Thermal diffusivity and conductivity in low-conducting materials: A new technique

A comparative method is presented, suitable to measure both thermal diffusivity and conductivity of low-conducting solids. The repeatibility of the measurements of thermal conductivity is 3%, whereas for diffusivity is 6%. Data for some low-conducting materials are given, consistent with those reported in the literature.     

Thermal diffusivity of solids with a low expansion coefficient: A dilatometric technique

A dilatometric method is presented, suitable to obtain both thermal diffusivity and conductivity of low-conducting solids with a low expansion coefficient. The repeatibility of the measurements of thermal conductivity is 3%, whereas that for diffusivity is 5 %. Data for fused silica at room temperature are given, consistent with those reported in the literature. Since the method is based on detecting the thermal expansion of a copper disk in thermal contact with the specimen, its range of applicability is linked to the sensitivity by which the dilation of copper can be measured: no difficulty arises between liquid nitrogen and 1000°C.     

具有低热导率的Skutterudite类新型热电材料

结合声子散射机制介绍了近来报道的几种降低skutterudite类热电材料热导率的途径,为研究和发展skutterudite类热电材料提供一些思路和方法。     

Ag_2Te掺杂对p型Bi_(0.5)Sb_(1.5)Te_3块状合金热电性能的影响

采用真空熔炼、机械球磨及放电等离子烧结技术(SPS)制备得到了(Ag2Te)x(Bi0.5Sb1.5Te3)1-x(x=0,0.025,0.05,0.1)系列样品,性能测试表明,Ag2Te的掺入可以显著改变材料的热电性能变化趋势,掺杂样品在温度为450~550K范围内具有较未掺杂样品更优的热电性能.适当量的Ag2Te掺入能够有效地提高材料的声子散射,降低材料的热导率.在测试温度范围内,(Ag2Te)0.05(Bi0.5Sb1.5Te3)0.95具有最低的晶格热导,室温至575K范围内保持在0.2~0.3W/(m·K)之间,在575K时,(Ag2Te)0.05(Bi0.5Sb1.5Te3)0.95试样具有最大热电优值ZT=0.84,相较于未掺杂样品提高了约20%.     

Sc2O3-Y2O3-ZrO2陶瓷材料热物理性能

采用固相合成法制备了6.3%Sc_2O_3-1.3%Y2O3-92.4%ZrO_2(摩尔分数)陶瓷材料。分别利用X射线衍射、示差扫描量热法、高温热膨胀仪和激光导热法对陶瓷材料的物相组成、高温相稳定性、热膨胀系数和热扩散等性能进行了表征。结果表明,经1600℃烧结6h,该陶瓷材料由单一的立方相结构组成,具有良好的高温相稳定性,热导率低于传统的6~8YSZ,是一种良好的热障涂层候选材料。     

Ti掺杂对half-Heusler合金YNiSb热电性能的影响

通过悬浮熔炼方法制备了Y1-xTixNiSb(x=0,0.015,0.02,0.025)材料并研究了Ti掺杂对材料热电性能的影响。经过孔隙率修正后,Ti掺杂样品的热导率和电导率均比未掺杂样品要低,并且随着Ti含量的增加呈现先下降后上升的趋势。分析发现Ti掺杂后样品热导率的降低是由于电子热导率的下降所致,电子载流子的引入则导致了电导率的下降。Ti掺杂后样品Seebeck系数在室温下有变负趋势,表明材料在室温下可能呈现N型传导特性。最终,Ti掺杂提高了材料的热电性能。Ti含量x=0.015的样品在770K左右获得最大ZT值0.085,与未掺杂样品相比,提高了约60%。     

纳米氧化钇稳定氧化锆/钛酸锶复合热电材料的热导率研究

通过添加纳米尺度的低热导率添加剂YSZ,形成钛酸锶复合热电材料,研究发现,虽然电子热导率有明显提高,但声子热导率降低得更加明显,进而导致总热导率显著下降。声子热导率的降低主要是因为纳米YSZ在钛酸锶体材料中弥散分布,声子在纳米YSZ与钛酸锶界面处被大量散射,导致声子平均自由程明显降低,进而导致声子热导率明显降低。     

Thermal transport behavior of van der Waals solids and liquids in the neighborhood of the solid-liquid phase transition

The thermal conductivity, , is one of the few transport coefficients which shows a relatively small change at the solid-liquid phase transition, and hence it is a property that can be used in comparing dynamic properties of both ordered and disordered systems. Although the discontinuity in can be accounted for largely by the difference in density, , of solid and liquid at the phase transition, its volume dependence is examined more closely. The thermal diffusivity, which is known to dominate the dynamic structure factor of liquid argon, has been determined around the phase transition also; the sound velocity has been considered in addition. The results are discussed and a comparison is made with these properties in solid and liquid benzene and cyclohexane.Paper presented at the Ninth Symposium on Thermophysical Properties, June 24–27, 1985, Boulder, Colorado, U.S.A.     

Thin-Film Thermophysical Property Characterization by Scanning Laser Thermoelectric Microscope

This work presents a scanning laser-based thermal diffusivity measurement technique for thin films as well as for bulk materials. In this technique, a modulated laser beam is focused through a transparent substrate onto the film–substrate interface. The generated thermal wave is detected using a fast-responding thermocouple formed between the sample surface and the tip of a sharp probe. By scanning the laser beam around the thermocouple, the amplitude and phase distributions of the thermal wave are obtained with micrometer resolution. The thermal diffusivity of the film is determined by fitting the obtained phase signal with a three-dimensional heat conduction model. Experimental results are presented for a 150-nm gold film evaporated on a glass substrate.     

Cu2S相变过程中热扩散系数的精确测量和解析

材料发生相变时, 其结构和物理性能可能会发生剧烈的变化。采用激光闪射法测量热扩散系数时, 激光照射样品可能会伴随有光吸收/发射现象以及温度的显著升高, 导致其测量值偏离真实值。本工作以Cu₂S为研究对象, 发现激光照射样品后, 光吸收/发射的影响很小可以忽略, 但样品温度的升高则会明显影响热扩散系数的测量。通过构建具有不同石墨层厚度的石墨/Cu₂S双层结构, 利用石墨层减弱激光照射时Cu₂S样品的温度增加幅度, 成功使热扩散系数出现显著降低的起始温度接近采用DSC测量材料发生相变的起始温度。本研究进一步建立了石墨/Cu₂S双层结构样品的热流输运模型, 从石墨/Cu₂S双层结构样品的实验测试热扩散系数中解析出了Cu₂S在相变区间的本征热扩散系数。本工作对于理解和精确表征具有相变特征的离子导体热电材料、光敏、热敏材料的热扩散系数具有重要的意义。     

Ge1-xInxTe微观结构对热电性能的影响

在GeTe中掺杂In能够引入共振能级, 但其微观结构对热电性能的影响还不明确。本研究采用熔炼-淬火-退火并结合放电等离子体烧结(SPS)的方法制备了系列Ge_1-xIn_xTe样品, 采用XRD、SEM、激光导热仪和热电性能分析系统(ZEM-3)对其微观结构和热电性能进行了研究。结果表明, 随着In元素的掺入, Ge_1-xIn_xTe的晶胞体积减小、人字鱼骨结构变小、晶界增多, 导致晶格热导率降低, 获得的最低热导率为2.16 W·m ^-1·K ^-1。同时, 掺杂In引入了共振能级, 降低了载流子浓度, 使塞贝克系数以及功率因子增大。当In掺杂量x为0.03时, Ge_1-xIn_xTe在600 K时获得最大ZT值1.15, 比GeTe提升了26.4%, 表明调整Ge_1-xIn_xTe的微观结构可以有效提升热电性能。     

非钴基氧化物热电材料研究进展

氧化物热电材料以其独特的优点倍受人们的关注。本文概述了非钴基氧化物热电材料的研究现状,分析了影响提高其热电性能的主要因素,并指出了该类氧化物的未来发展方向。     

Comparison of thermal conductivity data for partially stabilized zirconia with values derived from thermal diffusivity results

The thermal conductivity of partially stabilized zirconia was measured over the temperature range 320–1273 K using the radial heat flow method. The data have an absolute uncertainty of about ±2% and repeat measurements showed no evidence of changes in the thermal conductivity at high temperatures. This also was true for the thermal diffusivity data, which were obtained in vacuum over the temperature range 300–1473 K. Both sets of thermal conductivity data pass through minima at high temperatures. Quantitative differences were observed in the temperatures and thermal conductivities of the two minima. The results were analyzed by assuming parallel conduction by phonons and photons, and the phonon component was identified by fitting lower-temperature data. Extrapolating this curve allowed identification of the photon contribution to the thermal conductivity at high temperatures. The photon contribution approached a T ³ function and was larger in the thermal conductivity specimens. The difference in the photon contributions correlates with changes in the optical properties of the samples produced during the high temperature measurments.     

Calorimetric and transport properties of Zircalloy 2, Zircalloy 4, and Inconel 625

This paper presents the measurements and the results on thermal and electrical transport properties of three nuclear reactor cladding materials: Zircalloy 2, Zircalloy 4, and Inconel 625. Study of these materials constituted a part of the IAEA coordinated research program aimed at the generation and establishment of a reliable and complete database of the thermal properties of reactor materials. Measured properties include thermal diffusivity, specific heat, and electrical resistivity. Thermal diffusivity was measured by the laser pulse technique. Specific heat and electrical resistivity were measured using a millisecond-resolution direct electrical pulse heating technique. Thermal conductivity was computed from the experimentally determined thermal difusivity and specific heat functions and the room temperature density values. Measurements were performed in the 20 to 1500°C temperature range, depending on the material and property concerned.     

氧化物热电材料研究进展

介绍了氧化物热电材料的应用前景,重点讨论了以NaCo2O4为代表的氧化物热电材料的基本结构、性能特征与研究进展;评述了NaCo2O4材料Na住、Co位掺杂研究和NaCo2O4材料研究中存在的问题;并介绍了几种其它氧化物热电材料的研究情况.     

Thermal conductivity and Lorenz function of zinc under pressure

The thermal conductivity and the Lorenz function L of polycrystalline zinc have been calculated from measured values of the thermal diffusivity a and the electrical resistivity as functions of pressure P up to 2 GPa at room temperature. The effects of convection in, and freezing of, the pressure transmitting medium are discussed. Both and L increase with increasing P, with pressure coefficients of 8.7×10^–2 and 1.5×10^–2 GPa^–1, respectively. The volume dependence of L is found to be similar to that found for other simple metals. Data are also given for the Seebeck coefficient S as a function of P and for a(T) and (T) between 55 and 300 K.     

Thermophysical Properties of Heterogeneous Structures Measured by Pulse Transient Method

This paper discusses differences in thermophysical parameters (thermal conductivity λ, thermal diffusivity a, and specific heat c) that can be found when experimental methods with different measuring regimes are used. Two classes of methods are compared, namely, classical methods using steady-state, equilibrium, and dynamic measuring regimes and transient methods. The data consistency formula λ = acρ gives a picture on data reliability when single-parameter methods are used. Results of analysis are verified on published, recommended, and measured data by transient methods considering homogenous materials (stainless steel A 310, BK 7, Perspex) and heterogeneous materials (composite C/C–SiC, aerated autoclaved concrete). Satisfactory agreement on data for the thermophysical parameters was found on homogenous materials only. Paper presented at the Fifteenth Symposium on Thermophysical Properties, June 22–27, 2003, Boulder, Colorado, U.S.A.