High power and high sensitivity planar lightwave circuit moduleincorporating a novel passive alignment method

A high-power, high-sensitivity planar lightwave circuit (PLC) module, comprising a laser diode (LD) and a photodiode (PD) surface mounted on a PLC platform, has been realized by a novel passive alignment technique. We used a spot-size transformed LD and a corner-illuminated PD to form a highly efficient optical coupling between the devices and a PLC waveguide. We used the unique marker alignment method to ensure accurate positioning of them. The positioning precision achieved in the lateral direction was within 1 μm for the LD's and within 10 μm for the PD's. The rotational precision was within 0.4° for both chips. We realized high power operation (>8 mW) with a high receiver sensitivity (0.3 A/W). In this paper, we describe a high power, high sensitivity PLC incorporating a novel passive optical alignment technique for LD's and PD's     

WDM-PON module using a planar lightwave circuit with a coated WDM filter

We have presented a new configuration of a planar lightwave circuit (PLC) module coated directly with a filter which divides 1310/1550-nm wavelength bands for a wavelength-division-multiplexing passive optical network module in order to improve the conventional insertion process of thin film filter into the narrow trench located at the Y-junction of a PLC platform. The broadly tapered output facet width of a V-shaped waveguide was designed to be 12 /spl mu/m to minimize the reflected loss. The receiver module integrated with a PIN-photodiode on a silicon optical bench was fabricated. Data transmission of 2.5-Gb/s was demonstrated with clear eye diagrams.     

Multiple-chip precise self-aligned assembly for hybrid integratedoptical modules using Au-Sn solder bumps

We have developed a novel three-dimensional high precision self-aligned assembly using stripe-type Au-Sn solder bumps and a micro-press solder bump formation method. This produces a high bonding precision of 1 μm for optical device assembly in both lateral and vertical directions without the need for time-consuming optical axes alignment. Furthermore, we tested a hybrid integrated 4×4 optical matrix switch, in which multiple SSC-SOAG arrays were simultaneously positioned and optical fibers were passively positioned on a silica based PLC platform using this technology. Four optical chips and seven wiring chips are assembled on a planar lightwave circuit (PLC) platform. The insertion loss for each of these paths at an injection current of 40 mA was within a range of 9±4 dB. The average extinction ratio was 40 dB. This self-aligned assembly technology was shown to be useful for building hybrid-integrated multichannel optical network components     

A 10 Gb/s hybrid-integrated receiver array module using a planarlightwave circuit (PLC) platform including a novel assembly regionstructure

A planar lightwave circuit (PLC) platform for optoelectronic hybrid integration shows potential for achieving 10 Gb/s operation. It uses AuSn bump-type bonding pads on a silica layer to decrease parasitic capacitance, which limited the CR time constant in the optical chip assembly region, and two-layer electrical wiring to reduce parasitic inductance, which caused resonance in the electrical circuit region. An arrayed receiver module fabricated by integrating a two-channel monolithic opto-electronic integrated circuit (OEIC) chip on the PLC platform demonstrated a 3 dB-bandwidth of 8 GHz in both channels, which is equal to the bandwidth of the OEIC chip. This shows the feasibility of using this PLC platform for multichannel 10 Gb/s operation. Furthermore, this PLC platform can combine the versatile optical circuit functions of a PLC, such as an arrayed-waveguide grating wavelength multiplexer, with the high-speed signal processing function of mature electronic IC circuits. Consequently, this platform is a key device that will lead to high-capacity optical signal processing systems using optical wavelength/frequency routing     

Multichip Integration on a PLC Platform for 16 × 16 Optical Switch Module Using Passive Alignment Technique

We have integrated eight sets of four-channel semiconductor optical amplifier (SOA) array chips on a silica-based planar lightwave circuit (PLC) platform for 16 times 16 optical switch module by flip-chip bonding technique. To accurately bond eight sets of the arrayed SOA chips on a PLC platform, two methods of two-step assembly and one-step assembly were tried. Among the results of two assembly methods, one-step assembly was estimated to be desirable in respect of the horizontal and vertical bonding accuracy. The bonding accuracy was measured to be within 0.5 mum. Also, we demonstrated 16 times 16 optical switch module.     

长波红外光学系统混合被动无热化设计

结合光学被动无热化和机械被动无热化各自优势,提出一种低成本、高质量混合被动无热化方法。针对焦距75 mm,F/1的无热化镜头研制要求,分别利用光学被动无热化和混合被动无热化设计实现。对比发现,相较于传统的机械被动式无热化,混合无热化可减小补偿结构的体积和复杂性,从而有助于系统的小型化、轻量化;相较于光学被动无热化,在保证成像质量相当的情况下,可减小系统的体积和加工难度。从而证实,利用混合被动无热化技术可实现低成本、高质量的长波无热化镜头设计。     

Tunable OTDR Based on Direct Modulation of Self-Injection-Locked RSOA for In-Service Monitoring of WDM-PON

We propose a tunable optical time-domain reflectometer (OTDR) for in-service monitoring of wavelength- division- multiplexing passive optical networks (WDM-PONs). The proposed method uses a reflective semiconductor optical amplifier, which is self-injection-locked by a tunable fiber Bragg grating. The proposed tunable OTDR has a tuning range of 30 nm and a resolution of 50 m. The performance of the proposed scheme is experimentally evaluated to demonstrate the in-service monitoring of WDM-PON.     

Compact PLC-based optical transceiver module with automatic tunable filter for multi-rate applications

A full-duplex, simultaneous operation, multi-rate optical transceiver module for flexible optical access network systems has been fabricated. Based on a planar lightwave circuit (PLC) platform, the module is compact, highly sensitive, and supports multi-rate operation because it offers automatic transimpedance gain and band-pass filtering. This module will realise economical optical access network systems.     

机载复杂红外光学系统无热化补偿方法研究

为提高机载红外光学系统的环境适应性,保证红外系统在机载动态环境中能够稳定成像,提出一种无热化加权温度补偿方法,根据每个光学元件和间隔温度变化对系统成像影响程度的不同赋予不同的权重,建立在不均匀变化温度场中光学系统的加权温度补偿模型。利用光学设计软件仿真分析,工作温度在-50～+60℃范围内仿真误差<0.5%。建立了无热化光学系统的测试平台,对无热化加权温度补偿方法仿真分析结果进行实验测试。研究结果表明,加权温度补偿模型实用性强、精度高。在机载环境温度范围内,各项误差能够控制在1.5%,满足机载环境复杂红外光学系统的被动无热化的要求。     

Effective Silicon Oxide Formation on Silica‐on‐Silicon Platforms for Optical Hybrid Integration

This paper describes an effective method for forming silicon oxide on silica‐on‐silicon platforms, which results in excellent characteristics for hybrid integration. Among the many processes involved in fabricating silica‐on‐silicon platforms with planar lightwave circuits (PLCs), the process for forming silicon oxide on an etched silicon substrate is very important for obtaining transparent silica film because it determines the compatibility at the interface between the silicon and the silica film. To investigate the effects of the formation process of the silicon oxide on the characteristics of the silica PLC platform, we compared two silicon oxide formation processes: thermal oxidation and plasma‐enhanced chemical vapor deposition (PECVD). Thermal oxidation in fabricating silica platforms generates defects and a cristobalite crystal phase, which results in deterioration of the optical waveguide characteristics. On the other hand, a silica platform with the silicon oxide layer deposited by PECVD has a transparent planar optical waveguide because the crystal growth of the silica has been suppressed. We confirm that the PECVD method is an effective process for silicon oxide formation for a silica platform with excellent characteristics.     

Passive alignment method of polymer PLC devices by using a hot embossing technique

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.     

Spot-size converted polarization-insensitive SOA gate with avertical tapered submicrometer stripe structure

To develop polarization-insensitive semiconductor optical amplifier (SOA) gates into more efficient and functional optical components by using hybrid integration with a planer lightwave circuit (PLC) platform, vertical tapered spot-size converters were integrated into a SOA gate with a narrow mesa-stripe structure of submicrometer width leading to low coupling loss (2.6 dB). Very-low polarization dependence of gain (<0.2 dB) and high extinction ratio (>30 dB) were achieved in a wide wavelength range (40 nm). High-speed (<1 us) gate operation was also demonstrated. These results indicate that the spot-size converted SOA integrated on a PLC platform will perform well in wavelength-division-multiplexing (WDM) applications     

Passively aligned hybrid WDM module integrated with spot-sizeconverter integrated laser diode and waveguide photodiode on PLCplatform for fibre-to-the-home

A low cost and high performance hybrid WDM module assembled by passive alignment has been developed for FTTH systems. High coupling efficiency of a spot-size converter integrated laser diode to a PLC waveguide, which facilitates mass production of the module, is achieved. A minimum optical received power of -37 dBm for a 50 Mbit/s burst signal is also achieved     

A Remotely Reconfigurable Remote Node for Next-Generation Access Networks

A remotely reconfigurable remote node (RN) for next-generation (NG) access networks is proposed and demonstrated. The RN is remotely reconfigured by instantaneous optical powering at the central office through feeder fiber and maintained in a passive state by employing optical latching switches (OLSs). The feasibility of the proposed RN is demonstrated by investigating the operating conditions of optical powering for the reconfiguration and its nonlinear effect both for time-division-multiplexing passive optical network (TDM-PON) as legacy services and wavelength-division-multiplexing passive optical network (WDM-PON) as NG services. The existence of OLSs for reconfigurability and crosstalk effect between TDM-PON and WDM-PON are negligible on transmission performance.     

液体盐度在线测量的一种光学方法

提出了一种对液体盐度进行检测的光学方法 ,特点是 :在液体中的探头是无源的光学结构 ,其性能简单可靠 ,可以温度补偿使其结果不受温度影响 ,采用对称的差动放大器可以消除零飘 ,可在线测量。     

运动旋转基线单站无源定位CRLB分析

针对仅用相位差变化率进行的单站无源定位，现有文献一般考虑干涉仪基线固定在观测平台上，并随其作某种机动下的定位效果，并未考虑基线自身旋转的情况，因此考虑观测平台机动，干涉仪基线自身旋转的情况，提出了基于运动观测平台旋转基线的无源定位方法，并对观测平台机动过程中基线自身不断旋转情况下的定位原理及其性能进行了分析，推导了该方法定位误差的克拉美罗下限（CRLB），仿真实验结果表明，该方法很好地改善了定位性能。     

无源波分复用设备应用分析

【】：针对NB基站和新建基站采用C-RAN接入,导致城区光缆网纤芯资源紧张,提出利用无源波分复用设备方式进行扩容纤芯,但无源波分复用设备插入损耗,造成了全程链路衰耗增大,理论分析最大传输距离,给出了无源波分复用设备和彩光模块选型,最后结合光缆网现状,提出无源波分复用设备的应用方案。     

Adaptive minimum MSE controlled PLC optical equalizer for chromatic dispersion compensation

With the advent of very high-bit-rate optical communication systems (40 Gb/s and beyond) and the progressive transformation of the optical layer in a real networking layer, a channel-by-channel adaptive optical equalization will be needed. An adaptive optical equalizer for chromatic dispersion compensation, based on planar lightwave circuit (PLC) technology and controlled by a minimum mean square error (MSE) strategy, is proposed here. It is shown in a rigorous manner how the PLC parameters are to be adjusted and that the control algorithm is effective even with a few stages PLC equalizer, performing better than other nonadaptive control techniques. An analysis of the dynamic behavior of the equalizer shows that, in a realistic time-varying scenario, it can easily adapt to slow channel variations and is able to quickly restore a minimum MSE condition after an abrupt chromatic dispersion variation.     

LOOKNoC: a low-loss,non-blocking,scalable passive optical interconnect network-on-chip architecture

Low-loss, non-blocking, scalable passive optical interconnect network on-lhip ( LOOKNoC) structure was proposed based on 2 *2 optical exchange switches, using wavelength division multiplexing (WDM) technology to expand to 8 *8, 16 *16, 32 *32, 64 *64 passive optical interconnection networks, which can achieve non-blocking communication. The experimental results show that based on the 16 *16 optical interconnection network structure, the number of microring resonators (MRs) in LOOKNoC was reduced by 90.9%, 90.9%, 20.0% and 75.0% compared with the generic wavelength-routed optical router (GWOR), λ-router topology and CrossBar structure. By testing the performance parameters based on the structure of 16 *16 by the OMNET + + platform, as the result shows, the average insertion loss of LOOKNoC is 3.0%, 11.6%, 4.8% and 16.7% less than that of     

基于PLC的电子装备自动测试系统设计

传统方法对电子装备自动测试系统的测试时间较长,提出基于PLC的电子装备自动测试系统设计.在硬件设计上,设计气源处理装置,为整个自动测试系统的运行提供气压;设计物料检测传感器,传输测试过程中的电信号;设计测试限位开关与激励源模块,并选择适合系统的PLC器件,辅助系统整个测试过程的进行.在软件设计上,建立整个系统的数据库平...