Surface finishing of Ni–Cr–B–Si composite coatings by precision grinding

A Ni–Cr–B–Si/10vol%WC coating material has been precision ground to an optical quality surface finish (<10 nm R_a) using a combination of a very stiff precision machine tool, Tetraform “C”, 76 μm CBN grinding wheels and electrolytic in-process dressing (ELID) assisted grinding. When grinding without ELID, surface finish has been shown to be limited by damage to primary and secondary carbides. This damage may be in the form of carbide pull-out or localised fracture and removal of the larger primary WC particulate. ELID assisted grinding helps maintain CBN grit protrusion and sharpness and thus promotes efficient cutting during grinding, minimising pull-out and localised damage to the harder phases within the coating microstructure. ELID therefore improves both the overall surface finish and surface integrity of the workpiece.     

A wavelet-based methodology for grinding wheel condition monitoring

Grinding wheel surface condition changes as more material is removed. This paper presents a wavelet-based methodology for grinding wheel condition monitoring based on acoustic emission (AE) signals. Grinding experiments in creep feed mode were conducted to grind alumina specimens with a resinoid-bonded diamond wheel using two different conditions. During the experiments, AE signals were collected when the wheel was ‘sharp’ and when the wheel was ‘dull’. Discriminant features were then extracted from each raw AE signal segment using the discrete wavelet decomposition procedure. An adaptive genetic clustering algorithm was finally applied to the extracted features in order to distinguish different states of grinding wheel condition. The test results indicate that the proposed methodology can achieve 97% clustering accuracy for the high material removal rate condition, 86.7% for the low material removal rate condition, and 76.7% for the combined grinding conditions if the base wavelet, the decomposition level, and the GA parameters are properly selected.     

Relationship between surface roughness and subsurface crack depth during grinding of optical glass BK7

Subsurface damages induced by grinding strongly influence the mechanical strength and optical quality of optical glasses. It is meaningful to rapid evaluate the depth of subsurface cracking through the measurement of surface roughness under different grinding parameters. Based on the features of surface and subsurface cracks as well as the kinetic analysis of surface grinding, the relationship between surface roughness and subsurface crack depth was established. Surface grinding experiments for optical glass BK7 were conducted. Utilizing optical microscope, optical profiling system and polishing-etching technique, the dependence of surface roughness and subsurface crack depth on grinding parameters was systematically analyzed. The predicted model of the relationship between surface roughness and subsurface crack depth was compared with experimental results. It was found that the relationship between surface roughness and subsurface crack depth is influenced by the half apex angle of abrasive grain as well as the magnitude of extra grain extrusion.     

Application of micro-EDM combined with high-frequency dither grinding to micro-hole machining

This research presents a novel process using micro electro-discharge machining (micro-EDM) combined with high-frequency dither grinding (HFDG) to improve the surface roughness of micro-holes. Micro-EDM is a well-established machining option for manufacturing geometrically complex small parts (diameter under 100 μm) of hard or super-tough materials. However, micro-EDM causes the recast layer formed on the machined surface to become covered with discharge craters and micro-cracks, resulting in poor surface quality. This affects the diameter of the micro-hole machined and undermines seriously the precision of the geometric shape. The proposed method that combines micro-EDM process with HFDG is applied to machining high-nickel alloy. As observed in SEM photographs and surface roughness measurement, HFDG method can reduce surface roughness from 2.12 to 0.85 μm Rmax with micro-cracks eliminated. Our results demonstrated that micro-holes fabricated by micro-EDM at peak current 500 mA followed by HFDG at 40 V can achieve precise shape and good surface quality after 6–8 min of lapping.     

Ultra-precision grinding of PZT ceramics—Surface integrity control and tooling design

A comprehensive statistical analysis of the factors controlling surface quality and form in ultra-precision grinding of polycrystalline lead zirconate titanate (PZT) ceramics has been conducted. The work focuses on practical grinding conditions and it includes an assessment of the interactions that exist between the method of material removal and the machine design. In the first phase of experimentation, defects including porosity and the fractural damage induced in the subsurface area were investigated. Machining trials were then conducted which were used to highlight the significant technical factors or combinations of technical factors that influence surface roughness, surface flatness and textural damage. A model for the systematic material removal mechanism which suggests that a relatively large depth of cut and ‘soft contact’ can be used to achieve improved surface integrity is proposed. In order to verify the suggested model, a series of design modifications to the tooling structure were made and the nature of the contact at the material removal interface was studied. Dramatic improvements in surface quality were achieved by incorporating a compliant polymer layer into the vacuum chuck used to hold the ceramics during grinding.     

电镀金刚石砂轮磨削光学玻璃表面质量综述

目前光学玻璃被广泛应用到航空航天、光电、空间技术以及精密工程等领域,其表面质量的加工要求越来越高。通过研究电镀金刚石砂轮对光学玻璃的磨削加工,从磨削力和表面形貌两方面分析了磨削参数对光学玻璃表面质量的影响,综述了超声磨削和模压成型两种加工方式的研究进展,并预测了未来光学玻璃加工的发展趋势。      

Drilling of hybrid metal matrix composites—Workpiece surface integrity

The main concern in the present study is the surface roughness variations on the drilled surface and extension of surface and sub-surface deformation due to drilling. The influence of different tools and cutting conditions on Al2219/15%SiCp and Al2219/15%SiCp-3%Graphite (hybrid) composites is investigated experimentally. The composites are fabricated by liquid metallurgy method. The drilling tests are conducted with carbide and coated carbide tools. The surface roughness decreases with the increase in cutting speed and increases with the increase in feed rate. The surface is analyzed using scanning electron microscope (SEM). Microhardness profiles indicate that the subsurface deformation extends up to a maximum of 120 μm below the machined surface for Al2219/15SiCp-3Gr composite when compared to 150 μm in Al2219/15SiCp composite.     

Force control grinding of gamma titanium aluminide

This paper addresses the grinding of ordered intermetallic compounds and their brittleness at ambient temperature. The depth of plastic deformation is supposed as the measure of surface integrity. The current paper expands the work of a previously reported indentation model that correlated the depth of plastic deformation and the normal component of the grinding force. This paper studies the indentation model using force control grinding of gamma titanium aluminide (TiAl-γ). Reciprocating surface grinding is carried out for a range of normal force 15–90 N, a cutting depth of 20–40 μm and removal rate of 1–9 mm³/sec using diamond, cubic boron nitride (CBN) and aluminum oxide (Al₂O₃) abrasives. The measured depths of plastic deformation are in the range of 150–300 μm. The deviations from the indentation model are explained by changes in the ductility during the grinding process. Furthermore, a force-based model for specific energy is developed and evaluated. The measured specific energies are in the range of 40 J/mm³ (diamond) to 400 J/mm³ (CBN).     

Surface integrity of finished turned Ti–6Al–4V alloy with PCD tools using conventional and high pressure coolant supplies

 Surfaces generated when machining Ti–6Al–4V alloy with PCD tools using conventional and high pressure coolant supplies was investigated. Longer tool life was recorded when machining Ti–6Al–4V with high-pressure coolant supplies and the recorded surface roughness R_a values were well below the tool rejection criterion (1.6 μm) for all cutting conditions investigated. The micro-structure of the machined surfaces were examined on a scanning electron microscope. Micrographs of the machined surfaces show that micro-pits and re-deposited work material were the main damages to the surfaces. Micro-hardness analysis showed hardening of the top machined surfaces when machining with conventional coolant while softening of the subsurface layer was observed when machining under high-pressure coolant supplies. The later is probably due to lower heat generated, with the consequent tempering action when machining with PCD tools with high-pressure coolant supplies. The microstructure below the machined surfaces had minimal or no plastic deformation when machining with conventional and high-pressure coolant supplies.     

Design of a six-axis high precision machine tool and its application in machining aspherical optical mirrors

The paper presents the design of a six-axis machining system and its application in fabricating large off-axis aspherical mirrors with sub-aperture lapping techniques. The new system is based on computer-controlled optical surfacing (CCOS), which combines the faculties of grinding, polishing, and on-machine profile measuring, has the features of conventional loose abrasive machining with the characteristics of a tool having multiple degrees of freedom moving in planar model. And a novel dual touch-trigger probe profiler is designed, which is composed of a probe, model METRO-MT60 made by HEIDENHAIN Co., is integrated into the system for measuring the shape accuracy of the tested aspherical surface, another probe modeled METRO-MT12 is designed as a calibrating device for minimizing the cosine error caused by assembly inaccuracy. The new CNC machining system with two kinds of moving coordinate systems, dual tool activities and on-machine measuring is presently developed based on the new concept. The general material removal function during machining is analyzed on the basis of the Preston hypothesis. Further, an alignment test of the measuring profiler is carried out using a leveling rule as a specimen. The accuracy of the optical surfaces measured by the dual probe profiler is found to be within 1 μm PV after removing cosine error and error compensating, achieves to the resolving power of the profiler is about 0.2–0.5 μm, so the developed system can be applied to the shape accuracy measuring of aspheric fabrication with micro precision during fine grinding process according to the calibrating results. Finally, the manufacturing experiments are carried out by virtue of an off-axis oblate ellipsoid mirror with rectangular aperture as 770 mm×210 mm and centered 127 mm. The accuracy of the aspherical mirror improved from the initial form error of 17.648 μm rms to the final one of 0.728 μm rms after grinding for 200 h.     

A study of EDM and ECM/ECM-lapping complex machining technology

EDM (electrodischarge machining) and ECM (electrochemical machining)/ECM-lapping complex machining is investigated in this paper. First, EDM shaping and ECM finishing technology are investigated. These processes are carried out in sequence on the same machine tool with the same electrode (copper) and the same machining liquid (water). Two types of EDM and ECM complex machining are investigated. One is with a formed electrode, and the other is with simple-shape electrode scanning. The complex machining with electrode scanning is applied to produce small and various-shaped components without making a formed electrode. The EDM surface of 1 μm Ra is improved to 0.2 μm Ra by applying ECM. Second, in order to get a smoother surface, a new EDM and ECM-lapping complex machining technology is developed. The surface roughness of a machined hole is improved to 0.07 μm Ra by applying 2 min of ECM lapping. The surface finishing of a hole shape is demonstrated with the complex machining technology.     

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

The difficulty and cost involved in the abrasive machining of hard and brittle ceramics are among the major impediments to the widespread use of advanced ceramics in industries these days. It is often desired to increase the machining rate while maintaining the desired surface integrity. The success of this approach, however, relies in the understanding of mechanism of material removal on the microstructural scale and the relationship between the grinding characteristics and formation of surface/subsurface machining-induced damage. In this paper, grinding characteristics, surface integrity and material removal mechanisms of SiC ground with diamond wheel on surface grinding machine have been investigated. The surface and subsurface damages have been studied with scanning electron microscope (SEM). The effects of grinding conditions on surface/subsurface damage have been discussed. This research links the surface roughness, surface and subsurface damages to grinding parameters and provides valuable insights into the material removal mechanism and the dependence of grinding-induced damage on grinding conditions.     

Microstructure and grain refining performance of a new Al–Ti–C–B master alloy

A kind of Al–Ti–C–B master alloy with a uniform microstructure is prepared using a melt reaction method. It is found that the average grain size of α-Al can be reduced from 3500 to 170 μm by the addition of 0.2 wt.% of the prepared Al–5Ti–0.3C–0.2B and the refining efficiency does not fade obviously within 60 min. It is considered that the TiC_xB_y and TiB_2−mC_n particles found at the grain center are the effective and stable nucleating substrates for α-Al during solidification, which accounts for the good grain refining performance.     

A critical analysis of effectiveness of acoustic emission signals to detect tool and workpiece malfunctions in milling operations

The industrial demands for automated machining systems to increase process productivity and quality in milling of aerospace critical safety components requires advanced investigations of the monitoring techniques. This is focussed on the detection and prediction of the occurrence of process malfunctions at both of tool (e.g. wear/chipping of cutting edges) and workpiece surface integrity (e.g. material drags, laps, pluckings) levels. Acoustic emission (AE) has been employed predominantly for tool condition monitoring of continuous machining operations (e.g. turning, drilling), but relatively little attention has been paid to monitor interrupted processes such as milling and especially to detect the occurrence of possible surface anomalies.This paper reports for the first time on the possibility of using AE sensory measures for monitoring both tool and workpiece surface integrity to enable milling of “damage-free” surfaces. The research focussed on identifying advanced monitoring techniques to enable the calculation of comprehensive AE sensory measures that can be applied independently and/or in conjunction with other sensory signals (e.g. force) to respond to the following technical requirements: (i) to identify time domain patterns that are independent from the tool path; (ii) ability to “calibrate” AE sensory measures against the gradual increase of tool wear/force signals; (iii) capability to detect workpiece surface defects (anomalies) as result of high energy transfer to the machined surfaces when abusive milling is applied.Although some drawbacks exist due to the amount of data manipulation, the results show good evidence that the proposed AE sensory measures have a great potential to be used in flexible and easily implementable solutions for monitoring tool and/or workpiece surface anomalies in milling operations.     

