GaAs solar cells grown on Si substrates for space use

GaAs single‐junction and InGaP/GaAs multi‐junction thin‐film solar cells fabricated on Si substrates have great potential for high‐efficiency, low‐cost, lightweight and large‐area space solar cells. Heteroepitaxy of GaAs thin films on Si substrates has been examined and high‐efficiency GaAs thin‐film solar cells with total‐area efficiencies of 18·3% at AM0 and 20·0% at AM 1·5 on Si substrates (GaAs‐on‐Si solar cells) have been fabricated. In addition, 1‐MeV electron irradiation damage to GaAs‐on‐Si cells has been studied. The GaAs‐on‐Si cells are found to show higher end‐of‐life efficiency than the conventional GaAs cells fabricated on GaAs substrates (GaAs‐ on‐GaAs cells) under high‐fluence 1‐MeV electron irradiation of more than 1 × 10¹⁵ cm⁻². The first space flight to make use of them has been carried out. Forty‐eight 2 × 2 cm GaAs‐on‐Si cells with an average AM0 total‐area efficiency of 16·9% have been evaluated in the Engineering Test Satellite No.6 (ETS‐VI). The GaAs‐on‐Si cells have been demonstrated to be more radiation‐resistant in space than GaAs‐on‐GaAs cells and 50, 100 and 200‐μm‐thick Si cells. These results show that the GaAs‐on‐Si single‐junction and InGaP/GaAs‐on‐Si multi‐junction cells have great potential for space applications. Copyright © 2001 John Wiley & Sons, Ltd.     

分子束外延生长的GaAs/GaInP双结电池研究

We report the recent result of GaAs/GaInP dual-junction solar cells grown by all solid-state molecularbeamepitaxy(MBE).The device structure consists of a GaIn0.48P homojunction grown epitaxially upon a GaAs homojunction,with an interconnected GaAs tunnel junction.A photovoltaic conversion efficiency of 27% under the AM1.5 globe light intensity is realized for a GaAs/GaInP dual-junction solar cell,while the efficiencies of 26% and 16.6% are reached for a GaAs bottom cell and a GaInP top cell,respectively.The energy loss mechanism of our GaAs/GaInP tandem dual-junction solar cells is discussed.It is demonstrated that the MBE-grown phosphide-containing Ⅲ–V compound semiconductor solar cell is very promising for achieving high energy conversion efficiency.     

GaAs Shallow-homojunction solar cells on Ge-coated Si substrates

Solar cells with conversion efficiencies of 12% (AM1) have been fabricated from single-crystal GaAs epilayers grown by CVD on Ge-coated Si substrates. The cells utilize an n⁺/p/p⁺shallow-homo junction GaAs structure on a thin (<0.2 µm) epitaxial Ge layer. These solar cells are the first reported GaAs devices fabricated on Si substrates.     

Enhanced efficiency in GaInP/GaAs tandem solar cells using carbon doped GaAs in tunnel junction

Carbon doping of GaAs using CBr₄ (carbon tetrabromide) in metal-organic chemical vapor deposition (MOCVD) was investigated to obtain very high and sharp doping profiles required for tunnel junction in tandem solar cells. It was found that the hole concentration increased with decreasing growth temperature and V/III ratio. Hole doping profiles versus distance from the sample surface showed that the hole concentration near the surface was very low in comparison with that far below the surface. As a post-growth treatment, CBr₄ was supplied during the cool down process and produced almost constant hole concentration of 1 × 10²⁰ cm⁻³ regardless of the depth, when CBr₄ flow rate was 9.53 μmol/min. Based on these results, solar cells were fabricated using both carbon (C) and zinc (Zn) as a p-type dopant. It was shown that C doping exhibits higher efficiency and lower series resistance than those of Zn doping in GaInP/GaAs tandem solar cells.     

p‐CuO/n‐Si heterojunction solar cells with high open circuit voltage and photocurrent through interfacial engineering

