The Sintering Trajectory and Electrical Properties of Niobium‐Doped Titania Sputtering Targets

Nb‐doped TiO₂ (TNO) films, which are highly conductive and transparent, can be used as transparent conductive oxide (TCO) films. A predominant manufacturing method for TCO film is magnetron sputtering, and the material of the sputtering target affects the performance of the film. The objective of this study was to investigate the sintering densification, microstructure, and electrical properties of TNO and TiO₂ sputtering targets. The results showed that the segregation of Nb at the grain boundary in TNO helps to facilitate densification and inhibit grain growth. After 1200°C sintering, the sintered density of TNO target achieves almost 100% of the theoretical density. Moreover, the Nb₂O₅ additive greatly improves the electrical properties, decreasing the resistivity of TiO₂ from >10⁸ Ωcm to 4.6 × 10¹ Ωcm. Correlations between TNO sputtering target investigated in this study and TNO sputtered film reported in the literature are also preliminarily established. The resistivity of TNO film with an anatase structure is obviously lower than that of TNO target with a rutile structure.     

Growth behavior and thermally stable electrical properties of TiNbO5 nanosheet thin films grown using the electrophoretic method

TiNbO₅ (TNO) thin films were deposited by electrophoresis at room temperature by using TNO⁻ nanosheets. These TNO films exhibited a large (001) interplanar distance (1.18 nm) owing to the presence of TBA⁺ between the TNO layers. The TBA⁺, which were used to synthesize the TNO⁻ nanosheets, were removed from the TNO film after annealing at 600 °C. Two types of structures were developed in the film annealed at 600 °C: type-1 and type-2, which revealed (001) interplanar distances of 0.52 and 0.71 nm, respectively. The TNO film annealed at 600 °C showed a dielectric constant of 48.5, low dielectric loss (0.02), and small leakage current density of 4.16 × 10⁻⁷ A/cm² at 0.6 MV/cm. The dielectric properties were stable with respect to the film thickness and the applied electric field; the dielectric and insulation properties were maintained up to 300 °C. Therefore, TNO films are good candidates for high-temperature capacitors.     

Sol-gel derived low temperature HfO2-GPTMS hybrid gate dielectric for a-IGZO thin-film transistors (TFTs)

In this study, we prepared inorganic-organic HfO₂-GPTMS hybrid films by a simple sol-gel method at low temperature for high-k dielectric gate applications. The hybrid films were deposited by spin coating process, followed by annealing at 150?°C. The hybrid dielectric material was characterized by Spectroscopic ellipsometry (SE), AFM, FESEM, FTIR, TGA, and XPS techniques. The resulting hybrid films exhibit homogeneous and smooth surface with high optical transparency. Their dielectric properties were analysed by measuring leakage current and capacitance versus voltage of metal-insulator-metal (MIM) capacitor structures. From this analysis, the leakage current density at ??5?V, capacitance and dielectric constant at 1?MHz measured on the hybrid films were 10^?7 A/cm², 51.3?nF/cm² and of 11.4 respectively. Finally, to investigate the electrical performance of the hybrid thin films as a dielectric gate in thin film transistors (TFTs), bottom-gate TFTs were fabricated by depositing the HfO₂-GPTMS dielectric gate layer on ITO-coated glass substrate and subsequently a sputtered a-IGZO thin film as the channel layer. The electrical response of the resulting TFTs demonstrated good saturation mobility of 4.74?cm² V^?1 s^?1, very low threshold voltage of 0.3?V and I_on/I_off current ratio of 10⁴, with low operating voltage under 8?V.     

Seed layer mediated growth of high dielectric and low leakage BaTiO3 thin film using two-step sputtering process

In this study, we demonstrated the seed layer mediated growth of high-quality BaTiO₃ (BTO) thin films using a two-step radio frequency (RF) magnetron sputtering process. Since the as-grown BTO thin films obtained by RF magnetron sputtering at the deposition temperatures of 300–500 °C were amorphous with a low dielectric constant of 20, it is necessary to develop a fabrication process for obtaining crystalline high-k BTO thin films without sacrificing other film properties such as morphology and leakage current. First, it was revealed that ex-situ post-deposition annealing (PDA) at high temperatures in the 700–800 °C range led to the crystallization of BTO films and a high dielectric constant of 121. However, the film morphology deteriorated significantly during PDA, and consequently, a high leakage current was observed due to the rough and discontinuous surface containing voids and micro-cracks. To achieve an excellent leakage current characteristic as well as a high dielectric constant for a crystalline BTO thin film, in-situ crystallization was carried out through local epitaxial growth using a crystalline seed layer. The crystalline BTO seed layer was formed by annealing a 5-nm-thick amorphous BTO film at 700 °C on which the in-situ crystallized BTO main layer was deposited at 500 °C. The in-situ crystallization method resulted in a smooth and uniform surface and a high dielectric constant of 113. In addition, the in-situ crystallized BTO film exhibited a low leakage current density of 10⁻⁶ A/cm² (at 0.8 V) displaying an improvement by a factor of 10³ compared to the ex-situ crystallized BTO film.     

Bismuth Zinc Niobate Thin Film Multilayer Capacitors with Cu Electrodes Fabricated at Low Temperature by RF Magnetron Sputtering

Thin film multilayer capacitors (MLCs) composed of amorphous Bi_1.5Zn_1.0Nb_1.5O₇ (BZN) dielectric layers with Cu internal electrodes were fabricated by radio‐frequency magnetron sputtering at a temperature below 150°C. Both BZN thin films and Cu internal electrodes were deposited in situ through a set of steel shadow masks at room temperature and postannealed at 150°C. The BZN dielectric layers used in the MLCs are amorphous and the thickness for each BZN layer is approximately 220 nm. Metallic Cu layer used as the internal electrode is about 50 nm thick. Auger electron spectroscopy analysis indicates that there are no diffusion between BZN films and Cu electrodes, as well as no oxidation of Cu electrodes during the fabrication process owing to room‐temperature deposition and low‐temperature postannealing (150°C). The thin film MLCs with different number of BZN layers were fabricated. The thin film MLCs with five BZN layers exhibit promising properties with dielectric constant of 72, capacitance density of 1600 nF/cm², and loss tangent of 5.4% at 10 kHz. These results suggest that the BZN thin film MLCs have potential applications for the embedded PCBs.     

Strontium doping effects on the characteristics of solution-processed aluminum oxide dielectric layer and its application to low-voltage-operated indium-gallium-zinc-oxide thin-film transistors

In this paper, we investigated the strontium doping effects on the electrical and physical characteristics of solution-processed aluminum oxide dielectric layer and its application to low-voltage-operated indium-gallium-zinc-oxide (IGZO) thin-film transistors (TFTs). With an optimized doping concentration of strontium (5 at%) in aluminum oxide (Al₂O₃), an oxide gate dielectric layer having a dielectric constant of ~7 and low leakage current characteristics (~4 × 10⁻⁷ A/cm² at 3 MV/cm) could be achieved by a solution process, which are comparably better than those of pristine Al₂O₃ film. The enhanced dielectric properties from strontium doping can be attributed to the change in the physical properties of Al₂O₃ film incorporated with strontium, providing charge relaxation of defect states in Al₂O₃ film. Also, since the strontium is highly reactive with oxygen, the strontium substitution through a doping leads to more strongly bound structure in an Al₂O₃ film without considerable lattice distortion. Using the strontium-doped aluminum oxide film as a gate dielectric layer, having a thickness less than 10 nm, solution-processed IGZO TFTs operating at ≤ 1 V were demonstrated showing a field-effect mobility of 1.74 ± 1.10 cm²/V s and an on-current level of ~10⁻⁵ A.     

Annealing temperature-dependent structural and electrical properties of (Ta2O5)1-x - (TiO2)x thin films,x ≤ 0.11