Vitreous bond silicon carbide wheel for grinding of silicon nitride

This study investigates the grinding of sintered silicon nitride using a SiC wheel with a fine abrasive grit size and dense vitreous bond. The difference of hardness between the green SiC abrasive and sintered Si₃N₄ workpiece (25.5 vs. 13.7 GPa) is small. Large grinding forces, particularly the specific tangential grinding forces, are observed in SiC grinding of Si₃N₄. The measured specific grinding energy is high, 400–6000 J/mm³, and follows an inverse relationship relative to the maximum uncut chip thickness as observed in other grinding studies. The SiC wheel wears fast in grinding Si₃N₄. The G-ratio varies from 2 to 12. Two unique features in SiC grinding of Si₃N₄ are the trend of increasing G-ratio at higher material removal rate and the excellent surface integrity, with 0.04–0.1 μm R_a and no visible surface damage. For a specific material removal rate, surface cracks along the grinding direction are generated on the ground surface. The problem of chatter vibration was identified at high material removal rates. Periodic and uneven wheel loading marks and clusters of workpiece surface cracks across the grinding direction could be observed at high material removal rates. This study demonstrates that the SiC grinding wheel can be utilized for precision form grinding of Si₃N₄ to achieve good surface integrity under a limited material removal rate.     

High speed versus conventional grinding in high removal rate machining of alumina and alumina–titania

High removal rate (up to 16.6 mm³/s per mm) grinding of alumina and alumina–titania was investigated with respect to material removal and basic grinding parameters using a resin-bond 160 μm grit diamond wheel at the speeds of 40 and 160 m/s, respectively. The results show that the material removal for the single-phase polycrystalline alumina and the two-phase alumina–titania composite revealed identical mechanisms of microfracture and grain dislodgement under the grinding conditioned selected. There were no distinct differences in surface roughness and morphology for both materials ground at either conventional or high speed. An increase in material removal rate did not necessarily worsen the surface roughness for the two materials at both speeds. Also the grinding forces for the two ceramics demonstrated similar characteristics at any grinding speeds and specific removal rates. Both normal and tangential grinding forces and their force ratios at the high speed were lower than those at the conventional speed, regardless of removal rates. An increase in specific removal rate caused more rapid increases in normal and tangential forces obtained at the conventional grinding speed than those at the high speed. Furthermore, it is found that the high speed grinding at all the removal rates exerted a great amount of coolant-induced normal forces in grinding zone, which were 4–6 times higher than the pure normal grinding forces.     

Servo scanning 3D micro-EDM based on macro/micro-dual-feed spindle

Using the end discharge of micro-rod-shaped electrode to scan layer by layer, micro-electrical discharge machining (EDM) can fabricate complex 3D micro-structures. During the machining process, the discharge state is broken frequently due to the wear of the tool electrode and the relative scanning motion. To keep a favorable discharge gap, the feed spindle of the tool electrode needs the characteristics of high-frequency response and high resolution. In this study, an experimental system with a macro/micro-dual-feed spindle was designed to improve the machining performance of servo scanning 3D micro-EDM (3D SSMEDM), which integrates an ultrasonic linear motor as the macro-drive and a piezoelectric (PZT) actuator as micro-feeding mechanism. Based on LabVIEW and Visual C++ software platform, a real-time control system was developed to control coordinately the dual-feed spindle to drive the tool electrode. The micro-feed motor controls the tool electrode to keep the favorable discharge gap, and the macro-drive motor realizes long working range by a macro/micro-feed conversion. The emphasis is paid on the process control of the 3D SSMEDM based on macro/micro-dual-feed spindle for higher machining accuracy and efficiency. A number of experiments were carried out to study the machining performance. According to the numerical control (NC) code, several typical 3D micro-structures have been machined on the P-doped silicon chips. Our study results show that the machining process is stable and the regular discharge ratio is higher. Based on our fundamental machining experiments, some better-machined effects have been gained as follows. By machining a micro-rectangle cavity (960 μm×660 μm), the machined depth error can be controlled within 2%, the XY dimensional error is within 1%, the surface roughness R_a reaches 0.37 μm, and the material removal rate is about 1.58×10⁴ μm³/s by using a tool electrode of Φ=100 μm in diameter. By machining multi-micro-triangle cavities (side length 700 μm), it is known that the machining repeatability error is <0.7%.     

