Method for polymer hot embossing process development

Molding technologies associated with fabricating macro scale polymer components such as injection molding and hot embossing have been adapted with considerable success for fabrication of polymer microparts. While the basic principles of the process remain the same, the precision with which the processing parameters need to be controlled especially in the case of molding high aspect ratio (HAR) polymer microparts into polymer sheets is much greater than in the case of macro scale parts. It is seen that the bulk effects of the mold insert fixture and molding machine have a dominant influence on the molding parameters and that differences in material parameters such as the glass transition temperature (T _g) of polymer sheets are critical for the success and typically differ from sheet to sheet. This makes it very challenging to establish standard processing parameters for hot embossing of sheet polymers. In the course of this paper, a methodology for developing a hot embossing process for HAR microstructures based on known material properties and considering the cumulative behavior of mold, material, and machine will be presented. Using this method force–temperature–deflection curves were measured with the intent of fine tuning the hot embossing process. Tests were carried out for different materials using a dummy mold insert yielding information that could be directly transferred to the actual mold insert with minimum development time and no risk of damage to the actual microstructures.     

Hot embossing at viscous state to enhance filling process for complex polymer structures

In this paper, a new hot embossing process, molding at the viscous state, for fabrication of complex polymer structures at the micro and millimeter scale is presented. Polymer deformability is enhanced due to its low viscosity and is increased by an inner pressure from confinement of the polymer flow. Various millimeter-scale polymer structures with high aspect ratios and complex features were hot embossed. In addition, typical microstructures were achieved. This new approach promises the advantages of a broad process capability and strong compatibility with conventional hot embossing processes.     

Hot embossing of thermoplastic multilayered stacks

The combination of different polymer materials during replication offers additional opportunities for fabrication and functionality of microsystems. Different surface and structural properties of polymers allow for improvements in microsystems for example by means of hydrophilic and hydrophobic combinations in microfluidic devices. Due to its high flexibility and precision hot embossing as one of the established micro replication processes facilitates processing of several polymer layers in one single process step. By this multi-component process micro structured systems consisting of thin layers of different polymers with adapted surface properties are fabricated. In this paper we describe the challenge of molding different types of polymers and some applications for multi-component micro systems.     

Study of Hot Embossing Using Nickel and Ni–PTFE LIGA Mold Inserts

Hot embossing is one of the main process techniques for polymer microfabrication, which helps X-ray lithography, electroplating, and molding (LIGA) to achieve low-cost mass production. Most problems in polymer micromolding are caused by demolding, especially for hot embossing of high-aspect-ratio microstructures. The demolding forces are related to the sidewall roughness of the mold insert, the interfacial adhesion, and the thermal shrinkage stress between the mold insert and the polymer. The incorporation of polytetrafluoroethylene (PTFE) particles into a nickel matrix can have the properties such as antiadhesiveness, low friction, good wear, etc. To minimize the demolding forces and to obtain high-quality polymer replicas, a Ni-PTFE composite microelectroforming has been developed, and the hot embossing process using Ni and Ni-PTFE LIGA mold inserts has been well studied in this paper. The morphologies, sidewall roughness, and friction coefficient have been explored in the fabricated Ni-PTFE LIGA mold insert. Finally, the comparison of embossed microstructures with various aspect ratios and the comparison of the embossing lifetimes of mold inserts have been carried out between Ni and Ni-PTFE mold inserts, which show a better performance of the Ni-PTFE mold and its potential applications.     

Modeling of large area hot embossing

Today, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know-how is needed to adapt hot embossing to industrial standards. To reach this objective, a German–Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about the first results of the simulation—the modeling and simulation of large area replication based on an eight in. microstructured mold.     

Hot embossing of high performance polymers

Hot embossing and injection moulding belong to the established plastic moulding processes in microengineering. Based on experimental and theoretical findings, a variety of microstructures have been replicated using these processes. However, beside the technology also the moulding materials their physical and chemical properties determines the process and their parameters. Especially high temperature semicrystalline polymers like PEEK and LCP are well suited for many applications in microfluidics. The moulding of these polymers by hot embossing requires a precise setting of temperatures for successful moulding. The present publication describes the moulding of high performance polymers by hot embossing and thermoforming. The focus is set to the process parameters and the required heating conditions for the replication of micro- and nanostructured mould inserts. In detail, the process conditions for hot embossing of LCP, PEEK, FEP and PSU will be discussed.     

Microfabrication by hot embossing and injection molding at LASTI

LIGA process includes three processes as X-ray lithography, electroforming to fabricate metalic molds and replication, and can be fabricated nano and micro parts for various devices that it is difficult to product by conventional machining methods. A key technology which gathers mass-production efficiency in the LIGA process is micro-replication technology. We choiced hot embossing and injection molding methods for replication. For a demonstration, two kinds of Ni molds, a mesh pattern within a line width of 100 m, and an aspect ratio of 1.0 and a mesh pattern within a line width of 40 m, and an aspect ratio of 2.5, were prepared. These were produced with X-ray lithography and nickel electrofoming technique. In hot embossing, an experiment of micro-replication using polymethyl methacrylate (PMMA) and polycarbonate (PC) sheets succeeded. At injection molding, it could not transfer well with PMMA and PC, but injection temperature was set up highly, and it succeeded by cycloolefin polymer. Furthermore, we measured sidewalls surface roughness of microstructures produced at each steppes of the LIGA process, and it checked that the LIGA process had processing accuracy higher than a conventional machining method.We would like to thank Ms. A. Kitajima and Dr. R. Maeda at National Institute of Advanced Industrial Science and Technology (AIST), Mr. M. Ohtomo at Ikegami Mold Engineering Co., Ltd., and Mr. Noriaki Sato at Juken Kogyo Co., Ltd. for their valuable collaboration and contributions. This research was the contract research from the New Industry Research Organization (NIRO) supported financially by the New Energy and Industrial Technology Development Organization (NEDO).     

Large-scale hot embossing

The hot embossing process is a flexible molding technique to produce delicate microstructures with high aspect ratios on thin layers. Large-scale hot embossing is one effective way to meet future requirements and produce high-quality microstructures at low costs. For this, however, principal changes of the molding process and molding tool design will be required. In the present paper, constructive solutions for large-scale hot embossing shall be described. Based on a simulation of the hot embossing process, solutions shall be presented that are aimed at reducing shrinkage of the molded parts and demolding forces and, hence, at avoiding damages of microstructures during demolding.     

New aspects of simulation in hot embossing

Hot embossing is especially well suited for manufacturing small and medium-volume series. However, wider diffusion of this process currently is seriously hampered by the lack of adequate simulation tools for process optimization and part design. This lack of simulation tools is becoming critical, as the dimensions of the microstructures continuously shrink from micron and sub-micron to nano scales and as productivity requirements dictate the enlargement of formats to process larger numbers of devices in parallel. Having no macroscopic equivalent, the micro hot embossing process cannot be described by simple downscaling of existing software tools like in injection molding. In this paper a first survey is given of how numerical simulation can also be applied to the hot embossing process.     

Hot embossing of microstructures: characterization of friction during demolding

Today, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the above processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know––how is needed to adapt hot embossing to industrial standards. To reach this objective, a German–Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about an important aspect––the determination of friction during the demolding of microstructures.     

Fabrication method of two-level polymeric microstructure with the help of deep X-ray lithography

Two- or multi-level microstructures are getting more important in several applications such as multi-component micro optical elements and various microfluidic systems. In the present study, a simple and efficient method is newly proposed for a fabrication of the two-level polymeric microstructures. Making a mother two-level microstructure consists of two processes: (1) the hot embossing process for a fabrication of microstructures on a PMMA substrate, and (2) the deep X-ray lithography using the hot embossed substrate for a high aspect ratio microstructure fabrication, resulting in a high aspect ratio microstructure containing smaller microstructures on its surface. Making use of so fabricated two-level microstructures as a mother structure, one could achieve a mass replication of the same microstructures via injection molding process with a metallic mold insert obtained by a nickel electroforming onto the mother microstructure. In order to demonstrate the proposed method, a polymeric high aspect ratio microstructure having smaller square microstructures on its top surface was fabricated. The fabricated two-level microstructure shows fine vertical sidewalls, which is a characteristic feature of the deep X-ray lithography. In addition, a metallic mold insert for a mass replication was fabricated by a nickel electroforming process.     