Heterojunction solar cells of p‐type cupric oxide (CuO) and n‐type silicon (Si), p‐CuO/n‐Si, have been fabricated using conventional sputter and rapid thermal annealing techniques. Photovoltaic properties with an open‐circuit voltage (V_oc) of 380 mV, short circuit current (J_sc) of 1.2 mA/cm², and a photocurrent of 2.9 mA/cm² were observed for the solar cell annealed at 300 °C for 1 min. When the annealing duration was increased, the photocurrent increased, but the V_oc was found to reduce because of the degradation of interface quality. An improvement in the V_oc resulting to a record value of 509 mV and J_sc of 4 mA/cm² with a high photocurrent of ~12 mA/cm² was achieved through interface engineering and controlling the phase transformation of CuO film. X‐ray diffraction, X‐ray photoelectron spectroscopy, and high‐resolution transmission electron microscopy analysis have been used to investigate the interface properties and crystal quality of sputter‐deposited CuO thin film. The improvement in V_oc is mainly due to the enhancement of crystal quality of CuO thin film and interface properties between p‐CuO and n‐Si substrate. The enhancement of photocurrent is found to be due to the reduction of carrier recombination rate as revealed by transient photovoltage spectroscopy analysis. Copyright © 2014 John Wiley & Sons, Ltd.     

Breakeven criteria for the GaInNAs junction in GaInP/GaAs/GaInNAs/Ge four‐junction solar cells

The four‐junction GaInP/GaAs/GaInNAs/Ge solar cell structure holds the promise of efficiencies exceeding those of the GaInP/GaAs/Ge three‐junction cell, which at present is the benchmark for high‐efficiency multijunction cell performance. The performance of GaInNAs junctions demonstrated to date has been insufficient for the realization of these projected efficiency gains, owing to poor minority‐carrier properties in the GaInNAs. However, incremental improvements in the GaInNAs junctions have brought this breakeven point within sight. In this paper, we use a semiempirical approach to estimate the efficiency of the GaInP/GaAs/GaInNAs/Ge four‐junction solar cell structure as a function of the performance parameters of the GaInNAs third junction. The results provide guidance on the extent to which the current and voltage of present‐day GaInNAs junctions will need to be improved in order for the resulting four‐junction cell to realize its potential for efficiencies higher than that of GaInP/GaAs/Ge benchmark. Published in 2002 by John Wiley & Sons, Ltd.     

大面积、高性能柔性 GaInP/GaAs/InGaAs叠层太阳电池的制备

柔性高效Ⅲ-Ⅴ族多结太阳电池正在被开发、应用于无人机、可穿戴设备和空间能源等领域.采用MOCVD技术在Ga As衬底上制备太阳电池外延层, 之后通过低温键合和外延层剥离方法将外延层转移到柔性衬底上.通过外延层剥离设备设计和大量参数优化实验, 实现了GaAs太阳电池结构从四英寸砷化镓晶圆上的有效分离, 且不产生缺陷并保持原有的性能.近期, 在50μm聚酰亚胺薄膜上制备的30 cm2大面积柔性GaInP/Ga As/InGaAs三结太阳电池实现了31. 5%的转换效率 (AM0光谱) , 其中开路电压3. 01 V, 短路电流密度16. 8 mA/cm2, 填充因子0. 845.由于采用了轻质的聚酰亚胺材料, 所得到的柔性太阳电池面密度仅为168. 5 g/m2, 比功率高达2 530 W/kg.     

Wafer bonded four‐junction GaInP/GaAs//GaInAsP/GaInAs concentrator solar cells with 44.7% efficiency

Triple‐junction solar cells from III–V compound semiconductors have thus far delivered the highest solar‐electric conversion efficiencies. Increasing the number of junctions generally offers the potential to reach even higher efficiencies, but material quality and the choice of bandgap energies turn out to be even more importance than the number of junctions. Several four‐junction solar cell architectures with optimum bandgap combination are found for lattice‐mismatched III–V semiconductors as high bandgap materials predominantly possess smaller lattice constant than low bandgap materials. Direct wafer bonding offers a new opportunity to combine such mismatched materials through a permanent, electrically conductive and optically transparent interface. In this work, a GaAs‐based top tandem solar cell structure was bonded to an InP‐based bottom tandem cell with a difference in lattice constant of 3.7%. The result is a GaInP/GaAs//GaInAsP/GaInAs four‐junction solar cell with a new record efficiency of 44.7% at 297‐times concentration of the AM1.5d (ASTM G173‐03) spectrum. This work demonstrates a successful pathway for reaching highest conversion efficiencies with III–V multi‐junction solar cells having four and in the future even more junctions. Copyright © 2014 John Wiley & Sons, Ltd.     

