一种新型聚氨酯高强胶布的研制

按特种护舷制作要求,研制了一种强度高、柔软性好的新型聚氨酯胶布。这种新型高强胶布采用了聚醚型聚氨酯基础胶料和聚酯纤维骨架材料,进行了耐光老化和耐磨性能改性研究,设计采用了一次挤出热熔涂覆成型新工艺,研制生产的新型胶布强度和粘合强度得到较大提升,并达到了特种护舷制作的性能要求。     

带有压敏性的环氧胶带的研制

研制带有压敏性的环氧胶带,可以使用表面涂或内部加压敏胶的方法,两种方法有各自的优缺点。表面涂压敏胶,压敏性好,但固化的粘接强度较低;内加压敏胶则相反。全面衡量,内加压敏胶的方法较好。     

Effects of nitrogen plasma treatment of pressure-sensitive adhesive layer surfaces on their peel adhesion behavior

The influence of the surface modification of pressure-sensitive adhesive tapes on their adhesion behavior has been investigated. PBA [poly(butyl acrylate)] and PIB [poly(isobutylene)] adhesives were chosen as pressure-sensitive adhesives and nitrogen plasma was used for the surface modification of the adhesives. The peel force of PBA or PIB adhesive/stainless steel joints was evaluated. The nitrogen plasma treatment showed large effects on the adhesion behavior of both the PBA and the PIB adhesives. The peel force for the PBA adhesive/stainless steel joint decreased by 57 times as a result of the nitrogen plasma treatment and that for the PIB adhesive/stainless steel joint increased by 2.2 times. There are essential differences in the modification reactions caused by the nitrogen plasma between the PBA and PIB adhesives. For the PBA adhesive, cross-linking reactions occurred among the PBA polymer chains and the surface was hardened. For the PIB adhesive, degradation reactions occurred and products with a low molecular weight were formed on the surface. These differences are due to the different responses of the PBA and PIB adhesives towards the nitrogen plasma. The mechanism of the changes in adhesion behavior caused by the nitrogen plasma is discussed.     

中国压敏胶粘带标准的现状

介绍了中国压敏胶粘带标准的制定情况 ,并将中国压敏胶粘带测试方法的标准 (厚度、剥离粘合力、持粘性、初粘性以及拉伸性能的测试方法 )与ASTM、PSTC、AFERA、JIS和UL等标准组织的相应标准进行了比较 ,指出了它们之间存在的差异。对中国压敏胶粘带标准中存在的问题提出了改进建议     

热敏型压敏胶带的研制

本热敏型压敏胶带的压敏胶以天然橡胶为主体，加入合成橡胶、增粘剂及其他助剂制成。胶带的基材是含有热敏剂的美纹纸。选用了一种比有机硅增粘剂交联温度低而且可以书写的高分子共聚物(100℃以下交联)作为防粘剂。确定了压敏胶的配方和胶带的生产工艺，并检测了各项性能。试验证明，该胶带在常温下无色，在高温时则会显示出标识、字迹或图案。在医学、科研等领域有广泛的用途。     

压敏胶(带)的可剥离性能的研究进展

综述了压敏胶(带)的可剥离性能的研究进展,介绍了压敏胶高聚物的弹性模量、交联、分子极性、接枝改性、与被保护表面的界面接触面积和使用条件等对剥离性能的影响。     

用强力双面胶带粘接客车车身侧围蒙皮新技术

介绍了3M公司的4951型双面粘接胶带的性能,提出了用粘接胶带粘接豪华客车车身侧围蒙皮的技术,并介绍了粘接技术相对于点焊侧围蒙皮的优势。     

我国压敏胶粘带的现状及发展

报道了我国压敏胶粘带的需用量、及应用市场。 1998年销售量 2 4.9亿m2 ,比上一年增长 3.75 %。包装用占份额48.5 % ,标签及印刷占 17.2 % ,医疗卫生用占 11.2 5 %。还介绍了压敏胶粘带的生产设备 ,基材 ,离型纸的技术现状 ,并提出正在或期待开发的项目     

