LTCC基板通孔金属化研究

低温共烧多层陶瓷（ＬＴＣＣ）基板是微电子先进产品ＭＣＭ的重要组成部分。这种基板的通孔金属化是制作成功基板的关键。本文重点分析了形成稳定金属化通孔导体的固有应力和热应力产生的原因,以及如何采取对策来解决。     

低烧基板的流延料浆配制及流延工艺研究

陶瓷材料的成膜技术是制造低温共烧多层陶瓷基板的关键技术之一，本文介绍了低温共烧（８００－９００℃），低介电常数（ε〈５）多层陶瓷基板中，流延料浆的配制及最佳流延工艺参数的研究。     

共烧多层陶瓷基板制造技术

本文对共烧多层陶瓷基板制造技术作了较为全面的探讨，详细分析和研究了它的工艺物性和材料系统特性。在分析和研究过程中用大量的数据和实例说明共烧多层陶瓷基板技术在微组装领域具有强大的生命力。事实表明，共烧多层陶瓷基板制造技术在未来的微电子封装技术中将发挥重要作用。     

以多层聚酰亚胺／陶瓷结构为基础的高密度混合元件的低成本制作工艺

本文结合多层聚酰亚胺和多层低温共烧陶瓷结构，描述了多芯片组件（ＭＣＭ）的制作工艺，多层低温共烧陶瓷用作封装基在。还报道了这种组件的主要特性。     

多芯片组件组装技术

多芯片组件（ＭＣＭ）的组装技术是制造ＭＣＭ的关键技术，本文主要介绍了芯片也基板、基板与外壳的连接技术。     

MCM多层共烧陶瓷基板技术的研究进展

本文介绍了MCM中的高温共烧陶瓷与低温共烧陶瓷基板技术,以及共烧陶瓷基板技术的研究进展情况。讨论了多层共烧陶瓷基板的关键工艺,比较了HTCC和LTCC的工艺。并对多层共烧陶瓷基板的发展进行了展望。     

LTCC多层微波互连基板布局布线设计及制造技术

采用低温共烧陶瓷 (LTCC)技术制造多层微波互连基板 ,可以研制出高密度的T/R组件。讨论了多层基板中微带线和带状线的结构及其优化设计技术 ,介绍了制造工艺流程和关键工艺难点。     

应用于MCM-C/D的减薄抛光工艺

混合型多芯片组件(MCM-C/D)研制技术具有共烧陶瓷技术高密度多层互连集成和薄膜电路高精度和高可靠性等优点,是目前先进实用的混合集成技术.共烧多层基板的总厚度差(TTV)和表面粗糙度是影响共烧多层基板在多芯片组件(MCM)中应用的关键因素.选取低温共烧陶瓷基板,研究了减薄抛光工艺对基板的作用机理,结合实际加工要求选择...     

TCLL多层微波互连基板布局布线设计及制造技术

采用低温共烧陶瓷(LTCC)技术制造多层微波互连基板,可以研制出高密度的T/R组件.讨论了多层基板中微带线和带状线的结构及其优化设计技术,介绍了制造工艺流程和关键工艺难点.     

氮化铝（AlN）高温共烧多层基板技术研究

多芯片组件（ＭＣＭ）作为一种新技术正在迅速发展,随着组装的不断提高,ＩＣ集成度的提高,ＭＣＭ的功率密度越来越大,为了改善器件的散热,提高可靠性,要求功率ＭＣＭ所用的多层基板应用具有高导热性。本研究采用ＡｌＮ流延生瓷片与钨高温共烧的方法,成功地制备出高热导率的ＡｌＮ以陶瓷基板的 完全满足高功率ＭＣＭ的使用要求。     

C波段LTCC高频前端模块的研究与实现

针对现有雷达高频接收组件尺寸大、集成度不高的情况,采用低温共烧陶瓷(LTCC)多层基板、单片微波集成电路(MMIC)芯片和微组装技术,设计和实现了C波段LTCC高频前端模块。该模块采用二次混频方案,包含限幅器、放大器、滤波器、衰减器、混频器等;其中主要器件用MMIC芯片实现,滤波器埋置在LTCC多层基板中实现,极大减小了模块的尺寸,模块最终尺寸为64 mm×20 mm×1.1 mm,比现有的接收组件尺寸减小了50%。经测试,该LTCC高频前端模块的增益大于40 dB,带内平坦度小于2 dB,噪声系数小于5 dB,镜像抑制度优于51 dB。可将高频前端模块应用于雷达高频接收组件中,从而减小组件尺寸。     

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm³. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.     

