Curing kinetics and thermal property characterization of a bisphenol‐S epoxy resin and DDS system

The kinetics of the cure reaction for a system of bisphenol‐S epoxy resin (BPSER), with 4,4′‐diaminodiphenyl sulfone (DDS) as a curing agent was investigated with a differential scanning calorimeter (DSC). Autocatalytic behaviour was observed in the first stages of the cure which can well be described by the model proposed by Kamal, using two rate constants, k₁ and k₂, and two reaction orders, m and n. The overall reaction order, m + n, is in the range 2∼2.5, and the activation energy for k₁ and k₂ was 86.26 and 65.13 kJ mol⁻¹, respectively. In the later stages, a crosslinked network was formed and diffusion control was incorporated to describe the cure. The glass transition temperature (T_g) of the BPSER/DDS samples partially cured isothermally was determined by means of torsional braid analysis (TBA) and the results showed that the reaction rate increased with increasing T_g, in terms of rate constant, but decreased with increasing conversion. It was also found that the  SO₂ group both in the epoxy resin and in the hardener increases the T_g values of the cured materials compared with that of BPAER. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of BPSER/DDS has nth order reaction kinetics. © 2000 Society of Chemical Industry     

Curing kinetics and thermal property characterization of the bisphenol‐F epoxy resin and phthalic anhydride system

The curing kinetics of bisphenol‐F epoxy resin (BPFER) and curing agent phthalic anhydride, with N,N‐dimethylbenzylamine as an accelerator, were studied by differential scanning calorimetry (DSC). Analysis of DSC data indicated autocatalytic behaviour in the first stages of the cure for the system, and that this, could be well described by the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. The curing reaction in the later stages was practically diffusion‐controlled. To consider the diffusion effect more precisely, a diffusion factor, ??(α), was introduced into Kamal's equation. The glass transition temperatures (T_gs) of the BPFER/phthalic anhydride samples were determined by means of torsional braid analysis. The thermal degradation kinetics of cured BPFER were investigated by thermogravimetric analysis. © 2002 Society of Chemical Industry     

Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4′‐diaminodiphenylmethane

The curing reaction of bisphenol S epoxy resin (BPSER) with 4,4′‐diaminodiphenylmethane (DDM) was studied by means of torsional braid analysis (TBA) in the temperature range of 393–433 K. The glass transition temperature (T_g) of the BPSER/DDM system is determined, and the results show that the reaction rate increases with increasing the T_g in terms of the rate constant, but decreases with increasing conversion. 1 The T_g of BPSER/DDM is about 40 K higher than BPAER/DDM. The gelation and vitrification time were assigned by the isothermal TBA under 373 K; in addition, an FTIR spectrum was carried out to describe the change of the molecular structure. The thermal degradation kinetics of this system was investigated by thermogravimetric analysis (TGA). It illustrated that the thermal degradation of the BPSER/DDM has n‐order reaction kinetics. 2 © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 794–799, 2000     

Synthesis and characterization of the two novel liquid crystalline epoxy resins based on bisphenol‐s mesogen

Two novel liquid crystalline epoxy resins (LCER) based on bisphenol‐S mesogen, 4,4′‐Bis‐(2,3‐epoxypropyloxy)‐sulfonyl bis(1,4‐phenylene) (p‐BEPSBP) and sulfonyl bis(4,1‐phenylene) bis[4‐(2,3‐epoxypropyloxy)benzoate] (p‐SBPEPB), were synthesized. Their liquid crystalline behavior and structure were characterized by Fourier transmittance infrared ray (FTIR), differential scanning calorimetry (DSC), ¹HNMR, polarized optical microscopy (POM) and X‐ray diffraction (XRD). The results show that p‐BEPSBP is a kind of thermotropic liquid crystal and has a smectic mesophase with a melting point (T_m) at 165°C; the p‐SBPEPB is a kind of nematic mesophase with the temperature range of 155–302°C from the T_m to the clearing point T_i. The curing behaviors and texture of the liquid crystalline epoxy resins with 4,4′‐diaminodiphenyl ether (DDE) were also studied by DSC and some kinetic parameters were evaluated according to the Ozawa's method. The dynamic mechanical properties of curing products were also investigated by torsional braid analysis (TBA), and the results suggest that the dynamic mechanical loss peak temperature (T_p) of p‐BEPSBP/DDE and p‐SBPEPB/DDE is 120 and 130°C, respectively. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Curing kinetics and thermal property characterization of an o‐cresol formaldehyde epoxy resin and 4,4′‐diaminodiphenyl ether system

