热沉扩展表面积对换热性能影响的数值模拟研究

通过数值模拟的方式,研究了在冷却工质通过热沉通道消耗的分别泵功为0.04W和0.4W时,扩展表面热沉的扩展表面面积对热沉加热面的过余温度的影响。结果显示,在加热面面积一定,泵功为0.04W时,扩展表面面积的增大可以明显的降低热沉加热面的过余温度;在泵功为0.4W,扩展表面面积与加热面面积比值小于2.25时,扩展面积的增大可以降低热沉加热面的过余温度,当该面积比值大于2.25时,扩展面积的增大对热沉加热面的最高过余温度和最低温过余温度没有影响。     

大功率激光二极管列阵的硅基微通道热沉研制

为了提高大功率激光二极管列阵的散热效率以便提高其寿命和波长稳定性,研制了一种封装集成度较高的屋脊式硅基微通道热沉.将田口稳健设计方法用于微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化.以(110)单晶硅作为基片,采用KOH各向异性刻蚀和硅-玻璃-硅三层阳极键合方法制作出了通道宽度约为50 μm的微通道热沉,通道壁面粗糙度优于0.1 μm.采用激光二极管芯片对样品进行了封装和测试,利用砷化镓激光波长的温度漂移系数估算出了中间激光二极管的有源区温升,从而计算出了热沉的热阻.测试结果表明,该微通道热沉的单位面积热阻约为0.070 cm2·K/W,与有限元分析结果基本一致.     

带凹穴渐缩型微通道传热与流动性能分析

针对电子器件的散热问题，设计了6种渐缩型微通道，并通过合理布置圆形凹穴来削减截面几何尺寸突变导致的压力损失。旨在借助凹穴结构促进微通道冷却液混合提升换热性能，以及通过优化通道几何尺寸来改善微通道的流体流速分布，从而进一步提升微通道换热性能。在高热流密度条件下，对6种带凹穴渐缩微通道和普通矩形微通道的流动换热特性进行了对比数值分析，并以泵功和热阻为评价指标来评价通道综合传热性能。结果表明：通过设置渐缩微通道凹槽及通道截面的合理分布，改善了流速的分布，使温度分布更加均匀，并且增强了其散热能力。在实验组的最优结构下，渐缩微通道热阻比普通矩形微通道降低了18.4%，综合传热性能最高提升了15.2%。     

微通道内油液低雷诺数运动流动特性数值模拟

基于连续性方程和N-S方程,建立了油液在102μm量级通道中流动的数学模型,利用有限元法求得了速度的数值解,并利用CFD软件Fluent分别数值模拟了进口段效应、几何结构参数和重力效应对光滑矩形截面微通道中油液流动特性的影响。结果表明:油液在微通道横截面上的速度分布近似呈抛物线型分布,最大流速在微通道的中心轴线处;进口段效应对油液微流动的影响在通道长度较大时可以忽略;微通道内油液低雷诺数流动的阻力系数随长径比增大而减小,长径比大于75时趋于稳定,而摩擦阻力常数则随高宽比的增大而呈指数级增大;重力效应对油液的微流动可以忽略不计。     

基于CFD三维集成电路微通道传热特性分析

三维集成电路（3D IC）由于其高热密度，给其热管理带来了巨大挑战。微通道热沉因结构紧凑、散热能力突出，是解决三维集成电路散热问题的有效途径。本文以三维集成电路单层不同形状的横截面的微通道热沉为研究对象，利用计算流体动力学（CFD）方法对三维集成电路单层不同形状的横截面的微通道的热特性进行数值仿真分析。实验结果表明，不同形状的横截面的微通道，有着不同的散热性能，针对矩形横截面的微通道和圆形横截面的微通道进行比较，矩形横截面的微通道有着更好的散热性能。     

用于大功率激光二极管列阵的硅基微通道热沉研制

将田口稳健设计方法用于面向大功率激光二极管列阵的硅基屋脊式微通道热沉的优化设计,利用正交试验和信噪比分析实现了参数的稳健优化。采用激光二极管条对样品进行了封装和测试。利用砷化镓激光波长的温度漂移系数估算出了中间的激光二极管条的有源区温升。测试结果表明,该微通道热沉的单位面积热阻约为0.070 K•cm2/W,与有限元分析结果基本一致。     

自相似结构微通道热沉内部流动特性及结构优化

电子设备高度集成化导致其发热功率同步大幅增加,需要更高效的冷却技术解决其散热问题。自相似微通道热沉(Self-similarity micro-channel heat sink,SSHS)是近几年提出的一种新型微通道换热结构,与一般的微通道热沉相比,具有更好的换热均匀性和更宽的适用性。利用数值方法对SSHS的一个完整工作单元内的流动过程进行了模拟计算,以进一步分析SSHS的综合性能,并在此基础上,改进和优化其结构参数。计算结果表明,SSHS内各溢流通道(微通道)间存在较严重的流量分配不均问题,改变溢流通道结构参数对其流量分配过程影响很小,流量分配不均是SSHS自身结构所决定的固有特性,通过将等截面分流通道结构设计改为渐縮式斜坡设计,可以减弱入口分流通道末端的滞止效应,从而可以大大缓解溢流通道间的流量分配不均匀性问题。优化计算结果表明,0.07～0.80 kg/h的流量范围内,当斜坡角度为5°时,可将溢流通道间的流量差由原来的数倍降至不超过35%,而平均流动阻力增加不超过10%。     

微通道热沉设计技术初探

半导体器件越小,单位面积的热生成率越大,温度急剧升高导致器件性能改变,因此必须对器件产生的废热进行有效处理.1981年,Tuckerman和Pease提出了利用强迫对流方法致冷微通道的概念,可用于高速电脑芯片、激光二极管阵列、无线电与微波频率放大器等高功率电子器件的有效散热.介绍了微通道热沉的相关物理概念,讨论了几何参数对歧管式微通道热沉冷却性能的影响.     

内置微通道T/R组件壳体设计及试验研究

为了降低界面热阻对微通道散热性能的制约,提出了一种组件壳体内置微通道散热单元的设计架构,以满足新一代高功率芯片T/R组件的热控需求.对内置微通道的传热特性进行数值仿真分析,优选出最佳结构参数组合.基于优选设计参数,整合UV-LIGA微细加工技术、精密扩散焊接技术及微组装技术,完成内置微通道散热单元T/R组件的模拟样件研...     

非接触密封流体膜的数值模拟研究

泄漏量是影响机泵密封性能的主要因素。采用干气密封中的螺旋槽为非接触密封研究对象,通过数值模拟的方法探究了压力、转速对机泵密封性能的影响。结果表明:螺旋槽的中心处受压最大,槽体根部速度最大,此时泄漏量增大密封性能降低。为此对结构的几何参数进行数值优化模拟,最终得到以下优化结构设计参数:当槽数在10～18,螺旋角小于30°,台宽比在0.4～0.5,槽深不超过8μm,坝长比在0.1～0.4之间,可以使干气密封达到良好的密封效果。     

Forced air cooling by using manifold microchannel heat sinks

A study of manifold microchannel (MMC) heat sinks for forced air cooling was performed experimentally. The manifold microchannel heat sink differs from a traditional microchannel (TMC) heat sink in that the flow length is greatly reduced to a small fraction of the total length of the heat sink. In other words, the MMC heat sink features many inlet and outlet channels, alternating at a periodic distance along the length of the microchannels while the TMC heat sink features one inlet and one outlet channels. The present study primarily focused to investigate the effects of geometrical parameters on the thermal performance of the manifold microchannel heat sinks for optimal design. Also, the thermal resistances of the MMC heat sinks were compared with those of the TMC heat sinks. Experimental results showed the thermal resistances of MMC heat sinks were affected strongly by the pumping power, the microchannel width and the manifold inlet/outlet channel width, but weakly by the microchannel thickness-width ratio and the microchannel depth coorporated with the manifold inlet/outlet channel width. However, it was found that there existed the optimum values of the latter parameters. Under the optimum condition of geometrical parameters in the present study, the thermal resistance of the MMC heat sink was approximately 35% lower than that of a TMC heat sink, which clearly demonstrated the effectiveness of using a manifold.     

Effect of channel and plenum aspect ratios on the performance of microchannel heat sink under different flow arrangements

Microchannels based heat sinks are considered as potential thermal management solution for electronic devices. The overall thermal performance of a microchannel heat sink depends on the flow characteristics within microchannels as well as within the inlet and outlet plenum and these flow phenomena are influenced by channel aspect ratio, plenum aspect ratio and flow arrangements at the inlet and outlet plenums. In the present research work an experimental investigation has been carried out to understand how the heat transfer and pressure drop attributes vary with different plenum aspect ratio and channel aspect ratio under different flow arrangements. For this purpose microchannel test pieces with two channel aspect ratios, 4.72 and 7.57 and three plenum aspect ratios, 2.5, 3.0 and 3.75 have been tested under three flow arrangements, namely U-, S- and P-types. Test runs were performed by maintaining three constant heat inputs, 125 W, 225 W and 375 W in the range 224.3 ?? R_e ?? 1121.7. Reduction in channel width (increase in aspect ratio, defined as depth to width of channel) in the present case has shown about 126 to 165% increase in Nusselt number, whereas increase in plenum length (reduction in plenum aspect ratio defined as width to length of plenum) has resulted in 18 to 26% increase in Nusselt number.     

微通道结构带状电极电火花加工方法研究

针对大厚度、高深宽比金属微通道结构加工的难题,提出一种带状电极电火花加工方法,利用厚度30～100 μm的带状电极,在金属基体上高效制造微通道结构。研究了带状电极电火花加工机理,建立了带状电极在加工间隙中的运动模型,分析了影响带状电极运动的主要因素,搭建了带状电极电火花加工装置,开展了微通道结构带状电极加工实验研究,获得了带状电极电火花加工基础工艺规律。利用带状电极电火花加工方法成功加工出的具有200条微通道的反应器结构和44×45微换热器阵列结构,表明带状电极电火花加工可以实现窄宽度(100 μm以下)、大厚度(35 mm以上)、高深宽比(10以上)和高精度(缝宽标准差3 μm以内)的大批量微通道结构的高效加工,相关方法和技术有望在微模具、微散热器、微反应器等领域获得推广和应用。     

微管道换热器多孔介质模型分析及应用

将微管道换热器抽象成多孔介质模型,由Brinkman-extended Darcy方程出发,分别按照双方程模型和单方程模型进行求解,以得到微管道内流体的速度场和温度场分布,并对单方程模型和双方程模型的解析解进行了对比,讨论了微管道高宽比和有效导热系数比对流动与传热的影响。证明了由基于多孔介质双方程、单方程模型所得的解析解均可用于预测微管道换热器中的容积平均速度与温度分布。利用基于多孔介质双方程模型还可得出微管道换热器的总热阻和优化设计结构,结合硅衬底上的多路感应耦合等离子体刻蚀工艺加工出了经结构优化的硅制微管道换热器。在满足局部热平衡条件下,基于多孔介质单方程模型更适用于实际工程计算,不必经由预先的试验确定换热系数。     

3D打印三层微通道冷板的综合特性研究

3D打印技术在快速成型和制造复杂结构零件方面具有巨大的优势.文中采用3D打印工艺制备了3种微通道散热器,分别是2种开放型的单层微通道和1种封闭型的三层微通道.对三层微通道散热器(Three-Layered Microchannel Heat Sink,TLMHS)的力学性能进行了压力测试.通过实验和数值仿真研究了50～...     

微管道散热器换热性能的有限元分析

利用伽辽金有限元公式计算了微管道散热器中的管道表面温度分布、流体温度分布及流动阻力系数和换热系数等。与现有的分析方法对比发现，利用有限元方法可对热负荷任意分布工况下的微管道散热器进行传热性能分析，而且使用范围比现行的大型CFD软件更广，也可用于分析微管道散热器的几何参数对散热器传热性能的影响。     

EXPERIMENTAL STUDY ON THE HOT EMBOSSING POLYMER MICROFLUIDIC CHIP

Experiments are used to study the fabrication of polymer microfluidic chip with hot embossing method. The pattern fidelity with respect to the process parameters is analyzed. Experiment results show that the relationship between the imprint temperature and the microchannel width is approximately exponential. However, the depth of micro channel isn＇t sensitive to the imprint temperature. When the imprint pressure is larger than 1 MPa and the imprint time is longer than 2 min, the increasing of imprint pressure and holding time has little impact on the microchannel width. So over long holding time is not needed in hot embossing. Based on the experiment analysis, a series of optimization process parameters is obtained and a fine microfluidic chip is fabricated. The electrophoresis separation experiment are used to verify the microfluidic chip performance after bonding. The results show that 100bp-ladder DNA sample can be separated in less than 5 min successfully.     

微尺度受限冲击冷却通道换热特性研究

为了更进一步研究真实发动机尺寸下冲击通道的流动与换热情况,针对冲击孔与气膜孔组合形式的受限冲击通道,在保证与真实发动机工况相等的克努森数,通过实验研究与数值模拟研究,进一步解释了不同结构微小冲击通道的整体换热情况,结果表明,在相同的雷诺数下,冲击射流孔径越小,冲击靶面驻点区域内换热越强,冲击平均对流换热系数越大。孔间距越小,冲击靶面平均对流换热系数越大,并且随着射流冲击距的增大,换热减弱。     

Effect of process parameters in nanosecond pulsed laser micromachining of PMMA-based microchannels at near-infrared and ultraviolet wavelengths

This paper presents investigations on the effects of nanosecond laser processing parameters on depth and width of microchannels fabricated from polymethylmethacrylate (PMMA) polymer. A neodymium-doped yttrium aluminium garnet pulsed laser with a fundamental wavelength of 1,064 nm and a third harmonic wavelength of 355 nm with pulse duration of 5 ns is utilized. Hence, experiments are conducted at near-infrared (NIR) and ultraviolet (UV) wavelengths. The laser processing parameters of pulse energy (402–415 mJ at NIR and 35–73 mJ at UV wavelengths), pulse frequency (8–11 Hz), focal spot size (140–190 μm at NIR and 75 μm at UV wavelengths) and scanning rate (400–800 pulse/mm at NIR and 101–263 pulse/mm at UV wavelengths) are varied to obtain a wide range of fluence and processing rate. Microchannel width and depth profile are measured, and main effects plots are obtained to identify the effects of process parameters on channel geometry (width and depth) and material removal rate. The relationship between process variables (width and depth of laser-ablated microchannels) and process parameters is investigated. It is observed that channel width (140–430 μm at NIR and 100–150 μm at UV wavelengths) and depth (30–120 μm at NIR and 35–75 μm at UV wavelengths) decreased linearly with increasing fluence and increased non-linearly with increasing scanning rate. It is also observed that laser processing at UV wavelength provided more consistent channel profiles at lower fluences due to higher laser absorption of PMMA at this wavelength. Mathematical modeling for predicting microchannel profile was developed and validated with experimental results obtained with pulsed laser micromachining at NIR and UV wavelengths.     

A numerica1 study of fluid flow and heat transfer in different microchannel heat sinks for electronic chip cooling

Four different microchannel heat sinks are designed to study the effects of structures in microchannel heat sinks for electronic chips cooling. Based on the theoretic analysis and numerical computation of flow and heat exchange characteristics, the electronic chip’s temperature and flow rate distributions are obtained. The correspondence between flow pressure drop and chip’s temperature in the four microchannel heat sinks is also studied and analyzed. Numerically analyzed results indicate that the topological structure in microchannel heat sink has a significant influence on electronic chips cooling. This study shows various thermal properties in the four microchannel heat sinks.