(Ta₂O₅)_1-x- (TiO₂)_x (TTO_x) thin films, with x = 0, 0.03, 0.06, 0.08, and 0.11, were deposited using magnetron direct current (DC) sputtering method onto the P/boron-silicon (1 0 0) substrates by varying areas of Tantalum and Titanium metallic targets, in oxygen environment at ambient temperature. The as-deposited thin films were annealed at temperatures ranging from 500 to 800 °C. Generally, the formation of the Ta₂O₅ structure was observed from the X-ray diffraction measurements of the annealed films. The capacitance of prepared metal– oxide– semiconductor (MOS) structures of Ag/TTO_x/p-Si was measured at 1 MHz. The dielectric constant of the deposited films was observed altering with varying composition and annealing temperature, showing the highest value 71, at 1 MHz, for the TTO_x films, x = 0.06, annealed at 700 °C. With increasing annealing temperature, from 700 to 800 °C, the leakage current density was observed, generally decreasing, from 10^?5 to 10^?8 A cm^?2, for the prepared compositions. Among the prepared compositions, films with x = 0.06, annealed at 800 °C, having the observed value of dielectric constant 48, at 1 MHz; and the leakage current density 2.7 × 10^?8 A cm^?2, at the electric field of 3.5 × 10⁵ V cm^?1, show preferred potential as a dielectric for high-density silicon memory devices.     

Aqueous Solution‐Processable,Flexible Thin‐Film Transistors Based on Crosslinked Chitosan Dielectric Thin Films

The hydrophilic character of chitosan (CS) limits its use as a gate dielectric material in thin‐film transistors (TFTs) based on aqueous solution‐processable semiconductor materials. In this study, this drawback is overcome through controlled crosslinking of CS and report, for the first time, its application to aqueous solution‐processable TFTs. In comparison to natural CS thin films, crosslinked chitosan (Cr‐CS) thin films are hydrophobic. The dielectric properties of Cr‐CS thin films are explored through fabrication of metal–insulator–metal devices on a flexible substrate. Compared to natural CS, the Cr‐CS dielectric thin films show enhanced environmental and water stabilities, with a high breakdown voltage (10 V) and low leakage current (0.02 nA). The compatibility of Cr‐CS dielectric thin films with aqueous solution‐processable semiconductors is demonstrated by growing ZnO nanorods via a hydrothermal method to fabricate flexible TFT devices. The ZnO nanorod‐based TFTs show a high field‐effect mobility (linear regime) of 10.48 cm² V^?1 s^?1. Low temperature processing conditions (below 100 °C) and water as the solvent are utilized to ensure the process is environmental friendly to address the e‐waste problem.     

Robust SiO2 gate dielectric thin films prepared through plasma-enhanced atomic layer deposition involving di-sopropylamino silane (DIPAS) and oxygen plasma: Application to amorphous oxide thin film transistors

DIPAS (di-isopropylamino silane, H₃Si[N(C₃H₇)₂]) and O₂ plasma were employed, using plasma-enhanced atomic layer deposition (PEALD), to deposit silicon oxide to function as the gate dielectric at low temperature, i.e., below 200 °C. The superior amorphous SiO₂ thin films were deposited through the self-limiting reactions of atomic layer deposition with a deposition rate of 0.135 nm/cycle between 125 and 200 °C. PEALD-based SiO₂ thin layer films were applied to amorphous oxide thin film transistors constructed from amorphous In-Ga-Zn-O (IGZO) oxide layers, which functioned as channel layers in the bottom-gated thin film transistor (TFT) structure, with the aim of fabricating transparent electronics. The SiO₂ gate dielectric exhibited the highest TFT performance through the fabrication of heavily doped n-type Si substrates, with a saturation mobility of 16.42 cm²/V·s, threshold voltage of 2.95 V and large on/off current ratio of 3.69 × 10⁸. Ultimately, the highly doped Si was combined with the ALD-based SiO₂ gate dielectric layers, leading to a saturation mobility of 16.42 cm²/V·s, threshold voltage of 2.95 V, S-slope of 0.1944, and on/off current ratio of 3.69 × 10⁸. Semi-transparent and transparent TFTs were fabricated and provided saturation mobilities of 22.18 and 24.29 cm²/V·s, threshold voltages of 4.18 and 2.17 V, S-slopes of 0.1944 and 0.1945, and on/off current ratios of 9.63 × 10⁸ and 1.03 × 10⁷, respectively.     

Improving the electrical properties of niobium-doped titania sputtering targets by sintering in oxygen-deficient atmospheres

Niobium-doped titania (TNO) film can be used as a transparent conductive oxide (TCO) film due to its excellent conductivity and visible transparency. The performances of TNO sputtering targets are thus critical issues in optimizing sputtered films. This study clarifies the influences of inert and reducing atmospheres on the microstructure, densification, crystal structure, and electrical properties of TNO sputtering targets. The results indicate that a sintering atmosphere of 90% Ar–10% H₂ can result in a lower sintered density, larger grain size, and lower resistivity than can an atmosphere of Ar, followed by one of air. Sintering in 90% Ar–10% H₂ or Ar obviously decreases the resistivity of TiO₂, from >10⁸ Ω cm to <10⁻¹ Ω cm, and the TNO target, from >10¹ Ω cm to <10⁻¹ Ω cm. The resistivity of TNO target sintered at 1200 °C in 90% Ar–10% H₂ is as low as 1.8×10⁻² Ω cm.     

Dielectric Properties of Sol–Gel‐Derived Bi12SiO20 Thin Films

In this paper the dielectric properties of crack‐free, Bi₁₂SiO₂₀ thin films were investigated. The films were prepared on Pt/TiO₂/SiO₂/Si and corundum substrates using the sol–gel method. The formation of a pure Bi₁₂SiO₂₀ phase was observed at a temperature of 700°C. The Bi₁₂SiO₂₀ thin films, heat treated at 700°C for 1 h, had a dense microstructure with an average roughness (R_a) of 50 nm. The dielectric properties of the film were characterized by using both low‐ and microwave‐frequency measurement techniques. The low‐frequency measurements were conducted with a parallel capacitor configuration. The dielectric constant and dielectric losses were 44 and 7.5 × 10^?3, respectively. The thin‐film dielectric properties at the microwave frequency were measured using the split‐post, dielectric resonator method (15 GHz) and the planar capacitor configuration (1–5 GHz). The dielectric constant and the dielectric losses measured at 15 GHz were 40 and 17 × 10^?3, respectively, while the dielectric constant and the dielectric losses measured with the planar capacitor configuration were 39 and 65 × 10^?3, respectively.     

Large recoverable energy density with excellent thermal stability in Mn‐modified NaNbO3‐CaZrO3 lead‐free thin films

Effect of Mn dopant on energy storage properties in lead‐free NaNbO₃?0.04CaZrO₃ (NNCZ) thin films was investigated. The leakage current was largely suppressed, whereas dielectric constant, breakdown fields, and the difference between maximum polarization and remnant polarization were improved significantly by Mn doping, resulting in a large enhancement of energy storage performance. A large recoverable energy storage density of ~19.64 J/cm³ and an excellent thermal stability (from 30 to 160°C) were simultaneously achieved in the NNCZ thin film with 1 mol% Mn addition. Our results ascertain the great potential of NNCZ lead‐free thin films for the applications in energy storage devices over a wide temperature range.     

Electro-optical performances of nanostructured SrTiOx films: The effect of plasma power,Ar/O2 ratio and annealing

The present work evaluates the effects of plasma power and oxygen mixing ratios (OMRs) on structural, morphological, optical, and electrical properties of strontium titanate SrTiO_x (STO) thin films. STO thin films were grown by magnetron sputtering, and later thermal annealing at 700°C for 1 h was applied to improve film properties. X-ray diffraction analysis indicated that as-deposited films have amorphous microstructure independent of deposition conditions. The films deposited at higher OMR values and later annealed also showed amorphous structure while the films deposited at lower OMR value and annealed have nanocrystallinity. In addition, all as-deposited films were highly transparent (~80%–85%) in the visible spectrum and exhibited well-defined main absorption edge, while the annealing improved transparency (90%) within the same spectrum. The calculated direct and indirect optical band gaps for films were in the range of 3.60-4.30 eV as a function of deposition conditions. The refractive index of the films increased with OMRs and the postdeposition annealing. The frequency dependent capacitance measurements at 100 kHz were performed to obtain film dielectric constant values. High dielectric constant values reaching up to 100 were obtained. All STO samples exhibited more than 2.5 μC/cm² charge storage capacity and low dielectric loss (less than 0.07 at 100 kHz). The leakage current density was relatively low (3 × 10⁻⁸Acm⁻² at +0.8 V) indicating that STO films are promising for future dynamic random access memory applications.     

