Preparation,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and ¹H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Curing kinetics and properties of epoxy resin-fluorenyl diamine systems

Diglycidyl ether of bisphenol fluorene (DGEBF), 9,9-bis-(4-aminophenyl)-fluorene (BPF) and 9,9-bis-(3-methyl-4-aminophenyl)-fluorene (BMAPF) were synthesized to introduce more aromatic structures into the epoxy systems, and their chemical structures were characterized with FTIR, NMR and MS analyses. The curing kinetics of fluorenyl diamines with different epoxy resins including DGEBF, cycloaliphatic epoxy resin (TDE-85) and diglycidyl ether of bisphenol A (DGEBA) was investigated using non-isothermal differential scanning calorimetry (DSC), and determined by Kissinger, Ozawa and Crane methods. The thermal properties of obtained polymers were evaluated with dynamic mechanical thermal analysis (DMTA) and thermogravimetric analysis (TGA). The results show that the values of activation energy (E_a) are strongly dependent on the structures of epoxy resin and curing agent. The curing reactivity of epoxy system is restrained by the introduction of rigid fluorene into chain backbone and flexible methyl into side groups. The cured DGEBF/fluorenyl diamine systems exhibit remarkably higher glass transition temperature, better thermal stability and lower moisture absorption compared to those of DGEBA/fluorenyl diamine systems, and display approximate heat resistance and much better moisture resistance relative to those of TDE-85/fluorenyl diamine systems.     

Crystal structure,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) monomer was successfully synthesized and characterized in detail. The crystal structure of DGEBF was measured by single‐crystal X‐ray diffraction analysis. Curing kinetics of DGEBF with 4,4‐diaminodiphenyl sulfone (DDS), thermal properties, and decomposition kinetics were investigated using nonisothermal differential scanning calorimetry (DSC) according to Kissinger, Ozawa and Crane methods. The glass transition temperature (T_g), thermal properties of cured polymer were estimated by DSC, dynamic mechanical analysis, and thermogravimetric analyses. Epoxy value of DGEBF monomer up to theoretical value leads to higher crosslink density of cured polymers. The cured DGEBF/DDS system exhibited obvious higher T_g and better thermal stability compared to those of DGEBF/diamine systems reported previously. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

含芳醚芴二胺/环氧树脂固化反应动力学及性能研究

以9,9-双[4-4-氨基苯氧基苯基]芴(BAOFL)作为固化剂,采用非等温DSC技术,研究了BAOFL/环氧树脂(E-51、TDE-85和芴基环氧树脂)体系的固化反应动力学,利用动态热机械分析仪(DMA)和热重分析仪(TGA)测试了固化树脂的力学性能和热稳定性。结果表明,固化反应活化能与环氧树脂和固化剂的结构密切相关,芳醚的引入提高了氨基与环氧基的反应性,固化树脂呈现出优良的热性能和力学性能,其玻璃化转变温度(T)达到206~248℃,贮能模量为2.54~2.94 GPa,初始热分解温度312~375℃,700℃g时的残炭率达到15.2%~31.7%。()     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Low dielectric thermoset. I. Synthesis and properties of novel 2,6‐dimethyl phenol‐dicyclopentadiene epoxy

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant 2,6‐dimethyl phenol‐dicyclopentadiene novolac was epoxidized to 2,6‐dimethyl phenol‐dicyclopentadiene epoxy. The structures of novolac and epoxy were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis, mass spectroscopy (MS), nuclear magnetic resonance spectroscopy (NMR), and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol‐dicyclopentadiene epoxy was then cured with 4,4‐diaminodiphenyl methane (DDM), phenol novolac (PN), 4,4‐diaminodiphenyl sulfone (DDS), and 4,4‐diaminodiphenyl ether (DDE). Thermal properties of cured epoxy resins were studied by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermal gravimetric analysis (TGA). These data were compared with those of the commercial bisphenol A epoxy system. Compared with the bisphenol A epoxy system, the cured 2,6‐dimethyl phenol‐ dicyclopentadiene epoxy resins exhibited lower dielectric constants (～3.0 at 1 MHz and 2.8 at 1 GHz), dissipation factors (～0.007 at 1 MHz and 0.004 at 1 GHz), glass transition temperatures (140–188°C), thermal stability (5% degradation temperature at 382–404°C), thermal expansion coefficients [50–60 ppm/°C before glass‐transition temperature (T_g)], and moisture absorption (0.9–1.1%), but higher modulus (～2 Gpa at 60°C). © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2607–2613, 2003     

Morphology,thermal and mechanical performance of epoxy/polysulfone composites improved by curing with two different aromatic diamines

Epoxy/polysufone (PSF) composites cured with 4,4'-diaminodiphenyl sulfone (DDS) and 4,4'-diaminodiphenyl methane (DDM) were fabricated, and the effect of dual curing reaction of diamines with epoxy on morphology, mechanical, and thermal performance was investigated. DSC results indicated that DDM was more reactive than DDS and the activation energy decreased with the rising of DDM content. Structures with small domain size at the early stage of phase separation were fixed by the fast epoxy-DDM reaction. When the DDM content was elevated to a high level, large dual structures were changed to fine bicontinuous structures, which was favorable to improve the mechanical property. The mechanical performance of epoxy composites was enhanced and the maximum values were achieved when the DDM/DDS ratio was located at 75/25 (PSF/DDS0.25-DDM0.75). The flexural and tensile strength relative to epoxy/DDM system were enhanced more than those relative to epoxy/DDS, while the increase in toughness was the opposite. TGA measurement showed that thermal stability of epoxy/PSF composites was improved because of the restricting effect of continuous PSF domains on thermal motion of epoxy. DMA analysis exhibited two relaxation peaks for PSF/DDS0.25-DDM0.75, which could be attributed to the formation of phase separated morphology and epoxy network with different cross-link density.     

Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4′‐diglycidyl (3,3′,5,5′‐tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

A series of novel composites based on different ratios of epoxidised cresol novolac (ECN) and 4,4′‐diglycidyl(3,3′,5,5′‐tetramethylbiphenyl) epoxy resin (TMBP) have been prepared with the curing agent 4,4′‐methylenediamine (DDM) and 4,4′‐diaminodiphenylsulfone (DDS), respectively. The investigation of cure kinetics was performed by differential scanning calorimetry using an isoconversional method. The high thermal stabilities of the cured samples were also studied by thermogravimetric analysis. In addition, no phase separation was observed for cured ECN/DDM and ECN/DDS blending with different amounts of TMBP by dynamic mechanical analysis and scanning electron microscopy. Moreover, the cured systems also exhibited excellent impact properties and low moisture absorption. All the results indicate that the ECN/TMBP/DDM and ECN/TMBP/DDS systems are promising materials in electronic packaging. Copyright © 2011 Society of Chemical Industry     

Chemical recycling of glass fiber reinforced epoxy resin cured with amine using nitric acid

An approach to chemical recycling of amine cured epoxy resin using nitric acid solution has been proposed [Dang W, Kubouchi M, Yamamoto S, Sembokuya H, Tsuda K. Polymer 2002;43:2953-8. [1]]. 1,8-p-Menthanediamine cured bisphenol F type (BPF/MDA) epoxy resin was decomposed in nitric acid solution, and then the decomposed product was repolymerized with original resin. In this paper, applicability of the proposed approach to glass fiber reinforced bisphenol F type epoxy resin cured with diamino diphenyl methane (DDM) was investigated. It was concluded that the approach was applicable to BPF/DDM epoxy resin, and potentially to all of amine cured epoxy resin. Flexural strength of the recycled resin was higher than that of virgin resin until the content of the neutralized extract, which was available from degradation of BPF/DDM epoxy resin, was not more than 30 wt% of the original resin. The reinforcement of glass fiber could be separated and recovered. The existence of the reinforcement did not affect decomposition the matrix.     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and liquid oxygen compatibility of a phosphorous‐containing epoxy resin

A phosphorus‐containing epoxy resin was synthesized successfully by 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and bisphenol F epoxy resin (DGEBF) and its molecular structure was confirmed by FTIR spectra. The results of the liquid oxygen mechanical impact test indicated that the cured phosphorus‐containing epoxy resin did not show any reactions during the 20 times of mechanical impact, which revealed that it was compatible with liquid oxygen. Thermal properties of the cured epoxy resins were evaluated by differential scanning calorimetry and thermal gravimetric analysis. It was found that the cured phosphorus‐containing epoxy resin had a better thermal stability than DGEBF. The enhancement of thermal stability for the epoxy resin was favorable to improve liquid oxygen compatibility. The X‐ray photoelectron spectroscopy analysis confirmed that the mechanical impact resulted in phosphorus‐containing groups on the surface of the cured phosphorus‐containing epoxy resin thermally decomposed to form phosphoric oxyacid which was in accordance with the mechanism that organo‐phosphorus compounds could work in the condensed phase to inhibit the combustion. These results suggest that the phosphorus‐containing epoxy resin has the potential as the matrix of the liquid oxygen composite tank. POLYM. ENG. SCI., 55:651–656, 2015. © 2014 Society of Plastics Engineers     

