毫米波准光腔双层介质电介质参数测量新技术

提出了一种利用毫米波准光腔测量双层介质电个质参数的新技术．在８毫米波段，建立了一套准光腔测量系统，并对几种双层介质样品进行了实际测量．     

微扰用介质薄片介电常数的精确测量

本文介绍作为平面结构慢波系统耦合阻抗测量用的介质薄片(云母片,陶瓷片等)介电常数ε_r的测量方法——谐振微扰法;并考虑到测试腔耦合元件电纳对测量结果的影响,提出了修正公式。在三厘米波段,对几种介质薄片进行了实际测量,并与传输线驻波比法进行了比较。这种测量方法还适用于各种半导体材料薄膜介电特性的测量。     

用复合谐振腔法测量介质谐振器材料的介电特性

本文根据Barlow提出的在TE(01n)模谐振腔上耦合一段截止波导构成复合腔的原理，首次在C波段对介质谐振器材料的介电性能进行了测量，并从理论上证明了该方法对相对介电系数有很高的测试灵敏度，本文给出了几种介质谐振器材料的测试结果，最后就样品厚度对测试精度的影响作了分析。     

用复合谐振腔法测量介质谐振器的介电特性

本文根据Ｂａｒｌｏｗ提出的在ＴＥ０１ａ模谐振腔上耦合一段截止波导的构成复合腔的原理，首次在Ｃ波段地介质谐振器材料的介电性能进行了测量，并从理论上证明了该方法对相对介电系数有很高的测试灵敏度，本文给出了几种介质谐振器材料的测试结果，最后就样品厚度对测试精度的影响了分析。     

单轴应力下热氧化SiO_2的介电电致伸缩系数研究

微机电系统和集成电路中常用的热氧化SiO2是各向同性材料,研究了其在单轴应力场中介电常数的变化规律。依据介质在自由和束缚两种边界条件下受到单轴应力作用产生的应变不同,从电动力学基本关系出发推导了各向同性电介质两种边界下的介电电致伸缩系数计算公式,表明介电电致伸缩系数是与电介质的初始介电常数、杨氏模量和泊松比有关的常数。计算得到热氧化SiO2薄膜在自由和束缚条件下的介电电致伸缩系数M12分别为-0.143×10-21和-0.269×10-21 m2/V2。搭建了基于三维微动台的微位移加载系统,测量了在单轴应力下微悬臂梁SiO2薄膜电容的变化,测量得到热氧化SiO2薄膜的M12为(-0.19±0.01)×10-21 m2/V2,表明实际SiO2薄膜介质层的边界条件处于自由和束缚之间。     

梯度多层BST薄膜介电性能研究

成分梯度多层钛酸锶钡薄膜具有较好的综合介电性能,包括适中的介电常数、高的介电调谐率、低的介质损耗及低的介电温度系数等,日益成为微波调制器件如移相器、滤波器、谐振器等的重要候选薄膜材料。就国内外近年来取得的重要成果进行了综述,对今后成分梯度多层BST薄膜的研究前景及方向进行了展望。     

铁电态-顺电态双层薄膜的高介电调谐

基于Landau-Devonshire自由能理论建立了热力学模型,对生长在(001)SrTiO3衬底上的PbZr0.4Ti0.6O3(PZT)/SrTiO3(STO)双层异质外延结构铁电薄膜以及不受约束的双层薄膜的介电响应与调谐率进行了研究。结果表明,在两层薄膜为无约束的自由薄膜情况下,STO厚度占双层薄膜总厚度的百分比为30%时,相对介电响应达到最大值约3.3×105,当两薄膜为异质外延结构时,其百分比为51%时,相对介电响应达到最大值约4×105。同时,调谐率还随外加电场的增大而增大,在临界百分比时,调谐率可达到约99%。     

S0l—Gel法制备BST铁电薄膜及其性能分析

用SoI—Gel法制备出表面致密，界面清晰的BST铁电薄膜。分析了BST薄膜的J-V特性，由于使用了不同的上下电极，导致J—V曲线的不对称，且在外延生长的Pt电极上制备的BST薄膜有较低的漏电流。分别在大气和干燥气氛下测量了BST薄膜的介电特性，分析结果表明：湿度对BST薄膜的介电特性有很大的影响,为了得到正确的介电特性，其测量必须在真空或干燥气氛下进行。     

BST薄膜非线性特性及机理研究

钛酸锶钡(BaxSr1-xTiO3,简称BST)薄膜具有非线性强、漏电流小、居里温度可调等特点,因而在介质移相器、压控滤波器等方面有着广泛的应用前景。笔者对BaxSr1-xTiO3(x=0.45~0.90)系列陶瓷的晶体结构和介电性能、膜厚均匀性控制、BST薄膜的微结构(包括组成、晶体结构和电畴等)和介电非线性尺度效应、铁电薄膜介电非线性模型、薄膜型介质移相器的设计和制作等重要问题进行了研究,取得了以下研究结果:通过研究靶基中心不重合的磁控溅射系统,建立了平面磁控溅射膜厚分布的数学模型,提出了采用T=∫Ld(x,y)ds=∫0td(ξ(t),ψ(t))ξ'2(t)+ψ'2(t)dt来描述靶基中心不重合的平面磁控溅射的膜厚分布情况。在靶基距为72mm、公自转转速比为5.3的条件下,采用自行设计的射频磁控溅射设备和φ100mm靶材制备的BST薄膜膜厚均匀性偏差为2.8%。采用压电力显微镜(PFM)研究了BST薄膜中电畴的类型和尺寸。不仅证实BST薄膜中存在90°铁电畴,而且确定了BST薄膜由多畴转变为单畴结构的晶粒临界尺寸(单畴临界尺寸)为31nm左右。通过研究BST薄膜的介电非线性尺度效应,发现晶粒尺寸和膜厚对薄膜的介电非线性具有重要的作用。随着晶粒尺寸和膜厚的增加,BST薄膜的介电系数、介电系数变化率都逐渐增大。晶粒尺寸对单畴态薄膜的介电系数电压变化率和矫顽场强影响特别显著,而对多畴态薄膜的介电系数电压变化率和矫顽场强影响不明显。在上述实验研究的基础上,对铁电材料的介电非线性机理进行了研究。首先,从简单、实用的角度出发写出表征P(E)和ε(E)非线性的数学多项式,根据介电偏压特性曲线和电滞回线的特征值和连续性原理,给出边界条件和初始条件,解出表达式中的各项系数,从而建立了铁电晶体的介电非线性模型。然后,采用理想的晶粒–晶界几何模型,画出铁电陶瓷材料的等效电路,引入晶粒和晶界的大小,从而建立了铁电陶瓷的介电非线性模型。再采用理想二极管等效界面势垒,得到薄膜型平板电容器等效电路,引入膜厚和界面厚度两个尺度变量,从而建立了铁电薄膜的介电非线性模型。最后,利用文献的数据和曲线对模型进行了验证,模拟得到的曲线与实验得到的曲线变化趋势基本一致,表明该模型可以较好地解释铁电材料(包括陶瓷和薄膜)的介电非线性特性及其随晶粒大小、膜厚和界面厚度等尺度变化的规律。对薄膜型介质移相器的设计、制作和测试进行了研究。采用ADS和HFSS软件进行仿真,设计出了分布式电容负载型铁电薄膜介质移相器的电路结构和各部分的尺寸;采用改进的剥离工艺,制作出了电极线条整齐的铁电薄膜介质移相器;采用矢量网络分析仪,在频率为35GHz、控制电压为40V条件下,测得介质移相器的移相度为180°,插损为9.7dB。     

MCM—D介质膜及通孔工艺技术

MCM—D中薄膜介质层主要是用于多层布线的层间绝缘及埋置电容器介质层。介质膜的制备及刻蚀工艺是（MCM—D）薄膜多层布线工艺的基础和关键技术。聚酰亚胺具有高热稳定性、低介电系数、良好的平坦性及可加工性，是用的最多的薄膜介质材料。本文通过对聚酰亚胺的选择、旋涂、固化工艺控制解决了聚酰亚胺介质膜的制备及稳定性难题。通过精确控制腐蚀时间来实现通孔的湿法刻蚀。     

高温超导微波电路衬底材料复介电常数的测量

本文讨论了在液氮温度下高温超导微波电路介质衬底材料复介电常数测试技术。利用TMono模高Q圆柱形谐振腔,对高温超导常用的几种单晶介质材料进行了测试。结果表明,该测试技术在不同温度下,可对低耗单晶和各向同性介质材料进行准确的测试,且测试简便、迅速、自动化程度高,具有测试介质材料某一方向复介电常数的优点。     

Multiferroic Bi 0.7Dy/ 0.3 FeO3 films as high k dielectric material for advanced non-volatile memory devices

Gate dielectric materials having high dielectric constant, low interface state density and good thermal stability are needed for advanced CMOS applications. In this letter, the electrical properties of novel multiferroic Bi_0.7Dy_0.3FeO₃ (BDFO) thin films deposited using the pulsed laser deposition technique on p-type (100) silicon substrate are reported. Using high frequency capacitance-voltage (C-V) measurements, the dielectric constant, effective oxide charge density and interface state density were estimated. The results suggest the potential application of multiferroic BDFO films as gate dielectric material for novel memory devices that can be electrically written and magnetically read.     

基片对SrTiO3薄膜结构与介电性能的影响

对比研究了MgO和LaAlO3(LAO)单晶基片上采用脉冲激光法生长的SrTiO3(STO)薄膜的微观结构和介电性能。通过XRD,AFM和制备叉指电容测量的方法研究发现,在MgO基片上生长高质量(00L)织构STO薄膜需要较高的生长温度;LAO基片上的STO薄膜更加平整;而MgO上的STO薄膜具有更高的零偏压介电常数和更强的非线性介电性质。     

Sol-Gel法制备BST铁电薄膜及其性能分析

用Sol-Gel法制备出表面致密,界面清晰的BST铁电薄膜。分析了BST薄膜的J-V特性,由于使用了不同的上下电极,导致J-V曲线的不对称,且在外延生长的Pt电极上制备的BST薄膜有较低的漏电流。分别在大气和干燥气氛下测量了BST薄膜的介电特性,分析结果表明:湿度对BST薄膜的介电特性有很大的影响,为了得到正确的介电特性,其测量必须在真空或干燥气氛下进行。     

Preparation and Dielectric Characteristics of Semitransparent CoFe2O4–P(VDF-TrFE) Nanocomposite Films

Polymer–ceramic nanocomposites play an important role in embedded capacitors. However, polymer–ceramic dielectrics are limited for commercial applications due to their low transmittance, poor adhesion, and poor thermal stress reliability at high filler loadings. Thus, materials design and processing is critical to prepare films with improved dielectric properties and low filler loading. In this work, we use a spin coating-assisted method to fabricate poly(vinylidene fluoride-co-trifluoroethylene) [P(VDF-TrFE)]–CoFe₂O₄ (CFO) nanocomposite films. Magnetic CFO nanoparticles in the size range of 10 nm to 40 nm were successfully synthesized using a hydrothermal process. The dispersion of the nanoparticles, the dielectric properties, and the transmittance of the nanocomposite films were studied. The dielectric constant of the nanocomposite films increased by about 45% over the frequency range of 100 Hz to 1 MHz, compared with that of pristine P(VDF-TrFE) film. Optical measurements indicated that the transmittance of the films remains above 60% in the visible range, indicating a relatively low content of CFO in the polymer matrix. Our experimental results suggest that spin coating-assisted dispersion may be a promising route to fabricate dielectric polymer–ceramic nanocomposite films of controllable thickness.     

Radio-frequency and microwave dielectric properties of insects.

