基于图形衬底生长的GaN位错机制分析

采用缺陷选择性腐蚀法结合光学显微镜及原子力显微镜(AFM)对金属有机化合物气相外延(MOVPE)在蓝宝石图形衬底(PSS)上生长的非掺杂GaN体材料的位错产生机制进行了研究,分析结果表明,位错来源于三个方面:一是"二步法"生长机制引入的位错;二是是由于图形衬底上不同区域GaN晶体相互连接时由于晶面不连续所造成的位错群;三是由于图形衬底制作工艺过程中引入的表面污染与损伤.     

Nanofabrication of gallium nitride photonic crystal light-emitting diodes

We describe a comparison of nanofabrication technologies for the fabrication of 2D photonic crystal structures on GaN/InGaN blue LEDs. Such devices exhibit enhanced brightness and the possibility of controlling the angular emission profile of emitted light. This paper describes three nano lithography techniques for patterning photonic crystal structures on the emitting faces of LEDs: direct-write electron beam lithography, hard stamp nanoimprint lithography and soft-stamp nanoimprint lithography with disposable embossing masters. In each case we describe variations on the technique as well as its advantages and disadvantages. Complete process details have been given for all three techniques. In addition, we show how high performance GaN dry etch techniques, coupled with optical process monitoring can transfer resist patterns into underlying GaN material with high fidelity.     

图形衬底对InGaN/GaN多量子阱太阳能电池性能的提升

In this paper, the enhanced performance of InGaN/GaN multiple quantum well solar cells grown on patterned sapphire substrates （PSS） was demonstrated. The short-circuit current （Jsc） density of the solar cell grown on PSS showed an improvement of 60%, compared to that of solar cells grown on conventional sapphire substrate. The improved performance is primarily due to the reduction of edge dislocations and the increased light absorption path by the scattering from the textured surface of the PSS. It shows that the patterned sapphire technology can effectively alleviate the problem of high-density dislocations and low Jsc caused by thinner absorption layers of the InGaN based solar cell, and it is promising to improve the efficiency of the solar cell.     

图形化蓝宝石衬底结构对GaN基LED发光性能的影响

为了研究图形化蓝宝石衬底(PSS)的结构和形貌对GaN基发光二极管(LED)光学性能的影响,对PSS的制备工艺和参数进 行了调控,从而 形成具有不同填充因子的蒙古包形PSS(HPSS)和金字塔形PSS(TPSS)两种衬底,用于生长 和制备蓝光LED 芯片。通过对TPSS-LED的光学性能测试和分析得到,随着PSS填充因子的增大, LED的 光输出功 率也增大;进而比较具有相同填充因子的HPSS和TPSS的光学性能表明,HPSS明显优于TPSS。 因此, PSS填充因子的增大,能够提高LED的光输出功率;优化PSS的结构可以改善LED中光出射途径 ,从而更有效提高LED的光发射效率。     

Improvement of the performance of GaN-based LEDs grown on sapphire substrates patterned by wet and ICP etching

Sapphire substrates patterned by a selective chemical wet and an inductively coupled plasma (ICP) etching technique was proposed to improve the performance of GaN-based light-emitting diodes (LEDs). GaN-based LEDs were fabricated on sapphire substrates through metal organic chemical vapor deposition (MOCVD). The LEDs fabricated on the patterned substrates exhibit improved device performance compared with the conventional LED fabricated on planar substrates when growth and device fabricating conditions were the same. The light output powers of the LEDs fabricated on wet-patterned and ICP-patterned substrates were about 37% and 17% higher than that of LEDs on planar substrates at an injection current of 20 mA, respectively. The enhancement is attributable to the combination of the improvement of GaN-based epilayers quality and the improvement of the light extraction efficiency.     

最大振荡频率为200 GHz的蓝宝石衬底AlGaN/GaN HEMT

本文报道了fmax为200GHz的基于蓝宝石衬底的AlGaN/GaN 高电子迁移率晶体管（HEMT）。外延材料结构采用了InGaN背势垒层来减小短沟道效应,器件采用了凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaN HEMT。器件饱和电流达到1.1A/mm,跨导为421mS/mm,截止频率（fT）为30GHz,最大振荡频率（fmax）为105GHz。采用了湿法腐蚀工艺将器件的Si3N4钝化层去除后,器件的Cgs和Cgd减小,器件截止频率提高到50GHz,最大振荡频率提高到200GHz。     

在蓝宝石图形衬底上生长低穿透性位错的GaN薄膜

使用MOCVD外延系统,采用3D-2D生长模式在圆锥图形蓝宝石衬底上生长GaN薄膜。研究发现3D-2D生长模式能够有效的减少GaN薄膜的穿透性位错,其中3D GaN层的生长条件是关键：低V/III比,低温和高生长压力。为了进一步减少TD,3D GaN层的厚度应该与图形衬底上的图形高度接近。当3D GaN层生长结束时,3D GaN层把图形衬底的图形围在其中,具有倾斜的侧壁和（0001）向的上表面,而图形上基本没有沉积物。在接下来的2D生长过程里,GaN沿倾斜侧面快速生长,使得侧面上的穿透性位错产生弯曲,从而减少GaN薄膜的穿透性位错。经过对3D条件的优化,GaN薄膜的穿透性位错降低到1×108cm-2,XRD测试得到的（002）,（102）半宽分别达到211弧秒和219弧秒。     

最大振荡频率为200GHz的蓝宝石衬底AlGaN/GaN HEMT

报道了最大振荡频率为200 GHz的基于蓝宝石衬底的AlGaN/GaN高电子迁移率晶体管(HEMT).外延材料结构采用InGaN背势垒层来减小短沟道效应,器件采用凹栅槽和T型栅结合的工艺,实现了Ka波段AlGaN/GaNHEMT.器件饱和电流达到1.1 A/mm,跨导为421 mS/mm,截止频率(fT)为30 GHz...     

图形蓝宝石衬底GaN基发光二极管的研制

采用抗刻蚀性光刻胶作为掩膜,并利用光刻技术制作周期性结构,进行ICP干法刻蚀C面(0001)蓝宝石制作图形蓝宝石衬底(PSS);然后,在PSS上进行MOCVD制作GaN基发光二极管(LED)外延片;最终,进行芯片制造和测试。PSS的基本结构为圆孔,直径为3μm,间隔为2μm,深度为864 nm,呈六角形分布。与同批生长的普通蓝宝石衬底(CSS)GaN基LED芯片相比,PSS芯片的光强和光通量比CSS分别提高57.32%和28.33%(20 mA),并可减小芯片的反向漏电流,且未影响芯片的波长分布和电压特性。     

InGaN/GaN light-emitting diodes with a reflector at the backside of sapphire substrates

Nitride-based light-emitting diodes (LEDs) with a reflector at the backside of the sapphire substrates have been demonstrated. It was found that an SiO₂/TiO₂ distributed-Bragg reflector (DBR) structure could reflect more downward-emitting photons than an Al-mirror layer. It was also found that the 20-mA output power was 2.76 mW, 2.65 mW, and 2.45 mW for the DBR LED, Al-reflector LED, and conventional LED, respectively. With the same 50-mA current injection, the integrated-electroluminescence (EL) intensity of a DBR LED and an Al-reflector LED was 19% and 15% larger than that observed from a conventional LED.     

Investigation of GaN-based light-emitting diodes using double photonic crystal patterns

GaN-based LEDs with photonic crystal (PhC) patterns on an n- and a p-GaN layer by nano-imprint lithography (NIL) are fabricated and investigated. At a driving current of 20 mA on Transistor Outline (TO)-can package, the light output power of the GaN-based LED with PhC patterns on an n- and a p-GaN layer is enhanced by a factor of 1.30, and the wall-plug efficiency is increased by 24%. In addition, the higher output power of the LED with PhC patterns on the n- and p-GaN layer is due to better crystal quality on n-GaN and higher scattering effect on p-GaN surface using PhC pattern structure.     

Enhancement of photo- and electro-luminescence of GaN-based LED structure grown on a nanometer-scaled patterned sapphire substrate

In this study, a 2 in. sized a highly periodic nanometer-scaled patterned sapphire substrate (NPSS) was fabricated using nanoimprint lithography (NIL) and inductively coupled plasma etching to improve the light-extraction efficiency of GaN-based light-emitting diodes (LEDs). A blue LED structure was grown on the nanometer-scale patterned sapphire substrates, and the photoluminescence (PL) and electroluminescence (EL) were measured to confirm the effectiveness of the nanometer-scaled patterns on sapphire. An improvement in luminescence efficiency was observed when NPSS was applied; 2 times stronger PL intensity and 2.8 times stronger EL intensity than the LED structure grown on the unpatterned sapphire wafers were measured. These results show highly periodic nanometer-scaled patterns create multi-photon scattering and effectively enhance the light-extraction efficiency of LEDs.     

Improving performance of high-power indium gallium nitride/gallium nitride-based vertical light-emitting diodes by employing simple n-type electrode pattern

In this work, simple n-type electrode structures were used to enhance the electrical and optical performances of fully packaged commercially mass-produced vertical-geometry light-emitting diodes (VLEDs). The forward bias voltage of the VLED with a Y-pattern electrode increased less rapidly than that of VLEDs with a reference electrode. The VLEDs with the reference and Y-pattern electrodes exhibited forward voltages of 2.93±0.015 and 2.89±0.015 V at 350 mA and 3.77±0.015 and 3.53±0.015 V at 2000 mA, respectively. The VLEDs with the Y-pattern electrode resulted in a higher light output than the VLEDs with the reference electrode with increase in the drive current to 2000 mA. The emission images showed that the VLEDs with the Y-pattern electrode exhibited better current spreading behavior and lower junction temperatures than the VLEDs with the reference electrode. With increase in the current from 350 to 2000 mA, the VLEDs with the Y-pattern electrode experienced a 39.4% reduction in the wall plug efficiency, whereas the VLEDs with the reference electrode suffered from a 43.3% reduction.     

Increased effective reflection and transmission at the GaN-sapphire interface of LEDs grown on patterned sapphire substrates

The effect of patterned sapphire substrate (PSS) on the top-surface (P-GaN-surface) and the bottom-surface (sapphire-surface) of the light output power (LOP) of GaN-based LEDs was investigated, in order to study the changes in reflection and transmission of the GaN-sapphire interface. Experimental research and computer simulations were combined to reveal a great enhancement in LOP from either the top or bottom surface of GaN-based LEDs, which are prepared on patterned sapphire substrates (PSS-LEDs). Furthermore, the results were compared to those of the conventional LEDs prepared on the planar sapphire substrates (CSS-LEDs). A detailed theoretical analysis was also presented to further support the explanation for the increase in both the effective reflection and transmission of PSS-GaN interface layers and to explain the causes of increased LOP values. Moreover, the bottom-surface of the PSS-LED chip shows slightly increased light output performance when compared to that of the top-surface. Therefore, the light extraction efficiency (LEE) can be further enhanced by integrating the method of PSS and flip-chip structure design.     

Electrical and luminescent properties and the spectra of deep centers in GaMnN/InGaN light-emitting diodes

Electrical and electroluminescent properties were studied for GaN/InGaN light-emitting diodes (LEDs) with the n-GaN layer up and with the top portion of the n layer made of undoped GaMnN to allow polarization modulation by applying an external magnetic field (so-called “spin-LEDs”). The contact annealing temperature was kept to 750°C, which is the thermal stability limit for retaining room-temperature magnetic ordering in the GaMnN layer. Measurable electroluminescence (EL) was obtained in these structures at threshold voltages of ∼15 V, with a lower EL signal compared to control LEDs without Mn. This is related to the existence of two parasitic junctions between the metal and the lower contact p-type layer and between the GaMnN and the n-GaN in the top contact layer.     

Investigation of n-ohmic contact of vertical GaN-based light-emitting diodes on graphite substrate with Ag-In bonding

Vertical light-emitting diodes (VLEDs) were successfully transferred from a GaN-based sapphire substrate to a graphite substrate by using low-temperature and cost-effective Ag-In bonding, followed by the removal of the sapphire substrate using a laser lift-off (LLO) technique. One reason for the high thermal stability of the AgIn bonding compounds is that both the bonding metals and Cr/Au n-ohmic contact metal are capable of surviving annealing temperatures in excess of 600 °C. Therefore, the annealing of n-ohmic contact was performed at temperatures of 400 °C and 500 °C for 1 min in ambient air by using the rapid thermal annealing (RTA) process. The performance of the n-ohmic contact metal in VLEDs on a graphite substrate was investigated in this study. As a result, the final fabricated VLEDs (chip size: 1000 µm×1000 µm) demonstrated excellent performance with an average output power of 538.64 mW and a low operating voltage of 3.21 V at 350 mA, which corresponds to an enhancement of 9.3% in the light output power and a reduction of 1.8% in the forward voltage compared to that without any n-ohmic contact treatment. This points to a high level of thermal stability and cost-effective Ag-In bonding, which is promising for application to VLED fabrication.     

锥形图形衬底上氮化镓薄膜生长和表征

GaN films are grown on cone-shaped patterned sapphire substrates(CPSSs)by metal-organic chemical vapor deposition,and the influence of the temperature during the middle stage of GaN growth on the threading dislocation(TD)density of GaN is investigated.High-resolution X-ray diffraction(XRD)and cathodeluminescence(CL)wereusedtocharacterizetheGaNfilms.TheXRDresultsshowedthattheedge-typedislocation density of GaN grown on CPSS is remarkably reduced compared to that of GaN grown on conventional sapphire substrates(CSSs).Furthermore,whenthegrowthtemperatureinthemiddlestageofGaNgrownonCPSSdecreases,the full width at half maximum of the asymmetry(102)plane of GaN is reduced.This reduction is attributed to the enhancement of vertical growth in the middle stage with a more triangular-like shape and the bending of TDs.The CL intensity spatial mapping results also showed the superior optical properties of GaN grown on CPSS to those of GaN on CSS,and that the density of dark spots of GaN grown on CPSS induced by nonradiative recombination is reduced when the growth temperature in the middle stage decreases.     

Influence of GaN material characteristics on device performance for blue and ultraviolet light-emitting diodes

An analysis of blue and near-ultraviolet (UV) light-emitting diodes (LEDs) and material structures explores the dependence of device performance on material properties as measured by various analytical techniques. The method used for reducing dislocations in the epitaxial III-N films that is explored here is homoepitaxial growth on commercial hybride vapor-phase epitaxy (HVPE) GaN substrates. Blue and UV LED devices are demonstrated to offer superior performance when grown on GaN substrates as compared to the more conventional sapphire substrate. In particular, the optical analysis of the near-UV LEDs on GaN versus ones on sapphire show substantially higher light output over the entire current-injection regime and twice the internal quantum efficiency at low forward current. As the wavelength is further decreased to the deep-UV, the performance improvement of the homoepitaxially grown structure as compared to that grown on sapphire is enhanced.     

LED蓝宝石图形化衬底的研究进展及发展趋势

图形化蓝宝石衬底作为GaN基LED照明外延衬底材料,由于其能降低GaN外延薄膜的线位错密度和提高LED的光萃取效率的显著性能在近几年来引起国内外许多科研机构和厂商的广泛兴趣。从衬底的制备工艺、图形尺寸角度出发,综述了图形化蓝宝石衬底GaN基LED的研究进展,并对其未来在大功率照明市场的应用进行了展望。