Epitaxial necking in GaAs grown on pre-pattemed Si substrates

We report a new method for the natural reduction of threading dislocations in GaAs on Si by growing on patterned Si substrates. We also explore other effects of patterning on dislocation formation during growth: stress relief near the mesa edges at high aspect ratios, and limited dislocation nucleation and propagation. Prior to growth, the Si substrates were processed to produce a plurality of mesas varying in width (5-170 μm) and geometry (circular, rectangular, and square mesas). After growth of the GaAs, the material was characterized with cathodoluminescence (CL) and secondary electron microscopy. For a GaAs growth temperature of 570° C and a thickness of 10 μm, the GaAs grown on the 40μ-wide Si mesas show a factor of 1.6 increase in luminescence intensity over the luminescence intensity from the unpatterned control area. Also, the emission wavelength from the smaller mesas is shifted to shorter wavelengths as compared to GaAs/GaAs and the unpatterned control area. The emission wavelength and CL intensity varies across the mesas; for 40 μm wide mesas, the emission wavelength is fairly constant across the mesa and the CL intensity decreases near the edges, whereas for larger mesas the emission wavelength decreases and the CL intensity increases at the mesa edges. For the 40 μm wide mesas, the integrated CL intensity is equal to that of a control GaAs/GaAs grown with the same doping level. No cracks were observed in the GaAs grown on the Si mesas, even though the thickness of the GaAs was 10 μ,m.     

Analysis of perimeter recombination in the subcells of GaInP/GaAs/Ge triple‐junction solar cells

This paper studies the recombination at the perimeter in the subcells that constitute a GaInP/GaAs/Ge lattice‐matched triple‐junction solar cell. For that, diodes of different sizes and consequently different perimeter/area ratios have been manufactured in single‐junction solar cells resembling the subcells in a triple‐junction solar cell. It has been found that neither in GaInP nor in Ge solar cells the recombination at the perimeter is significant in devices as small as 500 μm × 500μm(2.5 ⋅ 10 ^{− 3} cm²) in GaInP and 250μm × 250μm (6.25 ⋅ 10 ^{− 4}cm²) in Ge. However, in GaAs, the recombination at the perimeter is not negligible at low voltages even in devices as large as 1cm², and it is the main limiting recombination factor in the open circuit voltage even at high concentrations in solar cells of 250 μm × 250μm (6.25 ⋅ 10 ^{− 4} cm²) or smaller. Therefore, the recombination at the perimeter in GaAs should be taken into account when optimizing triple‐junction solar cells. Copyright © 2014 John Wiley & Sons, Ltd.     

High‐efficiency GaInP/GaAs/GaInNAs solar cells grown by combined MBE‐MOCVD technique

Triple‐junction GaInP/GaAs/GaInNAs solar cells with conversion efficiency of ~29% at AM0 are demonstrated using a combination of molecular beam epitaxy (MBE) and metal‐organic chemical vapor deposition (MOCVD) processes. The bottom junction made of GaInNAs was first grown on a GaAs substrate by MBE and then transferred to an MOCVD system for subsequent overgrowth of the two top junctions. The process produced repeatable cell characteristics and uniform efficiency pattern over 4‐inch wafers. Combining the advantages offered by MBE and MOCVD opens a new perspective for fabrication of high‐efficiency tandem solar cells with three or more junctions. Copyright © 2016 John Wiley & Sons, Ltd.     

Open‐circuit voltage recovery in type II GaSb/GaAs quantum ring solar cells under high concentration

We report on the open‐circuit voltage recovery in GaSb quantum ring (QR) solar cells under high solar concentration up to 2500 suns. The detailed behaviour of type II GaSb/GaAs QR solar cells under solar concentration, using different temperatures and light illumination conditions, is analysed through optical and electrical measurements. Although enhancement of the short‐circuit current was observed because of sub‐bandgap photon absorption in the QR, the thermionic emission rate of holes was found to be insufficient for ideal operation. The direct excitation of electron–hole pairs into QRs has revealed that the accumulation of holes is one of the causes of the open‐circuit voltage (V_OC) degradation. However, using concentrated light up to 2500 suns, the GaSb QR cell showed much quicker V_OC recovery rate than a GaAs control cell. Copyright © 2015 John Wiley & Sons, Ltd.     