Basic principles and definitions of dielectric properties of materials are presented. Data from the literature on the dielectric properties of insects are briefly reviewed and discussed in relation to insect control by selective dielectric heating. Because early measurements of the dielectric properties of insects were taken on bulk samples of insects (insect and air-space dielectric mixtures), a means for converting the dielectric properties, or permittivities, of bulk samples of particulate materials to those of the solid particles is described. The technique uses the Landau & Lifshitz, Looyenga dielectric mixture equation and information on the bulk densities of air-insect mixtures used for dielectric properties measurements along with the densities of the insects. Such converted data for the dielectric constants and loss factors of the insects are presented and collected for comparison with other measurements of insect tissues and permittivity determinations from more recent microwave measurements of these same parameters. Resulting data are presented for reference, and comparisons are presented and discussed briefly.     

Electrical characterization of AlN MIS and MIM structures

Aluminum nitride (AlN) thin films have been deposited on p-Si[100] and Mo-Si[100] substrates. The sputter deposited Mo was polycrystalline, predominantly showing a [110] orientation. Thin AlN films were grown under different process conditions in a physical vapor deposition (PVD) system to attain highly textured polycrystalline films as well as close to amorphous films. MIS and MIM structures were fabricated and electrical properties such as the dielectric constant, leakage current, and high-frequency behavior were investigated. It is found that the dielectric constant is 10 and does not change with the crystallinity of the films. High-frequency measurements up to 10 GHz show no frequency dispersion of the capacitance. The leakage current stays relatively constant between films and is believed to be Poole-Frenkel controlled. Capacitance-voltage (C-V) measurements for MIS structures revealed the presence of charges in the interface layer between the substrate and the dielectric film. The temperature dependence of the capacitance has also been studied.     

Tera Tool [terahertz time-domain spectroscopy]

The terahertz differential time-domain spectroscopic method is applied to characterize the dielectric and optical properties of a variety of thin films at terahertz frequency. The results of several samples including silicon dioxide, parylene-n polymer film, tantalum oxide film, and protein thin layer samples were presented. The dielectric property of silicon dioxide thin film is well fitted to that of a bulk. The dielectric properties of parylene-n thin films show good agreement with the result measured by the goniometric terahertz time-domain spectroscopy. The dielectric and optical properties of the tantalum oxide show reasonable data with previously available data. Some properties in thin films are slightly different from the bulk materials. The origin of this discrepancy is considered due to fine grain formation, mechanical stresses, formation of interfacial layers, or rough interfaces during thin-film deposition process. The terahertz differential time-domain spectroscopy may be applied to the measurement of the dielectric and optical properties of thin films (nanometer to micrometer) of several materials, which cannot be done by any other method.     

Effect of deposition methods on dielectric breakdown strength of PECVD low-k carbon doped silicon dioxide dielectric thin films

The effect of deposition methods on dielectric breakdown strength of PECVD low-k dielectric carbon doped silicon dioxide films is investigated. I-V measurements were performed using metal-insulator semiconductor structures for carbon doped silicon dioxide thin films with various thicknesses by single deposition station and six sequential deposition systems. I-t measurements are also performed for films with the thickness of 32 nm prepared using both deposition methods. Comparison studies have been carried out for the thickness dependence, temperature dependence, conduction mechanism and time dependence of dielectric breakdown for carbon doped silicon dioxide with single layer and six sub-layers. Results demonstrated that both films follow the newly obtained relationship between dielectric strength E_B and thickness d, i.e. E_B∝(d−d_c)⁻ⁿ, but with a lower exponential factor n and a larger thickness limit d_c for films with six sub-layers. It is also demonstrated that films with six sub-layers have a higher dielectric strength in all the thickness and temperature ranges, a thickness independent thermal behavior and a longer lifetime under constant voltage stressing. This indicates that by tuning the deposition methods smaller thickness with desired dielectric properties can be achieved.     

Porous organosilicates low-dielectric films for high-frequency devices

The dielectric properties are reported for nanoporous thin films of poly(methyl silsesquioxane) (MSSQ) for use as an ultralow, dielectric intermetal insulator. Direct experimental conformation is provided that the films have low dielectric constants with low loss up to 10 GHz. Low-frequency measurements are also reported.