INDEP approach for leakage reduction in nanoscale CMOS circuits

Complementary metal oxide semiconductor (CMOS) technology scaling for improving speed and functionality turns leakage power one of the major concerns for nanoscale circuits design. The minimization of leakage power is a rising challenge for the design of the existing and future nanoscale CMOS circuits. This paper presents a novel, input-dependent, transistor-level, low leakage and reliable INput DEPendent (INDEP) approach for nanoscale CMOS circuits. INDEP approach is based on Boolean logic calculations for the input signals of the extra inserted transistors within the logic circuit. The gate terminals of extra inserted transistors depend on the primary input combinations of the logic circuits. The appropriate selection of input gate voltages of INDEP transistors are reducing the leakage current efficiently along with rail to rail output voltage swing. The important characteristic of INDEP approach is that it works well in both active as well as standby modes of the circuits. This approach overcomes the limitations created by the prevalent current leakage reduction techniques. The simulation results indicate that INDEP approach mitigates 41.6% and 35% leakage power for 1-bit full adder and ISCAS-85 c17 benchmark circuit, respectively, at 32 nm bulk CMOS technology node.     

Process variation aware dual-Vth assignment technique for low power nanoscale CMOS design

This paper presents a novel sensitivity-based, transistor-level, dual threshold voltage (V_th) assignment technique for the design of low power nanoscale CMOS circuits. The proposed technique is based on the Plackett-Burman Design of Experiment method (PB-DOE) in which sensitivity of each transistor to delay variation due to change in its V_th is obtained. The various paths in the circuit are categorized into process sensitive and process-insensitive paths. Transistors in the process sensitive paths are assigned a high V_th to reduce the leakage power without affecting performance. The application of the proposed technique to ISCAS-85 C17 benchmark circuit shows 20% reduction in the leakage power as compared to conventional gate-level dual-V_th assignment technique. Moreover, it is shown that the proposed algorithm can be easily extended to assign dual gate length circuits to achieve a further 20% reduction in the leakage power. The robustness of the proposed technique against process variations is demonstrated with extensive Monte Carlo Simulations. The versatility of the proposed approach to reduce the leakage power for a general CMOS circuit is demonstrated using a Manchester carry chain adder.     

Estimation of delay variations due to random-dopant fluctuations in nanoscale CMOS circuits

In nanoscale CMOS circuits the random dopant fluctuations (RDF) cause significant threshold voltage (Vt) variations in transistors. In this paper, we propose a semi-analytical estimation methodology to predict the delay distribution [Mean and Standard Deviation (STD)] of logic circuits considering Vt variation in transistors. The proposed method is fast and can be used to predict delay distribution in nanoscale CMOS technologies both at the circuit and the device design phase. The method is applied to predict the delay distributions in different logic gates and flip-flops and is verified with detail Monte Carlo simulations. It is observed that a 30% spread (STD/Mean) in Vt variation results in 5% spread in the delay of logic gates (inverter, NAND, etc.). The effect of Vt variation due to RDF is more significant in the setup time (STD/Mean = 11%) and clock-to-output delay (STD/Mean = 5% to 25%) of flip-flops.     

LECTOR: a technique for leakage reduction in CMOS circuits

In CMOS circuits, the reduction of the threshold voltage due to voltage scaling leads to increase in subthreshold leakage current and hence static power dissipation. We propose a novel technique called LECTOR for designing CMOS gates which significantly cuts down the leakage current without increasing the dynamic power dissipation. In the proposed technique, we introduce two leakage control transistors (a p-type and a n-type) within the logic gate for which the gate terminal of each leakage control transistor (LCT) is controlled by the source of the other. In this arrangement, one of the LCTs is always "near its cutoff voltage" for any input combination. This increases the resistance of the path from V/sub dd/ to ground, leading to significant decrease in leakage currents. The gate-level netlist of the given circuit is first converted into a static CMOS complex gate implementation and then LCTs are introduced to obtain a leakage-controlled circuit. The significant feature of LECTOR is that it works effectively in both active and idle states of the circuit, resulting in better leakage reduction compared to other techniques. Further, the proposed technique overcomes the limitations posed by other existing methods for leakage reduction. Experimental results indicate an average leakage reduction of 79.4% for MCNC'91 benchmark circuits.     

