Cure kinetics of epoxy resin used for advanced composites

The cure kinetics of an epoxy resin used for the preparation of advanced polymeric composite structures was studied by isothermal differential scanning calorimetry (DSC). A series of isothermal DSC runs provided information about the kinetics of cure over a wide temperature range. According to the heat evolution behavior during the curing process, several influencing factors of isothermal curing reactions were evaluated. The results showed that the isothermal kinetic reaction of this epoxy resin followed an autocatalytic kinetic mechanism. In the latter reaction stage, the curing reaction became controlled mainly by diffusion. Cure rate was then modeled using a modified Kamal autocatalytic model that accounts for the shift from a chemically controlled reaction to a diffusion‐controlled reaction. The model parameters were determined by a nonlinear multiple regression method. Copyright © 2004 Society of Chemical Industry     

Equivalent processing time analysis of glass transition development in epoxy/carbon fiber composite systems

The cure kinetics and glass transition development of a commercially available epoxy/carbon fiber prepreg system, DMS 2224 (Hexel F584), was investigated by isothermal and dynamic‐heating experiments. The curing kinetics of the model prepreg system exhibited a limited degree of cure as a function of isothermal curing temperatures seemingly due to the rate‐determining diffusion of growing polymer chains. Incorporating the obtained maximum degree of cure to the kinetic model development, the developed kinetic equation accurately described both isothermal and dynamic‐heating behavior of the model prepreg system. The glass transition temperature was also described by a modified DiBeneditto equation as a function of degree of cure. Finally, the equivalent processing time (EPT) was used to investigate the development of glass transition temperature for various curing conditions envisioning the internal stress buildup during curing and cooling stages of epoxy‐based composite processing. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 144–154, 2002; DOI 10.1002/app.10282     

Resin transfer molding (RTM) process of a high performance epoxy resin. I: Kinetic studies of cure reaction

The cure kinetics of a high performance PR500 epoxy resin in the temperature range of 160–197°C for the resin transfer molding (RTM) process have been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cure reaction and the degree of cure being determined under isothermal conditions. A modified Kamal's kinetic model was adapted to describe the autocatalytic and diffusion‐controlled curing behavior of the resin. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.     

Curing kinetics and viscosity change of a two‐part epoxy resin during mold filling in resin‐transfer molding process

The curing kinetics and the resulting viscosity change of a two‐part epoxy/amine resin during the mold‐filling process of resin‐transfer molding (RTM) of composites was investigated. The curing kinetics of the epoxy/amine resin was analyzed in both the dynamic and the isothermal modes with differential scanning calorimetry (DSC). The dynamic viscosity of the resin at the same temperature as in the mold‐filling process was measured. The curing kinetics of the resin was described by a modified Kamal kinetic model, accounting for the autocatalytic and the diffusion‐control effect. An empirical model correlated the resin viscosity with temperature and the degree of cure was obtained. Predictions of the rate of reaction and the resulting viscosity change by the modified Kamal model and by the empirical model agreed well with the experimental data, respectively, over the temperature range 50–80°C and up to the degree of cure α = 0.4, which are suitable for the mold‐filling stage in the RTM process. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 2139–2148, 2000     

Study of the effect of BDMA catalyst in the epoxy novolac curing process by isothermal DSC

Epoxy novolac/anhydride cure kinetics has been studied by differential scanning calorimetry under isothermal conditions. The system used in this study was an epoxy novolac resin (DEN431), with nadic methyl anhydride as hardener and benzyldimethylamine as accelerator. Kinetic parameters including the reaction order, activation energy and kinetic rate constants, were investigated. The cure reaction was described with the catalyst concentration, and a normalized kinetic model developed for it. It is shown that the cure reaction is dependent on the cure temperature and catalyst concentration, and that it proceeds through an autocatalytic kinetic mechanism. The curing kinetic constants and the cure activation energies were obtained using the Arrhenius kinetic model. A suggested kinetic model with a diffusion term was successfully used to describe and predict the cure kinetics of epoxy novolac resin compositions as a function of the catalyst content and temperature. Copyright © 2003 Society of Chemical Industry     

Kinetic study by FTIR,TMA, and DSC of the curing of a mixture of DGEBA resin and γ‐butyrolactone catalyzed by ytterbium triflate

A mixture of diglycidylether of bisphenol A (DGEBA) and γ‐butyrolactone (γ‐BL) was cured in the presence of ytterbium triflate as a catalyst. The kinetics of the various elemental processes that occur in the curing process were studied by means of isothermal curing in the FTIR spectrometer. The kinetics of the contraction during the curing was also evaluated by TMA. In both cases, the kinetics was analyzed by means of isoconversional procedure and the kinetic model was determined with the so‐called compensation effect (isokinetic relationship). The isothermal kinetic analysis was compared with that obtained by dynamic curing in DSC. We found that all the reactive processes and the contraction follow a surface‐controlled reaction type of kinetic mechanism, R₃. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 381–393, 2004     

Cure kinetics modeling and process optimization of the vialux 81 epoxy photodielectric dry film (PDDF) material for microvia applications

The cure kinetics of a photodielectric dry film (PDDF) material called ViaLux 81 has been studied, with the aim of understanding and optimizing its curing schedule for the fabrication of sequentially built‐up (SBU) high‐density‐interconnect printed wiring boards (HDI‐PWB). Initial dynamic differential scanning calorimetry (DSC) scans on the material revealed a two‐stage curing mechanism due to the long lifetime of the photoinitiator catalyst, which could not be separated at lower heating rates. On the other hand, the heat flow exotherm from isothermal DSC experiments showed a rapid reaction rate at the beginning with only a single peak. Therefore, to capture the complexity of the process, the faster multiple heating rate DSC experiments are used to predict the degree‐of‐cure (DOC) evolution. Two approaches have been developed based on the dynamic DSC data: (1) a “model‐free” approach, which only requires information about the cure‐dependence of the activation energy; and (2) a practical scheme to deconvolute the two curing peaks. Excellent agreement is observed for the heating rate experiments, but the methods are inadequate for predicting the DOC evolution under isothermal conditions. Therefore, a modified autocatalytic model with temperature‐dependent kinetic parameters has been developed based on the isothermal DSC data. This model predicts the DOC evolution for isothermal curing profiles very well. However, some discrepancy is evident in predicting the DOC evolution for heating rate experiments, due to the underestimation of the activation energy. With appropriate corrections, excellent predictive capability is illustrated for complex cure schedules with combined heating rate and isothermal segments. In addition, a cure process optimization strategy has been suggested, and the fabrication of fine features and microvias is demonstrated. © 2002 John Wiley & Sons, Inc. J Appl Polym Sci 84: 691–700, 2002; DOI 10.1002/app.2345     

Cure kinetics of an epoxy resin containing naphthyl/dicyclopentadiene moieties and bis‐phenoxy (3‐hydroxy) phosphine oxide system and properties of its cured polymer

The cure kinetics of naphthyl/dicyclopentadiene epoxy resin and bisphenoxy (3‐hydroxy) phosphine oxide was investigated by differential scanning calorimetry (DSC) under nonisothermal and isothermal condition. The advanced isoconversional method was used to study the nonisothermal DSC data, the effective activation energy of the curing system in the early stage agreed with the value calculated from the Kissinger model and then increased because of the hindrance of molecular mobility. Autocatalytic behavior was shown in the isothermal DSC measurement, which was well described by Kamal model in the early curing stage. In the later stage, a crosslinked network structure was formed and the curing reaction was mainly controlled by diffusion. The diffusion factor was introduced to optimize the Kamal model and correct the deviation of the calculated data. The physical properties of the cured polymer were evaluated by dynamic mechanical thermal analyses, thermogravimetric analyses, and limiting oxygen index test, which exhibited relatively high glass transition temperature, thermal stability, and flame retardancy. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Cure kinetics of epoxy resins and aromatic diamines

An analysis of the cure kinetics of several different formulations composed of bifunctional epoxy resins and aromatic diamines was performed. A series of isothermal differential scanning calorimetry (DSC) runs (at higher temperature) and Fourier transform infrared spectroscopy (FT-IR) runs (at lower temperature) provided information about the kinetics of cure in the temperature range 18–160°C. All kinetic parameters of the curing reaction, including the reaction rate order, activation energy, and frequency factor were calculated and reported. Dynamic and isothermal DSC yielded different results. An explanation was offered in terms of different curing mechanisms which prevail under different curing conditions. A mechanism scheme was proposed to account for various possible reactions during cure.     

Kinetics and thermal properties of epoxy resin cured with Ni(II)‐tris‐(O‐pheneylendiamine) bromide

Diglycidyl ether of bisphenol A (DGEBA) is cured with a nickel complex of O‐phenylendiamine (OPD) as a ligand. The structure of the synthesized curing agent is confirmed through IR and elemental analysis. The curing kinetics of DGEBA/Ni(OPD)₃Br₂ system is studied by the dynamic DSC and isothermal FTIR techniques. In all cases, we have observed at least two exothermic peaks during DSC traces up to 350°C. Dynamic activation energies are calculated by using the two isoconversional, Kissinger and Ozawa, methods applied to peak maximum. A two‐parameter (m, n) autocatalytic model (Sestak–Berggren equation) is found to be the most adequate model to describe the cure kinetics of the observed thermal events. Isothermal kinetic parameters are estimated using the Horie model. The onset decomposition temperature and char yield (at 700°C) of the crosslinked material were 290°C and 27%, respectively. The activation energy of the solid‐state thermal degradation process is evaluated by Ozawa approach, resulting in 95–138 kJ/mol on a range of 2–20% decomposition conversion. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1257–1265, 2006     

Modeling the curing kinetics for a modified bismaleimide resin using isothermal DSC

The kinetics of curing for a modified bismaleimide (BMI) resin was investigated to ascertain a suitable cure model for the material. The resin system used in this study was composed of 4,4′‐bismaleimidodiphenylmethane (BMIM) and 0,0′‐diallyl bisphenol A (DABPA, DABA). The BMIM was the base monomer and the DABPA was the modified agent. A series of isothermal DSC runs provided information about the kinetics of cure in the temperature range 170–220°C. Regardless of the different temperatures, the shape of the conversion curves was similar, and this modified BMI resin system underwent an nth‐order cure reaction. Kinetic parameters of this BMI resin system, including the reaction model, activation energy, and frequency factor, were calculated. From the experimental data, it was found that the cure kinetics of this resin system can be characterized by a first‐order kinetic model. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3338–3342, 2004     

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical-graphical method determining the kinetic parameters. A modified Kamal model was developed by introducing a concept of the maximum degree of cure (DOC) and temperature-depended kinetic parameters to describe the isothermal cure kinetics of the adhesive with a typical exothermic peak, and an extended Kamal model was further proposed by adding an initial-phase-control term to the modified Kamal model to describe the isothermal cure kinetics of the adhesive with two exothermic peaks. The results showed that the presented curing kinetics models with the determined parameters can precisely predict the evolutions of the DOC of the two thermoset adhesives in both anisothermal and isothermal modes.     

Cure kinetics of aqueous phenol–formaldehyde resins used for oriented strandboard manufacturing: Analytical technique

The cure kinetics of commercial phenol–formaldehyde (PF), used as oriented strandboard face and core resins, were studied using isothermal and dynamic differential scanning calorimetry (DSC). The cure of the face resin completely followed an nth‐order reaction mechanism. The reaction order was nearly 1 with activation energy of 79.29 kJ mol^?1. The core resin showed a more complicated cure mechanism, including both nth‐order and autocatalytic reactions. The nth‐order part, with reaction order of 2.38, began at lower temperatures, but the reaction rate of the autocatalytic part increased much faster with increase in curing temperature. The total reaction order for the autocatalytic part was about 5. Cure kinetic models, for both face and core resins, were developed. It is shown that the models fitted experimental data well, and that the isothermal DSC was much more reliable than the dynamic DSC in studying the cure kinetics. Furthermore, the relationships among cure reaction conversion (curing degree), cure temperature, and cure time were predicted for both resin systems. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1642–1650, 2006     

Comparison of the curing kinetic behavior for two epoxy resin systems containing EPIKOTE 828–EPIKURE 3090 and DURATEK KLM 606A–DURATEK KLM 606B

The aim of the study is to determine the optimum cure temperatures and kinetics for two different epoxy resin systems without using solvent. Two resin systems consist of EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent and DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent. The ratio of resin to curing agent was kept as 1:1 for both the systems. Curing temperatures of both the systems were determined and kinetic parameters were calculated with respect to the experimental results following nth‐order kinetics. Then, a series of isothermal temperatures was applied to the resin systems in order to assess the cure process in terms of conversion, time, and temperature by using differential scanning calorimeter (DSC). The test results of both systems show that the rate of degree of cure for EPIKOTE 828® epoxy resin–EPIKURE® 3090 polyamidoamine curing agent system is approximately 10 times higher than that of DURATEK® KLM 606A epoxy resin–DURATEK® KLM 606B polyamide curing agent system at 230°C. POLYM. COMPOS., 28:762–770, 2007. © 2007 Society of Plastics Engineers     

Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data

The curing kinetics of blends of diglycidyl ether of bisphenol A (DGEBA), cycloaliphatic epoxy resins, and carboxyl‐terminated butadiene‐acrylonitrile random copolymer (CTBN) in presence of 4,4′‐diamino diphenyl sulfone (DDS) as the curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. The kinetic parameters of the curing process were determined by isoconversional method given by Malek for the kinetic analysis of the data obtained by the thermal treatment. A two‐parameter (m, n) autocatalytic model (Sestak‐Berggren equation) was found to be the most adequate selected to describe the cure kinetics of the studied epoxy resins. The values of E_a were found to be 88.6 kJ mol^?1 and 61.6 kJ mol^?1, respectively, for the studied two sample series. Nonisothermal DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Kinetic study of the curing behavior of bismaleimide modified with diallylbisphenol A

The curing kinetics of bismaleimide modified with diallylbisphenol A were investigated for different ratios of 1,1′‐(methylene di‐4,1‐phenylene) bismaleimide and diallylbisphenol A with differential scanning calorimetry. Multiheating‐rate and isothermal methods were used to study the kinetics of the curing process. The results indicated that the activation energy changed with the extent of conversion. The activation energy obtained by the multiheating‐rate method was higher than that obtained by the isothermal method. Two kinetic models (autocatalytic and nth‐order) were successfully used to model the curing process. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2229–2240, 2003     

Cure kinetics modeling and cure shrinkage behavior of a thermosetting composite

In this work, the cure kinetics and through‐the‐thickness cure shrinkage upon curing of a carbon fiber‐epoxy composite (AS4/8552) were studied. The study is composed of two major parts. Firstly, dynamic and isothermal Differential Scanning Calorimeter (DSC) scans were performed to develop a new cure kinetics model. The most appropriate kinetic model that produces a nearly perfect fit of all data sets corresponds to a process with two single‐step parallel autocatalytic reactions with diffusion control. Multivariate kinetic analysis was used to evaluate the parameters. In the second part of the study, the coefficients of thermal expansion (CTEs), the glass transition temperatures (T_g), and the through‐the‐thickness cure shrinkage strain values of the partially cured unidirectional and cross‐ply composite samples were measured by using a dynamic mechanical analyzer (DMA). Cure strains were measured throughout the Manufacturer's Recommended Cure Cycle (MRCC) with the same method. Results indicate that glass transition temperatures of partially cured samples can be measured very closely by the two methods (DSC and DMA). The methods proposed were proved to be very reliable to predict the degree of cure and to measure the through‐the‐thickness strains during the cure cycle. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers     

Thermal analysis of curing process of epoxy prepreg

The curing process of epoxy prepreg was studied by means of differential scanning calorimetry analysis. The dynamic, isothermal, and combinations of dynamic and isothermal measurements were done over selected temperature ranges and isothermal cure temperatures. The heats of reaction for dynamic and isothermal cure were determined. The results show that the heat of the isothermal‐cure reaction increased with the increment of temperature. The degree of cure was calculated from the heat of the isothermal‐cure reaction. The complete cure reaction could be achieved at 220°C within a very short cure time. The changes of cure rate with time were given for the studied isothermal cure temperatures. To simulate the relationship between the cure rate and degree of cure, the autocatalytic model was used and the four parameters were calculated. Except in the late stage of the cure reaction, the model agrees well with the experimental data, especially at high temperatures. To account for the effect of diffusion on the cure rate, a diffusion factor was introduced into the model. The modified model greatly improved the predicted data at the late stage of cure reaction. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 1074–1083, 2002     

Effects of storage aging on the cure kinetics of T700/BMI prepregs for advanced composites

The effects of room temperature aging on the cure kinetics of a bismaleimide (BMI) matrix prepreg have been characterized by different time and storage conditions. The study has focused on the stability of BMI matrix carbon fiber prepregs, when exposed to controlled environmental conditions before being used in composite manufacturing. The effects of aging on reactivity, glass transition temperature, and process window have been investigated by differential scanning calorimetrer through dynamic and isothermal tests. A theoretical kinetic model for epoxy matrix prepregs, developed in previous studies, has been applied to the cure of both aged and virgin BMI matrix. The model is able to satisfactorily describe the effect of processing variables such as temperature and degree of cure during the curing of the composite under different conditions (curing temperature and heating rate). The effects of diffusion‐controlled phenomena on the cure kinetics, associated with changes in glass transition temperature as a function of the degree of cure, have been taken into account in the formulation of an nth‐order kinetic model. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers