Enhanced conductivity behavior of polydimethylsiloxane (PDMS) hybrid composites containing exfoliated graphite nanoplatelets and carbon nanotubes

Polydimethylsiloxane (PDMS) hybrid composites consisting of exfoliated graphite nanoplatelets (xGnPs) and multiwalled carbon nanotubes functionalized with hydroxyl groups (MWCNTs-OH) were fabricated, and the effects of the xGnP/MWCNT-OH ratio on the thermal, electrical, and mechanical properties of polydimethylsiloxane (PDMS) hybrid composites were investigated. With the total filler content fixed at 4 wt%, a hybrid composite consisting of 75% × GnP/25% MWCNT-OH showed the highest thermal conductivity (0.392 W/m K) and electrical conductivity (1.24 × 10⁻³ S/m), which significantly exceeded the values shown by either of the respective single filler composites. The increased thermal and electrical conductivity found when both fillers are used in combination is attributed to the synergistic effect between the fillers that forms an interconnected hybrid network. In contrast, the various different combinations of the fillers only showed a modest effect on the mechanical behavior, thermal stability, and thermal expansion of the PDMS composite.     

Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities

Polyhedral oligomeric silsesquioxane grafting thermally conductive silicon carbide particle (POSS-g-SiCp) fillers, are performed to fabricate highly thermally conductive ultra high molecular weight polyethylene (UHMWPE) composites combining with optimal dielectric properties and excellent thermal stabilities, via mechanical ball milling followed by hot-pressing method. The POSS-g-SiCp/UHMWPE composite with 40 wt% POSS-g-SiCp exhibits relative higher thermal conductivity, lower dielectric constant and more excellent thermal stability, the corresponding thermally conductive coefficient of 1.135 W/mK, the dielectric constant of 3.22, and the 5 wt% thermal weight loss temperature of 423 °C, which holds potential for packaging and thermal management in microelectronic devices. Agari’s semi-empirical model fitting reveals POSS-g-SiCp fillers have strong ability to form continuous thermally conductive networks.     

Mechanical and electrical properties of carbon fiber composites with incorporation of graphene nanoplatelets at the fiber–matrix interphase

In this study, carbon fibers (CFs) were coated with graphene nanoplatelets (GnP), using a robust and continuous coating process. CFs were directly immersed in a stable GnP suspension and the coating conditions were optimized in order to obtain a high density of homogeneously and well-dispersed GnP. GnP coated CFs/epoxy composites were manufactured by a prepreg and lay-up method, and the mechanical properties and electrical conductivity of the composites were assessed. The GnP coated CFs/epoxy composites showed 52%, 7%, and 19% of increase in comparison with non-coated CFs/epoxy composites, for 90° flexural strength, 0° flexural strength and interlaminar shear strength, respectively. Meanwhile, incorporating GnP in the CF/epoxy interphase significantly improved the electrical conductivity through the thickness direction by creating a conductive path between the fibers.     

Introducing cellulose nanocrystals in sheet molding compounds (SMC)

The mechanical properties of short glass fiber/epoxy composites containing cellulose nanocrystals (CNC) made using sheet molding compound (SMC) manufacturing method as well as the rheological and thermomechanical properties of the CNC-epoxy composites were investigated as a function of the CNC content. CNC up to 1.4 wt% were dispersed in the epoxy to produce the resin for SMC production. The addition of CNC in the resin increased its viscosity and slightly reduced the heat of reaction during the polymerization without altering the curing time and temperature and the effective pot life of the resin. The incorporation of 0.9 wt% CNC in the SMC composite resulted in increases in elastic modulus and tensile strength by ∼25% and ∼30% and in flexural modulus and strength by ∼44% and ∼33% respectively. Concentrations of CNC up to 0.9 wt% in the SMC composite did not alter the impact energy.     

SiC颗粒-SiC晶须混杂填料/双马来酰亚胺树脂导热复合材料的制备与性能

以双马来酰亚胺树脂(BMI)为树脂基体,二烯丙基双酚A(DABA)为增韧剂,γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)表面改性的SiC颗粒-SiC晶须(SiCP-SiCW)为复配导热填料,浇注成型制备SiC_P-SiC_W/BMI导热复合材料,分析研究SiC形状、用量、质量比及表面改性对SiC_P-SiC_W/BMI导热复合材料的导热性能、介电性能、力学性能和热性能的影响。结果表明,当改性SiC_P-SiC_W用量为40wt%且SiC_P∶SiC_W质量比为1∶3时,SiC_P-SiC_W/BMI导热复合材料具有最佳的综合性能,导热系数λ为1.125W(m·K)~(-1),介电常数ε为4.12,5%热失重温度为427℃。     

Thermal conductivity of epoxy composites with a binary-particle system of aluminum oxide and aluminum nitride fillers

Aluminum oxide and aluminum nitride with different sizes were used alone or in combination to prepare thermally conductive polymer composites. The composites were categorized into two systems, one including composites filled with large-sized aluminum nitride and small-sized aluminum oxide particles, and the other including composites filled with large-sized aluminum oxide and small-sized aluminum nitride. The use of these hybrid fillers was found to be effective for increasing the thermal conductivity of the composite, which was probably due to the enhanced connectivity offered by the structuring filler. At a total filler content of 58.4 vol.%, the maximum values of both thermal conductivities in the two systems were 3.402 W/mK and 2.842 W/mK, respectively, when the volume ratio of large particles to small particles was 7:3. This result was represented when the composite was filled with the maximum packing density and the minimum surface area at the same volume content. As such, the proposed thermal model predicted thermal conductivity in good agreement with experimental values.     

Graphene woven fabric-reinforced polyimide films with enhanced and anisotropic thermal conductivity

Due to the growing needs of thermal management in modern electronics, polyimide-based (PI) composites are increasingly demanded in thermal interface materials (TIMs). Graphene woven fabrics (GWFs) with a mesh structure have been prepared by chemical vapor deposition and used as thermally conductive filler. With the incorporation of 10-layer GWFs laminates (approximate 12 wt%), the in-plane thermal conductivity of GWFs/PI composite films achieves 3.73 W/mK, with a thermal conductivity enhancement of 1418% compared to neat PI. However, the out-of-plane thermal conductivity of the composites is only 0.41 W/mK. The in-plane thermal conductivity exceeds its out-of plane counterpart by over 9 times, indicating a highly anisotropic thermal conduction of GWFs/PI composites. The thermal anisotropy and the enhanced in-plane thermal conductivity can be attributed to the layer-by-layer stacked GWFs network in PI matrix. Thus, the GWFs-reinforced polyimide films are promising for use as an efficient heat spreader for electronic cooling applications.     

Characteristics of nanoclay and calcined nanoclay-cement nanocomposites

The influence of nanoclay (NC) and calcined nanoclay (CNC) on the mechanical and thermal properties of cement nano-composites presented. Calcined nanoclay is prepared by heating nanoclay (Cloisite 30B) at 900 °C for 2 h. Characterisation of microstructure is investigated using Quantitative X-ray Diffraction Analysis (QXDA) and High Resolution Transmission Electron Microscopy (HRTEM). Estimation of Ca(OH)₂ content in the cement nanocomposite is studied by the combination of QXDA and thermogravimetry analysis (TGA) techniques. Results showed that the mechanical and thermal properties of the cement nanocomposites are improved as a result of NC and CNC addition. An optimum replacement of ordinary Portland cement with 1 wt% CNC is observed through reduced porosity and water absorption as well as increased density, compressive strength, flexural strength, fracture toughness, impact strength, hardness and thermal stability of cement nanocomposites. The microstructural analyses from QXRA and SEM indicate that the CNC acted not only as a filler to improve the microstructure, but also as the activator to support the pozzolanic reaction. Cost-benefit analysis indicates that nanoparticles are expensive but from economic point of view nanoclay is used in very small amount (i.e. 1 wt. %) in cementitious materials. As a result nanoclay does not add any significant cost but improves the mechanical properties significantly.     

Carbon black/graphite nanoplatelet/rubbery epoxy hybrid composites for thermal interface applications

Hybrid composites were developed by dispersing carbon black (CB) nanoparticles and graphite nanoplatelets (GNPs) at 4–6 and 12–14 wt%, respectively, into rubbery epoxy resin. SEM analysis showed that CB particles improved the dispersion of GNPs in the hybrid composite. The thermal conductivity of 4 wt% CB/14 wt% GNP-15/rubbery epoxy hybrid composite, 0.81 W/m K, is ca. four times higher than that of rubbery epoxy. When silane-functionalised, the fillers reduced the viscosity of the hybrid dispersion and made the hybrid composite highly electrically insulating. Nevertheless, filler functionalisation decreased the composite’s thermal conductivity by only 16.6%. Compression testing showed that the hybrid fillers increased the compressive modulus and strength of rubbery epoxy by nearly two and three times, respectively. Overall, the hybrid composites with their thermal paste-type morphology, low viscosity, high compliance, improved thermal conductivity and, when fillers are functionalised, low electrical conductivity makes them promising materials as thermal interface adhesives.     

High-performance conductive materials based on the selective location of carbon black in poly(ether ether ketone)/polyimide matrix

A novel high performance conductive material with excellent comprehensive properties was prepared by melt-blending, and its performances were adjusted by controlling the selective location of carbon black (CB) in poly(ether ether ketone) (PEEK)/thermoplastic polyimide (TPI) matrix. With increasing the CB loadings, the morphology of PEEK/TPI blends changed from sea-island to co-continuous structure, which was owing to the selective location of CB in TPI phase. Notably, with the selective location of CB in the induced co-continuous PEEK/TPI matrix, the electrical percolation threshold was reduced to 5 wt%, which was significantly lower than that of binary PEEK/CB (9 wt%) and TPI/CB (10 wt%) composites. And the electrical conductivity of ternary PEEK/TPI/CB composites was 10⁴ to 10⁶ times higher than that of binary composites at identical 7.5 wt% CB loading, which was attributed to the double percolation effect. Moreover, the incorporation of CB could improve the thermal and mechanical properties effectively.     

Manufacturing techniques and property evaluations of conductive composite yarns coated with polypropylene and multi-walled carbon nanotubes

This study uses a melt extrusion method, a method for producing wires, to coat polyester (PET) yarns with polypropylene (PP) and multi-walled carbon nanotubes (MWCNTs). The resulting PP/MWCNTs-coated PET conductive yarns are tested for their tensile properties, processability, morphology, melting and crystallization behaviors, electrical conductivity, and applications. The test results indicate that tensile strength of the conductive yarns increases with an increase in the coiling speed that contributes to a more single-direction-orientated MWCNTs arrangement as well as a greater adhesion between PP/MWCNTs and PET yarns. 8 wt% MWCNTs results in an 18 °C higher crystallization temperature (T_c) of PP and an electrical conductivity of 0.8862 S/cm. The test results of this study have proven that this form of processing technology can prepare PP/MWCNTs-coated PET conductive yarns that have satisfactory tensile properties and electrical conductivity, and can be used in functional woven fabrics and knitted fabrics.     

In situ thermal reduction of graphene oxide for high electrical conductivity and low percolation threshold in polyamide 6 nanocomposites

Electrically conductive and thermally stable polyamide 6 (PA 6) nanocomposites were prepared through one-step in situ polymerization of ε-caprolactam monomer in the presence of electrically insulating and thermally unstable graphene oxide (GO) nanosheets. These nanocomposites show a low percolation threshold of ∼0.41 vol.% and high electrical conductivity of ∼0.028 S/m with only ∼1.64 vol.% of GO. Thermogravimetric analysis and X-ray photoelectron spectroscopy results of GO before and after thermal treatment at the polymerization temperature indicate that GO was reduced in situ during the polymerization process. X-ray diffraction patterns and scanning electron microscopy observation confirm the exfoliation of the reduced graphene oxide (RGO) in the PA 6 matrix. The low percolation threshold and high electrical conductivity are attributed to the large aspect ratio, high specific surface area and uniform dispersion of the RGO nanosheets in the matrix. In addition, although GO has a poor thermal stability, its PA 6 nanocomposite is thermally stable with a satisfactory thermal stability similar to those of neat PA 6 and PA 6/graphene nanocomposite. Such a one-step in situ polymerization and thermal reduction method shows significant potential for the mass production of electrically conductive polymer/RGO nanocomposites.     