Investigation of the peel behavior of polyethylene/polybutene-1 peel films using in situ peel tests with environmental scanning electron microscopy

The micro-deformation processes of sealed low-density polyethylene/isotactic polybutene-1 (PE-LD/iPB-1) films with different contents of iPB-1 up to 20 m.-% (mass-percentage) were investigated in this study.The peel process was analyzed in detail using in situ peel test measurements with environmental scanning electron microscopy (ESEM). This method enables the direct correlation of recorded force-elongation data with observed structural phenomena. Thus, important parameters, e.g., the peel initiation value, could be determined directly from in situ measurements. The dependence of the peel properties on the iPB-1 content was analyzed and the correlation between micro-structure and performance of the peel process was clarified.Furthermore, the structural reason behind the dependence of the peel properties on the peel angle was identified. The crack propagation types interlaminar and translaminar were analyzed in detail with the ESEM. The translaminar crack propagation was further characterized using a tilted microscope stage with a mounted tensile tester.The direct contact of the electron beam with the non-conductive sample surface can cause beam damage. The beam damage, indicated by the absorbancy band at 965 cm⁻¹ in the infrared spectrum, was investigated in dependence on the total irradiation time.     

双面压敏胶带在汽车防擦条上的应用

综述了双面压敏胶带在以改性聚丙烯为本体的汽车防擦条上的应用。包括在实际工作过程中碰到的问题和总结出的一些经验。     

微胶囊促进剂在环氧树脂胶带固化中的应用

把环氧树脂固化促进剂制成了以脲醛树脂为外壁的微胶囊 ,并将其应用于环氧树脂胶带中 ,结果表明 ,微胶囊促进剂的使用可以显著提高胶带的使用期 ,尤其是使用部分反应的EMI微胶囊 ,且微胶囊的加入对胶带的粘结强度和耐热性基本没有不利影响     

橡胶与金属热硫化粘结剥离方向性研究

对以天然橡胶为基料，硫黄硫化的三种硫化体系的胶料进行金属样板及圆柱型金属同橡胶的粘接实验。实验表明配合胶料的硫化体系不仅影响橡胶同金属的粘结强度而且是产生其粘结剥离方向性差异的主要原因。     

MQ硅树脂及其压敏胶粘带的研究

用FT -IR、2 9Si-NMR和GPC对适用于合成硅酮压敏胶的自制MQ硅树脂进行了表征 ,研究了硅酮压敏胶的合成配比和工艺对PET压敏胶带“三物性的影响 ,并优选出最佳配比     

室温固化高剥离耐热环氧树脂胶粘剂

介绍了一种具有高剥离强度和剪切强度的室温固化耐热胶粘剂。室温固化10d后,室温剥离强度可达到7．0kN／m;室温剪切强度为30．8MPa,150℃剪切强度可达14．5MPa。重点讨论了环氧树脂种类、复配合固化剂比例以及促进剂用量对胶粘剂粘接强度和耐热性能的影响。     

Vacuum-based picking-up of thin chip from adhesive tape

The reliable picking-up of thin chip using the vacuum sorption determines the success rate of flip chip assemblies from donor tape to receptor substrate. An analytical solution to model the chip–adhesive–tape structure with vacuum loads is introduced to understand the fracture mechanism of chip picking-up. The critical process parameters (the length of bonded region, vacuum strength, and pick-up displacement, etc.) are investigated. Theoretical predictions are used in combination with virtual crack-closure-based finite-element technique to reveal the detaching behavior between the chip and the adhesive tape. The results show that the length of the bonded region should be controlled less than 40% of chip length to eliminate the effects of chip thickness, and the higher vacuum strength acting on the adhesive tape is able to accelerate the detachment of the chip from the adhesive tape. In particular, a process window is proposed to enhance the reliability and efficiency of picking-up for a thin chip.     

水性聚氨酯压敏胶的制备与性能研究

以聚丙二醇(N-220)和异佛尔酮二异氰酸酯(IPDI)为主要原料、二羟甲基丙酸(DMPA)和聚乙二醇(PEG)为亲水性物质、三乙胺为中和剂,制备出一种具有压敏特性的水性聚氨酯(WPU)胶粘剂。通过红外光谱(FT-IR)法、粒度分析法等检测手段,研究了DMPA、PEG、中和剂、增黏树脂和交联剂等对WPU的结构和性能的影响。结果表明:亲水性基团含量越少,产物粒径越大,耐水性越好;中和度越低,WPU胶膜的耐水性越好,同时可供交联的羧基含量越多;当中和度为33.3%、w(固化剂)=1.5%时,WPU压敏胶带的内聚强度较大且不脱胶,其吸水率为31.2%,180°剥离强度为2.2N/25mm,可望在保护膜胶带等领域中得到应用。     

医用自交联聚丙烯酸酯压敏胶的性能研究

研究了一种皮肤用聚丙烯酸酯压敏胶,讨论了自交联剂和干燥时间等因素对压敏胶性能的影响,介绍了医用胶带的制备和测试方法。     

Effect of Peel Load on Stringiness Phenomena and Peel Speed of Pressure-Sensitive Adhesive Tape

The factors governing interfacial separation in lightly cross-linked polymer adhesives at low pulling rates as demonstrated by their stringiness phenomenon are investigated.

Cohesive failure and adhesive/substrate interfacial separation of uncross-linked polymer adhesives have been adequately explained. However, in lightly cross-linked polymer adhesives, where cohesive failure cannot occur because there is no viscous flow, there are two regions of interfacial separation at low rate and this phemonenon cannot be readily explained by present viscoelastic theories.

Investigation of the stringiness phenomenon of peeling pressure-sensitive adhesive tapes at constant loads shows that two peeling speeds exist for any peeling load up to the vicinity of 200 g/25 mm. Also it is clear that stringiness structure differs greatly at each peeling speed. The stringiness phenomenon of each of these two regions is analyzed using Miyagi's observation apparatus. These two measurements are then reversed and a comparison shows that the two peeling speeds correspond to each steady peeling region.

This field of investigation, when added to the present viscoelastic property studies, should lead to a new peeling adhesive theory which, in turn, may lead to the development of new high peel force pressure-sensitive adhesives.     

Two-Dimensional Analysis of Peeling Adhesive Tape from Human Skin

Adhesive tapes are attached to human skin for various purposes. When they are removed by peeling, discomfort or trauma may occur. Typically, the removed tape is partially covered by skin cells, and peeling involves failure within the substrate (skin), rather than just interfacial failure between the adhesive and the substrate, or cohesive failure within the adhesive. As an edge of the tape is pulled, first the skin deforms outward, and then peeling occurs after some threshold is attained. The literature is reviewed first, and then a two-dimensional analysis is developed. The tape is modeled as an extensible elastica, while the skin is represented as a nonlinear elastic strip with no bending stiffness. In the numerical results, the peel angle varies from 90° to 170°. Shapes of the tape and skin during pulling are determined, and the corresponding force is computed. For a certain peel criterion, the peel force is obtained.     

Microstructural surface analysis of Ni/Cu front contact after peel force test to improve contact adhesion

Ni/Cu two-step plating has been applied to solar cells as a metallization technique since it has low contact resistance after nickel sintering process, and is suitable for fabricating narrow fingers. However, a reliable adhesion of the Ni/Cu contact is still one of the remaining challenges. In this experiment, a peel force test was used to investigate the dependence of varied sintering temperatures on the adhesion of the Ni/Cu front contact. The surface of the bus bars was observed by field emission scanning electron microscope (FE-SEM) to analyse the high and low adhesion regions. When the adhesion result was high, silicon chunks from the substrate were often observed on the nickel layer (ribbon side). Also, the influence of oxidation on the nickel surface during sintering was discussed with the oxygen atomic ratio, which was measured by energy dispersive spectroscopy (EDS). Decent adhesion values up to 1.16 N/mm average with 2.47 N/mm maximum have been achieved with good soldering process.