A reliable ground bounce noise reduction technique for nanoscale CMOS circuits

Power gating is the most effective method to reduce the standby leakage power by adding header/footer high-V_TH sleep transistors between actual and virtual power/ground rails. When a power gating circuit transitions from sleep mode to active mode, a large instantaneous charge current flows through the sleep transistors. Ground bounce noise (GBN) is the high voltage fluctuation on real ground rail during sleep mode to active mode transitions of power gating circuits. GBN disturbs the logic states of internal nodes of circuits. A novel and reliable power gating structure is proposed in this article to reduce the problem of GBN. The proposed structure contains low-V_TH transistors in place of high-V_TH footer. The proposed power gating structure not only reduces the GBN but also improves other performance metrics. A large mitigation of leakage power in both modes eliminates the need of high-V_TH transistors. A comprehensive and comparative evaluation of proposed technique is presented in this article for a chain of 5-CMOS inverters. The simulation results are compared to other well-known GBN reduction circuit techniques at 22 nm predictive technology model (PTM) bulk CMOS model using HSPICE tool. Robustness against process, voltage and temperature (PVT) variations is estimated through Monte-Carlo simulations.     

Dynamic SVL and body bias for low leakage power and high performance in CMOS digital circuits

In this article, a new complementary metal oxide semiconductor design scheme called dynamic self-controllable voltage level (DSVL) is proposed. In the proposed scheme, leakage power is controlled by dynamically disconnecting supply to inactive blocks and adjusting body bias to further limit leakage and to maintain performance. Leakage power measurements at 1.8?V, 75°C demonstrate power reduction by 59.4% in case of 1?bit full adder and by 43.0% in case of a chain of four inverters using SVL circuit as a power switch. Furthermore, we achieve leakage power reduction by 94.7% in case of 1?bit full adder and by 91.8% in case of a chain of four inverters using dynamic body bias. The forward body bias of 0.45?V applied in active mode improves the maximum operating frequency by 16% in case of 1?bit full adder and 5.55% in case of a chain of inverters. Analysis shows that additional benefits of using the DSVL and body bias include high performance, low leakage power consumption in sleep mode, single threshold implementation and state retention even in standby mode.     

DOIND: a technique for leakage reduction in nanoscale domino logic circuits

A novel DOIND logic approach is proposed for domino logic, which reduces the leakage current with a minimum delay penalty. Simulation is performed at 70 nm technology node with supply voltage 1V for domino logic and DOIND logic based AND, OR, XOR and Half Adder circuits using the tanner EDA tool. Simulation results show that the proposed DOIND approach decreases the average leakage current by 68.83%, 66.6%, 77.86% and 74.34% for 2 input AND, OR, XOR and Half Adder respectively. The proposed approach also has 47.76% improvement in PDAP for the buffer circuit as compared to domino logic.     

A subthreshold low-power CMOS LC-VCO with high immunity to PVT variations

This paper presents a current driver with a novel high voltage (HV) switch schematic for the use as a protective switch for recording circuits during the stimulation sequence in neural measurement system. The current driver can source and sink currents of amplitudes up to ±8.2 mA with a HV tolerance from 30 V up to 120 V. The proposed HV switch also tolerates the voltage difference up to 120 V between its terminals. Between stimulation sequences the driver provides the effective isolation of the stimulation electrode from ground and HV supply voltage. The inter pulse current is no more than 60 pA. The chip was fabricated with AMS HV 0.35 \(\mu\)m CMOS technology. For test purposes the complete stimulation system including the proposed chip and the external C8051F410 controller was build. For the proposed system the mismatch between the sourced and sinked current does not exceed 20 \(\mu\)A. The possibility to stimulate with frequencies up to 1 kHz is proven by measurement along with the electrode-tissue model.     

Design and analysis of a 32 nm PVT tolerant CMOS SRAM cell for low leakage and high stability

A novel nine transistor (9T) CMOS SRAM cell design at 32 nm feature size is presented to improve the stability, power dissipation, and delay of the conventional SRAM cell along with detailed comparisons with other designs. An optimal transistor sizing is established for the proposed 9T SRAM cell by considering stability, energy consumption, and write-ability. As a complementary hardware solution at array-level, a novel write bitline balancing technique is proposed to reduce the leakage current. By optimizing its size and employing the proposed write circuit technique, 33% power dissipation saving is achieved in memory array operation compared with the conventional 6T SRAM based design. A new metric that comprehensively captures all of these figures of merit (and denoted to as SPR) is also proposed; under this metric, the proposed 9T SRAM cell is shown to be superior to all other cell configurations found in the technical literatures. The impact of the process variations on the cell design is investigated in detail. HSPICE simulation shows that the 9T SRAM cell demonstrates an excellent tolerance to process variations comparing with the conventional SRAM cells.     