Annealing-temperature-modulated optical,electrical properties,and leakage current transport mechanism of sol–gel-processed high-k HfAlOx gate dielectrics

Deposition of HfAlO_x gate dielectric films on n-type Si and quartz substrates by sol-gel technique has been performed and the optical, electrical characteristics of the as-deposited HfAlO_x thin films as a function of annealing temperature have been investigated. The optical properties of HfAlO_x thin films related to annealing temperature are investigated by ultraviolet-visible spectroscopy (UV–vis) and spectroscopy ellipsometry (SE). By measurement of UV–vis, average transmission of all the HfAlO_x samples are about 85% owing to their uniform composition. And the increase in band gap has been observed with the increase of annealing temperature. Moreover, the increase of refractive index (n) and density with the increase of annealing temperature are obtained by SE measurements. Additionally, the electrical properties based on Al/Si/HfAlO_x/Al capacitor are analyzed by means of the high frequency capacitance-voltage (C-V) and the leakage current density-voltage (J-V) characteristics. Results have shown that 400 °C-annealed sample demonstrates good electrical performance, including larger dielectric constant of 12.93 and lower leakage current density of 3.75×10⁻⁷ A/cm² at the gate voltage of 1 V. Additionally, the leakage current conduction mechanisms as functions of annealing temperatures are also discussed systematically.     

Improvement in performance of indium gallium oxide thin film transistor via oxygen mediated crystallization at a low temperature of 200 °C

We report the fabrication of high-performance polycrystalline indium gallium oxide (IGO) thin film transistors (TFTs) at a low temperature of 200 °C. Growth of a highly aligned cubic phase with a bixbyite structure was accelerated at a certain proportion of oxygen plasma density during deposition of the IGO thin film, which leads to outstanding electrical characteristics. The resulting polycrystalline IGO TFT exhibited a high field-effect mobility of 56.0 cm²/V, a threshold voltage (V_TH) of 0.10 V, a low subthreshold gate swing of 0.10 V/decade, and a current modulation ratio of >10⁸. Moreover, the crystalline IGO TFTs have highly stable behaviors with a small V_TH shift of +0.8 and ?1.0 V against a positive bias stress (V_GS,ST ?V_TH = 20 V) and negative bias illumination stress (V_GS,ST ?V_TH = ?20 V) for 3,600 s, which is attributed to the high quality of the bixbyite crystalline structure.     

AlGaN/GaN MISHEMT with hBN as gate dielectric

Metal/Insulator/Semiconductor AlGaN/GaN High Electron Mobility Transistors (MISHEMTs) on sapphire substrate were fabricated with hexagonal Boron Nitride (hBN) thin film as gate dielectric. The hBN thin film, deposited by MW-PECVD, is an insulator permitting to obtain a low leakage current gate, an interface state density as low as 5 × 1011 cm^? 2 eV^? 1 for hBN/AlGaN interface and low roughness surface less than 0.4 nm. HBN thin film is deposited to have optical c-axis oriented weakly tilted to the perpendicular at the AlGaN barrier surface and to increase the lateral electrical resistivity. DC measurement on MISHEMT exhibits promising performance for microwave power devices associated to a good gate charge control in enhancement mode.     

Influence of post-deposition annealing on electrical and optical properties of (Ta2O5)1-x - (TiO2)x thin films,x ≤ 0.08

Tantalum (Ta) and titanium (Ti) metal targets were direct current (DC) magnetron sputtered in the oxygen environment by varying its relative areas to deposit (Ta₂O₅)_1-x- (TiO₂)_x (TTO_x) thin films, with x = 0, 0.03, 0.06, and 0.08, onto the boron-doped p-silicon (1 0 0) and optically polished quartz substrates, at room temperature; and were annealed at 500, 600, 700, and 800 °C, for 1.5 h. The thin films annealed at and above 600 °C show the Ta₂O₅ structure. The leakage current density and capacitance-voltage (C–V) characteristics were measured for TTO_x, x ≤ 0.08, assisted Ag/TTO_x/p-Si metal– oxide– semiconductor (MOS) structures. The leakage current density was found minimum, for the films annealed at 800 °C, for all the prepared TTO_x films, x ≤ 0.08. The minimum leakage current density 1.6 × 10^?8 A/cm², at 3.5 × 10⁵ V/cm electric field, was observed for x = 0.03, annealed at 800 °C, among the prepared compositions. The prepared TTO_0.03 films, annealed at 700 °C show maximum dielectric constant 39, at 1 MHz. The optical parameters, viz., refractive index (n), extinction coefficient (k), and optical band gap (E_g) of the films, with x = 0.03, prepared on quartz substrates, were determined from their optical transmittance plots. The values of n and k of the crystalline films were observed increasing from 2.123 to 2.143, and 0.099 to 0.130, respectively, at 550 nm wavelength; and E_g decreasing from 3.95 to 3.89 eV with the increasing annealing temperature, from 600 to 800 °C. Ohmic emission, in the lower electric field; Schottky and space-charge- limited current conduction mechanisms, in the intermediate to higher electric fields, were generally envisaged from the current-voltage characteristics in the prepared Ag/TTO_0.03/p-Si structures.     