低温共烧陶瓷(LTCC)技术新进展

介绍了低温共烧陶瓷(LTCC)技术的特点,并详细介绍了LTCC技术在零收缩基板及内埋置材料方面的最新技术,综述了LTCC技术在高密度封装以及微波无源元件领域中的应用。最后介绍了国内外LTCC器件的发展现状,并展望了LTCC技术的未来发展趋势。     

LTCC专用烧结炉的研制

随着低温共烧陶瓷（Low Temperature Co—fired Ceramic,LTCC）多层基板为适应电子器件向着小型化、高密度、多功能的发展,从而对低温共烧工艺设备的也提出了更为严格的要求。针对目前低温共烧工艺设备的主要特点介绍了低温共烧陶瓷技术中新型烧结炉的研制方案及技术难点。     

基于LTCC技术的三维集成微波组件

低温共烧陶瓷(LTCC)技术和三维立体组装技术是实现微波组件小型化、轻量化、高性能和高可靠的有效手段.本文研究实现了基于LTCC技术的三维集成微波组件,对三维集成微波组件的立体互连结构、三维集成LTCC微波电路的垂直微波互连、微波多芯片模块(MMCM)的垂直微波互连等关键技术进行了重点阐述.研制出的三维集成微波组件的体积和重量分别比传统的二维平面LTCC集成微波组件减小40%和38%,电气性能相当.     

400～520 MHz LTCC多层片状耦合器

介绍了一种400～520MHz耦合度为-20dB的LTCC多层片状耦合器的设计。该耦合器由两个高耦合系数多层电感相互耦合而成,它的应用频率范围是400～520MHz。用标准LTCC工艺实现的耦合器尺寸仅1.6mm×3.2mm×0.76mm,耦合度-20±2dB,隔离度-35dB,反射损耗小于-20dB。     

LTCC滤波器性能改善的研究

微波滤波器在现代微波技术领域中的作用举足轻重,而基于LTCC（低温共烧陶瓷）技术的多层微波滤波器因具有满足现代电子系统要求的高频化、小型化及低成本等许多优点而成为当今微波领域常用滤波器之一。如何提高LTCC滤波器性能使其损耗更小,更适应实际工程的高要求就成为了关键一环。本文结合经典的分布参数理论设计出一个中心频率为1.2GHz,带宽40MHz的新型LTCC多层滤波器,其尺寸为14mm×20mm×2mm,并在此基础上结合金属电导率和趋肤深度的理论对金属层改进,设计出性能更优的LTCC滤波器,从而得出改善LTCC滤波器性能的方法,并做出实物验证了与仿真的一致性。     

Efficiency improvement of a DC/DC converter using LTCC substrate

We propose a substrate with high thermal conductivity, manufactured by the low‐temperature co‐fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC‐ and PCB‐based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC‐based converter, two types of tests were conducted. Storage temperature tests were conducted at ?20 °C and 85 °C for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 °C without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.     

High quality LTCC resonator for voltage-controlled oscillator

Design and technology of microwave conductor lines embedded in low-temperature cofired ceramic (LTCC) multilayer substrates are summarized with a focus on achieving the highest possible quality (Q) factor for a given line inductance. The work was initiated to test the integrability of base station voltage-controlled oscillators (VCOs) in ceramic multilayer substrates. This approach leads to a miniaturization of current versions by a factor of 2 to 4. However, base station specifications for phase noise and hence resonator Q are extremely demanding. Therefore, both the design and the processing technology were optimized. By choosing a twin-line design with two parallel lines vertically separated by a single LTCC layer, Q factors of 90 and 180 have been achieved for integrated 5.5 nH inductors at frequencies of 640 MHz and 1650 MHz, respectively. Application of this result to VCO modules in standard LTCC technology already yields low phase noise levels, e.g., -136 dBc/Hz at 100 kHz offset, which is suitable for base station applications. However, further noise reduction is expected from a dedicated high Q fabrication process that uses conventional via punching and filling steps to replace the ceramic material between the two lines by conductive silver paste. This raises the Q to 120 and 200, respectively, at the two frequencies and adds extra degrees of freedom to LTCC design for low-loss wireless solutions.     

LTCC基P波段90°功分器的制作

文章以LTCC基P波段90°功分器的设计和制作为例,从无源设计仿真和LTCC工艺阐述了P波段功分器的研制过程。选用了承受功率大、尺寸相对较小的宽边耦合器结构。设计的宽边耦合器采用多层结构,有利于发挥LTCC基板多层、高集成度等优点。其电路物理模型为Broadside-coupled symmetric stripline（BCL）,采用的介质为LTCC,介电常数为5．9,每层介质厚度为0．1mm,导体采用Ag浆。在实物制作过程中,TOP层和Bottom层是采用灌银通孔实现的。最终测试结果与仿真结果吻合较好,在225MHz～400MHz频段内隔离23dB,插损0．5dB,驻波1．1,相平衡度±2．5,功率250W．