Study of precision micro-holes in borosilicate glass using micro EDM combined with micro ultrasonic vibration machining

Because of its excellent anodic bonding property and surface integrity, borosilicate glass is usually used as the substrate for micro-electro mechanical systems (MEMS). For building the communication interface, micro-holes need to be drilled on this substrate. However, a micro-hole with diameter below 200 μm is difficult to manufacture using traditional machining processes. To solve this problem, a machining method that combines micro electrical-discharge machining (MEDM) and micro ultrasonic vibration machining (MUSM) is proposed herein for producing precise micro-holes with high aspect ratios in borosilicate glass. In the investigations described in this paper, a circular micro-tool was produced using the MEDM process. This tool was then used to drill a hole in glass using the MUSM process. The experiments showed that using appropriate machining parameters; the diameter variations between the entrances and exits (DVEE) could reach a value of about 2 μm in micro-holes with diameters of about 150 μm and depths of 500 μm. DVEE could be improved if an appropriate slurry concentration; ultrasonic amplitude or rotational speed was utilized. In the roundness investigations, the machining tool rotation speed had a close relationship to the degree of micro-hole roundness. Micro-holes with a roundness value of about 2 μm (the max. radius minus the min. radius) could be obtained if the appropriate rotational speed was employed.     

Application potential of coarse-grained diamond grinding wheels for precision grinding of optical materials

Fine-grained resin bonded diamond tools are often used for ultra-precision machining of brittle materials to achieve optical surfaces. A well-known drawback is the high tool wear. Therefore, grinding processes need to be developed exhibiting less wear and higher profitability. Consequently, the presented work focuses on conditioning a mono-layered, coarse-grained diamond grinding wheel with a spherical profile and an average grain size of 301 µm by combining a thermo-chemical and a mechanical-abrasive dressing technique. This processing leads to a run-out error of the grinding wheel in a low-micrometer range. Additionally, the thermo-chemical dressing leads to flattened grains, which supports the generation of hydrostatic pressure in the cutting zone and enables ductile-mode grinding of hard and brittle materials. After dressing, the application characteristics of coarse-grained diamond grinding wheels were examined by grinding optical glasses, fused silica and glass–ceramics in two different kinematics, plunge-cut surface grinding and cross grinding. For plunge-cut surface grinding, a critical depth of cut and surface roughness were determined and for cross-grinding experiments the subsurface damage was analyzed additionally. Finally, the identified parameters for ductile-machining with coarse-grained diamond grinding wheels were used for grinding a surface of 2000 mm² in glass–ceramics.     

Runout effects in milling: Surface finish, surface location error, and stability

This paper investigates the effect of milling cutter teeth runout on surface topography, surface location error, and stability in end milling. Runout remains an important issue in machining because commercially-available cutter bodies often exhibit significant variation in the teeth/insert radial locations; therefore, the chip load on the individual cutting teeth varies periodically. This varying chip load influences the machining process and can lead to premature failure of the cutting edges. The effect of runout on cutting force and surface finish for proportional and non-proportional tooth spacing is isolated here by completing experiments on a precision milling machine with 0.1 μm positioning repeatability and 0.02 μm spindle error motion. Experimental tests are completed with different amounts of radial runout and the results are compared with a comprehensive time-domain simulation. After verification, the simulation is used to explore the relationships between runout, surface finish, stability, and surface location error. A new instability that occurs when harmonics of the runout frequency coincide with the dominant system natural frequency is identified.