Structural and electrical properties of Sr2NaNb4O13 thin film grown by electrophoretic method using nanosheets synthesized from K(Sr2Na)Nb4O13 compound

Sr₂NaNb₄O₁₃⁻ (SNNO⁻) nanosheets were exfoliated from the K(Sr₂Na)Nb₄O₁₃ compound that was synthesized at 1200 °C. The SNNO⁻ nanosheets were deposited on a Pt/Ti/SiO₂/Si substrate at room temperature by the electrophoretic method. Annealing was conducted at various temperatures to remove organic defects in the SNNO film. A crystalline SNNO phase without organic defects was formed in the film annealed at 500 °C. However, a SrNb₂O₆ secondary phase was formed in the films annealed above 600 °C, probably due to the evaporation of Na₂O. The SNNO thin film annealed at 500 °C showed a dielectric constant of 74 at 1.0 MHz with a dielectric loss of 2.2%. This film also exhibited a low leakage current density of 9.0 × 10⁻⁸ A/cm² at 0.6 MV/cm with a high breakdown electric field of 0.72 MV/cm.     

TiO2/TNO homojunction introduced in a dye‐sensitized solar cell with a novel TNO transparent conductive oxide film

In this study, niobium‐doped titanium oxide (TNO) was employed for a novel transparent conductive oxide (TCO) film to construct a porous‐TiO₂/TNO homojunction in a dye‐sensitized solar cell (DSSC). However, considering a balance between the electrical and optical properties of the TCO film, the sheet resistance in TNO was tuned to be higher than that in a typical fluorine‐doped tin oxide (FTO). The photovoltaic performance of the cell with the TNO film (TNO cell) was optimized to be almost comparable to that with a conventional FTO film (FTO cell) by coating the surface of the porous‐TiO₂ layer with a thin alumina or magnesia film to block a back reaction within the cell. An electrochemical impedance measurement was conducted to determine the detailed photovoltaic performance from the viewpoint of electron transportation in the cell. R₁, the real part of ω₁, indicated that electron transportation at the porous‐TiO₂/TNO interface was more favorable than that at the porous‐TiO₂/FTO interface, which was supported by AC phase change in the cell at a high‐frequency range. We found that the homojunction newly introduced in the cell is one of the key concepts for developing a DSSC into a high‐performance photovoltaic device.     

Sol–Gel‐Derived Amorphous‐MgNb2O6 Thin Films for Transparent Microelectronics

In this work, transparent amorphous‐MgNb₂O₆ thin films were fabricated on ITO/glass substrates using the sol–gel method. The change in the chemical states, as well as the optical and dielectric properties of MgNb₂O₆ films at various annealing temperatures is investigated. In this study, MgNb₂O₆ films exhibited the amorphous phase when the annealing temperature was below 600°C. From X‐ray photoelectron spectroscopy, the major parts of the films' chemical states can be indexed as Mg²⁺, Nb⁵⁺, Nb⁴⁺, and O^2?. Furthermore, the Nb⁴⁺ element can be reduced at higher annealing temperatures. The average transmission percentage in the visible range (λ = 400–800 nm) is over 80% for all MgNb₂O₆/ITO/glass samples, whereas the optical band gap (E_g) for all samples is estimated at ~4 eV. In addition, the dielectric constant was calculated to be higher than 20 under a 1 MHz AC electric field, with a leakage current density below 2 × 10^?7 A/cm² at 1 V. In this study, the fabrication procedure and experiment results of MgNb₂O₆ films are introduced for transparent microelectronics.