Pervaporation and gas separation membranes made from polyimide/polydimethylsiloxane block copolymer

Polyimide/polydimethylsiloxane block copolymers were prepared from oligoimides based on 2-aminopyridine-terminated 3,3′-oxybis(phthalic anhydride) and 1,4-bis(4-amino-α, α-dimethylbenzyl)benzene, and 3-aminopropyl-terminated oligo(dimethylsiloxane)s. Selectivity of homogeneous membranes prepared from the copolymers depends on the polydimethylsiloxane (PDMS) content: Selectivity of copolymers with up to approximately 20 wt % of PDMS is similar to that of polyimide homopolymer, whereas selectivity of copolymers containing more than 20 wt % of PDMS resembles that of pure PDMS. © 1996 John Wiley & Sons, Inc.     

Synthesis and characterization of organosoluble polyfluorinated polyimides derived from 3,3′,5,5′‐tetrafluoro‐4,4′‐diaminodiphenylmethane and various aromatic dianhydrides

A polyfluorinated aromatic diamine, 3,3′, 5,5′‐tetrafluoro‐4,4′‐diaminodiphenylmethane (TFDAM), was synthesized and characterized. A series of polyimides, PI‐1–PI‐4, were prepared by reacting the diamine with four aromatic dianhydrides via a one‐step high‐temperature polycondensation procedure. The obtained polyimide resin had moderate inherent viscosity (0.56–0.68 dL/g) and excellent solubility in common organic solvents. The polyimide films exhibited good thermal stability, with an initial thermal decomposition temperature of 555°C–621°C, a 10% weight loss temperature of 560°C–636°C, and a glass‐transition temperature of 280°C–326°C. Flexible and tough polyimide films showed good tensile properties, with tensile strength of 121–138 MPa, elongation at break of 9%–12%, and tensile modulus of 2.2–2.9 GPa. The polyimide films were good dielectric materials, and surface and volume resistance were on the order of a magnitude of 10¹⁴ and 10¹⁵ Ω cm, respectively. The dielectric constant of the films was below 3.0 at 1 MHz. The polyfluorinated films showed good transparency in the visible‐light region, with a cutoff wavelength as low as 302 nm and transmittance higher than 70% at 450 nm. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1442–1449, 2007     

Synthesis and characterization of polyimide–silica nanocomposites using novel fluorine‐modified silica nanoparticles

Polyimide–silica nanocomposites were synthesized with 4,4′‐oxydianiline, 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride), and fluorine‐modified silica nanoparticles. Fluorinated precursors such as 4″,4?‐(hexafluoroisopropylidene)bis(4‐phenoxyaniline) (6FBPA) and 4,4′‐(hexafluoroisopropylindene)diphenol (BISAF) were employed to modify the surface of the silica nanoparticles. The microstructures and thermal, mechanical, and dielectric properties of the polyimide–silica nanocomposites were investigated. An improvement in the thermal stability and storage modulus of the polyimide nanocomposites due to the addition of the modified silica nanoparticles was observed. The microstructures of the polyimide–silica nanocomposites containing 6FBPA‐modified silica exhibited more uniformity than those of the nanocomposites containing BISAF‐modified silica. The dielectric constants of the polyimide were considerably reduced by the incorporation of pristine silica or 6FBPA‐modified silica but not BISAF‐modified silica. The addition of a modifier with higher fluorine contents did not ensure a lower dielectric constant. The uniformity of the silica distribution, manipulated by the reactivity of the modifier, played an important role in the reduction of the dielectric constant. Using 6FBPA‐modified silica nanoparticles demonstrated an effective way of synthesizing low‐dielectric‐constant polyimide–silica nanocomposites. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 882–890, 2007     

Synthesis and characterization of ABA‐type triblock copolymers derived from polyimide and poly(2‐methyl‐2‐adamantyl methacrylate)

ABA‐type triblock copolymers derived from 4,4‐(hexafluoroisopropylidene)diphthalic anhydride‐2,3,5,6‐tetramethyl‐1,4‐phenylenediamine and 2‐methyl‐2‐adamantyl methacrylate (2‐MAdMA) were synthesized via atom transfer radical polymerization. The component ratios of polyimide (PI) and poly(2‐MAdMA) (PMAdMA) were about 8/2, 6/4 and 3/7, as determined using ¹H NMR spectroscopy and thermogravimetric analysis (TGA). The film structure of the triblock copolymers was dependent on the PI structure. Hydrophobicity increased as the component ratio of PMAdMA increased. Based on TGA, three‐step decomposition behaviors of all triblock copolymers derived from PI and PMAdMA in nitrogen and air atmosphere were observed. The gas permeability of the triblock copolymers was lower than that of PI. This finding can be attributed to the decrease in fractional free volume by the adamantane component and the decrease in permeability of the triblock copolymers compared with PI. The dielectric constant of the triblock copolymers was lower than that of PI. The dielectric constant was dependent on molar volume and molar porlarizability, and the dielectric constant derived from the symmetric structure of adamantane was reduced. The ABA‐type triblock copolymers derived from PI and PMAdMA can be considered as new polymer materials with high hydrophobicity, high H₂/CO₂ selectivity and low dielectric constant. © 2013 Society of Chemical Industry     

Novel low‐dielectric‐constant copolyimide thin films composed with SiO2 hollow spheres

A series of copolyimide/SiO₂ hollow sphere thin films were prepared successfully based on bis[3,5‐dimethyl‐4‐(4‐aminophenoxy)phenyl]methane and 9,9‐bis(4‐(4‐aminophenoxy)phenyl)fluorene (molar ratio = 3 : 1) as diamine, and 4,4′‐(4,4′‐isopropylidenediphenoxy)bis(phthalic anhydride) as dianhydride, with different wt % SiO₂ hollow sphere powder with particle size 500 nm. Some films possessed excellent dielectric properties, with ultralow dielectric constants of 1.8 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared spectra, scanning electron microscope, thermogravimetric analysis, and dynamic mechanical thermal analysis. The polyimide (PI) films exhibited glass‐transition temperatures in the range of 209– 273°C and possessed initial thermal decomposition temperature reaching up to 413–477°C in air and 418–472°C in nitrogen. Meanwhile, the composite films were also exhibited good mechanical properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Structure–property relationship of starch‐filled chain‐extended polyurethanes

Chain‐extended polyurethane (PU) elastomers were prepared using castor oil with 4,4′‐methylene bis (phenyl isocyanate) (MDI) as a crosslinker and 4,4′‐diamino diphenyl sulphone (DDS) as an aromatic diamine chain extender. A series of starch‐filled (from 5 to 25% wt/wt) diamines chain‐extended PUs have been prepared. The starch‐filled PU composites were characterized for physico‐mechanical properties viz, density, surface hardness, tensile strength, and percentage elongation at break. Thermal stability of PU/starch have been carried out by using thermogravimetric analyzer (TGA). Thermal degradation process of PU/starch were found to proceed in three steps. TGA thermograms of PU/starch shows that all systems were stable upto 235°C, and maximum weight loss occur at temperature 558°C. The microcrystalline parameters such as crystal size (〈N〉) and lattice strain (g in %) of PU/starch have been established using wide‐angle X‐ray scattering (WAXS) method. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2945–2954, 2003     

Synthesis and characterization of low‐dielectric photosensitive polyimide/silica hybrid materials

Photosensitive polyimide/silica hybrid materials were synthesized by reaction between 4,4′‐hexafluoroisopropylidene diphthalic anhydride (6FDA) and 4,4′‐oxydianiline. The intrachain chemical bonding and the interchain hydrogen bonding between the polyimide and silica moieties were increased by the incorporation of 2‐(dimethylamino) ethyl acrylate and 3‐aminopropyl trimetho xysilane, respectively. The photoinitiator was bis(2,4,6‐trimethyl benzoyl) phenylphosphine oxide (Irgacure‐819). The various coupling agents were utilized included tetrakis (allyloxy) silane (TAL). Most silica hybrid films showed better volume shrinkage and temperature resistance. The cooperation of octavinyl POSS, as the coupling agent, can lower dielectric constant (k) down to 2.48 but with the poorer volume shrinkage and temperature resistance than the other silica hybrid films. The addition of tetramethyl orthosilicate and 3‐methacryloxy propyltrimethoxysilane with silica content of 5.6 wt % can reduce k down to 2.26 but with worse volume shrinkage than the incorporation with TAL. The TAL hybrid film with degree of polymerization of 25 showed the best properties that optimized photolithography, dielectric constant (k = 3.81), volume shrinkage, and temperature resistance (Td5% = 378°C) with only 0.22 wt % silica content. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Synthesis and characterization of new functional poly(urethane‐imide) crosslinked networks

To synthesize new functional poly(urethane‐imide) crosslinked networks, soluble polyimide from 2,2′‐bis(3,4‐dicarboxyphenyl) hexafluoropropane dianhydride, 4,4′‐oxydianiline, and maleic anhydride and polyurethane prepolymer from polycaprolactone diol, tolylene 2,4‐diisocyanate and hydroxyl ethyl acrylate were prepared. Poly(urethane‐imide) thin films were finally prepared by the reaction between maleimide end‐capped soluble polyimide (PI) and acrylate end‐capped polyurethane (PU). The effect of polyurethane content on dielectric constant, residual stress, morphology, thermal property, and mechanical property was studied by FTIR, prism coupler, Thin Film Stress Analyzer (TFSA), XRD, TGA, DMTA, and Nano‐indentation. Dielectric constant of poly(urethane‐imide) thin films (2.39–2.45) was lower than that of pure polyimide (2.46). Especially, poly(urethane‐imide) thin films with 50% of PU showed lower dielectric constant than other poly(urethane‐imide) thin films did. Lower residual stress and slope in cooling curve were achieved in higher PU content. Compared to typical polyurethane, poly(urethane‐imide) thin films exhibited better thermal stability due to the presence of the imide groups. The glass transition temperature, modulus, and hardness decreased with increase in the flexible PU content even though elongation and thermal expansion coefficient increased. Finally, poly(urethane‐imide) thin films with low residual stress and dielectric constant, which are strongly affected by the morphological structure, chain mobility, and modulus, can be suggested to apply for electronic devices by variation of PU. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 113–123, 2006     

Synthesis and characterization of hydroxypropyl terminated polydimethylsiloxane‐polyurethane copolymers

Polyurethane (PU) block copolymers were synthesized using prepared hydroxypropyl terminated polydimethylsiloxane (HTPDMS MW 990) and polyether diols (N‐210) as soft segment with 4,4′‐diphenylmethane diisocyanate (MDI) and 1,4‐butanediol. This low molecular weight polydimethylsiloxanes (PDMS) containing hydroxypropyl end‐groups displayed better compatibility with PU than common PDMS. In this article, we illustrate its synthesis routes and confirmed the proposed molecular structures using NMR and infrared radiation (IR). We varied the contents of HTPDMS and N‐210 in soft segments (HTPDMS—N‐210: 0 : 100, 20 : 80, 40 : 60, 60 : 40, 80 : 20, and 100 : 0) to synthesize a series of PDMS‐PU copolymer. IR spectroscopy showed the assignment characteristic groups of each peak in copolymers and confirmed that the desired HTPDMS‐PU copolymers have been prepared. The different thermal, dynamic mechanical and surface properties of the copolymers were compared by thermogravimetry, DMA, contact angle and solvent resistance. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Synthesis of aromatic poly(urea‐imide) with heterocyclic side‐chain structure

The poly(urea‐imide) copolymers with inherent viscosity of 0.81–1.08 dL/g were synthesized by reacting aryl ether diamine or its polyurea prepolymer with various diisocyanate‐terminated polyimide prepolymers. The aryl ether diamine was obtained by first nucleophilic substitution of phenolphthalein with p‐chloronitrobenzene in the presence of anhydrous potassium carbonate to form a dinitro aryl ether, and then further hydrogenated to diamine. The polyimide prepolymers were prepared by using 4,4′‐diphenylmethane diisocyanate to react with pyromellitic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, or 3,3′,4,4′‐sulfonyldiphthalic anhydride by using the direct one‐pot method to improve their solubility, but without sacrificing thermal property. These copolymers are amorphous and readily soluble in a wide range of organic solvents such as N‐methyl‐2‐pyrrolidone, dimethylimidazole, N,N‐dimethylacetamide, dimethyl sulfoxide, N,N‐dimethylformamide, m‐cresol, and sulfolane. All the poly(urea‐imides) have glass transition temperatures in the range of 205–240°C and show a 10 wt % loss at 326–352°C in nitrogen and 324–350°C in air. The tensile strength, elongation at break, and initial modulus of these copolymer films range from 42 to 79 MPa, 5 to 16%, and 1.23 to 2.02 GPa, respectively. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 1719–1730, 1999     

Organic–inorganic hybrids containing polyimide,organically modified clay and in situ formed polydimethylsiloxane

A series of organic–inorganic hybrid consisting of polyimide (PI) prepared from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA), organically modified montmorillonite (OMMT) and polydimethylsiloxane (PDMS) were successfully prepared by in situ sol–gel process. OMMT was prepared by surface treatment of montmorillonite (MMT) with hexadecyltrimethylammonium bromide. X-ray diffraction (XRD) analysis showed that the OMMT layers were exfoliated into the polymer matrix at 2% of OMMT content. The PI–OMMT–PDMS hybrids at 2% of OMMT content were transparent when PDMS content was less than 5%. The PI–OMMT–PDMS hybrid showed better tensile modulus, strength and elongation at break than that of pristine PI due to the reinforcement effect of OMMT and toughening effect of PDMS. The thermal stability of hybrids such as the decomposition temperature and weight residue at 800 °C also increased with the increase of PDMS content as evidenced by thermogravimetric analysis (TGA).     

Synthesis and properties of fluorinated polyimides from 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,4,5‐trifluorophenyl)‐2,2,2‐trifluoroethane and various aromatic dianhydrides

A novel aromatic diamine, 1,1‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3,4,5‐trifluorophenyl)‐2,2,2‐trifluoroethane, containing a pendant polyfluorinated phenyl group, a trifluoromethyl group, and methyl groups ortho‐substituted to the amino groups in the structure was synthesized and characterized. The diamine was polymerized with several aromatic dianhydrides, including 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride, 4,4′‐oxydiphthalic anhydride, and 4,4′‐hexafluoroisopropylidene diphthalic anhydride, via a high‐temperature one‐step procedure to afford four polyimides (PIs) with inherent viscosities of 0.47–0.70 dL/g. The PIs exhibited excellent solubilities in a variety of organic solvents. They were soluble not only in polar aprotic solvents but in many common solvents, such as cyclopentanone, tetrahydrofuran, and even toluene at room temperature. The tough and flexible PI films cast from the PI solutions exhibited good thermal stabilities and acceptable tensile properties. The glass‐transition temperatures were in the range 312–365°C, and the 5% weight loss temperatures were all higher than 480°C in nitrogen. The films had tensile strengths in the range 76–99 MPa, tensile moduli of 2.2–2.8 GPa, and elongations at break of 5–8%. In addition, the PI films exhibited excellent transparency in the visible light region with cutoff wavelength as low as 302 nm and transmittance higher than 88% at the wavelength of 450 nm. The PI films showed low dielectric constants ranging from 2.50–2.68 and low moisture absorptions of less than 0.56%. The good combined properties of the PIs mainly resulted from the synergic effects of the different substituents. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Reduction of dielectric constant by nanovoids formed through chemical treatment on silica crosslinked polyimide and its effect on properties

In this study, 2,7‐diamino‐9‐fluorenol (DAF) has been introduced to bond silica to the main chain of the polyimide (PI) copolymer. DAF contains a hydroxyl group that could covalently bond with silica particles. 4,4′‐(Hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 4,4′‐oxydianiline (4,4′‐ODA) have been used as monomers to form a copolymer with DAF. The variation of silica content was controlled as 5%, 7.5, 10, 12.5 wt %. Variation in silica content contributes to the formation of various size (100–410 nm) of macroporous voids after hydrofluoric acid (HF) treatment. HF etching process was introduced to dissolve the silica and form voids in the structure of PI copolymer films. Compared with conventional PI films, air voids that were formed in the PI copolymer film reduced the dielectric from 4.40 to 1.86. The reduction in the dielectric constants can be explained in terms of creating silica particles that increase the presence of air voids after HF treatment. The thermal stability was stable up to 500 °C and the modulus change was confirmed with a dynamic mechanical analysis (DMA) to evaluate the effect of silica on thermal and mechanical properties. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45982.     

Thermal and thermo‐oxidative degradation properties of poly(benzimidazole amide imide) copolymers

In this study, 3,3′‐dinitrobenzidine was first reacted with excess isophthaloyl chloride to form a monomer with dicarboxylic acid end groups. Two types of aromatic dianhydride, [viz., pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐sulfonyldiphthalic anhydride (DSDA)] also were reacted with excess 4,4′‐diphenyl‐ methane diisocyanate (MDI) to form polyimide prepolymers terminated with isocyanate groups. The prepolymers were reacted further with the diacid monomer to form a nitro group–containing aromatic poly(amide imide) copolymers. The nitro groups in these copolymers were hydrogenated to form amine groups and cyclized at 180°C to form the poly(benzimidazole amide imide) copolymers in polyphosphoric acid (PPA), which acts as a cyclization agent. From the viscosity measurements, copolymer appeared to be a reasonably high molecular weight. From the differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) measurements it was shown that the glass transition temperature of copolymers was in the range of ～270–322°C. The 10% weight loss temperatures were in the range of 460 ～ 541°C in nitrogen and ～441–529°C in air, respectively. The activated energy and the integration parameter of degradation temperature of the copolymers were evaluated with the Doyle‐Ozawa method. It indicated that these copolymers have good thermal and thermo‐oxidative stability with the increase in imide content. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2072–2081, 2004     

Superhydrophobic and Low‐k Polyimide Film with Porous Interior Structure and Hierarchical Surface Morphology

Porous interior structured polyimide (PI) films with a hierarchical surface are fabricated from 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride and 4,4′‐oxydianiline by a water vapor induced phase separation process under a humid environment. Superhydrophobic properties with a water contact angle of 161° are obtained using the hierarchical surface morphology, which can be adjusted from flower‐like to wrinkle‐shape particles facilely by changing the relative humidity. The dielectric constant (k) of the PI film decreases sharply from 2.8 (film prepared under dry conditions) to ≈1.9 (film prepared under humid conditions) because of the interior porous structure and fluorine‐containing framework. Both a low‐k and superhydrophobicity are very important parameters for PI films in microelectronic and insulating applications.     

Synthesis of polydimethylsiloxane‐block‐polystyrene‐block‐polydimethylsiloxane via polysiloxane‐based macroinitiator in supercritical CO2

Polydimethylsiloxane‐block‐polystyrene‐block‐polydimethylsiloxane (PDMS‐b‐PS‐b‐PDMS) was synthesized by the radical polymerization of styrene using a polydimethylsiloxane‐based macroazoinitiator (PDMS MAI) in supercritical CO₂. PDMS MAI was synthesized by reacting hydroxy‐terminated PDMS and 4,4′‐azobis(4‐cyanopentanoyl chloride) (ACPC) having a thermodegradable azo‐linkage at room temperature. The polymerization of styrene initiated by PDMS MAI was investigated in a batch system using supercritical CO₂ as the reaction medium. PDMS MAI was found to behave as a polyazoinitiator for radical block copolymerization of styrene, but not as a surfactant. The response surface methodology was used to design the experiments. The parameters used were pressure, temperature, PDMS MAI concentration and reaction time. These parameters were investigated at three levels (?1, 0 and 1). The dependent variable was taken as the polymerization yield of styrene. PDMS MAI and PDMS‐b‐PS‐b‐PDMS copolymers obtained were characterized by proton nuclear magnetic resonance and infrared spectroscopy. The number‐ and weight‐average molecular weights of block copolymers were determined by gel permeation chromatography. Copyright © 2004 Society of Chemical Industry     

Novel phenylethynyl‐endcapped polyimide oligomers: Synthesis and characterization

A series of novel phenylethynyl‐endcapped polyimide oligomers were prepared by polycondensation of an aromatic diamine mixture of 1,3‐bis(4‐aminophenoxy) benzene (1,3,4‐APB) and 3,4′‐oxydianiline (3,4′‐ODA) with different aromatic dianhydrides including 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA), 4,4′‐(hexafluoro isopropylidene)diphthalic anhydride (6FDA), 4,4′‐oxydiphthalic anhydride (ODPA), and 4,4′‐[2,2,2‐trifluoro‐1‐(3′,5′‐bis‐(trifluoro‐methyl)phenyl)ethylidene]diphthalic anhydride (9FDA) in the presence of 4‐phenyl‐ethynylaniline (PEA) as endcapping agent in aprotic solvent at elevated temperature. The chemical structures, thermal behavior, and melt rheological properties of the synthesized polyimide oligomers were investigated. Experimental results indicated that the fluorinated polyimide oligomers derived from 6FDA (PI‐2) and 9FDA (PI‐4) are amorphous solid resins and exhibited lower melt viscosities than those prepared from the unfluorinated aromatic dianhydrides such as BPDA and ODPA. The BPDA‐based polyimide oligomers with a molar ratio of 1,3,4‐APB/3,4′‐ODA = 50:50 (PI‐5) showed lower melt viscosity than those derived from a mixture of 1,3,4‐APB and 3,4′‐ODA with molar ratios of 75:25 and 100:0, respectively. In addition, the melt viscosity of the polyimide oligomers increased obviously with increasing of the polymer calculated molecular weights. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Curing behavior study of polydimethylsiloxane‐modified allylated novolac/4,4′‐bismaleimidodiphenylmethane resin

The curing behavior of polydimethylsiloxane‐modified allylated novolac/4,4′‐bismaleimidodiphenylmethane resin (PDMS‐modified AN/BDM) was investigated by using Fourier transform infrared spectrometry (FTIR) and differential scanning calorimetry. The results of FTIR confirmed that the curing reactions of the PDMS‐modified AN/BDM resins, including “Ene” reaction and Diels–Alder reaction between allyl groups and maleimide groups, should be similar to those of the parent allylated novolac/4,4′‐bismaleimidodiphenylmethane (AN/BDM) resin. The results of dynamic DSC showed that the total curing enthalpy of the PDMS‐modified AN/BDM resins was lower than that of the parent resin. Incorporation of polydimethylsiloxane (PDMS) into the backbone of the allylated novolac (AN) resin favored the Claisen rearrangement reaction of allyl groups. The isothermal DSC method was used to study the kinetics of the curing process. The experimental data for the parent AN/BDM resin and the PDMS‐modified AN/BDM resins exhibited an nth‐order behavior. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and characterization of quartz‐fiber‐cloth‐reinforced,polymerization‐of‐monomer‐reactant‐type polyimide substrates with a high impact strength

A series of novel quartz‐fiber‐cloth‐reinforced polyimide substrates with low dielectric constants were successfully prepared. For this purpose, the A‐stage polyimide solution was first synthesized via a polymerization‐of‐monomer‐reactant procedure with 2,2′‐bis(trifluoromethyl)benzidine and 3,3′,4,4′‐oxydiphthalic anhydride as the monomers, and cis?5‐norbornene‐endo‐2,3‐dicarboxylic anhydride as the endcap. Then, an A‐stage polyimide solution (TOPI) was impregnated with quartz‐fiber cloth (QF) to afford the prepregs, which were thermally molded into the final substrate composites. The influence of the curing temperature and the resin content on the mechanical properties of the composite were examined. The composites exhibited a high glass‐transition temperature over 360°C, a low and steady dielectric constant below 3.2 at a test frequency of 1–12 GHz, and a volume resistance over 1.8 × 10¹⁷ Ω cm. Meanwhile, they also showed a high mechanical strength with flexural and impact strengths in ranges 845–881 MPa and 141–155 KJ/m², respectively. The excellent mechanical and thermal properties and good dielectric properties indicated that they are good candidates for integrated circuit packaging substrates. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42358.     

Functionalized KIT‐6/Terpolyimide composites with ultra‐low dielectric constant

Polyimides with low dielectric constants are important raw materials for the fabrication of flexible printed circuit boards and other microelectronic applications. As creation of voids in polyimide matrix could decrease dielectric constant, in this study mesoporous KIT‐6, synthesized hydrothermally, was functionalized with 3‐aminopropyltriethoxysilane (APTS) and mixed with 4,4′‐oxydianiline (ODA) in the synthesis of terpoly(amic acid) using 3,3′,4,4′‐biphenyldianhydride (BPDA), 3,3′,4,4′‐oxydiphthalic dianhydride (ODPA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and subsequently stage‐cured to obtain APTS‐KIT‐6/Terpolyimide composites (APTS‐KIT‐6/TPI). The asymmetric and symmetric vibrations of imide O?C? N? C?O groups of APTS‐KIT‐6/TPI composites showed their peaks at 1772 and 1713 cm^?1. The dielectric constant decreased with the increase in KIT‐6 loading from 2 to 4%, but increased at higher loadings, and at 4% loading it was 1.42. Its tensile strength (103 MPa), tensile modulus (2.5 GPa), and percentage elongation (8.2) and high thermal stability (>540°C) were also adequate for application in microelectronics such as flexible printed circuits. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40508.