The kinetics of the curing reaction for a system of o‐cresol formaldehyde epoxy resin (o‐CFER) with 4,4′‐diaminodiphenyl ether (DDE) as a curing agent were investigated with differential scanning calorimetry (DSC). An analysis of the DSC data indicated that an autocatalytic behavior appeared in the first stages of the cure for the system, and this could be well described by the model proposed by Kamal, which includes two rate constants and two reaction orders (m and n). The overall reaction order (m + n) was 2.7–3.1, and the activation energies were 66.79 and 49.29 kJ mol^?1, respectively. In the later stages, a crosslinked network was formed, and the reaction was mainly controlled by diffusion. For a more precise consideration of the diffusion effect, a diffusion factor was added to Kamal's equation. In this way, the curing kinetics were predicted well over the entire range of conversions, covering both the previtrification and postvitrification stages. The glass‐transition temperatures of the o‐CFER/DDE samples were determined via torsional braid analysis. The results showed that the glass‐transition temperatures increased with the curing temperature and conversion up to a constant value of approximately 370 K. The thermal degradation kinetics of the system were investigated with thermogravimetric analysis, which revealed two decomposition steps. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 182–188, 2004     

Curing behavior and thermal property of epoxy resin with boron‐containing phenol‐formaldehyde resin

The curing reaction of bisphenol‐A epoxy resin (BPAER) with boron‐containing phenol–formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER‐BPFR was shown to follow autocatalytic kinetics. The activation energy in the dynamic cure reaction was derived. The influence of the composition of BPAER and BPFR on the reaction was evaluated. In addition, the glass transition temperatures (T_gs) were measured for the BPAER‐BPFR samples cured partially at isothermal temperatures. With the curing conditions varying, different glass transition behaviors were observed. By monitoring the variation in these T_gs, the curing process and the thermal property of BPAER–BPFR are clearly illustrated. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1054–1061, 2000     

Curing kinetics,thermal property,and stability of tetrabromo-bisphenol-A epoxy resin with 4,4′-diaminodiphenyl ether

The curing reaction of tetrabromo-bisphenol-A epoxy resin (TBBPAER) with 4,4′-diaminodiphenyl ether (DDE) was studied by isothermal differential scanning calorimetry (DSC) in the temperature range of 110–140°C. The results show that the isothermal cure reaction of TBBPAER–DDE in the kinetic control stage is autocatalytic in nature and does not follow simple nth-order kinetics. The autocatalytic behavior was well described by the Kamal equation. Kinetic parameters, including 2 rate constants, k₁ and k₂, and 2 reaction orders, m and n, were derived. The activation energies for these rate constants were 83.32 and 37.07 kJ/mol, respectively. The sum of the reaction orders is around 3. The glass transition temperatures (T_gs) were measured for the TBBPAER–DDE samples cured partially in isothermal temperature. With the degree of cure varies, different glass transition behaviors were observed. By monitoring the variation in these T_gs, it is illustrated that the network of the system is formed via different stages according to the sequence reactions of primary and second amines with epoxides. It is due to the presence of the 4 bromine atoms in the structure of TBBPAER that this curing process can be clearly observed in DSC curves. The thermal stability of this system studied by differential thermal analysis–thermogravimetric analysis illustrates that the TBBPAER–DDE material can automatically debrominate and takes the effect of flame retarding when the temperature reaches 238.5°C. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1991–2000, 1998     

Preparation,characterization and thermal properties of tetramethylbisphenol F epoxy resin and mixed systems

Tetramethylbisphenol F epoxy resin (TMBPFE) was successfully synthesized based on tetramethylbisphenol F (TMBPF) and epichlorohydrin with tetrabutylammonium bromide as the catalyst. The structure of TMBPFE was characterized by Fourier transform infrared spectroscopy, nuclear magnetic resonance and elemental analysis. Then, a mixed system composed of TMBPFE and 4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy (TMBP) was prepared by a melting method, i.e. without any solvent. Both the TMBPFE and the mixed system were cured using 4,4′‐diaminodiphenyl methane (DDM) as the curing agent. The thermal properties of TMBPFE and the mixed system were studied using differential scanning calorimetry, dynamic mechanical analysis and thermogravimetric analysis (TGA). The results showed that the TMBP mixed in the TMBPFE matrix had little effect on the thermal properties of TMBPFE. However, the glass transition temperature improved markedly with increasing content of TMBP. Moreover, the TGA results showed that the degradation characteristics of TMBPFE resins did not seriously decrease when TMBP was incorporated into the TMBPFE matrix, although there are large steric hindrance biphenyl groups in TMBP. Both TMBPFE and the TMBPFE/TMBP system have potential applications in electrical and electronic fields. Copyright © 2011 Society of Chemical Industry     

Curing kinetics and thermal property characterization of o‐CFER/MeTHPA/O‐MMT nanocomposite

The kinetics of the cure reaction for a system of o‐cresol‐formaldehyde epoxy resin (o‐CFER), 3‐methyl‐tetrahydrophthalic anhydride (MeTHPA), N,N‐dimethyl‐benzylamine, and organic montmorillonite(O‐MMT) were investigated by means of X‐ray diffraction (XRD) and differential scanning calorimetry (DSC). The XRD result indicates that an exfoliated nanocomposite was obtained. The analysis of DSC data indicated the behavior was shown in the first stages of the cure for the system, which could be well described by the model proposed by Kamal. In the later stages, the reaction is mainly controlled by diffusion, and diffusion factor, f(α), was introduced into Kamal's equation. In this way, the curing kinetics was predicted well over the entire range of conversion. Molecular mechanism for curing reaction was discussed. The thermal degradation kinetics of the system were investigated by thermogravimetric analysis (TGA), which revealed that with the increase of O‐MMT content, TG curves shift to higher temperature. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3023–3032, 2006     

Influence of cure treatment on extent of reaction and glassy modulus for BADGE‐DDM epoxy resin

The extent of conversion of epoxy groups cured with diaminodiphenyl methane, a diamine, at 100°C was approximately 100%, and the glass‐transition temperature (T) was found to be an increasing function of cure time with very large increases with extended postcure treatments at 180°C. However, this considerable increase in the T_g with postcure at 180°C was not due to the reactions of epoxy and amine groups. The specific volume reduced with the T_g to a minimum at 103° for the cured samples but showed a very slight increase with the T_g for the postcured samples. It was also found that the glassy modulus (E_g) was a linear decreasing function of the T_g. There were two separate relationships between the E_g and the rubbery modulus that depended on the cure conditions and suggested that the “structure” formed due to cure at a temperature of 100°C was different than that at postcure, which was 180°C. The most sensitive structural parameter for these cured epoxy resins was their T. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 1265–1276, 2001     

Kinetics of 4,4′-diaminodiphenylmethane curing of bisphenol-S epoxy resin

The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k₁ and k₂, and two reaction orders, m and n. Rate constants k₁ and k₂ were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k₁ and k₂ were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999     

Photopolymerization kinetics and thermal properties of dimethacrylate based on bisphenol‐S

A dimethacrylate based on bisphenol‐S (DBSMA) was prepared and characterized by Fourier Transform infrared spectroscopy (FTIR), Electrospray Ionisation Tandem Mass Spectrometry (ESI/MS) ¹H NMR, and ¹³C NMR. DBSMA was investigated by a real‐time infrared spectroscopy (RTIR), under different conditions such as varying photoinitiator type and concentration, with and without oxygen, mixing with different amounts of a reactive diluent [1,6‐hexanediol dimethacrylate (HDDMA)]. The mechanical and thermal properties of these curing films were also investigated by dynamic mechanical analysis and thermogravimetric analysis. The results showed homopolymer of DBSMA has better thermal stability than copolymers of DBSMA/HDDMA systems. Also, the cured DBSMA polymer exhibited higher glass transition temperature (T_g) and better thermal stability compared with commercial available resin 2,2‐Bis[4‐(2‐hydroxy‐3‐methacryloxypropoxy)phenyl]propane (BIS‐GMA) (CN151). © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Cure kinetics and thermal properties of tetramethylbiphenyl epoxy resin/phthalazinone‐containing diamine/hexa(phenoxy)cyclotriphophazene system

Inherently flame retardant epoxy resin is a kind of halogen‐free material for making high‐performance electronic materials. This work describes an inherently flame retardant epoxy system composed of 4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP), 1,2‐dihydro‐2‐(4‐aminophenyl)‐4‐(4‐(4‐aminophenoxy) phenyl) (2H) phthalazin‐1‐one (DAP), and hexa(phenoxy) cyclotriphophazene (HPCTP). The cure kinetics of TMBP/DAP in the presence or absence of HPCTP were investigated using isoconversional method by means of nonisothermal differential scanning calorimeter (DSC). Kinetic analysis results indicated that the effective activation energy (E_α) decreased with increasing the extent of conversion (α) for TMBP/DAP system because diffusion‐controlled reaction dominated the curing reaction gradually in the later cure stage. TMBP/DAP/HPCTP(10 wt %) system had higher E_α values than those of TMBP/DAP system in the early cure stage (α < 0.35), and an increase phenomenon of E_α ～ α dependence in the later cure stage (α ≥ 0.60) due to kinetic‐controlled reaction in the later cure stage. Such complex E_α ～ α dependence of TMBP/DAP/HPCTP(10 wt %) system might be associated with the change of the physical state (mainly viscosity) of the curing system due to the introduction of HPCTP. These cured epoxy resins had very high glass transition temperatures (202–235°C), excellent thermal stability with high 5 wt % decomposition temperatures (>340°C) and high char yields (>25.6 wt %). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Modelling the cure of a commercial epoxy resin for applications in resin transfer moulding

An analytical procedure has been developed for modelling the kinetics of the cure process of a commercial epoxy resin for resin transfer moulding (RTM) applications, using differential scanning calorimetry (DSC) in the isothermal and dynamic modes to obtain the experimental database. The overall reaction rate of the epoxide groups with amines was determined and fitted by an autocatalytic kinetic model. An improvement of the model to allow for diffusion limitation effects results in a good agreement between experimentally determined and predicted reaction rates. A non-linear least squares regression analysis method based on Marquardt's algorithm was used to fit the DSC reaction rate data with an appropriate model and to evaluate the activation energies and the reaction orders for this particular resin system. The Di Benedetto equation was utilised to establish the relationship between conversion and glass transition temperature (T_g), required to develop the diffusion-dominated part of the model.     

Curing behavior and thermal properties of multifunctional epoxy resin with methylhexahydrophthalic anhydride

The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC), and thermogravimetry. The results showed that the FTIR absorption intensity of anhydride and epoxide decreased during the curing reaction, and the absorption peak of ester appeared. The dynamic curing energies were determined as 48.5 and 54.1 kJ/mol with Kissinger and Flynn–Wall–Ozawa methods, respectively. DSC measurements showed that as higher is the curing temperature, higher is the glass transition. The thermal degradation of the cured bisANER/MHHPA network was identified as two steps: the breaking or detaching of ? OH, ? CH₂? , ? CH₃, OC? O and C? O? C, etc., taking place between 300 and 450°C; and the carbonizing or oxidating of aromatic rings occurring above 450°C. The kinetics of the degradation reaction was studied with Coats–Redfern method showing a first‐order process. In addition, vinyl cyclohexene dioxide (VCD) was employed as a reactive diluent for bisANER (VCD/bisANER = 1 : 2 w/w) and cured with MHHPA, and the obtained network had a higher T_g and a slight lower degradation temperature than the undiluted system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2041–2048, 2007     

Cure kinetics of epoxy resin used for advanced composites

The cure kinetics of an epoxy resin used for the preparation of advanced polymeric composite structures was studied by isothermal differential scanning calorimetry (DSC). A series of isothermal DSC runs provided information about the kinetics of cure over a wide temperature range. According to the heat evolution behavior during the curing process, several influencing factors of isothermal curing reactions were evaluated. The results showed that the isothermal kinetic reaction of this epoxy resin followed an autocatalytic kinetic mechanism. In the latter reaction stage, the curing reaction became controlled mainly by diffusion. Cure rate was then modeled using a modified Kamal autocatalytic model that accounts for the shift from a chemically controlled reaction to a diffusion‐controlled reaction. The model parameters were determined by a nonlinear multiple regression method. Copyright © 2004 Society of Chemical Industry     

Synthesis and thermal properties of ester‐type crosslinked epoxy resins derived from lignosulfonate and glycerol

Among various biomass‐based components, both lignin and glycerol are important, since they are abundantly produced as by‐products in industrial processes. Accordingly, in the present study, new types of crosslinked epoxy resins were synthesized from lignin and glycerol. Polymers derived from two types of lignin‐based crosslinked epoxy resins were prepared through two‐step reactions, ester‐carboxylic acid derivative preparation followed by crosslinked epoxy resin preparation, in order to establish a crosslinked epoxy resin system in which glycerol units were included. The resins obtained were labeled as follows: series 1, lignosulfonate‐glycerol polyacid (Ser1LSGLYPA); and series 2, glycerol diglycidyl ether (Ser2GLYDGE). The functional groups of the resins were analyzed using Fourier transform infrared spectrometry. The thermal properties of the resins were analyzed using differential scanning calorimetry and thermogravimetry. The glass transition temperature of the crosslinked epoxy resins increased with increasing LSGLYPA and GLYDGE contents for Ser1LSGLYPA and Ser2GLYDGE, respectively. The thermal degradation temperature for Ser1LSGLYPA and Ser2GLYDGE did not show significant change, suggesting that the crosslinked epoxy resins were thermally stable. The mass residue at 500 °C was not affected by the changes of LSGLYPA and GLYDGE contents. Copyright © 2009 Society of Chemical Industry     

Cure kinetics and rheology characterization of soy‐based epoxy resin system

A novel soy‐based epoxy resin system was synthesized by the process of transesterification and epoxidation of regular soy bean oil, which has the potential to be widely usable in various composite manufacturing processes. Cure kinetics and rheology are two chemical properties commonly required in process modeling. In this work, the cure kinetics and rheology of the soy‐based resin system were measured by means of differential scanning calorimetry (DSC) and viscometer. DSC was used to measure the heat flow of dynamic and isothermal curing processes. The cure kinetics models of the different formulations were thus developed. A Brookfield viscometer was used to measure the change in viscosity under isothermal conditions. A novel neural network‐based model was developed to improve modeling accuracy. The models developed for cure kinetics and rheology for soy‐based epoxy resin system can be readily applied to composite processing. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3168–3180, 2006     

Novolac epoxy resin from 4,4′‐dihydroxybenzophenone: Thermal,thermomechanical, interfacial,and cure kinetics with DGEBA/DICY blend

A novolac epoxy resin based on 4,4′‐dihydroxybenzophenone (BZPNE) was synthesized via epoxidation of 4,4′‐dihydroxybenzophenone novolac resin (BZPN). BZPN was obtained by strong mineral acid catalyzed reaction of 4,4′‐dihydroxybenzophenone (BZP) and paraformaldehyde. The formation of BZPNE and BZPN was confirmed by Fourier transform infrared spectroscopy, proton and carbon nuclear magnetic resonance spectroscopy, gel permeation chromatography, and epoxy equivalent weight. Different blends of BZPNE with diglycidyl ether of bisphenol‐A (DGEBA; EEW ～180) were cured using dicyandiamide were characterized by thermogravimetric analysis, thermomechanical analysis, dynamic mechanical analysis, and interfacial property between aluminum adherends at ambient and elevated temperature. Thermal properties were found to improve on increasing quantity of BZPNE in DGEBA as it is evidenced from glass transition temperature (T_g). Likewise, no deterioration in interfacial properties was observed with the highest quantity of BZPNE (30%) in DGEBA blend, when tested at 150 °C. Cure kinetics of compositions were studied by nonisothermal differential scanning calorimetry and Kissinger method was used to compute the kinetic parameters such as frequency factor (A), activation energy (E_a) followed by the dependency of rate constant (k) on temperature of different blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46164.