Hot embossing - The molding technique for plastic microstructures

 Hot embossing is the technique to fabricate high precision and high quality plastic microstructures. Industrial fabrication of plastics components is normally achieved by injection molding. Hot embossing is actually used only for a few optical applications where high precision and high quality are important. The advantages of hot embossing are low material flow, avoiding internal stress which induces e.g. scattering centers infavorable for optical applications, and low flow rates, so more delicate structures can be fabricated, such as free standing thin columns or narrow oblong walls. The development of modular molding equipment, orientated on industrial standards has opened the door to the fabrication of plastic microcomponents in great numbers (for example LIGA-UV/VIS-spectrometers). Hot embossing has the potential of increasing production rates and therefore decreasing production costs by the enlargement of the molding surface and automatization of the molding process. Received: 25 August 1997/Accepted: 22 September 1997     

Hot embossing of micro and sub-micro structured inserts for polymer replication

Today replication of microstructured parts is state of the art in laboratory and commercial use. Beside the process of injection molding hot embossing enables the accurate replication of polymer structures in a broad variety of thermoplastic polymers even in the nanometer range. Characteristic for the most replication processes dealing with thermoplastic polymers is the use of microstructured mold inserts based on metals. In this paper we describe an alternative to the established mold inserts––the use of so called interstage mold inserts. These interstage mold inserts are replicated in high performance polymers and technical thermoplastics and can be fabricated many times by a previous replication step from a master even in the sub-micro range. Aspects like suitable material combinations, demolding behaviour, long time stability, production rate, and the quality of structures will be discussed. Because of the high flexibility the process of hot embossing is used for the fabrication of the microstructured interstage mold inserts and their replications.     

Analysis of the demolding forces during hot embossing

Hot embossing is one of the main processing techniques for polymer microfabrication, which helps the LIGA (UV-LIGA) technology to achieve low cost mass production. When hot embossing of high aspect ratio microstructures, the deformation of microstructures usually occurs due to the demolding forces between the sidewall of mold inserts and the thermoplastic (PMMA). The study of the demolding process plays a key role in commercial manufacturing of polymer replicas. In this paper, the demolding behavior was analyzed by Finite element method using ABAQUS/Standard. Simulation identified the friction force caused by interface adhesion and thermal stress due to shrinkage between the mold and the polymer as the main sources of the demolding forces. Simulation also showed that the friction force made a greater contribution to the deformation than thermal stress, which is explained in the accompanying theoretical analysis. To minimize the friction force the optimized experiment was performed using PTFE (Teflon) as anti-adhesive films and using Ni-PTFE compound material mold inserts. Both lowered the surface adhesion energy and friction coefficient. Typical defects like pull-up and damaged edges can be reduced.     

Micro-optical elements and their integration to glass and optoelectronic wafers

Polymer replication technique enables for low cost devices even in the case of aspheric or irregular shaped surfaces, submicron or other challenging structures. The use of UV-reaction moulding on semiconductors, glass or other inorganic substrates as the replication technique leads to a high degree of stability and allows for the simultaneous integration of optoelectronics or ion exchanged GRIN elements. Thin polymer layers on inorganic substrates show high flatness and lower wavefront deviations with respect to all-polymer elements. They show low lateral shrinkage during the UV-polymerisation, and the lateral thermal expansion is determined by the substrate. Furthermore, sensitive substrates can be used because the process does not involve high mechanical stress or elevated temperatures. Original structures for the replication masters are fabricated by different resist technologies. Subsequently, they are proportionally transferred by dry etching (RIE) into glass or silicon, or, the resist structure is transformed into a metal master by electroplating. The utilisation of UV-transparent replication tools allows for the use of opaque substrates (i.e. detectors). Locally UV-transparent replication tools enable a combination of replication and resist technology (leading to elements with new features) or can protect sensitive areas like bond pads from being coated with optical layers. The fabrication of isolated polymer elements on arbitrary substrates is an advantage of UV-reaction moulding against injection moulding or hot embossing. Received: 30 March 1999 / Accepted: 12 April 1999     

Micro powder metallurgy for the replicative production of metallic microstructures

 Reproductive techniques like injection molding or embossing of feedstock provide microstructures of a wide variety of materials for a reasonable price to micro system technology. In this paper, the dependencies and barriers to produce high aspect ratio structures by micro metal injection molding are described; some results of embossing of metal powder based feedstocks are presented, too. The investigations show different influencing parameters for reaching high aspects ratios. The main factor is the used powder, finer powders allow higher aspect ratios. Moreover, the binder system, the feedstock (mixture of powder and binder) and the quality of the injection mold influence the reproduction process. Received: 10 August 2001/Accepted: 24 September 2001     

Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Hot embossing, a polymer molding process conceived by Forschungszentrum Karlsruhe, is one of the established replication processes for microstructures The process is especially well suited for manufacturing small and medium series of microcomponents (SPIE Conference 1997; Polymer News 25:224–229, 2000; J Micromech Microeng 14:R1–14, 2004; Sensors Actuators 3:130–135, 2000). However, a wider application of the process currently is seriously hampered by the lack of adequate simulation tools for process optimization and part design. This situation is becoming more critical, as the dimension of the microstructures shrink from micron and submicron levels to the nanoscale and as productivity requirements dictate the enlargement of formats to process larger numbers of devices in parallel. Based on the current scientific work (Forschungszentrum Karlsruhe, FZKA-Bericht 7058 2003; DTIP Conference Montreux 2004; Microsystem Tech 10:432–437 2004), a German–Canadian cooperation has been started. The objective of this cooperation is to fill the gap mentioned above by developing reliable computer models and simulation tools for the hot embossing process and to incorporate these models in a user-friendly computer code. The present paper will give an overview of the activities in the project. The activities related to material characterization, especially the development of a viscoelastic material model, the characterization of friction between polymer and mold during demolding, the development of an 8-in. microstructured mold, and the fabrication of nanostructured molds will be discussed.

     

Various replication techniques for manufacturing three-dimensional metal microstructures

 In microsystem technology a large range of different 6materials will be available only after the necessary micromanufacturing techniques have been developed or adapted. Existing manufacturing techniques are structuring or shaping techniques producing three-dimensional microstructures out of silicon (silicon etching, silicon surface micromechanics), mostly unfilled plastics (lithographic techniques, injection molding, hot embossing, reaction molding) or a few pure metals or binary alloys (electroforming). The choice of materials for microcomponents is determined by the function and conditions of use of microsystems. Especially the range of metals is still restricted considerably because the only processes available are electroforming and thin-layer techniques. It is for these reasons that we are developing various processes for manufacturing three-dimensional metal microstructures. In addition to direct electroforming of injection molding lost plastic micromolds, these are a new microcasting process and Micro Metal Injection Molding (Micro MIM). Microstructures have already been molded from mold inserts made by micromechanical cutting or by the LIGA technique. The results achieved, and future prospects, are outlined below. Received: 25 August 1997/Accepted: 3 September 1997     

Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Hot embossing, a polymer molding process conceived by Forschungszentrum Karlsruhe, is one of the established replication processes for microstructures The process is especially well suited for manufacturing small and medium series of microcomponents (SPIE Conference 1997; Polymer News 25:224–229, 2000; J Micromech Microeng 14:R1–14, 2004; Sensors Actuators 3:130–135, 2000). However, a wider application of the process currently is seriously hampered by the lack of adequate simulation tools for process optimization and part design. This situation is becoming more critical, as the dimension of the microstructures shrink from micron and submicron levels to the nanoscale and as productivity requirements dictate the enlargement of formats to process larger numbers of devices in parallel. Based on the current scientific work (Forschungszentrum Karlsruhe, FZKA-Bericht 7058 2003; DTIP Conference Montreux 2004; Microsystem Tech 10:432–437 2004), a German–Canadian cooperation has been started. The objective of this cooperation is to fill the gap mentioned above by developing reliable computer models and simulation tools for the hot embossing process and to incorporate these models in a user-friendly computer code. The present paper will give an overview of the activities in the project. The activities related to material characterization, especially the development of a viscoelastic material model, the characterization of friction between polymer and mold during demolding, the development of an 8-in. microstructured mold, and the fabrication of nanostructured molds will be discussed.     

Rapid-manufacturing of micro-structured devices based on MWCNTs/PP composites by using hot embossing replication process

Carbon nanotubes have attracted the fancy of many scientists since their first discovery in 1991. Their small dimensions, strength and remarkable physical properties make them a very unique material with a whole range of promising applications. The most important application of carbon nanotubes based on their important mechanical properties will be as reinforcements in composite materials, especially nanotube-filled polymer composites are an obvious materials application area. In this work, the micro-structured devices in range of micro meter have been manufactured based on polymer/carbon nanotubes composites by using hot embossing replication process. Firstly, the carbon nanotubes with different loading rate (0.1, 1 and 10 %) have been mixed with polypropylene (PP) in molten state to obtain the composite, the rheological properties of MWCNTs/PP composites with different CNT loading ratios were investigated by means of rheometer with a cone-and-plate geometry, the improvement of dispersion of the CNT particles in polypropylene matrix were observed by scanning electronic microscopy. Afterwards, the obtained composite were granulated in particles and used in hot embossing process to realize the replication of micro structured; in this step, a Al mould with micro-motif on surface obtain by machining with computer numerical control machine tools has been used. Finally, the micro-structured motifs on the mould have been successfully transferred with the details on the MWCNTs/PP substrate under the embossing pressure.