电子封装器件BGA的实时全息干涉实验研究

９０年代以来,表面封装器件（ＳＭＤ）向高密度化、精密化、薄型化和高集成化方向快速地发展。在研究这些新型电子封装的应力—应变实验技术中,全息干涉测量方法因其高灵敏度、高精度、非接触性、全场分析,可直接获取离面位移等优点而被作为表面安装技术（ＳＭＴ）可靠性分析的有效方法。本文采用实时全息干涉方法对加电运行中的ＰＢＧＡ器件及外部热辐射条件下ＰＢＧＡ的离面变形进行了测量,得到ＰＢＧＡ呈球面弯曲及马鞍形翘曲变形的实验结果,并初步分析了产生形变差异的原因。     

BGS功能在AXE-10中的实现

ＡＸＥ＿１０中 ,ＢＧ用户不仅具有ＰＳＴＮ用户所具有的业务功能 ,还具有ＰＳＴＮ用户所没有的一些业务功能。由于ＢＧ用户与ＰＳＴＮ用户都有的功能其实现方法相同 ,故本文只介绍几种有别于ＰＳＴＮ用户的ＢＧＳ业务功能在ＡＸＥ＿１０中的实现。１连接ＰＡＢＸ的功能我们都知道 ,ＢＧ既可连接分机 ,又可连接ＰＡＢＸ。那么ＰＡＢＸ功能在ＢＧ中是如何通过指令来连接的 ?具体定义步骤如下：(１)定义ＰＡＢＸ的引示号码“ＳＮＢ”及对应的分机号码“ＢＳＮＢ”＜ＢＧＳＧＩ：ＢＧ＝,ＳＮＢ＝,ＢＳＮＢ＝,ＰＸＲ＝Ｂ -０／Ｉ-０／Ｏ -０…     

焊盘尺寸对PBGA组装板可靠性的影响

研究了焊盘尺寸对氮气再流焊ＰＢＧＡ组装板可靠性的影响。氮气保护再流焊炉内的氧含量可低至５×１０－５。对ＰＢＧＡ组装板的焊点进行了拉伸试验、弯曲疲劳试验以及热冲击疲劳试验。结果表明：经氮气保护再流焊组装的ＰＢＧＡ板其焊点的各项性能均比无保护的ＰＢＧＡ组装板好。当ＰＣＢ板焊盘直径等于ＰＢＧＡ基底焊盘直径时,其焊点有最好的性能。     

介绍国外一种新型的微电子封装——BGA（球形触点阵列）封装

综述了球形触点阵列封装的概念，特点，种类以及和ＱＦＰ（方形扁平封装）的比较。介绍了ＢＧＡ的制作及安装，ＢＧＡ采用的焊接材料。对ＢＧＡ的生产，应用及典型实例进行了叙述，最后，指出了ＢＧＡ的未来前景。     

域间路由选择协议BGP-4的介绍和测试

随着因特网的发展,人们开发了许多种用于路由选择的协议,并在不断完善之中。路由选择包括决定最佳路由和由互联网传送数据包两个基本功能。路由协议选路效率的高低直接关系到互联网传送数据包的质量。根据路由选择协议应用的位置,通常分为内部网关协议（ＩＧＰ）和外部网关协议（ＥＧＰ）。内部网关协议运行于自治系统（Ａｕｔｏｎｏｍｏｕｓ Ｓｙｓｔｅｍ）边界之内;外部网关协议运行于自治系统之间。内部网关协议和外部网关协议的应用见图１。内部网关协议包括ＲＩＰ、ＯＳＰＦ、ＩＳＩＳ等;外部网关协议包括ＢＧＰ－４和已经过时的ＥＧＰ等。ＢＧＰ－４是一种用于自治系统之间路由选择的路由选择协议,并交换其他ＢＧＰ系统的路由选择和可达性信息。开发ＢＧＰ协议是为了替换它先前的协议,即已经过时的对外网关协议ＥＧＰ。 图中ＡＳ１、ＡＳ２、ＡＳ３分别代表３个不同的自治系统,３个自治系统分别运行各自的内部网关协议如ＲＩＰ、ＯＳＰＦ和ＩＳＩＳ。在三个自治系统之间运行外部网关协议如ＢＧＰ－４。一、ＢＧＰ协议的发展历程 ＢＧＰ到目前为止共有四个版本,ＢＧＰ－１、ＢＧＰ－２、ＢＧＰ－３和ＢＧＰ－４,ＢＧＰ－４是目前最高级别的版本。ＢＧＰ协议最早于１９８９年６月由Ｃｉ...     

Al0.3Ga0.22In0.48P/GaAs HBT高温特性的研究

本文研制了Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓ高温ＨＢＴ器件,详细地研究了器件在３００Ｋ～６２３Ｋ范围内ＨＢＴ的直流电学特性。结果表明Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓＨＢＴ器件具有良好的高温特性,在３００Ｋ～６２３Ｋ温度内,动态电流增益变化小于１０％,Ａｌ０．３Ｇａ０．２２Ｉｎ０．４８Ｐ／ＧａＡｓＨＢＴ可工作至６２３Ｋ,工作温度超过６２３Ｋ后,器件就不能正常工作,经分析发现     

PBGA焊点热疲劳寿命的正交试验及回归分析

通过对ＰＢＧＡ焊点形态参数与焊点热疲劳寿命的正交试验,利用大型统计分析软件进行多元线性回归分析,建立起ＰＢＧＡ焊点高度固定,芯片在上焊点高度不固定及芯片在下焊 度不固定三种不同工作条件下形态参数与热疲劳寿命之间的回归多项表式,即ＰＢＧＡ焊点形参数与热疲劳寿命的关系表达式。     

BGA的返修

ＢＧＡ的返修美国ＰＡＣＥ公司是一家具有近４０年历史的专业工具公司，安全、迅速、简单地完成ＳＭＤ元件的拆装高的声誉。伴随ＢＧＡ产品在组装电路板的应用，ＰＡＣＥ公司又向市场推出一种新产品—ＣＲＡＦＴＢＧＡ。下面就ＣＲＡＦＴＢＧＡ工作过程向用户简单介绍一下...     

高电流截止频率GaInP／GaAs HBT

本文简要介绍了ＧａＩｎＰ／ＧａＡｓ ＨＢＴ的发展现状，用湿法工艺制作了自对准ＧａＩｎＰ／ＧａＡｓ ＨＢＴ，其电流截止频率高达５０ＧＨＺ，性能优于我们在同等工艺条件下制作的ＡｌＧａＡｓ／ＧａＡｓＨＢＰ。     

用SAA7283实现PAL-BG/I双制式丽音接收

介绍用飞利浦公司丽音解码器ＳＡＡ７２８３实现ＰＡＬ－ＢＧ／ＰＡＬ－Ｉ双制式丽音接收的电路及控制方案。     

Mechanical characterization of plastic ball grid array package flexure using moire interferometry

Most previous studies of PBGA packaging reliability focused on the effect of thermal cycling. However, as portable electronic products such as cellular phones and laptop computers are reduced in size and become more readily available, isothermal flexural fatigue also becomes an important reliability issue. Solder interconnects subjected to mechanically induced deformation may result in failure. In the current work, moire interferometry is used to investigate the influence of PCB flexure on interconnect strains. A versatile testing apparatus is developed to load PBGA packages in four point bending. Moire fringe patterns are recorded and analyzed at various bending loads to examine the variation in displacement and strain between the components. Solder balls across the entire array experience large shear strains, often resulting in plastic deformation, which reduces service life of the package.     

PBGA固化后产生翘曲的有限元模拟分析

由于PBGA器件中各材料热膨胀系数有差异,固化后易产生翘曲变形。采用有限元模拟法对PBGA器件的EMC封装固化和后固化过程进行了分析。结果表明:固化过程是影响翘曲的关键过程,残余应力增加,翘曲变形有所增加。如固化后最大残余应力为95.24MPa,翘曲位移为0.1562mm;后固化以后最大残余应力为110.3MPa,翘曲位移为0.1674mm,翘曲位移增加值仅为0.0112mm。适当增加硅粉填充剂的含量,可以减小固化工艺后的翘曲变形。     

Reliability of plastic ball grid array package

The reliability of plastic ball grid array (PBGA) package is studied for different materials. The reliability of the PBGA packages using conventional Bismaleimide-Triazine type PWB and our original product PWB that is made of high Tg epoxy resin is evaluated. The PBGA package using our original PWB has a feature of lower warpage for the package, and has similar performance regarding the thermal cycling stability and the endurance during reflow soldering as compared with the PBGA using the conventional PWB. The endurance during reflow soldering for each PBGA is JEDEC STD Method A112 level 3. In order to improve the endurance during reflow soldering, not only PWB materials but also other factors are investigated. As a result, the molding compound with the property of low moisture absorption and the die attach material with the properties of high adhesion strength and fracture strength are effective to improve the endurance property during reflow soldering. The package crack mechanism during reflow soldering is briefly described as follows     

Experimental Approach and Evaluation on Dynamic Reliability of PBGA Assembly

The aim of this paper is to provide a systematic method to perform experimental test and theoretical evaluation on fatigue characteristics of plastic-ball-grid-array (PBGA) assembly under random vibration. A specified PBGA assembly which contains different structural and material parameters was manufactured. The fatigue characteristics of PBGA assembly under random vibration were tested. Manson-Coffin empirically derived formula and rain-flow algorithm were used to achieve the fatigue life of solder joints. In the meantime, the failure curve (reliability-cycle number curve) can be obtained by using Weibull distribution method when PBGA assembly is on different working situation. Finally, life prediction of corner solder balls was deduced based on three-band technology and cumulative damage index. Test results lay a basis for high-reliability design of PBGA assembly for engineering application.     

PBGA组件振动疲劳寿命的实验研究

为了得到在基频激励下PBGA封装的可靠度特性,设计制作了一块包含不同结构和材料参数的PBGA组件样品,利用可靠性实验的方法测试了PBGA组件在正弦单频激励条件下的疲劳特性,同时运用Manson-Coffin方程经验公式及雨流计数法得到了相对应的焊点疲劳寿命.最后利用疲劳统计中威布尔分布得到了当PBGA芯片位于PCB不同位置、不同激励时可靠度-循环失效圈数曲线(R-N曲线).结果表明,大直径焊点芯片、分布在约束较多PCB上的芯片、无铅焊点芯片的焊点可靠度较高.     

PBGA器件焊点的可靠性分析研究

根据PBGA器件组装特点,分析了器件焊点的失效机理,并针对实际应用中失效的PBGA器件在温度循环前后,分别使用染色试验、切片分析、X-射线分析等方法进行失效分析.分析结果显示样品PBGA焊点存在不同程度的焊接问题,并且焊接质量的好坏直接影响器件焊点抵抗外界应变应力的能力.最后,开展了PBGA器件焊接工艺研究和可靠性试验,试验结果显示焊接工艺改进后焊点的可靠性良好.     

PBGA封装的可靠性研究综述

通过传统BT类型的PWB材料与独特的PWB材料来PBGA封装的可靠性。相关的研究结果表明,后者同样具有相同的热循环稳定性和回流焊期间的疲劳强度,并具有较低的封装翘曲特点;模塑料的低吸湿性及粘片材料的高粘附强度和高断裂强度特性,有利于提高回流焊期间的疲劳强度和防止剥离现象的扩散。