Impact of gate induced drain leakage on overall leakage ofsubmicrometer CMOS VLSI circuits

In this paper, the impact of gate induced drain leakage (GIDL) on the overall leakage of submicrometer VLSI circuits is studied. GIDL constitutes a serious constraint, with regards to off-state current, in scaled down complimentary metal-oxide-semiconductor (CMOS) devices for DRAM and/or EEPROM applications. Our research shows that the GIDL current is also a serious problem in scaled CMOS digital VLSI circuits. We present the experimental and simulation data of GIDL current as a function of 0.35-μm CMOS technology parameters and layout of CMOS standard cells. The obtained results show that a poorly designed standard cell library for VLSI application may result in extremely high leakage current and poor yield     

Variability aware low leakage reliable SRAM cell design technique

This paper presents a technique for designing a low power SRAM cell. The cell achieves low power dissipation due to its series connected drivers driven by bitlines and read buffers which offer stack effect. The paper investigates the impact of process, voltage, and temperature (PVT) variations on standby leakage and finds appreciable improvement in power dissipation. It also estimates read/write delay, read stability, write-ability, and compares the results with that of standard 6T SRAM cell. The comparative study based on Monte Carlo simulation exhibits appreciable improvement in leakage power dissipation and other design metrics at the expense of 84% area overhead.     

一种新的低功耗CMOS三值电路设计

提出一种新的静态电压型CMOS三值电路设计方案.该方案具有电路结构规则,输入信号负载对称等特点,是一种具有互补输入-输出的双轨三值逻辑电路.由于电路中同时采用pMOS和nMOS两种传输管,从而保证了输出信号具有完整的逻辑摆幅和高噪声容限.尤为重要的是该设计方案是基于标准CMOS工艺而无需修改阈值电压,且结构较简单.采用0.25μm CMOS工艺参数及3V电源的计算机模拟结果同时表明所提出的电路设计具有高速及低功耗的特点.     

High performance low power CMOS dynamic logic for arithmetic circuits

This paper presents the design of high performance and low power arithmetic circuits using a new CMOS dynamic logic family, and analyzes its sensitivity against technology parameters for practical applications. The proposed dynamic logic family allows for a partial evaluation in a computational block before its input signals are valid, and quickly performs a final evaluation as soon as the inputs arrive. The proposed dynamic logic family is well suited to arithmetic circuits where the critical path is made of a large cascade of inverting gates. Furthermore, circuits based on the proposed concept perform better in high fanout and high switching frequencies due to both lower delay and dynamic power consumption. Experimental results, for practical circuits, demonstrate that low power feature of the propose dynamic logic provides for smaller propagation time delay (3.5 times), lower energy consumption (55%), and similar combined delay, power consumption and active area product (only 8% higher), while exhibiting lower sensitivity to power supply, temperature, capacitive load and process variations than the dynamic domino CMOS technologies.     

Threshold voltage mismatch and intra-die leakage current in digital CMOS circuits

Due to device and voltage scaling scenarios for present and future deep-submicron CMOS technologies, it is inevitable that the off-state current (I/sub off/) of MOSFET transistors increases as the technology minimum dimensions scale down. Experimental evidence shows that the leakage current distribution of modern deep-submicron designs not only has a higher mean value but it also presents a larger variability as well. In this paper, we investigate the impact of threshold voltage mismatch as one plausible source for this increased variability. In digital circuit design, it is commonly assumed that the threshold voltage difference (mismatch) of static CMOS cells is negligible. However, threshold voltage mismatch (/spl Delta/V/sub to/) has a two-sided effect on the off-state current. Namely, the total cell's current can increase or decrease depending upon the direction of the V/sub t/ mismatch shift. This effect can be so severe that I/sub off/ can increase by more than one order of magnitude with respect to its nominal value due only to V/sub to/ mismatch. We further show through experimental results that the V/sub to/ mismatch of paired transistors working in the subthreshold regime can be worse by a factor of two as compared to transistors working in the saturation or linear regions. A factor of two larger spread is obviously quite devastating in terms of area, speed, and power consumption, should it be desired to attain the same I/sub off/ level as for a V/sub to/ mismatch characterized out of the subthreshold regime.     