High-performance AlGaAs/GaAs SDHTs and ring oscillators grown byMBE on Si substrates

High-performance AlGaAs/GaAs selectively doped heterojunction transistors (SDHTs) and 19-stage oscillators fabricated on silicon substrates are discussed. Epitaxial layers of AlGaAs/GaAs were grown by MBE on Si substrates. The mobility of two-dimensional electron gas (2DEG) in the SDHTs was as high as 53000 cm²/V-s at 77 K for a sheet charge density of 10×1¹² cm^-2. For 1-μm-gate-length devices, maximum transconductances of 220 and 364 mS/mm were measured at 300 and 77 K, respectively, for the SDHTs. A minimum propagation delay time of 27 ps/stage at room temperature was obtained for a 19-stage direct-coupled FET logic ring oscillator with a power dissipation of 1.1 mW/stage. The propagation delay time was reduced to 17.6 ps/stage at 77 K. From microwave S-parameter measurements at 300 K, current gain and power gain cutoff frequencies of 15 and 22 GHz, respectively, were measured. These results are comparable to those obtained for SDHT technology on GaAs substrates     

Simulation analysis of a high efficiency GaInP/Si multijunction solar cell

The solar power conversion efficiency of a gallium indium phosphide(GaInP)/silicon(Si)tandem solar cell has been investigated by means of a physical device simulator considering both mechanically stacked and monolithic structures.In particular,to interconnect the bottom and top sub-cells of the monolithic tandem,a gallium arsenide(GaAs)-based tunnel-junction,i.e.GaAs(n+)/GaAs(p+),which assures a low electrical resistance and an optically low-loss connection,has been considered.The J–V characteristics of the single junction cells,monolithic tandem,and mechanically stacked structure have been calculated extracting the main photovoltaic parameters.An analysis of the tunnel-junction behaviour has been also developed.The mechanically stacked cell achieves an efficiency of 24.27%whereas the monolithic tandem reaches an efficiency of 31.11%under AM1.5 spectral conditions.External quantum efficiency simulations have evaluated the useful wavelength range.The results and discussion could be helpful in designing high efficiency monolithic multijunction GaInP/Si solar cells involving a thin GaAs(n+)/GaAs(p+)tunnel junction.     

Integration of InGaP/GaAs/Ge triple‐junction solar cells on deeply patterned silicon substrates

We report preliminary results on InGaP/InGaAs/Ge photovoltaic cells for concentrated terrestrial applications, monolithically integrated on engineered Si(001) substrates. Cells deposited on planar Ge/Si(001) epilayers, grown by plasma‐enhanced chemical vapor deposition, provide good efficiency and spectral response, despite the small thickness of the Ge epilayers and a threading dislocation density as large as 10⁷/cm². The presence of microcracks generated by the thermal misfit is compensated by a dense collection grid that avoids insulated areas. In order to avoid the excessive shadowing introduced by the use of a dense grid, the crack density needs to be lowered. Here, we show that deep patterning of the Si substrate in blocks can be an option, provided that a continuous Ge layer is formed at the top, and it is suitably planarized before the metalorganic chemical vapor deposition. The crack density is effectively decreased, despite that the efficiency is also lowered with respect to unpatterned devices. The reasons of this efficiency reduction are discussed, and a strategy for improvement is proposed and explored. Full morphological analysis of the coalesced Ge blocks is reported, and the final devices are tested under concentrated AM1.5D spectrum. Copyright © 2016 John Wiley & Sons, Ltd.     

