基于单片机高精度电感测量的设计与实现

电感元件是电路中应用最为广泛的元件之一，因此电感的精度将对电路的性能带来直接的影响。本文设计的电感测量方案，采用L-T电路，将民感量转换成与之对应的振荡周期T，经缓冲电路、整形电路后送入CPU进行测量及数据处理，并直接数字显示测量结果。本文介绍了该测量方案的硬件和软件设计，同时也对测量误差的产生原因作了扼要的分析。     

实用的电感测量法

在家电维修中,电感的测量是极为重要的,不仅有利于准确判断电感元件妤坏,而且便于自制和仿制。例如音箱分频器的电感量,开关变压器绕组的电感量以及行输出变压器、偏转线圈的电感量等等。这些元件的电感量直接关系到其性能好坏,维修时通常靠测直流电阻判断其好坏,但这是极不可靠的方法。因为一只电感(例如开关变压器初级线圈)即使圈数完全相同,其电感量误差也相当大。电感量的测量有专用的仪器,如数字式电感电容测量仪。但这些仪器不但成本高,其测试频率也不合要求。测试高压脉冲条件下工作的电感元     

基于二极管的限幅蔡氏电路实验研究

根据经典蔡氏电路的数学模型,获得系统各个变量之间的运算关系,利用运算放大器、电阻、电容及二极管等元器件,完成非线性限幅函数的电路设计,实现无电感元件的等效蔡氏电路硬件实验图。结果表明,通过调试电路中电阻值,可以直接从示波器观测到蔡氏电路的三个运动变量,包括周期、单涡卷、双涡卷等运动行为的时序图和相位图。搭建的电路结构简单,学生实验时调试容易,并且由于电路中不含电感元件,实验过程中混沌吸引子的稳定性也明显得到了提高。     

通用阻抗变换器在有源滤波器中的应用

利用通用阻抗变换器(GIC)可以将原有滤波电路中的电容或电感用模拟电容或电感来替代,因此,文中提出了用频变负阻(FDNR)或D元件来直接从归一化LC低通滤波器原型得到有源滤波器的实现方法.     

RF螺旋电感参数的提取方法

射频集成电路(RFIC)中电感元件十分重要,其模型是RFIC模拟的关键.在确定电感的电路模型后,要进行正确的设计和优化,还必须知道模型中各元件的参数.文中首先给出了电感结构的嵌入式和非嵌入式电路模型,然后从已知的S参数通过三种途径提取了模型中集总元件参数,并对三种途径提取的元件参数进行了模拟,以便得到提取模型参数的最佳途径.     

RF螺旋电感参数的提取方法

射频集成电路（RFIC）中电感元件十分重要,其模型是RFIC模拟的关键．在确定电感的电路模型后,要进行正确的设计和优化,还必须知道模型中各元件的参数．文中首先给出了电感结构的嵌入式和非嵌入式电路模型,然后从已知的S参数通过三种途径提取了模型中集总元件参数,并对三种途径提取的元件参数进行了模拟,以便得到提取模型参数的最佳途径．     

电子元器件实用知识讲座(5)

<正> 第五讲 电感元件和变压器 电感元件和变压器都是根据电磁感应原理工作的零部件。电感元件(也称线圈或电感线圈)是依靠线圈本身的“自感应”作用而工作的,而变压器则是依靠线圈之间的“互感应”作用而工作的。电感元件和变压器也是电子电路中十分常用的元件,如收音机中的磁性天线线圈、振荡线圈、阻流圈和电视机中的电源变压器、偏转线圈、行线性调整线圈、行输出(回扫)变压器等等。     

电子技术入门新路(16)——实用电子装置制作之六(下)

<正> 电路及元器件基本知识 1.电感元件 凡是应用电磁感应原理工作的元件统称电感元件。电感元件与电阻器、电容器一样,是电子电路中最常用的重要元件。常见的电感元件有一般电路中用的固定电感器、高频阻流圈、低频阻流圈,收音机和录音机中用的各种电感线圈,电视机上用的偏转线圈、振荡线圈和行线性调整线圈等等。它们在电路中虽然作用不尽相同,但都是利用电磁感应原理进行工作的。电感元件一般是由导线(大多为漆包线或其他绝缘表层导线)绕成空心线圈或带铁芯(磁芯)线圈而制成,所以通常也称作电感线圈,或简称为线圈。     

基于玻璃的高性能电感的设计与实现

作为射频系统中的关键元件,电感的性能会影响整个系统的稳定性,传统的硅基电感由于较大的衬底损耗导致其Q值较低,无法满足射频系统的要求。因此为了提高电感性能,采用性能优良、损耗较低的玻璃作为衬底材料,首先提出了两种结构的电感,分别为埋入玻璃衬底的螺旋电感和基于TGV的三维电感,通过仿真研究了电感性能,并将其与相同结构下的硅基电感的性能进行了比较,并对两种电感分别进行结构优化,最后详细介绍了电感的加工工艺以及实物成果。研究结果表明,采用玻璃作为衬底可以大幅度提高电感的Q值,其Q值可达60以上,相比于硅基电感,其Q值分别提高了137.7%和55%,且通过改善电感自身的结构参数,可以进一步获得高性能的电感。     

Equivalent Circuit Analysis of an RF Integrated Inductor with Ferrite Thin-Film

针对已制作并发表的一种新型铁氧体磁膜结构射频集成微电感进行了等效电路分析.阐述了磁性铁氧体薄膜对电感的感值(L)和品质因数(Q)的增强作用.对射频测试结果进行了电路元件参数提取.结果表明,与空气芯无磁膜微电感相比,磁膜结构微电感的L和Q在2GHz处分别提高了17%和40%.等效电路分析和测试结果均证明了铁氧体薄膜的引入对增强射频集成微电感性能的作用显著.     

RF MEMS电感的研究与进展

无线通信的迅速发展,对高性能电感有迫切的需要。本文介绍了目前电感的发展状况,包括表面螺旋电感、垂直平面螺旋电感、悬浮螺旋电感和螺线管电感。对各种电感的性能进行了比较,讨论了电感设计所需考虑的问题及相关因素,对各种电感的加工工艺作了介绍。总结了各种电感的品种因数。     

叠层片式电感的发展趋势

论述了叠层片式电感的发展趋势。指出高频电感应用领域扩大,使用频率不断提高;高频电感尺寸进一步小型化;集成化趋势方兴未艾; 大电流与高频磁珠需求不断增加。     

一种改进光探测器高速性能的新方法

研究了一种在光探测器的结构设计中加入平面螺旋电感从而提高光探测器高速性能的新方法。对影响探测器频率响应的因素进行分析,结果表明,增加电感值可以减小结电容对高速性能的限制,仿真结果也得到同样的结论。根据理论分析结果制作出探测器并进行测量,测量数据显示,未加电感的光探测器高速性能只能达到2GHz,而加电感的光探测器高速性能最大,可以达到5GHz,证明了电感值的增加可以明显提高器件的高速性能,得到了与理论分析一致的结果。     

Packaging-compatible high Q microinductors and microfilters forwireless applications

To meet requirements in mobile communication and microwave integrated circuits, miniaturization of the inductive components that many of these systems require is of key importance. At present, active circuitry is used which simulates inductor performance and which has high Q-factor and inductance; however, such circuitry has higher power consumption and higher potential for noise injection than passive inductive components. An alternate approach is to fabricate integrated inductors, in which lithographic techniques are used to pattern an inductor directly on a substrate or a chip. However, integrated inductors can suffer from low Q-factor and high parasitic effects due to substrate proximity. To expand the range of applicability of integrated microinductors at high frequency, their electrical characteristics, especially quality factor, should be improved. In this work, integrated spiral microinductors suspended (approximately 60 μm) above the substrate using surface micromachining techniques to reduce the undesirable effect of substrate proximity on the inductor performance are investigated. The fabricated inductors have inductances ranging from 15-40 nH and Q-factors ranging from 40-50 at frequencies of 0.9-2.5 GHz. Microfilters based on these inductors are also investigated by combining these inductors with integrated polymer filled composite capacitors     

RF packaging and passives: design, fabrication, measurement, and validation of package embedded inductors

Design, modeling, and characterization of inductors embedded in a package substrate promising higher quality factor (Q) and lower cost than on-chip inductors is described. In addition to the problem of large conductor losses, on-die inductors with or without magnetic materials consume considerable die area and require the removal of the first-level interconnect bumps beneath them to maintain a reasonably high Q value. Moving inductors to the package eliminates the need for bump array depopulation and, thus, mitigates the potential reliability problems caused by voids in the epoxy underfill between the die and the substrate. Competency developed to design, fabricate, and characterize inductors based on standard organic flip-chip packaging technology is described. Physical design details along with measurement procedures and results are discussed. In addition, modeling techniques for achieving good correlation to measured data are included.     

A High-Efficiency DC–DC Converter Using 2 nH Integrated Inductors

Historically, buck converters have relied on high-Q inductors on the order of 1 to 100 muH to achieve a high efficiency. Unfortunately, on-chip inductors are physically large and have poor series resistances, which result in low-efficiency converters. To mitigate this problem, on-chip magnetic coupling is exploited in the proposed stacked interleaved topology to enable the use of small (2 nH) on-chip inductors in a high-efficiency buck converter. The dramatic decrease in the inductance value is made possible by the unique bridge timing of the stacked design that causes magnetic coupling to boost the converter's efficiency by reducing the current ripple in each inductor. The magnetic coupling is realized by stacking the two inductors on top of one another, which not only lowers the required inductance, but also reduces the chip area consumed by the two inductors. The measured conversion efficiency for the prototype circuit, implemented in a 130-nm CMOS technology, shows more than a 15% efficiency improvement over a linear converter for low output voltages rising to a peak efficiency of 77.9 % for a 0.9 V output. These efficiencies are comparable to converters implemented with higher Q inductors, validating that the proposed techniques enable high-efficiency converters to be realized with small on-chip inductors.     

可调谐微机电电感(英文)

射频可调谐微电感在当前发挥着重要作用,它能满足高性能紧凑型器件设计的要求。对于器件设计者来说,可调电感能调谐电感量并能保证较高或适当的品质因素(Q值),这种能力在可调谐系统中比可调电容更有优势,因为可调电容可靠性较低并且大量占用基片面积。可调电感能节省芯片面积,它为将来便携式通讯系统所需的大范围可调谐系统提供一个优选的方案。因此,从器件角度对可调电感进行综述。根据可调电感的调谐机制,可调电感可分为四大类:离散型、金属屏蔽型、磁芯调谐型和线圈耦合型。对文献报道的可调电感进行概括,讨论这些可调电感优点和缺点,同时也介绍了这些可调电感的制备工艺、结果比较和其应用等。     

Spiral Inductors Using Polymer-Core Conductors

We made thick spiral inductors using a polymer-core conductor. The proposed fabrication process to make the polymer-core conductor is very easy and cost effective compared with other radio frequency microelectromechanical systems processes. SU-8 photoresist was used as the core. The fabricated spiral inductors on a high resistivity silicon, 2500 Omega have a very high Q factor of more than 40 at 2 GHz.     

Microwave inductors and capacitors in standard multilevelinterconnect silicon technology

Spiral inductors and metal-to-metal capacitors for microwave applications, which are integrated on a silicon substrate by using standard 0.8 μm BiCMOS technology, are described. Optimization of the inductors has been achieved by tailoring the vertical and lateral dimensions and by shunting several interconnect metal layers together. Lumped element models of inductors and capacitors provide detailed understanding of the important geometry and technological parameters on the device characteristics. The high quality factors of nearly 10 for the inductors are among the best results in silicon, particularly when using standard silicon technology     

Small-Resistance and High-Quality-Factor Magnetic Integrated Inductors on PCB

We have designed and fabricated both single-coil and parallel-coil magnetic integrated inductors with extremely small resistances and high quality factors on an 8-in-round printed circuit board (PCB) substrate for microprocessor power delivery applications. The dc resistances of these inductors are less than 12 ${hbox{m}} Omega $. Soft magnetic material CoFeHfO was successfully integrated into the inductor fabrication to increase the inductance. The quality factors are more than 80 in a frequency range of 1.5–2 GHz for air-core inductors and more than 23 in a range of 200–300 MHz for magnetic inductors. The net inductance improvement of the magnetic inductor over air-core inductor is about 12%, which could be further enhanced with a thicker magnetic core, according to our theoretic calculation and HFSS simulation. We also characterized the permeability spectra of CoFeHfO material on the PCB substrate, simulated the high-frequency performance of the magnetic integrated inductor by HFSS, and, for the first time, reached a good agreement with the experimental data. The experimental and simulation results of the magnetic inductors as compared to those of the air-core inductors point out the future direction to further optimize magnetic integrated inductors.