New epoxy resins. I. The stability of epoxy–trialkoxyboroxines triaryloxyboroxine system

A polymer with high aromaticity and/or cyclic ring structures chain backbone usually has high heat, thermal, and flame resistance. Two diglycidyl ethers of bisphenols were prepared from 4,4′ isopropylidenediphenol (DGEBA) and 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) for evaluation. Four boroxines—trimethoxyboroxine (TMB), triethoxyboroxine (TEB), triisopropoxyboroxine (TIPB) and triphenoxyboroxine (TPB)—were used as the curing agents. DGEBA and DGEBF cured with various boroxines indicate that the trend for their respective glass transition temperature (T_g's), degradation temperatures (T_d's), and gel fractions are TMB-cured epoxy ≈ TEB-cured epoxy < TIPB cured epoxy < TPB cured epoxy. The DGEBF system usually has a higher T_g, T_d, gel fraction, oxygen index (OI), and char yield than the related DGEBA system. DGEBF/DGEBA (80/20 mol ratio) shows a synergistic effect in regard to char formation. This effect exists not only in the copolymer system but also in blended homopolymers of the separately cured resins. A modified mechanism for the polymerization of phenyl glycidyl ether (PGE) with TMB has been proposed.     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Rheological and thermal properties of epoxy nanocomposites reinforced with alkylated multi‐walled carbon nanotubes

The effects of functionalized multi‐walled carbon nanotubes (MWCNTs) on thermal and chemorheological behaviors of an epoxy‐based nanocomposite system were investigated. Chemical functionalization of MWCNTs by acid modification (A‐MWCNTs) and chemical amidation (D‐MWCNTs) was confirmed using Fourier transform infrared spectroscopy and thermogravimetric analysis. It was found that the D‐MWCNTs had a significant effect on the chemorheological behaviors of the epoxy‐based nanocomposite. Compared to the epoxy/A‐MWCNT nanocomposite, the epoxy/D‐MWCNTs nanocomposite showed a significant increase in gel time, as obtained from isothermal rheology measurements. Also, the storage modulus of the diglycidylether of bisphenol F (DGEBF)/D‐MWCNTs nanocomposite was higher than that of the DGEBF/D‐MWCNTs nanocomposite and gradually increased with an increase of frequency. This could be interpreted by the relatively strongly interconnected structure of the D‐MWCNTs in the DGEBF epoxy resin, which arises from the functionalized alkyl groups of the D‐MWCNTs in dispersion phases with the DGEBF epoxy resin. Copyright © 2012 Society of Chemical Industry     

Influence of molecular interactions on spherulite morphology in miscible poly(ethylene oxide)/epoxy network versus poly(ethylene oxide)/poly(4‐vinyl phenol) blend

Relationships between the spherulite morphology and changes in hydrogen‐bonding interactions between the linear poly(ethylene oxide) (PEO) polymer and a crosslinking epoxy system (diglycidylether of bisphenol‐A resin with 4,4′‐diaminodiphenylsulfone) (DGEBA/DDS) before and after cure have been explored The hydrogen‐bonding interaction is more significant before cure because of the interactions between the ether group of PEO and the amine group of DDS. The interaction between PEO and epoxy/DDS becomes less in the cured network. The morphology of the PEO crystals is, in turn, affected by the contents and chemical structures (functional groups, molecular weights, crosslinks, etc) of crosslinking epoxy/DDS. PEO/poly(4‐vinyl phenol) (PVPh), a thermoplastic non‐curing miscible system with the hydrogen bonding between the ether group of PEO and the ? OH group of PVPh, is also compared. In comparison with the PEO/epoxy/DDS system, the spherulite morphology of PEO/PVPh becomes more extensively spread out, with the extents increasing with the PVPh contents in the PEO/PVPh blend. © 2001 Society of Chemical Industry     

Synthesis and properties of phosphorus‐containing advanced epoxy resins. II

Two phosphorus‐containing diacids were synthesized from 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and either maleic acid or itaconic acid and then reacted with diglycidyl ether of bisphenol A (DGEBA) to form two series of advanced epoxy resins. Reaction conditions, such as reaction time, temperature and catalyst, are discussed in this article. After curing with 4,4'‐diaminodiphenyl sulfone (DDS), thermal properties of cured epoxy resins were studied using dynamic mechanical analysis (DMA) and thermal gravimetric analysis (TGA). The flame retardancy of cured epoxy resins was evaluated using a UL‐94 measurement. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 78: 228–235, 2000     