The effect of interfacial state on the thermal conductivity of functionalized Al2O3 filled glass fibers reinforced polymer composites

Rapidly increasing packaging density of electronic devices puts forward higher requirements for thermal conductivity of glass fibers reinforced polymer (GFRP) composites, which are commonly used as substrates in printed circuit board. Interface between fillers and polymer matrix has long been playing an important role in affecting thermal conductivity. In this paper, the effect of interfacial state on the thermal conductivity of functionalized Al₂O₃ filled GFRP composites was evaluated. The results indicated that amino groups-Al₂O₃ was demonstrated to be effective filler to fabricate thermally conductive GFPR composite (1.07 W/m K), compared with epoxy group and graphene oxide functionalized Al₂O₃. It was determined that the strong adhesion at the interface and homogeneous dispersion of filler particles were the key factors. Moreover, the effect of interfacial state on dielectric and thermomechanical properties of GFRP composites was also discussed. This research provides an efficient way to develop high-performance GFRP composites with high thermal conductivity for integrated circuit packaging applications.     

The thermal conductivity of Al(OH)3 covered MWCNT/epoxy terminated dimethyl polysiloxane composite based on analytical Al(OH)3 covered MWCNT

Aluminum-hydroxide-covered multi-walled carbon nanotubes (A–MWCNT) were fabricated as a thermally conductive material. The thermal conductivity of A–MWCNT was estimated based on Casimir theory. The effective thermal conductivity of A–MWCNT was estimated at about ∼26 W/mK. The thermal conductivity of A–MWCNT/epoxy-terminated polydimethylsiloxane (ETDS) composite was examined as a function of A–MWCNT loading, and the results showed the maximum value at 1.5 wt% of A–MWCNT loading, above which it decreased slightly. The effective medium approximation (EMA) developed by Maxwell–Garnett (M–G) was used to analyze the thermal conducting behavior of the composite. The experimental results showed negative deviation from the expected thermal conductivity, k_e, beyond 1.5 wt% of A–MWCNT loading, because the composites containing A–MWCNT were strongly affected by interfacial resistance. The interfacial resistance value calculated from M–G approximation increased when filler loading was higher than 1.5 wt% because of the folded and partially agglomerated A–MWCNT along with insufficient interfacial interactions.     

Effects of carbon nanotubes and carbon fiber reinforcements on thermal conductivity and ablation properties of carbon/phenolic composites

The ablation properties and thermal conductivity of carbon nanotube (CNT) and carbon fiber (CF)/phenolic composites were evaluated for different filler types and structures. It was found that the mechanical and thermal properties of phenolic-polymer matrix composites were improved significantly by the addition of carbon materials as reinforcement. The concentrations of CF and CNT reinforcing materials used in this study were 30 vol% and 0.5 wt%, respectively. The thermal conductivity and thermal diffusion of the different composites were observed during ablation testing, using an oxygen–kerosene (1:1) flame torch. The thermal conductivity of CF mat/phenolic composites was higher than that of random CF/phenolic composites. Both CF mat and CNT/phenolic composites exhibited much better thermal conductivity and ablation properties than did neat phenolic resin. The more conductive carbon materials significantly enhanced the heat conduction and dissipation from the flame location, thereby minimizing local thermal damage.     

Electrostatic self-assembled carbon nanotube/nano carbon black composite fillers reinforced cement-based materials with multifunctionality

Electrostatic self-assembled carbon nanotube (CNT)/nano carbon black (NCB) composite fillers are added into cement mortar to fabricate smart cement-based materials. The grape bunch structure of CNT/NCB composite fillers is beneficial for dispersing CNT/NCB in cement mortar matrix and achieving cooperative improvement effect. The mechanical, electrically conductive, and piezoresistive behaviors of the cement mortar are investigated. The CNT/NCB composite fillers can effectively enhance the flexural strength and electrical conductivity of cement mortars, and endow stable and sensitive piezoresistivity to cement mortar at a low filler content. However, they weaken the compressive strength of cement mortar to some extent. The percolation threshold zone of cement mortar with CNT/NCB composite fillers ranges in the amount of 0.39–1.52 vol.%. The optimal content of CNT/NCB composite fillers is 2.40 vol.% for piezoresistivity and the stress and strain sensitivities can reach 2.69% MPa⁻¹ and 704, respectively.     

