vias can be calculated with moderate CPU and memory requirement. Numerical results have been obtained for different via configurations and for a large range of frequency. Also illustrated are results for common and differential mode in differential signaling with surrounding idle and shorting vias.     

Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane

A full wave method is presented for modeling and analyzing multiple interactions among vertical vias in densely packaged integrated circuits and printed circuit board with ground plane of finite extent. In such structures, the TEM mode in the planar structure is excited and can propagate and cause interaction of waves among vias. Reflections will also occur at the edges of the finite ground plane. The electromagnetic analysis methodology is an extension of the previous methodology in analyzing multiple scattering among vias for infinite ground plane . The analysis is based upon the cylindrical wave mode expansion of the magnetic field Green's function, the Foldy-Lax multiple scattering formalism and utilizing the resonator modes of a circular cavity. The circular resonator modes are transformed into cylindrical waves onto the cylindrical via structures. Numerical results illustrate the physics of the underlying resonance scattering problems. We consider the cases of a) two coupled active vias of differential mode and b) two coupled vias of common mode. Results are also illustrated for ground plane resonance and the effects of shorting vias on such resonance. The effects of off-centering and the presence of idle vias are also illustrated.     

Multiple scattering among vias in lossy planar waveguides using SMCG method

Large-scale full-wave multiple scattering among cylindrical vias in planar waveguides is modeled using the Foldy-Lax equation. The formulation includes the skin effects of the conducting power/ground plane. Numerical solution of the Foldy-Lax equation with large number of unknowns is computed efficiently using the sparse-matrix canonical-grid method. In this method, interactions among vias are decomposed into the strong interactions part and the weak interactions part. The calculation of the weak part is carried out using two-dimensional (2-D)-fast Fourier transform (FFT) by translating the locations of the vias onto the uniform grids. The final solution of the Foldy-Lax equations is calculated by an iterative method. The results show O (N log N) CPU efficiency and O (N) memory efficiency. This makes large scale via problems possible for computer simulation.     

缝隙阵列天线DOA估计的互耦影响与修正

互耦的存在严重影响了DOA估计的精度，文中研究了存在互耦情况下的DOA估计问题，重点讨论了阵列单元互耦效应的有效计算和对MUSIC算法的修正问题；以缝隙阵列天线为例，通过对无限阵散射参量的修正得到有限阵的散射矩阵和阻抗矩阵，进而通过阻抗矩阵估计互耦的影响，并对MUSIC算法进行修正，最后给出了仿真结果。     

介质柱电磁极化散射的计算和分析

本文首次给出柱形体的一种有价值的极化散射矩阵Ｓ,定义,Ｓ,具有六个自由度,它包含了柱形体散射的所有信息,并给出计算平行极化ＲＣＳ的垂直极化ＲＣＳ等公式。从Ｓｓ也易于导出线极化基极化散射矩阵Ｓｔ和圆极化基极化散射矩阵Ｓｃ等。在此基础上本文将ＭｏＭ－ＣＧＭ－ＦＦＴ混降低了所需计算机内存和ＣＰＵ,提高了计算效率。本文以介质板柱体的极化散射为例进行了计算,所得结果与理论结果与及其它文献中的精确结果进行比较     

自由度和互耦联合优化的三阶嵌套阵

针对现有嵌套阵自由度低、 互耦率高的问题,本文采用均匀线阵进行级联,提出一种高自由度低互耦的三阶嵌套阵,该结构保留了嵌套阵的原有优势,具有物理阵元位置和自由度的闭式解,且极大程度地降低了阵元互耦.首先,对传统的回波信号模型引入互耦矩阵,建立了互耦条件下回波信号模型;然后,给出了三阶嵌套阵的布阵方式,并推导了"差联合阵列...     

高速PCB单端过孔研究

在高速数字电路设计中,过孔的寄生电容、电感的影响不能忽略,过孔在传输路径上表现为阻抗不连续的断点,会产生信号的反射、延时、衰减等信号完整性问题。文章采用矢量网络分析仪研究了过孔长度、过孔孔径、焊盘/反焊盘直径对过孔阻抗的影响。通过在信号孔旁增加接地孔,为过孔电流提供回路方法,提高过孔阻抗的连续性,并有效降低过孔损耗。此外,文章还探讨了过孔多余短柱对过孔阻抗及损耗的影响。本研究可为高速数字电路过孔设计和优化提供依据。     

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias

This paper presents a semi-analytical approach for electrical performance modeling of complex electronic packages with multiple power/ground planes and large number of vias. The method is based on the modal expansion technique and the method of moments. For the inner package domain with multiple power/ground planes and many vias, the modal expansion method is employed to compute the electromagnetic fields from which the multiport network parameters, e.g., the admittance matrix can be easily obtained. For the top/bottom domain of signal layers, the moment method is used to extract the equivalent resistance, inductance, capacitance, and conductance (RLCG) parameters. The equivalent circuit for the entire package is then generated by combining the results for both package domains. The equivalent circuit can be used in a SPICE-like simulator to study the signal and power integrity of an electronic package. Numerical examples demonstrate that the new approach is able to provide fast yet accurate signal and power integrity analysis of multilayered electronic packages.     

太赫兹硅基微环谐振器的设计与分析

设计了一个工作频率在太赫兹大气传输第一窗口的硅基波导型微环谐振器。利用传输矩阵法和耦合模理论计算微环谐振器的传输函数,并对波导耦合系数进行分析,获得微环谐振器的临界耦合条件。采用时域有限差分法分析微环谐振器的性能参数,并与串联双环谐振器性能参数相比较。结果表明：单环谐振器的自由谱宽范围为27 GHz,插入损耗为0.3 dB。单环与双环谐振器的响应谱线形状因子分别为0.16和0.52,即串联双环谐振器使谐振谱线顶端更平坦,滚降度增高。Abstract：关键词：     

高阻带抑制LTCC 滤波器的设计与实现*

提出了一种基于LTCC技术的新型高阻带抑制带通滤波器的实现方法.采用在并联谐振器的圆柱形电感之间引入感性耦合,在高阻带产生一个传输零点,并且能实现非常好的阻带衰减性能.本文对传统的梳状线带通滤波器结构进行改进,利用过孔的寄生电感效应,将过孔用作谐振杆,明显减小了器件的尺寸.并且通过利用空间耦合的寄生效应,实现滤波器的阻带高抑制传输零点,以满足了对特殊频点高抑制的要求.运用该方法设计了中心频率1.65 GHz,通带200MHz,带外2GHz处衰减大于60dBc的五级带通滤波器.实物测试结果和全波电磁仿真结果吻合较好.