程控相控型通信电源的设计

一种以8032单片机为控制器的相控电源。着重讨论了3相触发信号的产生、同步以及单片机与整流主回路的接口问题。     

现场部线PROFIBUS智能化DP从站的设计

本文介绍了利用8032单片机与SPC3控制器设计PROFIBUS智能化DP从站的方法，实现了实时控制。     

单片机在玻壳和灯芯封接机中的应用

利用8032AH单片机实现玻壳与灯芯封接机的智能控制,提出了只改变微步步长来调整定位精度和转速的方法.     

涡街流量计智能化二次仪表

介绍了采用8032单片机组成的涡街流量计二次仪表，并对议表的测量方法、系统的硬件组成原理及软件结构进行了分析。     

单片机在农林业喷灌控制中的应用

8032单片机在农林业生产中对于作物的喷灌、温度控制管理系统的设计和实现,以及精密温度传感器电路的设计和系统数据采集及喷灌控制管理的软件设计思想。     

一种新型热电偶数字温度计

利用巧妙的单片机数字线性化技术，采用AD650（V／F）转换电路，高精度仪用放大器，单片机微处理器8032及2764EPR0M存储器，研制出测量温度范围宽、精度高、智能化程度高、调试方便的数字显示新一代仪表──S系列温度仪表。     

基于μPSD3200的人机对话设计

在介绍具有USB、I2C、ADC、DDC和PWM功能并嵌入8032控制器内核的滋PSD3200单片机的基础上,重点分析利用滋PSD3200单片机与内嵌SSD1303驱动芯片的超薄OLED显示屏P09703的硬件连接和软件编程,同时给出利用滋PSD3200单片机一个A/D口实现32个按键的原理图,从而实现完整的人机对话设计。     

单片机电阻温度变化率测试仪

概述对于精密标准电阻的生产,需要测试电阻在温度变化时电阻值变化的情况,即电阻的温度系数。本仪表由于采用了Intel 8032单片机,使其功能大大增强,可以同时测试三十组电阻的温度系数,并在自动完成顺序测试后能显示及打印各组电阻的温度系数和平均值、离散值等一些统计数据。仪表的主要功能包括:     

一种超低频绝对振动信号参数检测的实现方法

超低频绝对振动信号参数的检测在工程上有着十分广泛的应用前景。提出一种软硬件相结合的超低频绝对振动信号参数的检测方法，根据被测信号的特殊性，以8032单片机为核心构建了专门的信号处理电路。经实际应用表明，它具有自动校零、可靠性高、性能好、实用性强等特点，适用于工程上对超低频绝对振动的测量。     

一种信道控制权分配的动态分时法

介绍了动态分时方法来分配信道访问控制权，并在总线型网络上用令牌的方法实现了集散式计算机控制系统的多机通信。为了保证令牌交换的可靠性。对令牌进行的异或效验，由于集散控制系统底层的各个模块都是采用8032或8098，为了在大批量数据的通用不影响控制模块的正常工作，网络的通信采用单片机串行口的模式2和9位异步通信。     

面向电阻抗成像检测的多电极阵列微流控芯片设计

设计了一种用于微尺度流动状态下电阻抗成像检测的多电极阵列微流控芯片,包括微流控芯片的结构设计、材料选择和加工工艺。设计的微流控芯片包含3个圆形电极横截面,每个横截面包含一组电极阵列。该阵列有3种数目的电极,分别为8电极,12电极和16电极。之后通过数值仿真方法实现了三种电极数目（8,12和16）微流控芯片的电阻抗成像,并与之前研究出来的菱形横截面8电极微流控芯片进行了对比,发现设计出来的16电极圆形微流控芯片具有较高的成像质量,验证了微流控芯片用于细胞电阻抗成像检测的可行性。     

An accuracy algorithm for chip thickness modeling in 5-axis ball-end finish milling

Chip thickness in milling is one of the most fundamental parameters, which can significantly affect cutting force, cutting heat, cutting stability and machined surface topography for computer-aided process planning. In this paper, a combination of a three-dimensional trochoidal tooth trajectory model (3D3T) and engagement-boundary chip model is developed to determine instantaneous chip thickness in 5-axis ball-end finish milling. In comparison with the chip volume measured in a commercial software package (Unigraphics) the accuracy of the proposed model has been numerically validated with various process parameters including cutting depth, tool–workpiece inclination and cutter runout. The differences in time-varying delay and dynamic chip thickness as well as stability are compared with different models to show the impact of using 3D3T mechanism for chip thickness modeling in 5-axis ball-end finish.     

基于ARM9的串口扩展的设计

介绍在ARM9系统中利用16C554芯片来扩展串口的方案,详细阐述S3C2410芯片与16C554芯片之间的接口设计及软硬件设计。     

基于FPGA的步进电机控制芯片设计

研究了一种以FPGA为基础的步进电机控制芯片的设计,本芯片采用Actel公司的ProASIC3系列FPGA:A3P030进行开发,采用Verilog HDL硬件描述语言进行硬件电路设计,使用Actel公司出品的Libero集成开发环境,通过C8051F060单片机,以C语言为开发语言对设计的芯片进行实际测试.     

