磁控溅射工艺对沉积丙纶无纺布基底金属薄膜的影响北大核心CSCD

本文利用直流磁控溅射法在丙纶无纺布基底沉积铜、不锈钢及氧化铜薄膜,研究了本底真空度、工作气体流量、溅射功率、工作气压等溅射工艺参数对薄膜沉积速率、薄膜厚度和表面形貌的影响规律,测试了镀膜前后样品的抗紫外和抗红外性能。结果表明,一定范围内的本底真空度的变化对成膜性能影响很小;存在一个比较合适的氩气流量大小和工作气体压强范围,使得沉积速率最大;沉积速率与溅射功率成正相关关系。经测试,镀铜膜后的织物抗紫外性能明显提高。     

磁控溅射工艺对沉积丙纶无纺布基底金属薄膜的影响

本文利用直流磁控溅射法在丙纶无纺布基底沉积铜、不锈钢及氧化铜薄膜,研究了本底真空度、工作气体流量、溅射功率、工作气压等溅射工艺参数对薄膜沉积速率、薄膜厚度和表面形貌的影响规律,测试了镀膜前后样品的抗紫外和抗红外性能。结果表明,一定范围内的本底真空度的变化对成膜性能影响很小;存在一个比较合适的氩气流量大小和工作气体压强范围,使得沉积速率最大;沉积速率与溅射功率成正相关关系。经测试,镀铜膜后的织物抗紫外性能明显提高。     

溅射功率对PET基表面沉积纳米铜膜特性影响

室温条件下采用射频磁控溅射法在涤纶(PET)平纹机织物表面沉积纳米Cu薄膜,借助原子力显微镜(AFM)分析溅射功率的变化对铜膜表面形貌、粒径的影响;同时研究不同溅射功率条件下制备的沉积纳米铜织物透光性能、导电性能及界面结合性能。实验结果表明,随着溅射功率增加,纳米铜膜颗粒大小、表面粗糙度随之减小,铜膜的均匀性、致密性先提高后下降;经Cu镀层处理的涤纶平纹织物对紫外光和可见光透射率明显低于原样,溅射功率提高能使样品屏蔽紫外线和可见光效果变好,但功率提高到120W后,屏蔽效果增加不明显;铜膜方阻随溅射功率提高而减小,导电性能增强,而铜膜与基材的剥离强力先增加后减少。     

基底的结构形态与磁控溅射织物导电性能的关系

通过磁控溅射方法使得金属粒子与织物结合在一起,制备导电织物。并对不同基材磁控溅射织物的导电性能测试,分析比较了涤纶针织布、涤纶机织物、纯棉机织物和纸板上溅射铜膜的导电性能。采用扫描电子显微镜(SEM)对织物进行表征,观察基底的表面形貌。研究了基布的连续性和致密性对导电性能和电磁屏蔽性能的影响。结果表明:不同的基底材料对磁控溅射镀膜织物的导电性能影响有一定的差异,基底材料结构越致密、表面越连续,其导电性能越好。     

磁控溅射工艺参数对涤纶织物表面沉积铜膜性能的影响

在室温条件下采用射频磁控溅射法在涤纶平纹机织物表面沉积纳米Cu薄膜,借助原子力显微镜(AFM)观察镀膜前后样品表面变化。通过分别改变镀膜时间、溅射功率和气体压强,研究其对样品透光性和导电性的影响。实验结果表明,经Cu镀层处理的涤纶平纹织物对紫外光和可见光的吸收能力明显优于原样。溅射压强增加,透光性能增强,铜膜方块电阻增加,导电性能减弱;镀膜时间延长和溅射功率增加,样品透射率降低,屏蔽紫外线和可见光效果明显,在溅射时间接近15min和溅射功率增加到120W后,样品屏蔽效果不明显,铜膜方块电阻随溅射功率增加而减小,导电性能增强。     

磁控溅射法在涤纶织物上制备氟碳薄膜

用磁控溅射法在涤纶(PET)织物上制备纳米氟碳薄膜,研究了磁控溅射过程中不同PET织物布样、溅射功率、工作气压和基底温度对薄膜性能的影响。对氟碳膜的成膜组分进行了研究,并对溅射后的织物进行了拒水性能和抗紫外性能的测试和分析。     

溅射工作气压对Fe/Si_3N_4多层膜微波磁性的影响

在不同的溅射气压下,采用连续磁控溅射制备了Fe/Si3N4多层膜,探讨了溅射气压对多层膜微波磁性的影响。研究发现,溅射气压影响着多层膜的沉积速率和微结构,在溅射铁子层时,Ar气流量控制在300sccm~400sccm下,在溅射氮化硅子层时,氩气与氮气的流量控制在2∶1,总流量控制在320sccm时制备得到的多层膜具有最好的磁性能。     

射频磁控溅射对PET基材制备铝薄膜的性能影响

针对传统制铝技术,为提高膜层结合力、阻隔性,采用射频磁控溅射镀铝工艺,制备纯铝高阻隔性膜层,在PET塑料薄膜表面沉积纯铝的实验.通过对射频电源功率和溅射气压等参数的改变,探究射频功率、溅射气压对薄膜结合力、阻隔性的影响.结果表明:薄膜沉积过程中的射频功率和溅射气压对磁控镀铝薄膜性能影响较大,在一定的溅射压力下,膜层的结...     

镀制工艺对TiO2光学膜层折射率影响研究

研究分析了基底温度、沉积速率、氧气分压、离子束辅助沉积等工艺参数和条件对TiO2膜层折射率的影响.研究表明,随着基底温度升高,TiO2光学膜层折射率呈上升趋势;随着沉积速率提高,TiO2膜层折射率存在极值;采用离子束辅助沉积工艺,可以有效提高TiO2膜层折射率值,所制备的TiO2膜为非晶态结构,具有较高的折射率和较小的光学损耗.     

中频双靶反应磁控溅射制备TiO2膜的一些探索

具有高折射率的TiO2膜在反射型液晶显示器的关键部件高反射率背板膜系的制备中起重要作用，本文使用国内首家在线中频双靶反应磁控溅射设备进行了制备TiO2膜的探索，完成了相应的膜层测试与分析。实验结果表明双靶磁控反射溅射可以制备高折射率的TiO2膜，实验还从折射率的角度证明中频双靶反应溅射与直流反应溅射的效果一致,为进一步提高膜层沉积速率以适应工业生产需求需要引入更有效的溅射过程控制手段。     

Millimeter wave electromagnetic interference shielding by coating expanded polystyrene particles with a copper film using magnetron sputtering

Expanded polystyrene (EPS) particles were coated with copper by magnetron sputtering in order to produce a material suitable for electromagnetic interference (EMI) shielding. Field emission scanning electron microscopy (FE-SEM) and energy dispersive X-ray analysis (EDS) results demonstrated the effectiveness of successful copper deposition. The EMI shielding effectiveness (SE) of the Cu-coated EPS particles was measured to be 14–39 dB over a frequency range of 80–110 GHz, suggesting that Cu-coated EPS particles can be used as an effective lightweight millimeter wave EMI shielding material.     

Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films

We investigated the effects of sputtering power and deposition pressure on the electrical and structural properties of dc magnetron sputter-deposited copper films on p-type silicon grown at room temperature. Results from our experiments showed that the deposition rate of the copper films increased proportionally with the sputtering power. Sputtering power also affected the structural properties of the copper films through the surface diffusion mechanism of the adatom. From the scanning electron microscopy surface analysis, the high sputtering power favored the formation of continuous film. The poor microstructure with voided boundaries as a result of low sputtering power deposition was manifested with the high resistivity obtained. The deposition rate was found also depending on the deposition pressure. The deposition pressure had the contrary effect on structural properties of copper films in which high deposition pressure favored the formation of voided boundaries film structure due to the shadowing effect, which varied with different deposition pressure.     

中频磁控溅射技术制备Co-Ni合金薄膜

由于电镀硬铬对环境有一定的污染,因而选择合适的制备方式和合适的替代硬铬的材料具有一定的实际意义。本文选用Co-Ni作为硬铬的替代材料,并采用中频磁控溅射的方式在铜基底上制备Co-Ni合金薄膜,重点研究了溅射功率与Co-Ni合金薄膜的沉积速率、成分的关系,结果表明沉积速率随溅射功率的增加而增加;溅射功率在0.8~1.1 kW之间时,薄膜成分与靶材成分基本一致;并把1.1 kW时制备的Co-Ni合金薄膜的电极化腐蚀性能与电镀Cr薄膜、离子镀Cr薄膜相比较,结果表明Co-Ni合金的腐蚀电位可达到-0.245 V,具有较强的耐腐蚀性。     

新型电磁屏蔽材料锡/铜导电布的研制

通过在织物上进行化学镀铜、电镀锡,得到了一种锡/铜柔性电磁屏蔽材料,对制备工艺进行了初步的研究与探讨。并对制得的电磁屏蔽织物进行了电磁屏蔽效能测试和织物的耐摩擦磨损性能测试。试验表明,在电流密度20~35A/cm2、电镀时间600s、电镀温度25~35℃时,得到的锡/铜柔性电磁屏蔽材料具有良好的导电性和电磁屏蔽效能。该织物布面比较柔软,且锡无毒,能克服目前常见镀镍织物对人造成的致敏、毒害等副作用,在民用电磁辐射防护服装市场上有广阔的应用前景。     

塑料表面溅射电磁屏蔽膜的研究

电磁干扰(EMI)日益严重,在产品表面镀覆电磁屏蔽膜成为抗EMI主要措施之一.本文采用磁控溅射技术在聚酯塑料(PET)上制备出附着力大于5 MPa、2 GHz～4 GHz频率范围内屏蔽效能大于60 dB的复合结构的电磁屏蔽膜,并研究了导电膜、导磁膜及其复合膜层的电磁屏蔽特性.有关数据表明:镀覆500 nm Cu+300 nm 1Cr18Ni9Ti的复合屏蔽膜可以获得屏蔽效果、成膜速率和结合力的综合好效果.溅射功率、膜层厚度对电磁屏蔽特性和结合力有一定影响.     

