Uniformity in HgCdTe diode arrays fabricated by reactive ion etching

Two-dimensional, midwavelength infrared (MWIR) HgCdTe detector arrays have been fabricated using reactive ion etching (RIE). Detector-to-detector uniformity has been studied in the devices fabricated with CdTe- and ZnS-passivation layers. Mapping of the doping profile, passivant/HgCdTe interface electrical properties, and diode impedance-area product (R₀A_j) in a two-dimensional array of diodes has been carried out. Temperature and perimeter/area dependence of the dark current are studied to identify the bulk and surface current components. Maximum R₀A_j=2×10⁷ Θcm² was achieved in CdTe-passivated, 200×200 μm² diode arrays. It demonstrates that CdTe-passivated, RIE-processed HgCdTe is a feasible technology.     

InSb阵列探测芯片的感应耦合等离子反应刻蚀研究

利用感应耦合等离子（ICP）反应刻蚀（RIE）进行了InSb阵列芯片台面刻蚀,并利用轮廓仪、SEM及XRD对台面形貌以及刻蚀损伤进行分析。采用优化的ICP刻蚀参数,实现的刻蚀速率为70~90 nm/min,刻蚀台阶垂直度~80°,刻蚀表面平整光滑、损伤低。与常规的湿法腐蚀相比,明显降低了侧向钻蚀。台面采用此反应刻蚀工艺,制备了具有理想I-V特性的320×256 InSb探测阵列芯片,在-500 mV到零偏压范围内,光敏元（面积23 μm×23 μm）的动态阻抗（Rd）大于100 MΩ。     

The influence of the AlN film texture on the wet chemical etching

The influence of the aluminum nitride (AlN) film texture on the chemical etching in KOH solution was invested. The AlN films with the different texture and crystal quality were prepared by sputtering. It is found that the chemical etching behaviors, including the etch rate, the activation energy, the surface morphology and the anisotropy, are strongly dependent on the film texture. There is a faster etching in the case of mixed (1 0 0) and (0 0 2) texture and a lower rate in the case of only (0 0 2) texture. The etch rate also decreases with the crystal quality. The sample with the only (0 0 2) texture forms discontinuous column structure after etching and exhibits lower porosity compared to that of the mixed (1 0 0) and (0 0 2) texture. Due to the strong anisotropy of the AlN wurtzite structure, the morphology of the film deposited at 700 °C shows the homogeneous pyramid shape after etching. The cross-section micrographs of etching patterns indicate that the anisotropy of the chemical etching is improved with the improving of the crystal quality.     

反应离子刻蚀InSb芯片引入的损伤研究

应用CH₄/H₂/Ar作为刻蚀气源对InSb微台面阵列进行了反应离子刻蚀,并对刻蚀后引入的损伤进行了分析。实验证实利用干法刻蚀与湿法腐蚀相结合的方法能有效地减少刻蚀引入的缺陷和损伤,获得较好的电学特性,达到低损伤刻蚀InSb材料的目的。     

湿法腐蚀后硅表面形态微结构的研究

随着半导体工艺集成度的不断提高及微纳米技术的发展,半导体硅材料的湿法腐蚀及腐蚀后硅表面的平整度及洁净度对半导体器件的影响越来越重要,有关此方面的研究也日益受到重视。本文利用扫描隧道显微镜(STM)技术,研究了Si(111)在几种不同比例的NH_4F-HCl溶液中腐蚀后的表面形态及洁净度。表面的STM图像分析,表明在较高pH值的NH_4F-HCl溶液中腐蚀的Si(111)表面粗糙度较小。     

Characterization of Hg0.7Cd0.3Te n- on p-type structures obtained by reactive ion etching induced p- to n conversion

This paper presents transport measurements on both vacancy doped and gold doped Hg_0.7Cd_0.3Te p-type epilayers grown by liquid phase epitaxy (LPE), with N_A=2×10¹⁶ cm⁻³, in which a thin 2 μm surface layer has been converted to n-type by a short reactive ion etching (RIE) process. Hall and resistivity measurements were performed on the n-on-p structures in van der Pauw configuration for the temperature range from 30 K to 400 K and magnetic field range up to 12 T. The experimental Hall coefficient and resistivity data has been analyzed using the quantitative mobility spectrum analysis procedure to extract the transport properties of each individual carrier contributing to the total conduction process. In both samples three distinct carrier species have been identified. For 77 K, the individual carrier species exhibited the following properties for the vacancy and Au-doped samples, respectively, holes associated with the unconverted p-type epilayer with p ≈ 2 × 10¹⁶ cm⁻³, μ ≈ 350 cm²V⁻¹s⁻¹, and p ≈ 6 × 10¹⁵ cm⁻³, μ ≈ 400 cm²V⁻¹s⁻¹; bulk electrons associated with the RIE converted region with n ≈ 3 × 10¹⁵cm⁻³, μ ≈ 4 × 10⁴ cm²V⁻¹s⁻¹, and n ≈ 1.5 × 10¹⁵ cm⁻³, μ ≈ 6 × 10⁴ cm²V⁻¹s⁻¹; and surface electrons (2D concentration) n ≈ 9 × 10¹² cm⁻² and n ≈ 1 × 10¹³ cm⁻², with mobility in the range 1.5 × 10³ cm²V⁻¹s⁻¹ to 1.5 × 10⁴ cm²V⁻¹s⁻¹ in both samples. The high mobility of bulk electrons in the RIE converted n-layer indicates that a diffusion process rather than damage induced conversion is responsible for the p-to-n conversion deep in the bulk. On the other hand, these results indicate that the surface electron mobility is affected by RIE induced damage in a very thin layer at the HgCdTe surface.     

大面积均匀平坦纳米AlN薄膜的研制

采用射频磁控溅射法,通过优化沉积工艺,在n型 (100)Si片上制备出 (100)择优取向表面粗糙度均匀的氮化铝(AlN)薄膜。当溅射功率为 120W和N₂∶Ar＝12∶8时,制备的AlN薄膜的结晶性最好,101.6 mm AlN薄膜样 品的表面粗糙度为3.31~3.03nm,平均值为3.17nm。研究结果表明:射频磁控溅射能量 和N₂浓度是实现大面积、均匀平坦、纳米级AlN薄膜的重要制备工艺参数。     

铜辅助化学腐蚀条件对多孔硅的影响

以铜(Cu)作为催化剂,采用两步化学腐蚀法成功制 备了微纳米多孔硅(PS)。本文方法成本低廉、操 作简易。系统研究了腐蚀液中H₂O₂浓度、Si衬底掺杂浓度、腐蚀液温度和腐 蚀时间对PS表 面形貌和腐蚀深度的影响,并得到最佳制备参数。高、低掺Si衬底所采用的最佳配比腐蚀液 中的H₂O₂浓度分 别达到0.70mol/L和0.24mol/L。在 25℃腐蚀液中,腐蚀2h得到约200nm深的纳米级孔洞 ,其表面反射率在 宽波段内降低到5%以下;而在50℃腐蚀液中,经过2～ 4h的腐蚀,可得到14～41μm深的结构稳定的微纳 米级孔洞。文中还对Cu辅助腐蚀与其他金属辅助腐蚀(MACE)作了对比,分析了Cu辅助腐蚀获 得锥状孔洞的原因和机理。     

激光刻蚀柔性薄膜太阳电池复合背反射层的研究

柔性聚酯膜衬底薄膜电池通过激光刻蚀等工艺形成集成串联,激光刻蚀柔性薄膜太阳电池复合背反射层(Ag/ZnO)是其中的重要工艺。首先对聚酰亚胺(PI)、Ag、ZnO材料的光学特性进行了分析,然后采用1 064nm脉冲激光与532nm脉冲激光分别对柔性薄膜太阳电池复合背反射层进行刻蚀研究。通过改变重复频率、激光功率、扫描速度和焦点位置等参数,分析了激光刻蚀物理机制,获得了好的刻蚀效果。结果表明,1 064nm纳秒脉冲激光更适合刻蚀柔性PI衬底复合背反射层Ag/ZnO,在激光功率860mW、刻蚀速度800mm/s和重复频率50kHz下,获得了底部平整、两侧无尖峰的刻线,刻线宽为32μm,满足柔性薄膜太阳电池集成串联组件的制备工艺要求。     

SiCl4-based reactive ion etching of ZnO and MgxZn1−xO films on r-sapphire substrates

SiCl₄-based reactive ion etching (RIE) is used to etch Mg_xZn_1−xO (0≤x≤0.3) films grown on r-plane sapphire substrates. The RIE etch rates are investigated as a function of Mg composition, RIE power, and chamber pressure. SiO₂ is used as the etching mask to achieve a good etching profile. In comparison with wet chemical etching, the in-plane etching anisotropy of Mg_xZn_1−xO (0≤x≤0.3) films is reduced in RIE. X-ray photoelectron spectroscopy measurements show that there is no Si and Cl contamination detected at the etched surface under the current RIE conditions. The influence of the RIE to the optical properties has been investigated.     

衬底偏压对HWCVD制备纳米晶硅薄膜结晶性的影响

通过在热丝化学气相沉积(HWCVD)制备纳米晶硅 薄膜过程中施加衬底偏压,研 究衬底偏压对HWCVD制备纳米晶硅薄膜结晶性能的影响。利用拉曼(Raman)光谱,X射线 衍射(XRD)和扫描电子显微镜(SEM)对所制备的纳米晶硅薄膜的结构性能进行分析。结果表 明,与未施加衬底偏压的薄膜相比,当衬底偏压为－300V时,薄膜 的晶化率由42.2%升高至 46.2%;当衬底偏压升高至－600V时,晶化率 又降至40.6%;未施加衬底偏压与施加－300V 偏压的纳米晶硅薄膜表面由长约200nm、宽约100nm的晶粒构成,－600V衬底偏压的薄 膜表面晶粒尺寸明显变小,并且出现大量非常细小的晶粒。分析产生上述现象的原因,主要 与 高温热丝发射电子、电子在电场作用下加速运动并与反应气体、基团碰撞发生能量传递有关 。     

Iron nitride mask and reactive ion etching of GaN films

One of the major GaN processing challenges is useful pattern transfer. Serious photoresist mask erosion and hardening are often observed in reactive ion etching of GaN. Fine pattern transfer to GaN films using photoresist masks and complete removal of remaining photoresist after etching are very difficult. By replacing the etch mask from conventional photoresist to a sputtered iron nitride (Fe-8% N) film, which is easily patterned by wet chemical etching and is very resistive to Cl based plasmas, GaN films can be finely patterned with vertical etched sidewalls. Successful pattern transfer is realized by reactive ion etching using Cl (H) containing plasmas. CHF₃/Ar, C₂ClF₅/Ar, C₂ClF₅/Ar/O₂, SiCl₄, and CHCl₃ plasmas were used to etch GaN. The GaN etch rate is dependent on the crystalline quality of GaN. Higher crystalline quality GaN films exhibit slower etch rates than GaN films with higher dislocation and stacking fault density.     

Basic studies of gallium nitride growth on sapphire by metalorganic chemical vapor deposition and optical properties of deposited layers

We have studied the growth of gallium nitride on c-plane sapphire substrates. The layers were grown in a horizontal metalorganic chemical vapor deposition reactor at atmospheric pressure using trimethylgallium (TMG) and ammonia (NH₃). Variation of the V/III ratio (150–2500) shows a distinct effect on the growth rate. With decreasing V/III ratio, we find an increasing growth rate. Variation of the growth temperature (700–1000°C) shows a weak increase in growth rate with temperature. Furthermore, we performed secondary ion mass spectroscopy measurements and find an increasing carbon incorporation in the GaN films with decreasing ammonia partial pressure and a growing accumulation of carbon at the substrate interface. Photoluminescence measurements show that samples with high carbon content show a strong yellow luminescence peaking at 2.2 eV and a near band gap emission at 3.31 eV. With increasing carbon content, the intensity of the 3.31 eV line increases suggesting that a carbon related center is involved.