Electrical and mechanical properties of antistatic PVC films containing multi-layer graphene

In order to explore practical application of graphene as novel conductive fillers in the filed of composite materials, we prepared anti-static multi-layer graphene (MLG) filled poly(vinyl chloride) (PVC) composite films by using conventional melt-mixing method, and investigated electrical conductivity, tensile behavior, and thermal properties of the MLG/PVC composite films. We found that the presence of MLG can greatly increase electrical conductivity of the MLG/PVC composites, and the surface electrical conductivity of the MLG/PVC composites is less than 3 × 10⁸ Ohm/square when the MLG loading is about 3.5 wt%, meeting anti-static requirement for commercial anti-static PVC films. On the other hand, the MLG/PVC composites exhibited higher tensile modulus and higher glass transition temperature than neat PVC, which is closely associated with crumpled morphology of the MLG and good compatibility between components of the MLG/PVC composites. By virtue of its satisfied anti-static performance and high mechanical properties, the MLG/PVC composites exhibit great potential to be used as high-performance antistatic materials in many fields.     

Effect of clay and PEO-PPO-PEO block copolymer on the microstructure and properties of cyanate ester/epoxy composite

In this study, processing, morphology and properties of poly (ethylene oxide)-block-poly (propylene oxide)-block-poly (ethylene oxide) (PEO-PPO-PEO) triblock copolymer and clay modified cyanate ester/epoxy hybrid nanocomposites were investigated. The PEO-PPO-PEO triblock copolymer preferentially reaction-induced microphase separate into spherical micelles in the cyanate ester/epoxy matrix. PEO-PPO-PEO was used as both nanostructuring agent for cyanate ester/epoxy blended resin and thus the predominantly intercalated and few exfoliated platelets of were also observed with clay, which successfully reduced the brittleness of the cyanate ester/epoxy blended resin increasing the toughness of designed materials. The stiffness and heat resistance of the neat BCE/EP resin could be retained in the BCE/EP/F68/clay hybrid nanocomposites. The optimum property enhancement was observed in the hybrid nanocomposites containing 5 wt% PEO-PPO-PEO and 3 wt% clay. The thermo/mechanical properties of the hybrid nanocomposites depend on microstructure, dispersion state and the ratio between organic and inorganic modifiers content.     

Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Polyimide (PI) composites containing one-dimensional SiC nanowires grown on two-dimensional graphene sheets (1D–2D SiC_NWs-GSs) hybrid fillers were successfully prepared. The PI/SiC_NWs-GSs composites synchronously exhibited high thermal conductivity and retained electrical insulation. Moreover, the heat conducting properties of PI/SiC_NWs-GSs films present well reproducibility within the temperature range from 25 to 175 °C. The maximum value of thermal conductivity of PI composite is 0.577 W/mK with 7 wt% fillers loading, increased by 138% in comparison with that of the neat PI. The 1D SiC nanowires grown on the GSs surface prevent the GSs contacting with each other in the PI matrix to retain electrical insulation of PI composites. In addition, the storage modulus and Young’s modulus of PI composites are remarkably improved in comparison with that of the neat PI.     

The role of conductive fillers on the rheological behavior and electrical conductivity of multi-functional shear thickening fluids (M-STFs)

Multi-functional shear thickening fluids (M-STFs) with both shear thickening behavior and electrical conductivity have a great potential for usage in a variety of applications ranging from intelligent anti-impact and vibration damping structures to effective electric mechanical platforms. However, the influences of conductive fillers on the rheological behavior and electrical conductivity of M-STFs remained unclear. In this study, the role of conductive fillers including multi-walled carbon nanotubes (MWCNTs), carbon nanofibers (CNFs), and mixtures of MWCNT/CNF was investigated through the response surface methodology (RSM) in the temperature range of 0 °C to 60 °C. The individual and combined effects of filler content, temperature, and type of fillers on the electrical resistance and rheological behavior of M-STFs were studied. The results revealed the significant role of conductive fillers on the rheological properties and electrical conductivity of M-STFs. It is found that the initial viscosity of M-STF increases with increasing the filler content. Moreover, the M-STFs containing CNF exhibits higher electrical conductivity and lower percolation threshold (0.4 wt%). The results of this work provide new insights for the development of novel STF-based systems with multi-functional properties.