The Miscibility of Novel Bisphenol-Propylene Epoxy Resin With Liquid NBR

A novel kind of bisphenol-type epoxy resin with a vinyl side-chain was developed and its miscibility behavior with liquid nitrile-butadiene rubber (NBR) was investigated. The diglycidyl ether of bisphenol propylene (DGEBP) was prepared by the condensation of phenol with acrolein in the presence of an acid catalyst and the subsequent epoxidization with epichlorohydrin (ECH). The structures of the bisphenol and corresponding epoxy resin were characterized by infrared (IR) and nuclear magnetic resonance (NMR) spectral analyses and the epoxy value was determined to be 0.34 mol/100 g by titration. The mixture of DGEBP with the liquid NBR containing diglycidyl ether of bisphenol acetone (DGEBA) was prepared and cured with diaminodiphenylmethane (DDM). The miscibility and morphology of the mixture system were studied by dynamic mechanical thermal analysis (DMTA) and transmission electron microscopy (TEM), respectively. The cured mixture of DGEBP/NBR/DDM exhibited good miscibility and, therefore, no separation, along with a transparent appearance at rubber contents of 10 wt% and 30 wt%. For cured DGEBP/DGEBA/NBR/DDM systems at 20 wt% rubber content, the dispersed rubber phase and rubber particles were not observed by DMTA or TEM at DGEBP content above 40 wt%. The DMTA plot showed a single peak related to the glass transition temperature (T _g) which decreased with increasing DGEBP content. The appearance of the system varied from transparent to opaque and the rubber separated from the epoxy matrix to form two phases when the DGEBP content decreased. The T _g values of the rubber- and epoxy-rich phases were strongly dependent on the DGEBP content in the mixed system. The miscibility of epoxy resin with liquid NBR can be altered by varying the ratio of DGEBP to DGEBA.     

The boron trifluoride monoethyl amine complex cured epoxy resins

The curing exotherm pattern is affected by the equivalent ratio of curing agent, boron trifluoride monoethylamine complex (BF₃ · MEA), to epoxy resin. The diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) cures more slowly than the diglycidyl ether of bisphenol A (Epon 828). The glass transition temperatures (T_g's) of BF₃ · MEA cured Epon 828 are increased with inceasing concentration of curing agent (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450 eq./epoxy eq.) cured Epon 828 and DGEBF are almost equivalent 43 and 44 kcal/mol, respectively. DGEBF when added to DGEBA improves the T_g and char yield with the BF₃ · MEA curing system. The T_g of both resin systems can be increased by longer post cure, whereas the char yield does not appear to change significantly. No ester group formation is found for the BF₃ · MEA-cured DGEBF, although this has been previously reported for the DGEBA system. The BF₃ · MEA cure at 120°C is better than at 140°C because of vaporization and degradation of the curing agent at the higher temperature. The rapid gelation of the epoxy resin may be another reason for the lower degree of cure at high temperature.     

Synthesis, characterization and properties of tetramethyl stilbene-based epoxy resins for electronic encapsulation

Two novel tetramethyl stilbene-based novolac (II and IV) were synthesized from 2,6-dimethyl phenol and chloroacetaldehyde dimethylacetal or chloroacetone, and then the resulted novolacs were epoxidized to tetramethyl stilbene-based epoxy resins (III and V). The proposed structures were confirmed by FTIR, elemental analysis, mass spectra, NMR spectra and epoxy equivalent weight titration. The synthesized tetramethyl stilbene-based epoxy resins were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-diaminodiphenyl sulfone (DDS). Thermal properties of cured epoxy resins were studied using dynamic mechanical analyzer, differential scanning calorimeter, thermal expansion analyzer and thermal gravimetric analyzer (TGA). These data were compared with that of the commercial tetramethyl biphenol (TMBP) epoxy system. According to the experimental data, the order of T_g for cured epoxy system is III>TMBP>V. The order of moisture absorption for cured epoxy system is V<III<TMBP. According to TGA, the 5% degradation temperatures in nitrogen atmosphere were in the range 370-377 and 397-412 °C for DDM and DDS curing systems, respectively. In air atmosphere, the 5% degradation temperatures were in the range 372-385 and 410-411 °C for DDM and DDS curing systems, respectively. The CTE is in inverse order with T_g, therefore, III/DDS<TMBP/DDS<V/DDS.