Will new chip revolutionize digital photography?

A company founded by well-known physicist, technologist, and inventor Carver Mead has developed a light-sensing chip that promises to radically change digital photography. Mead's company, Foveon, spent four years developing the X3 photographic sensor chip, which delivers two to four times the image resolution of other comparable digital-camera chips. Most digital cameras use charge-coupled-device technology. In the CCD process, light-sensitive integrated circuits store and display an image's data, converting each pixel into an electrical charge whose intensity corresponds to a specific color. These cameras use a mosaic filter with chip sensors that each detect just one color: red, green, or blue. Within the X3 chip, each sensor can detect red, green, and blue, depending on how far the captured light penetrates through layers of silicon-based color filters. The first X3-based cameras are scheduled to ship in the near future. National Semiconductor will build most of each chip, while Foveon will handle the final steps     

0.8 /spl mu/m CMOS implementation of weighted-order statistic image filter based on cellular neural network architecture.

In this paper, a very large scale integration chip of an analog image weighted-order statistic (WOS) filter based on cellular neural network (CNN) architecture for real-time applications is described. The chip has been implemented in CMOS AMS 0.8 /spl mu/m technology. CNN-based filter consists of feedforward nonlinear template B operating within the window of 3 /spl times/ 3 pixels around the central pixel being filtered. The feedforward nonlinear CNN coefficients have been realized using programmable nonlinear coupler circuits. The WOS filter chip allows for processing of images with 300 pixels horizontal resolution. The resolution can be increased by cascading of the chips. Experimental results of basic circuit building blocks measurements are presented. Functional tests of the chip have been performed using a special test setup for PAL composite video signal processing. Using the setup real images have been filtered by WOS filter chip under test.     

Finite-element-analysis of the relationship between chip geometry and stress triaxiality distribution in the chip breakage location of metal cutting operations

Chip breakage is a major machinability criterion of metal cutting operations. Favorable broken chips enable their efficient removal and prevent mechanical damages to the machined surface.Ductile failure on the chip free surface initiates chip breakage. The ductility of most materials depends on the stress triaxiality. Its relationship to the manufacturing parameters has to be understood in order to develop predictive methodologies of tool/process design. The problem can be approached by assessing the relationship between triaxiality and chip geometry, which is an integral representation of all tool/process parameters and material properties.This work presents a novel Finite-Element (FE) modeling approach of the relationship between the 3D chip geometry and the distribution of the stress triaxiality in the chip breakage location. For the derivation of the proposed approach it is shown that the stress state in the chip breakage location mainly develops during the chip bending phase. The approach enables for the first time to study the separate impacts of chip helical radius, helical angle, helical pitch and the shape of the deformed chip cross section on the triaxiality distribution. A sensitivity analysis of all input parameters is conducted and it is shown that all parameters but the helical pitch have characteristic impacts on the triaxiality distribution.The computational effort of the proposed modeling approach is significantly lower of than of available FE-models of metal cutting processes. The validation includes longitudinal turning experiments on steel AISI 1045 and 3D FE-process simulation modeling.     

LPC1766与Si4432的无线数据传输系统设计

本文设计了一种基于微功率无线收发芯片Si4432的远程数据传输系统。该系统采用ARM Cortex-M3核芯片LPC1766,通过SSP控制器操作射频收发芯片,详细论述了芯片基于时序的编程方法。该方案的运用可以实现无线数据的可靠收发,具有良好通信效果。     

高聚物微流控芯片上集成化气动微阀的研制

报道了一种新型的聚甲基丙烯酸甲酯(PMMA)/聚二甲基硅氧烷(PDMS)复合芯片。该芯片采用PMMA-PDMS…PDMS-PMMA的四层构型,以在芯片上集成气动微阀。具有液路和控制通道网路的PMMA基片与PDMS弹性膜间采用不可逆封接,分别形成液路半芯片和控制半芯片,而2个半芯片则依靠PDMS膜间的粘性实现可逆封接,组成带有微阀的全芯片。这种制备方法解决了制备PMMA-PDMS-PMMA三层结构芯片的封接难题,封接过程简单可靠。其控制部分和液路部分可以单独更换,可进一步降低使用成本,尤其适合一次性应用场合。初步实验表明:该微阀具有良好的开关性能和耐用性。     

基于高速单片机内核的高精度三相数字电表设计

谐波功率的计量能力直接决定着电表的精度等级。为了提高高精度三相数字电表的性价比，提出了一种应用高速单片机内核的设计思想。介绍了用单片机实现小测量的系统硬件框架、软件设计及与之相关的算法设计；叙述了软件流程、算法分析、单片机选择；综合分析了将误差控制在1％对单片机处理能力的要求。