MOCVD grown CdZn Te/GaAs/Si substrates for large-area HgCdTe IRFPAs

Large-area HgCdTe 480×640 thermal-expansion-matched hybrid focal plane arrays were achieved by substituting metalorganic chemical vapor deposition (MOCVD)-grown CdZnTe/GaAs/Si alternative substrate in place of bulk CdZnTe substrates for the growth of HgCdTe p-on-n double-layer heterojunctions by controllably-doped mercury-melt liquid phase epitaxy (LPE). (100) CdZnTe was grown by MOCVD on GaAs/Si using a vertical-flow high-speed rotating disk reactor which incorporates up to three two-inch diameter substrates. Layers having specular surface morphology, good crystalline structure, and surface macro defect densities <50 cm⁻² are routinely achieved and both the composition uniformity and run-to-run reproducibility were very good. As the composition of the CdZnTe layers increases, the x-ray full width at half maximum (FWHM) increases; this is a characteristic of CdZnTe grown by VPE techniques and is apparently associated with phase separation. Despite a broader x-ray FWHM for the fernary CdZnTe, the FWHM of HgCdTe grown by LPE on these substrates decreases, particularly for [ZnTe] compositions near the lattice matching condition to HgCdTe. An additional benefit of the ternary CdZnTe is an improved surface morphology of the HgCdTe layers. Using these silicon-based substrates, we have demonstrated 78K high-performance LWIR HgCdTe 480×640 arrays and find that their performance is comparable to similar arrays fabricated on bulk CdZnTe substrates for temperatures exceeding approximately 78K. The performance at lower temperatures is apparently limited by the dislocation density which is typically in the low-mid 10⁶ cm⁻² range for these heteroepitaxial materials.     

Threshold voltage uniformity and characterization of microwaveperformance for GaAs/AlGaAs high electron-mobility transistors grown onSi substrates

We report on DC and microwave characteristics for high electron-mobility transistors (HEMT's) grown on Si substrates by metal-organic chemical vapor deposition (MOCVD). Threshold voltage (V _th) distribution in a 3-in wafer shows standard deviation of V_th (σV_th) of 36 mV with V_th of -2.41 V for depletion mode HEMT's/Si and σV_th of 31 mV with V_th of 0.01 V for enhancement mode, respectively. The evaluation of V_th in a 1.95×1.9 mm² area shows high uniformity for as-grown HEMT's/Si with σV_th of 9 mV for V_th of -0.10 V, which is comparable to that for HEMT's/GaAs. Comparing the V_th distribution pattern in the area with that for annealed HEMT's/Si, it is indicated that the high uniformity of V_th is obtained irrelevant of a number of the dislocations existing in the GaAs/Si. From microwave characteristic evaluation for HEMT's with a middle-(10~50 Ω·cm) and a high-(2000~6000 Ω·cm) resistivity Si substrate using a new equivalent circuit model, it is demonstrated that HEMT's/Si have the disadvantage for parasitic capacitances and resistances originated not from the substrate resistivity but from a conductive layer at the Si-GaAs interface. The parasitic parameters, especially the capacitances, can be overcome by the reduction of electrode areas for bonding pads and by the insertion of a dielectric layer under the electrode, which bring high cut-off frequency (f_T) and maximum frequency of operation (f_max) of 24 GHz for a gate length of 0.8 (μm). These results indicate that HEMT's/Si are sufficiently applicable for IC's and discrete devices and have a potential to be substituted for HEMT's/GaAs     

GaAs MESFET's fabricated on monolithic GaAs/Si substrates

GaAs MESFET's have been fabricated for the first time on monolithic GaAs/Si substrates. The substrates were prepared by growing single-crystal GaAs layers on Si wafers that had been coated with a Ge layer deposited by e-beam evaporation. The MESFET's exhibit good transistor characteristics, with maximum transconductance of 105 mS/mm for a gate length of 2.1 µm.     

Theory of open circuit voltage decay in a p-n junction diode at high injection

A high injection theory of open circuit voltage decay in a p-n junction diode is given. The theory takes into account the saturation of junction voltage at high injections and coupling between emitter and base of the diode. The results are in qualitative agreement with the available experimental results. In particular the theory explains the plateau which has been observed in most experimental results on the open circuit voltage decay at high injections.     

酞菁铜缓冲层对有机太阳能电池开路电压的影响

用p型有机半导体材料酞菁铜作为阴极缓冲层制作了器件结构为氧化铟锡/酞菁锌/碳六十/酞菁铜/铝的有机小分子太阳能电池, 对器件进行电学测量发现酞菁铜缓冲层的厚度对器件的开路电压有明显影响.基于半导体器件物理分析了光照下测量得到的电流-电压曲线, 由拟合结果得到的器件参数表明高理想因子导致了器件开路电压升高, 其原因为器件的输运特性不只受酞菁锌与碳六十形成的p-n结影响, 还与酞菁铜缓冲层与铝电极形成的肖特基接触有关.研究表明在有机太阳能电池器件中引入一个合适的缓冲层/阴极肖特基结可以提高器件的开路电压.