光子带隙光纤准直器回波损耗研究

研究了一种光子带隙光纤准直器。为了降低回波对光源的干扰,通常光纤准直器的回波损耗不应低于60 dB。由于带隙光纤端面没有反射,因此满足这一条件的带隙光纤准直器GRIN透镜入射面的倾斜角与普通光纤准直器不同。从高斯光束通过光学系统的一般模型出发,利用矩阵光学和高斯光束耦合理论,推导了光线传输矩阵。结合实际应用中光纤及GRIN透镜的参数,仿真分析了尾纤与GRIN透镜之间的间距及GRIN透镜的参数对准直器回波损耗的影响。结果表明,镀有增透膜时,当光子带隙光纤准直器的GRIN透镜入射面倾角等于3时,回波损耗大于60 dB。研究结果对进行光子带隙光纤准直器的设计具有指导意义。     

大功率双包层光纤准直器的建模与仿真分析

研究了一种适用于大功率激光应用的双包层光纤准直器。考虑在制作准直器时,双包层光纤尾纤和C-lens 透镜端面8倾斜角度的影响,从高斯光束通过复杂光学系统的一般模型出发,利用矩阵光学的理论,在光线传输的子午面和弧矢面上分别进行建模计算,推导光线的传输变换矩阵。结合实际应用中光纤及C-lens 透镜的相关参数,仿真分析了尾纤与C-lens 透镜间距及C-lens 透镜参数对准直器工作距离和出射光束腰直径的影响。研究结果对进行大功率准直器的设计具有指导意义。     

自适应光纤光源准直器的结构设计

设计了一种可以快速高精度调节光纤准直激光束发射角度的自适应光纤光源准直器.该器件利用双压电驱动器控制光纤端面的位置,通过准直透镜实现出射激光束的准直.建立了自适应光纤光源准直器的物理模型,通过理论分析得出了光纤端面的偏移与器件结构参数的关系.研制了一个器件,并对其光纤端面偏移量、谐振频率等进行了测试.实验结果表明,理论...     

一种新型光纤准直器封装方法

提出了一种基于数字图像处理技术的光纤准直器封装方法.先由CCD获取光纤插针端面的图像,并通过算法计算出光纤插针端面的投影面积;再由给定的数学模型计算出光纤插针的相位,据此由控制系统对光纤插针进行旋转调节,使光纤插针的斜端面与自聚焦透镜(GRIN)斜端面基本保持平行;然后由光学仪器监控进行微调,便能快速使斜面插针到达最佳装配位置,保证输出的光功率最大.系统由CCD摄像机、图像采集卡和由VC 开发的处理软件等构成,并由计算机控制其装配全过程.实验表明,本文提出的光纤准直器装配方法,其相位可控制在±3°内,满足光纤准直器装配精度要求.     

基于热扩芯光纤的光纤准直器特性研究

为了提高光纤和光器件之间的耦合效率,设计了由热扩芯光纤和自聚焦透镜构成的新型热扩芯光纤准直器。理论上分析了热扩芯光纤准直器的基本结构参数与光学特性的关系以及由3种失配导致的耦合插入损耗。研究发现,热扩芯光纤准直器的耦合特性与自聚焦透镜的参数有关,热扩芯光纤准直器在轴向间距和角度偏差上的耦合失配容限明显优于普通光纤准直器,横向位移损耗则高于普通光纤准直器。采用模场半径为15.4μm的热扩芯光纤与自聚焦常数为0.295mm-1的自聚焦透镜制备了热扩芯光纤准直器,并对热扩芯光纤准直器因3种失配导致的耦合插入损耗进行了理论和实验比较,结果表明实验数据与理论吻合较好,说明所设计的热扩芯光纤准直器可用于长距离光耦合和旋转连接器件。     

微型准直透镜的研究与设计

自聚焦透镜与多模光纤的折射率分布都遵从平方律分布,基于这个事实,进行了以多模光纤生产工艺制造微型准直透镜的研究和设计。结果表明,该微型准直透镜用作单模光纤准直器,具有良好的准直性能,该器件较之自聚焦透镜,尺寸更小且制造工艺简单。     

球透镜准直器耦合效率的研究

利用传输矩阵和高斯光束的有关理论,分析影响球透镜准直器耦合效率的因素,建立了耦合效率与角向位置失配和横向位置失配关系的理论数值解模型.数值计算表明:耦合效率对角向倾斜和横向偏离的变化非常敏感.实验结果很好地验证了理论模型的正确性.球透镜准直器耦合效率理论模型的建立进一步完善了有关准直器耦合效率的理论,将在无源器件的研究和开发中具有重要的指导意义.(OD12)     

基于ZEMAX单模大光束光纤准直透镜信号耦合分析

针对光纤连接器核心部件之一光纤准直透镜信号精密耦合问题,采用双合透镜设计了一种单模大光束光纤连接器.通过分析双合透镜特性、光纤准直器阵列中的多光学器件耦合机理和准直透镜间的3种耦合偏差引起的传输损耗,推导出该耦合系统的传输损耗公式.基于MATLAB分析得到:角向失配对准直器的耦合损耗影响最大,轴向失配影响最小.利用光学仿真软件ZEMAX在序列和混合模式下对连接器进行模拟,用Origin绘制出不同失配情况下信号耦合效率曲线,结果表明单模光纤芯径为12 μm时,耦合效率达到92.42％.最后通过光学平台搭建实验系统,验证了仿真结果的准确性.     

大口径菲涅耳透镜远距离宽光谱聚光系统设计

针对使用光纤光谱仪探测远距离宽光谱弱信号的应用需求,基于成像光学与非成像光学的混合设计方法,设计了大口径菲涅耳透镜聚光系统。系统由直径为1.1 m的菲涅耳透镜、匀光棒、全反射准直器和中继透镜组组成,接收端为直径为2 mm、数值孔径为0.22的光纤束。大口径菲涅耳透镜具有质轻体小的优点,解决了传统大口径透镜体积大质量大的问题。由匀光棒和全反射准直器组成的非成像光学元件后组可减小由菲涅耳透镜口径增大引起的球差和宽光谱色差,使光信号能量分布更加均匀且出射角度减小;中继透镜组进一步控制光束发散角和光斑尺寸,使光信号在光纤束端面高效率耦合,提高系统的光能利用率。仿真和实验结果均表明,所设计的后组系统能够减小像差影响,有效控制光束发散角度和光斑尺寸,提高光能利用率,满足光纤光谱仪对远距离宽光谱弱信号进行光谱探测的需要。     

基于像散曲面微透镜的半导体激光准直研究

为了实现半导体激光器的光束准直,分析了半导体激光器光束沿快、慢轴方向的准直原理。采用单个半导体激光器作为被准直单元,提出了基于像散曲面微透镜的半导体激光器光束准直方法。讨论了半导体激光器填充因子对像散曲面微透镜准直性能的影响。对填充因子0.5的半导体激光器进行模拟验证。准直后,快轴方向剩余发散角约为0.34,慢轴方向剩余发散角约为2.69。结果表明,像散曲面微透镜不但可以对高填充因子的半导体激光器光束进行准直,而且准直后出射光斑面积小。该研究为高功率半导体激光器堆栈光束的准直提供了可行性方案。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks