多层片式LC滤波器中间层复合材料的研究

为了解决多层片式LC滤波器制造中的介电体与铁氧体的共烧问题,采取了在两种材料之间加入中间层复合材料的方法来实现异种材料之间的共烧。制备了由Pb(Ni1/3Nb2/3)O3-PbTiO3基介电体和NiZnCu铁氧体构成的中间层复合材料,研究了其显微组织、成分分布以及其与介电体和铁氧体的共烧界面等,结果表明中间层复合材料中介电体与铁氧体各自保持独立的相结构,没有新相生成;介电体晶粒与铁氧体晶粒相间分布于中间层中,且它们之间存在着离子的相互扩散;中间层能够有效地减小异种材料共烧界面上的应力。     

利用K-K关系计算量子点玻璃的介电函数

为了得到PbSe量子点(QD)玻璃的光学常数,为 实验制备QD材料提供定性和定量参考,本文利用 实验中测量的吸收光谱,结合米氏散射理论和克拉默斯-克勒尼希(K-K)关系,通过多次迭 代运算,从吸收光 谱中分离出相应的介电函数的实部和虚部,最终获得材料的光学常数。为了使矩阵迭代运算 能够快速收敛, 设计了一种快速、不产生奇异矩阵的简便方法。计算得给出的PbSe QD玻璃的介电函数与 实验测量得到 的胶体QD介电函数分布非常相似,表明本文方法能够用于快速测定QD玻璃的介电 函数。本文方法可 以推广到其他液体、固体和气体材料光学常数的测量中,为纳米材料制备提供一定的参考。     

基于传输反射法的等离子体相对复介电系数测量

为解决微波激发等离子体参数诊断存在的困难问题,提出利用二端口传输反射法测量微波激励产生的低温等离子体的等效相对复介电系数。使用有限元方法设计了基于BJ22标准波导的样品测试结构,该结构能在较大的介电系数范围内,保证介电系数和端口的|S11|,φS11和|S21|参数保持较好的单调性,避免产生多值问题;通过人工神经网络对计算获得的各介电系数对应的S参数进行训练,达到足够的精确度;最后通过实验,将测量获得的S参数利用神经网络反演获得待测物质的相对复介电系数。该方法对今后测量类似等离子体、复介电系数实部为负的特殊材料的介电常数具有一定的指导意义。     

液晶材料介电常数的毫米波频率特性研究

利用矩形波导管和向量分析仪,测量了几种液晶材料在26.5～40 GHz波段(Ka波)的介电常数.实验表明,1 kHz频率下呈现正、负介电各向异性的液晶材料,在该微波波段下都显示为正的介电各向异性.尽管这些材料的静介电常数各向异性相差很大,但是该微波波段对应的介电各向异性相差却很小,而且在26.5～38 GHz区间内几乎不随频率的增大而发生变化.     

铁电材料相变温度自动测试仪

铁电材料相变温度的测量一般采用电桥法,即测量铁电材料介电系数随温度的变化,由介电系数的转折温度来确定相变温度。但电桥法测量常常碰到一些困难:第一,有些铁电材料相变温度较高,在高温时电导较大;有些铁电材料在接近相变温度时损耗已超出电桥测量范围,使电桥无法平衡,不能确定其相变温度。第二,大部分手控电桥不备有线性电压输出,     

测量多层薄膜材料复介电系数的准光腔技术

本文提出用准光腔测薄膜材料复介电系数的新技术，根据双层介质的测量原理，把多层薄膜叠加起来并压上一块介电特性已知的平板样品以消除空气间隙及平整卷曲材料，推导了双层介质的正确理论计算公式，更正了以往文献中的失误之处，采用简易的变腔长法，对几种薄膜材料进行了测量，取得了满意的结果。     

针对太赫兹波段介电参数测量的宽带准光系统

该文针对太赫兹波段材料的介电参数提取的需求,利用准光学技术设计了一套宽带介电参数测量系统并讨论了自由空间的介电参数提取方法。通过平面扫描的方法验证了系统电磁传输特性。结果表明,准光系统的近场参数与设计结果相吻合。利用石英硼化玻璃和水样品进行了测试,并利用数值方法对介电参数进行提取。测试结果表明,利用准光方法测试所得到的介电参数与典型值相吻合,进一步验证了该方法的有效性。      

