Novel biobased nanocomposites from functionalized vegetable oil and organically-modified layered silicate clay

The new biobased nanocomposites are processed from anhydride-cured epoxidized linseed oil (ELO)/ or octyl epoxide linseedate (OEL)/diglycidyl ether of bisphenol F (DGEBF) epoxy matrix and organomontmorillonite clay. The selection of anhydride curing agent and biobased epoxy resulted in an excellent combination to provide an epoxy matrix having high elastic modulus, high glass transition temperature, and high heat distortion temperature (HDT), with higher amounts of functionalized vegetable oil (FVO), compared with amine-cured biobased epoxy. The sonication technique was utilized to process the organically-modified clay nanoplatelets in the glassy biobased epoxy network resulting in nanocomposites where the clay nanoplatelets are almost completely exfoliated and homogeneously dispersed in the epoxy network. The processed exfoliated clay nanocomposites showed higher storage modulus compared with the neat epoxy containing the same amount of FVO. Therefore, the lost storage modulus with larger amount of FVO can be regained with exfoliated clay nanoreinforcement.     

Thermophysical properties of anhydride‐cured epoxy/nano‐clay composites

Polymer nano‐composites made with a matrix of anhydride‐cured diglycidyl ether of bisphenol A (DGEBA) and reinforced with organo‐montmorillonite clay were investigated. A sonication technique was used to process the epoxy/clay nano‐composites. The thermal properties of the nano‐composites were measured with dynamic mechanical analysis (DMA). The glass transition temperature T_g of the anhydride‐cured epoxy was higher than the room temperature (RT). For samples with 6.25 wt% (4.0 vol%) of clay, the storage modulus at 30°C and at (T_g + 15)°C was observed to increase 43% and 230%, respectively, relative to the value of unfilled epoxy. The clay reinforcing effect was evaluated using the Tandon‐Weng model for randomly oriented particulate filled composites. Transmission electron microscopy (TEM) examination of the nano‐composites prepared by sonication of clays in acetone showed well‐dispersed platelets in the nano‐composites. The clay nano‐platelets were observed to be well‐intercalated/expanded in the anhydride‐cured epoxy resin system. POLYM. COMPOS., 26:42–51, 2005. © 2004 Society of Plastics Engineers.     

Synthesis and properties of trifluoromethyl groups containing epoxy resins cured with amine for low Dk materials

The study synthesized a trifluoromethyl (CF₃) groups with a modified epoxy resin, diglycidyl ether of bisphenol F (DGEBF), using environmental friendly methods. The epoxy resin was cured with 4,4′‐diaminodiphenyl‐methane (DDM). For comparison, this study also investigated curing of commercially available diglycidyl ether of bisphenol A (DGEBA) with the same curing agent by varying the ratios of DGEBF. The structure and physical properties of the epoxy resins were characterized to investigate the effect of injecting fluorinated groups into epoxy resin structures. Regarding the thermal behaviors of the specimens, the glass transition temperatures (T_g) of 50–160°C and the thermal decomposition temperatures of 200–350 °C at 5% weight loss (T_d5%) in nitrogen decreased as amount of DGEBF increased. The different ratios of cured epoxy resins showed reduced dielectric constants (D_k) (2.03–3.80 at 1 MHz) that were lower than those of pure DGEBA epoxy resins. Reduced dielectric constant is related to high electrronegativity and large free volume of fluorine atoms. In the presence of hydrophobic CF₃ groups, the epoxy resins exhibited low moisture absorption and higher contact angles. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Epoxy‐clay nanocomposites: Influence of the clay surface modification on structure

In this article, the effect of four different clay surface modifiers on the structure of epoxy‐clay nanocomposites was studied. Various organoclays were prepared via cation exchange reaction between inorganic cations naturally occuring in the clay gallery and different alkylammonium ions. Epoxy‐clay nanocomposites were prepared by in situ intercalative polymerization using a hardener of polyoxypropylenediamine type. It was found that various clay surface modifiers exhibit different catalytic effect on curing of epoxy inside the clay gallery as observed by measuring of the gel time with dynamic mechanical analysis. This was confirmed by monitoring the change in the d‐spacing by wide angle X‐ray scattering performed in situ during curing. Morphology of the cured systems was probed by transmission electron microscopy (TEM) and wide angle X‐ray scattering (WAXS). The degree of dispersion observed by TEM and WAXS corresponds with achieved mechanical properties of cured composites. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation,curing kinetics,and thermal properties of bisphenol fluorene epoxy resin

Diglycidyl ether of 9,9‐bis(4‐hydroxyphenyl) fluorene (DGEBF) was synthesized to introduce more aromatic structures into an epoxy resin system. The structure of DGEBF was characterized with Fourier transform infrared and ¹H‐NMR. 4,4′‐Diaminodiphenylmethane (DDM) was used as the curing agent for DGEBF, and differential scanning calorimetry was applied to study the curing kinetics. The glass‐transition temperature of the cured DGEBF/DDM, determined by dynamic mechanical analysis, was 260°C, which was about 100°C higher than that of widely used diglycidyl ether of bisphenol A (DGEBA). Thermogravimetric analysis was used to study the thermal degradation behavior of the cured DGEBF/DDM system: its onset degradation temperature was 370°C, and at 700°C, its char yield was about 27%, whereas that of cured DGEBA/DDM was only 14%. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Mechanical properties and failure surface morphology of amine‐cured epoxy/clay nanocomposites

The tensile and impact properties of amine‐cured diglycidyl ether of bisphenol A based nanocomposites reinforced by organomontmorillonite clay nanoplatelets are reported. The sonication processing scheme involved the sonication of the constituent materials in a solvent followed by solvent extraction to generate nanocomposites with homogeneous dispersions of the organoclay nanoplatelets. The microstructure of the clay nanoplatelets in the nanocomposites was observed with transmission electron microscopy, and the clay nanoplatelets were well dispersed and were intercalated and exfoliated. The tensile modulus of epoxy at room temperature, which was above the glass‐transition temperature of the nanocomposites, increased approximately 50% with the addition of 10 wt % (6.0 vol %) clay nanoplatelets. The reinforcing effect of the organoclay nanoplatelets was examined with respect to the Tandon–Weng and Halpin–Tsai models. The tensile strength was improved only when 2.5 wt % clay nanoplatelets were added. The Izod impact strength decreased with increasing clay content. The failure surfaces of the nanocomposites were observed with environmental scanning electron microscopy and confocal laser scanning microscopy. The roughness of the failure surface was correlated with the tensile strength. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 281–287, 2005     

Clay‐reinforced epoxy nanocomposites

Epoxy/clay nanocomposites were prepared using a conventional diglycidyl ether of bisphenol A (DGEBA) epoxy, cured with diethyltoluene diamine (DETDA). The nanocomposites were characterized by dynamic mechanical analysis. A modest increase in glass transition temperature and significant increase in storage modulus were achieved as a result of incorporation of clay. The formation of nanocomposite was confirmed by wide‐angle X‐ray analysis. The higher impact strength of the nanocomposite compared the DGEBA matrix was explained in terms of with the morphology observed by SEM. © 2003 Society of Chemical Industry     

Curing kinetics and properties of epoxy resin-fluorenyl diamine systems

Diglycidyl ether of bisphenol fluorene (DGEBF), 9,9-bis-(4-aminophenyl)-fluorene (BPF) and 9,9-bis-(3-methyl-4-aminophenyl)-fluorene (BMAPF) were synthesized to introduce more aromatic structures into the epoxy systems, and their chemical structures were characterized with FTIR, NMR and MS analyses. The curing kinetics of fluorenyl diamines with different epoxy resins including DGEBF, cycloaliphatic epoxy resin (TDE-85) and diglycidyl ether of bisphenol A (DGEBA) was investigated using non-isothermal differential scanning calorimetry (DSC), and determined by Kissinger, Ozawa and Crane methods. The thermal properties of obtained polymers were evaluated with dynamic mechanical thermal analysis (DMTA) and thermogravimetric analysis (TGA). The results show that the values of activation energy (E_a) are strongly dependent on the structures of epoxy resin and curing agent. The curing reactivity of epoxy system is restrained by the introduction of rigid fluorene into chain backbone and flexible methyl into side groups. The cured DGEBF/fluorenyl diamine systems exhibit remarkably higher glass transition temperature, better thermal stability and lower moisture absorption compared to those of DGEBA/fluorenyl diamine systems, and display approximate heat resistance and much better moisture resistance relative to those of TDE-85/fluorenyl diamine systems.     

Some factors influencing exfoliation and physical property enhancement in nanoclay epoxy resins based on diglycidyl ethers of bisphenol A and F

An investigation of the factors influencing the degree of exfoliation of an organically modified clay in a series of epoxy resins is reported. The use of sonication, choice of curing agent, effect of the moisture content of the clay, and the cure temperature were examined. The dispersion was characterized using a combination of rheological measurements, X‐ray diffraction, and dynamic mechanical thermal analysis. Rheological analysis of the clay dispersion in the epoxy monomer indicated that at high clay loads Herschel–Bulkley type behavior is followed. Higher cure temperatures and higher levels of clay moisture were found to influence the extent of exfoliation. Improvements in physical properties were observed through the addition of nanocomposites. The DGEBA/DDM and DEGEBA/DDS exhibited 2 and 4°C increase, respectively, in T_g per wt % of added clay. DGEBF showed virtually no enhancement. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

The boron trifluoride monoethyl amine complex cured epoxy resins

The curing exotherm pattern is affected by the equivalent ratio of curing agent, boron trifluoride monoethylamine complex (BF₃ · MEA), to epoxy resin. The diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) cures more slowly than the diglycidyl ether of bisphenol A (Epon 828). The glass transition temperatures (T_g's) of BF₃ · MEA cured Epon 828 are increased with inceasing concentration of curing agent (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450 eq./epoxy eq.) cured Epon 828 and DGEBF are almost equivalent 43 and 44 kcal/mol, respectively. DGEBF when added to DGEBA improves the T_g and char yield with the BF₃ · MEA curing system. The T_g of both resin systems can be increased by longer post cure, whereas the char yield does not appear to change significantly. No ester group formation is found for the BF₃ · MEA-cured DGEBF, although this has been previously reported for the DGEBA system. The BF₃ · MEA cure at 120°C is better than at 140°C because of vaporization and degradation of the curing agent at the higher temperature. The rapid gelation of the epoxy resin may be another reason for the lower degree of cure at high temperature.     

New epoxy resins. I. The stability of epoxy–trialkoxyboroxines triaryloxyboroxine system

A polymer with high aromaticity and/or cyclic ring structures chain backbone usually has high heat, thermal, and flame resistance. Two diglycidyl ethers of bisphenols were prepared from 4,4′ isopropylidenediphenol (DGEBA) and 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) for evaluation. Four boroxines—trimethoxyboroxine (TMB), triethoxyboroxine (TEB), triisopropoxyboroxine (TIPB) and triphenoxyboroxine (TPB)—were used as the curing agents. DGEBA and DGEBF cured with various boroxines indicate that the trend for their respective glass transition temperature (T_g's), degradation temperatures (T_d's), and gel fractions are TMB-cured epoxy ≈ TEB-cured epoxy < TIPB cured epoxy < TPB cured epoxy. The DGEBF system usually has a higher T_g, T_d, gel fraction, oxygen index (OI), and char yield than the related DGEBA system. DGEBF/DGEBA (80/20 mol ratio) shows a synergistic effect in regard to char formation. This effect exists not only in the copolymer system but also in blended homopolymers of the separately cured resins. A modified mechanism for the polymerization of phenyl glycidyl ether (PGE) with TMB has been proposed.     

Epoxy/anhydride networks modified by epoxy/anhydride oligomers containing SiOH groups

Epoxy/anhydride oligomers containing variable amounts of trialkoxysilane groups were synthesized from phenyl glycidyl ether (PGE), 3‐glycidoxypropyl trimethoxysilane (GPMS), and methyl tetrahydrophthalic anhydride (MTHPA), using benzyldimethylamine (BDMA) as an initiator. They were hydrolyzed and partially condensed using diluted formic as a catalyst, with the last step carried out in a solution of diglycidyl ether of bisphenol A (DGEBA). By curing with a stoichiometric amount of MTHPA, in the presence of BDMA, plasticized epoxy/anhydride networks were obtained without any evidence of phase separation. These materials showed a better abrasion resistance than that of the neat matrix. The presence of free SiOH groups can be used to improve the adhesion to glass surfaces. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 75: 1365–1370, 2000     

Addition of a reactive diluent to a catalyzed epoxy-anhydride system. II. effect on enthalpy relaxation

Enthalpy relaxation in an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) with a reactive diluent cured with methyl-tetrahydrophthalic anhydride (MTHPA) with an accelerator was investigated by differential scanning calorimetry. The reactive diluent (RD) added was an aliphatic diglycidyl ether which was mixed in a proportion of 50 parts by weight (pbw) per 100 parts of DGEBA, with the stoichiometric quantity of MTHPA. The key parameters of the enthalpy relaxation investigated were the nonlinearity parameter, x, the apparent activation energy,Δh^*, and the nonexponentiality parameter, β. The results were compared with other data obtained previously in similar epoxy-anhydride systems without an RD but with different degrees of conversion in order to analyze the effects of (a) the introduction of aliphatic chains of the RD in the epoxy structure and (b) a reduction in the crosslink density of the resin. © 1997 John Wiley & Sons, Inc.     

Mechanical and morphological properties of organic–inorganic,hybrid, clay‐filled,and cyanate ester/siloxane toughened epoxy nanocomposites

Organic–inorganic hybrids involving cyanate ester and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) modified diglycidyl ether of bisphenol A (DGEBA; epoxy resin) filled with organomodified clay [montmorillonite (MMT)] nanocomposites were prepared via in situ polymerization and compared with unfilled‐clay macrocomposites. The epoxy‐organomodified MMT clay nanocomposites were prepared by the homogeneous dispersion of various percentages (1–5%), and the resulting homogeneous epoxy/clay hybrids were modified with 10% HTPDMS and γ‐aminopropyltriethoxysilane as a coupling agent in the presence of a tin catalyst. The siliconized epoxy/clay prepolymer was further modified separately with 10% of three different types of cyanate esters, namely, 4,4′‐dicyanato‐2,2′‐diphenylpropane, 1,1′‐bis(3‐methyl‐4‐cyanatophenyl) cyclohexane, and 1,3‐dicyanato benzene, and cured with diaminodiphenylmethane as a curing agent. The reactions during the curing process between the epoxy, siloxane, and cyanate were confirmed by Fourier transform infrared analysis. The results of dynamic mechanical analysis showed that the glass‐transition temperatures of the clay‐filled hybrid epoxy systems were lower than that of neat epoxy. The data obtained from mechanical studies implied that there was a significant improvement in the strength and modulus by the nanoscale reinforcement of organomodified MMT clay with the matrix resin. The morphologies of the siloxane‐containing, hybrid epoxy/clay systems showed heterogeneous character due to the partial incompatibility of HTPDMS. The exfoliation of the organoclay was ascertained from X‐ray diffraction patterns. The increase in the percentage of organomodified MMT clay up to 5 wt % led to a significant improvement in the mechanical properties and an insignificant decrease in the glass‐transition temperature versus the unfilled‐clay systems. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Synthesis and characterization of epoxy based nanocomposites

Epoxy‐clay nanocomposites were synthesized to examine the effects of the content and type of different clays on the structure and mechanical properties of the nanocomposites. Diglycidyl ether of bisphenol‐A (epoxy) was reinforced by 0.5–11 wt % natural (Cloisite Na⁺) and organically modified (Cloisite 30B) types of montmorillonite. SEM results showed that as the clay content increased, larger agglomerates of clay were present. Nanocomposites with Cloisite 30B exhibited better dispersion and a lower degree of agglomeration than nanocomposites with Cloisite Na⁺. X‐ray results indicated that in nanocomposites with 3 wt % Cloisite 30B, d‐spacing expanded from 18.4 Å (the initial value of the pure clay) to 38.2 Å. The glass transition temperature increased from 73°C, in the unfilled epoxy resin, to 83.5°C in the nanocomposite with 9 wt % Cloisite 30B. The tensile strength exhibited a maximum at 1 wt % modified clay loading. Addition of 0.5 wt % organically modified clay improved the impact strength of the epoxy resin by 137%; in contrast, addition of 0.5 wt % unmodified clay improved the impact strength by 72%. Tensile modulus increased with increasing clay loading in both types of nanocomposites. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 1081–1086, 2005     

Thermo-physical and impact properties of epoxy nanocomposites reinforced by single-wall carbon nanotubes

The thermo-physical properties and the impact strength of diglycidyl ether of bisphenol F (DGEBF) epoxy nanocomposites reinforced with fluorinated single-wall carbon nanotubes (FSWCNT) are reported. A sonication technique was used to disperse FSWCNT in the glassy epoxy network resulting in nanocomposites having large improvement in modulus with extremely small amount of FSWCNT. The glass transition temperature decreased approximately 30 °C with an addition of 0.2 wt% (0.14 vol%) FSWCNT, without adjusting the amount of the anhydride curing agent. This was because of non-stoichiometry of the epoxy matrix that was caused by the fluorine on the single-wall carbon nanotubes. The correct amount of the anhydride curing agent needed to achieve stoichiometry was experimentally examined by dynamic mechanical analysis (DMA). The storage modulus of the epoxy at room temperature (which is below the glass transition temperature of the nanocomposites) increased up to 0.63 GPa with the addition of only 0.30 wt% (0.21 vol%) of FSWCNT, representing an up to 20% improvement compared with the neat epoxy. The Izod impact strength slightly decreased when the amount of FSWCNT was increased to 0.3 wt%. The excellent improvement in the storage modulus was achieved without sacrificing impact strength.     

Effect of bifunctional modifiers of the clay on the morphology of novolac cured epoxy resin/clay nanocomposites

Montmorillonite type clay, (PK‐802) is modified by the bifunctional modifiers (2‐phenylimidazole/benzalkonium chloride, PI/BEN or 2‐methylimidazole/benzalkonium chloride, MI/BEN) with different ratio, which contain a curing agent, BEN, and the promoters/accelerator (PI and MI). These two modifying agents are simultaneously intercalated into the gallery space of pure PK‐802. The novolac cured epoxy nanocomposites are prepared with this modified clay by crosslinking polymerization reaction. Wide‐angle X‐ray diffraction is used to measure the resulting d‐spacing of modified PK‐802 and the nanocomposites. Thermo‐gravimetric analysis is used to characterize the thermal properties of the nanocomposites. The morphology of the nanocomposites is investigated using transmission electron microscopy techniques. Well dispersion of clay into the novolac cured epoxy‐clay nanocomposites resulted when simultaneously both the modifying agents with 5:5 mole ratios are used to modify the clay instead of using single modified agent. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

Preparation and characterization of modified‐clay‐reinforced and toughened epoxy‐resin nanocomposites

Epoxy–clay nanocomposites were prepared by the dispersion of an organically modified layered clay in an epoxy resin (diglycidyl ether of bisphenol A) and curing in the presence of methyl tetrahydro acid anhydride at 80–160°C. The nanometer‐scale dispersion of layered clay within the crosslinked epoxy‐resin matrix was confirmed by X‐ray diffraction and transmission electron microscopy, and the basal spacing of the silicate layer was greater than 100–150 Å. Experiments indicated that the hydroxyethyl groups of the alkyl ammonium ions, which were located in the galleries of organically modified clay, participated in the curing reaction and were directly linked to the epoxy‐resin matrix network. Experimental results showed that the properties of epoxy were improved, evidently because of the loading of organically modified clay. The impact strength and tensile strength of the nanocomposites increased by 87.8 and 20.9%, respectively, when 3 wt % organic clay was loaded, and this demonstrated that the composites were toughened and strengthened. The thermal‐decomposition and heat‐distortion temperatures were heightened in comparison with those of pure epoxy resin, and so were the dynamic mechanical properties, including the storage modulus and glass‐transition temperature. Moreover, experiments showed that most properties of the composites were ameliorated with low clay contents. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2649–2652, 2004     

Time‐of‐flight secondary ion mass spectrometry investigation of epoxy resin curing behavior in real time

Time‐of‐flight secondary ion mass spectrometry and principal components analysis were used in real time to monitor the progress of curing reactions on the surface of a diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) epoxy resin blend reacted with the diamine hardener isophorone diamine at different time intervals. Molecular ions in the mass spectra that characterized the curing reactions steps, including blocking, coupling, branching, and crosslinking, were identified. The aliphatic hydrocarbon ions were correlated to the curing reaction rate, and this indicated that coupling and branching occurred much faster than the blocking and crosslinking curing reactions steps. The total conversion of the coupling and branching reaction steps were followed on the basis of changes with time in the relative ion intensity of molecular ions assigned to the DGEBA/DGEBF, aliphatic hydrocarbon, epoxide, and aromatic ring structures. Indicative measures of crosslinking density were monitored through the observation of changes in the ratio of the relative intensities of the aliphatic hydrocarbon and hydroxyl molecular ions over time. The curing reaction conversion was established by the observation of the changes in the relative ion intensity of the molecular ions that were related to the DGEBA/DGEBF molecules. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Preparation and properties of one epoxy system bearing fluorene moieties

Diglycidyl ether of bisphenol fluorene (DGEBF) and 9,9‐bis(4‐aminophenyl) fluorene (BPF) were synthesized to introduce more aromatic structures into an epoxy system, and their chemical structures were characterized with Fourier transform infrared spectroscopy, NMR, and mass spectrometric analysis. The dynamic curing behavior of the DGEBF/BPF system was investigated with differential scanning calorimetry. DGEBF was cured with BPF, diaminodiphenylsulfone (DDS), and diaminodiphenylmethane (DDM), and E‐44 (bisphenol A epoxide) was also cured with BPF for comparison. The thermal properties of the obtained polymers were evaluated with dynamic mechanical thermal analysis and thermogravimetric analysis. The cured DGEBF/BPF system showed a remarkably higher glass‐transition temperature, better thermal stability and lower moisture absorption in comparison with the general bisphenol A epoxy resin/BPF system but approximated the heat resistance of the DGEBF/DDS and DGEBF/DDM systems. Such properties make this epoxy system very promising for heat‐resistant applications. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009