Nickel-catalyzed deposition of Cu film on PET fabric with supercritical fluid

Polyester fabric was catalyzed with Nickel(II) acetylacetonate (Ni(acac)₂) in supercritical carbon dioxide (scCO₂) prior to electroless copper plating . The nickel activated polyester fibers were then characterized by scanning electron microscopy and X-ray photoelectron spectroscopy. Deposited weight, surface morphology, crystal structure, surface resistance, electromagnetic interference shielding effectiveness and thermal loss of the copper plated polyester fabrics catalyzed with nickel in scCO₂ were investigated. The results indicate that the amount of copper deposited onto polyester fabric catalyzed with Ni(acac)₂ in scCO₂ is much more than that without scCO₂. Deposition rate of copper particles onto polyester fabric increases with increased temperatures of scCO₂. The copper particles are uniformly coated on the polyester fibers. The surface resistance of the copper plated fabric is 50 mΩ/sq when the temperature of scCO₂ is increased to 90?°C. The electromagnetic interference shielding effectiveness of the copper plated polyester fabric is 60–80 dB at frequencies ranging from 2 to 18 GHz. These results suggest that catalysis in scCO₂ for electroless copper plating provides polyester fabric with excellent electrical conductivity, surface resistance and electromagnetic interference shielding effectiveness.     

Microscopic and macroscopic models of photo-induced volume changes in amorphous selenium

Electroless copper plating of polyester fabrics was demonstrated in the present investigation. The electroless Cu plating process on polyester fabric was modified by replacing the conventional PdCl₂ activator with an AgNO₃ activator to reduce the overall cost of the plating process. Both uncoated and Cu-coated polyester fabrics were characterized by the scanning electron microscope (SEM), energy dispersive spectroscopy (EDX), X-ray diffraction analysis (XRD) and X-ray photoelectron spectroscope (XPS). Relatively uniform and continuous plating was obtained under the given plating conditions. The possible mechanism of electroless copper plating of polyester fabrics utilizing an AgNO₃ activator was suggested. The electromagnetic interference (EMI) shielding effectiveness (SE) was also evaluated to study the shielding behavior of copper-plated polyester fabrics. The results demonstrated that copper-plated polyester fabrics can be applied for EMI shielding.     

磁控溅射法制备CIGS薄膜太阳能电池的工艺及性能研究

采用磁控溅射方法直接溅射铜铟镓硒(CIGS)靶材,制备得到了用于太阳能电池吸收层的CIGS薄膜,然后在Se气氛中对该CIGS薄膜进行退火处理。采用扫描电镜、X射线衍射、Raman、XRF、Hall等方法观察和分析了退火的主要工艺参数对薄膜表面形貌、组织结构、成分以及电学性能的影响,并制备了CIGS太阳能电池。结果表明,采用磁控溅射CIGS靶材+Se气氛中退火处理的方法,可以制备得到成分均匀、电学性能优良、单一黄铜矿相的CIGS薄膜;退火温度和退火时间是影响退火后薄膜质量的主要因素。退火温度低于350℃时,退火效果不明显。退火温度在400℃,退火时间达120 min时,薄膜完成再结晶过程,并制得单一黄铜矿相的CIGS薄膜;退火过程存在Cu-Se二次相的析出和消融,同时具有为薄膜补Se的作用。本文采用该方法制备出的CIGS太阳能电池的最高转换效率为7.69%。     

溅射靶功率对氮化碳薄膜结构的影响

利用双放电腔微波ECR等离子体增强非平衡磁控溅射技术,在Si(100)上制备氮化碳薄膜,并对薄膜进行了拉曼(Raman)、原子力显微镜(AFM)、X射线光电子谱(XPS)等结构的表征.发现溅射靶功率对制膜工艺、薄膜的结构和表面形貌产生很大影响.随着溅射靶功率的增大,薄膜的沉积速率减小,表面粗糙度增大,薄膜结构中的sp2含量增加.     

The electromagnetic interference shielding effect of indium-zinc oxide/silver alloy multilayered thin films

A study was made to examine the electromagnetic interference (EMI) shielding effect of multilayered thin films in which indium-zinc oxide (IZO) thin films and Ag or Ag alloy thin films were deposited alternately at room temperature using a RF magnetron sputtering. The optical, electrical and morphological properties of the constituent layers were analyzed using an ultraviolet-visible photospectrometer, a 4-point probe and an atomic force microscopy (AFM), respectively. The EMI shielding effect of the multilayered thin films was also measured using a coaxial transmission line method. A detailed analysis showed that the control of the film morphologies, i.e., the surface roughnesses of the constituent metal layers was essential to an accurate estimate of the electrical and optical properties of multilayered coatings. It was shown that properly designed IZO/Ag alloy multilayered thin films could yield a visible transmission of more than 70%, a sheet resistance of less than 1 Ω/sq., together with an EMI shielding effect larger than 45 dB in the range from 30 to 1000 MHz.