碳纳米管/液晶复合材料的研究进展

当今各种纳米材料在液晶显示和非显示应用方面已显示出非凡潜力。其中,碳纳米管与液晶分子同具各向异性几何外形,更容易分散到液晶中,稳定性更强。本文简要综述了近年来碳纳米管/液晶复合材料的研究进展,首先介绍了碳纳米管与液晶材料的基础概念与分类,讲述了将碳纳米管分散到液晶中常用的3种方法,讨论了碳纳米管对液晶材料相变温度、光学性能、电导率、介电性质与力学性能等物理性质的影响,最后介绍了碳纳米管/液晶复合材料在致动器、传感器、手写板、高强度材料等领域的应用。对碳纳米管/液晶复合材料制备、性能与应用研究的认识,将有助于探讨碳纳米管与液晶分子间相互作用导致改善液晶热、介电、电光、力学等物理性质的确切机制,为未来相关应用的实现奠定了基础。     

压电光声技术对材料热性能的研究

利用光声压电(PAPE)技术测量研究材料的热扩散率, 开展了对钇铝石榴石(YAG)新型复合材料热扩散率的测量研究。介绍了基于简化热弹模型理论的光声压电法, 对利用简化热弹模型建立的光声压电理论进行推导, 根据简化的热弹模型, 建立了运用光声压电法检测材料热扩散率的实验系统; 运用光声压电法, 在不同的测试条件下, 对参考样品热扩散率进行检测, 完成了对实验系统的校准; 对YAG等新型复合材料的热扩散率开展测量研究。研究结果显示, 光声压电法是可以用来准确测量金属材料的热扩散率。在适当的实验条件下, 光声压电技术可以有效地测量新型复合材料的等效热扩散率。     

绝缘与介电材料

IEEE 电绝缘和介电现象1998年年会于当年10月25日至28日在美国亚特兰大市举行。会议录共有两卷。本书为第一卷共收入文章80多篇。内容主要涉及绝缘材料,室外绝缘,介质击穿,空间电荷,电流体动力学,介电材料以及相关的测量技术等。     

SiO2含量对PTFE/SiO2复合材料性能的影响

采用类似于粉末冶金工艺,制备了无定形SiO2填充聚四氟乙烯(PTFE)复合材料,并对其进行了热、介电性能测试和SEM分析表征。系统研究了(1-x)PTFE-xSiO2(x为质量比)复合介质材料中,不同x值(x=0.35,0.40,0.45,0.50,0.55)对材料结构和性能的影响。结果表明,复合材料的密度随着SiO2含量的增加而减少,吸水率、热膨胀系数、介电常数和介电损耗随着SiO2含量的增加而增加。当SiO2质量分数为50%时,PTFE能很好地在SiO2表面形成一层包覆层,此时复合材料具有合适的热膨胀系数(17μ℃-1)、介电常数(2.74)和低介电损耗(0.002)。     

Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials

High frequency microelectronic and optoelectronic device packaging requires the use of substrate and encapsulation materials having a low dielectric constant, low dielectric loss and high volume resistivity. Most packaging materials are polymer-ceramic composites. A clear understanding of the broadband dielectric properties of composite materials is thus of great current importance for the effective development of high frequency packaging materials and optimized package design. Toward this goal, a general framework for understanding the dielectric properties of packaging materials was recently developed in which the dielectric constant of polymer-ceramic composite materials is characterized by the electrical properties of the polymer phase, the filler phase and an interphase region within the composite system. However, for this framework to be a viable tool for tailoring the dielectric properties of packaging materials, one must understand the dielectric properties of the polymer-filler interphase region, which represents a region of polymer surrounding and bonded to the surface of each filler particle having unique dielectric and physical characteristics. This work presents a model to explain and predict the dielectric properties of the composite interphase region based on dipole polarization theory.     

高介电常数有机复合介质功能材料

高介电常数复合材料在储能和实现电场均匀化等方面的作用，使得它在电工、电子技术领域有着特殊的意义。可塑性高介电常数多相复合材料在实现电场均匀化方面的研究还在起步阶段，笔者从这一目的出发，采用精细复合工艺，经试验制备了ＢａＴｉＯ３／聚合物两相复合材料和碳黑／ＢａＴｉＯ３／聚合物三相复合材料。研究了该复合材料的介电性能随其中的ＢａＴｉＯ３和碳黑的含量不同而采用梯度介电复合材料可实现电缆终端的不均匀电场均匀化。     

TiO_2掺杂量对PTFE/SiO_2复合材料性能的影响

采用新型化学工艺,制备了SiO2与TiO2共同填充的PTFE复合材料,系统研究了TiO2掺杂量对所制复合材料显微结构、微波介电性能和热膨胀系数的影响。结果表明,复合材料的密度、介电常数和热膨胀系数都随着掺杂量的增大而增加,吸水率随着掺杂量的增大而减小,介电损耗随着掺杂量的增大先减小后增大。当TiO2掺杂量为质量分数7%时,PTFE很好地包覆在SiO2表面,复合材料结构致密,具有与铜箔较为匹配的线膨胀系数(17.76×10–6/℃),且介电性能优良(εr=2.94,tanδ=0.000 82)。     

玻璃-莫来石陶瓷复合材料基板的研究

以低介电常数的玻璃粉末和莫来石粉末为原料,制备了玻璃–莫来石陶瓷复合材料基板。研究了烧结温度和莫来石含量对复合材料的介电性能和抗弯强度的影响。结果表明,当莫来石质量分数为50%时,玻璃–陶瓷复合材料经1 000℃、2 h的烧结后,其相对介电常数er为4.6、介质损耗tgd 为0.008、抗弯强度s 为90 MPa。另外,该复合材料在200~600℃之间的热膨胀系数约为4.0×106℃1,与Si、GaAs等半导体材料的热膨胀系数相近,可望作为优质封装材料应用。     

Composite Hole Conditions on Complex Permittivity Measurements Using Microwave Cavity Perturbation Techniques

This paper examines the edge effects of introducing a dielectric test cylinder with a test material into a cavity via a metallic support tube extending outside the cavity. A first-order perturbation theory is used for this metallic hole containing two different concentric dielectric materials. The Galerkin method is used to determine the amplitudes of numerous evanescent modes which exist in such composite hole geometries. Comparisons are made with the effects produced by a simple hole in which a single dielectric is postulated inside the metallic support tribe. The effects of the composite hole on the measurement of the dielectric properties of materials are given.     

Validation of a novel dielectric constant simulation model and the determination of its physical parameters

Precise determination of the dielectric constant of microelectronic packaging materials is critical for the performance optimization of high frequency devices. Accurate empirical data, however, is difficult to obtain and often not available for these complex composite materials. In order to provide a basis for predictive model verification, dielectric analysis of a series of model microelectronic packaging materials was conducted. Physical characteristics of the composite constituents, including the morphology of the dispersed phase as well as the dielectric constant of the dispersed and host phases, were used to define the indeterminate variables. The results of these analyses provide a systematic verification of a newly developed physical model for predicting the effective dielectric constant of complex composite systems. The model considers an interphase zone surrounding each dispersed particle having unique physical and electrical characteristics. A physical interpretation is presented to explain the indeterminate variables incorporated in this model.     

New frequency-dependent parametric modeling of dielectric materials

The recent increase in the use of electromagnetic (EM) waves raises more and more concern about the impact of EM radiation. Dielectric properties of materials are important indications of the depth of EM propagation and dispersion. This led to substantial research on the parametric modeling of dielectric properties of materials. In this paper, such modeling of material is studied for frequencies up to 100 GHz. The new model proposed was developed to describe the variation of dielectric properties of dielectricity as a function of frequency using experimental results on dielectric dispersion. Approximate modeling of electrical parameters can be very useful in that it allows the engineer to avoid complex equations of conventional models. Specifically, this work analyzes the dielectric properties of human parts, water, soil and vegetation. The new model is proposed for those materials. The theoretical background on those materials was investigated and simulation results on complex permittivity, the attenuation and phase constants of wave, of each of those materials were performed to assess the accuracy of the new approximate model. This model has further enabled conclusions in terms of measurable biophysical parameters.     

微波介质材料与器件的发展

详细论述了微波介质材料与器件国内外现状和技术发展趋势, 分析了应用前景和国内市场需求,对我国“十一·五”发展方向和重点研究课题提出了建议。     

低介电常数陶瓷复合基板材料

复合陶瓷材料具有较低的介电常数，可与Ｃｕ、Ａｇ导体共烧得到多层基板。这种基板适合于ＬＳＩ高速、高集成度的要求。本文介绍了复合陶瓷基板材料的特征及降低介电常数的措施。