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

High leakage current in deep-submicrometer regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, the identification and modeling of different leakage components is very important for estimation and reduction of leakage power, especially for low-power applications. This paper reviews various transistor intrinsic leakage mechanisms, including weak inversion, drain-induced barrier lowering, gate-induced drain leakage, and gate oxide tunneling. Channel engineering techniques including retrograde well and halo doping are explained as means to manage short-channel effects for continuous scaling of CMOS devices. Finally, the paper explores different circuit techniques to reduce the leakage power consumption.     

Optimization and CMOS design of chaotic oscillators robust to PVT variations: INVITED

Edward Lorenz was an early pioneer of the chaos theory. He discovered that small changes in initial conditions produce large changes in long-term outcome, and introduced a chaotic attractor already known as Lorenz chaotic oscillator, which produces a butterfly-like behavior. This and all kinds of continuous-time chaotic oscillators can be simulated with different numerical methods. However, a bad choice of the step size and/or parameters of the mathematical models can produce errors or even mitigate the chaotic behavior. These issues are related to the main property of chaotic oscillators, the high sensitivity to the initial conditions, which is quantified by evaluating the maximum Lyapunov exponent (MLE). The Lorenz and other representative oscillators like Lü, Chua's circuit and Rössler have been implemented using different discrete electronic devices and few ones with integrated circuits (IC) using CMOS technologies. Designing CMOS chaotic oscillators is challenging because a very small variation in their parameters from their mathematical models or in the sizes of the MOS transistors may suppress the chaotic behavior. This article describes how to perform a successful simulation and optimization, and how to synthesize the mathematical models using CMOS technology. The application of metaheuristics to optimize MLE by varying the parameters of the oscillators, and the optimization of the CMOS IC design to guarantee robustness to process, voltage and temperature (PVT) variations, are discussed. Finally, we discuss issues on the application of chaos generators in random number generators, robotics and chaotic secure communication systems.     

低电压下CMOS数字电路概率模型研究

为解决数字电路低功耗问题,电路工作电压被不断降低,导致电路逻辑器件呈现概率特性。本文提出了低电压下CMOS数字电路的错误概率模型,并完成硬件电路测试验证。本文首先详述了深亚微米（DSM）量级的门电路及模块在低电压供电条件下导致器件出错的因素,结合概率器件结构模型推导基本逻辑门概率模型,并提出了状态转移法用于完成由门级到模块级的概率分析模型;我们搭建硬件平台对CMOS逻辑芯片进行了低供电压测试,通过分析理论推导结果与实测结果,验证并完善了分析模型。实验结果表明,由状态转移法推导的电路概率模型符合电路实际性能,从而为构建低电压下数字电路概率模型提供了可靠分析模型。      

Correction to: A subthreshold low-power CMOS LC-VCO with high immunity to PVT variations

This paper presents a capacitor-free low dropout (LDO) linear regulator based on a dual loop topology. The regulator utilizes two feedback loops to satisfy the challenges of hearing aid devices, which include fast transient performance and small voltage spikes under rapid load-current changes. The proposed design works without the need of a decoupling capacitor connected at the output and operates with a 0–100 pF capacitive load. The design has been taped out in a \(0.18\,\upmu \hbox {m}\) CMOS process. The proposed regulator has a low component count, area of \(0.012\, \hbox {mm}^2\) and is suitable for system-on-chip integration. It regulates the output voltage at 0.9 V from a 1.0–1.4 V supply. The measured results for a current step load from 250 to 500 \(\upmu \hbox {A}\) with a rise and fall time of \(1.5\,\upmu \hbox {s}\) are an overshoot of 26 mV and undershoot of 26 mV with a settling time of \(3.5\,\upmu \hbox {s}\) when \({C_L}\) between 0 and 100 pF. The proposed LDO regulator consumes a quiescent current of only \(10.5\,\upmu \hbox {A}\). The design is suitable for application with a current step edge time of 1 ns while maintaining \(\Delta V_{out}\) of 64 mV.