亚胺化对聚酰亚胺热学性能的影响

用均苯四甲酸二酐(PMDA)与4,4’-二氨基二苯醚(ODA)为单体,聚合得到一定表观黏度的聚酰胺酸(PAA)。通过调节温度和时间两个变量,并采用红外光谱仪、高温综合热分析试着分别对PAA凝胶膜热亚胺化过程以及热学稳定性进行了研究,结果表明:亚胺化程度随时间的增加而增大,亚胺化程度随着亚胺化温度的提高同样增大;通过热重分析仪对聚酰亚胺薄膜热学性能进行了研究,随着薄膜亚胺化程度的增大,薄膜的热稳定性提高。     

纳米氧化铝（Al2O3）/聚酰亚胺（PI）杂化薄膜的制备及性能研究

笔者以均苯四甲酸二酐(PMDA)和4,4’-二氨基二苯醚(ODA)为单体,以N,N’-二甲基二苯醚(DMAc)为溶剂,制备聚酰胺酸溶液。在此过程中,采用原位聚合法在酰胺酸溶液中加入氧化铝(Al2O3),通过热亚胺化处理制备得到氧化铝/聚酰亚胺(Al2O3/PI)杂化薄膜。用傅立叶变换衰减透射射红外光谱(ATR/FTIR)、静态热机械分析(TMA)、力学性能测试等手段对PI/Al2O3杂化薄膜结构和性能进行表征。红外分析表明,杂化薄膜热亚胺化完全,杂化反应充分进行,并且Al2O3和PI基体之间形成键接;TMA分析表明,PI/Al2O3杂化薄膜的热膨胀系数随氧化铝含量的增加而减小;常温拉伸性能测试表明,随着Al2O3量的增加,PI杂化薄膜弹性模量逐渐增大,而拉伸强度和断裂伸长率呈下降趋势;玻璃化转变温度测试表明,杂化Al2O3之后的玻璃化温度不是很明显;热重分析表明,引入一定量的Al2O3,薄膜的热分解温度降低。而含有10%氧化铝的杂化薄膜各项性能都表现出相对优良的性能。     

化学亚胺化法聚酰亚胺材料的制备及性能研究

以对-亚苯基-双苯偏三酸酯二酐和4,4′-二氨基二苯醚为单体,乙酸酐和三乙胺为化学亚胺化试剂,通过改变亚胺化试剂的含量制备了一系列聚酰亚胺(PI)薄膜,并对薄膜的微观结构及性能进行了研究。研究结果表明,随着亚胺化试剂添加量的增加,聚酰胺酸脱水生成PI的反应程度逐渐增大,在后续薄膜成形过程中更有利于溶剂脱除,但是对最终PI的一级化学结构并没有影响。然而,亚胺化试剂的加入提高了最终PI薄膜的结晶度,同时改善了无定形区分子链段堆砌,使PI薄膜的玻璃化转变温度上升,热膨胀系数降低。     

共聚型聚酰亚胺热亚胺化动力学研究

为考察共聚体系的热亚胺化动力学,今以4,4’-二氨基二苯醚(ODA),均苯二酐(PMDA),3,3’,4,4’-二苯酮二酐(BTDA)为单体合成共聚型聚酰胺酸(PAA),通过差示扫描量热分析(DSC)法测量PAA亚胺化动力学,并通过红外光谱分析仪 FT-IR 分析聚酰亚胺(PI)亚胺化程度,万能试验机测试共聚物力学性能.结果表明:随着柔性二酐(BTDA)的引入,聚合物分子链柔性增强,DSC图谱上反应出亚胺化反应相对平缓.动力学数据显示,二酐共聚体系亚胺化反应活化能最小,端基间碰撞克服的能垒最低,有利于亚胺化的进行.     

聚酰胺酸薄膜表面热亚胺化动力学研究

采用均苯四甲酸二酐(PMDA)与4,4’-二氨基二苯醚(ODA)为单体,聚合得到表观黏度为1800m Pa·s的聚酰胺酸(PAA);通过衰减全发射红外光谱(ATR-FTIR)对聚酰胺酸凝胶膜表面亚胺化动力学进行了研究,结果表明:亚胺化程度随时间的增加和温度的升高而增大,并出现初期的快速和后期的慢速两个阶段。此外,由于薄膜下表面含有较多的残留溶剂,使其酰亚胺化程度高于上表面。用两步一级动力学模型进行关联,得到了相关的动力学参数。     

聚酰亚胺薄膜的制备及表征

用均苯四甲酸二酐(PMDA)和4,4-二氨基二苯醚(ODA)为主要反应原料,二甲基甲酰胺为溶剂,并采用化学亚胺化制备聚酰亚胺薄膜。研究成膜过程对聚酰亚胺薄膜力学性能的影响,并研究了薄膜的耐热性。结果表明,成膜时,在120℃烘箱中放置50 s,300℃烘箱中放置60 h薄膜的力学强度最好。     

聚酰胺酸的制备与亚胺化过程研究

用二酐BTDA与两种二胺单体(ODA、BAPP)在极性溶剂1-甲基-2-吡咯烷酮(NMP)中,通过共缩聚制备出聚酰胺酸(PAA),并经过热酰亚胺化得到聚酰亚胺(PI)。采用FT-IR和1H-NMR对产物的结构官能团和分子中质子氢进行表征,并利用FT-IR对聚酰胺酸热亚胺化过程进行追踪测试,结果表明,实验制备出了聚酰胺酸且固化工艺对聚酰胺酸亚胺化程度有较大影响。对固化温度和保温时间进行优化改进,确定出最佳固化工艺,并对聚酰胺酸热亚胺化过程的环化机理进行分析。     

聚酰亚胺/聚苯胺-TiO_2复合薄膜制备及表征

以4,4'-二氨基二苯醚(ODA)和均苯四甲酸二酐(PMDA)为单体,以聚苯胺-二氧化钛(PANI-TiO_2)为掺杂物,用原位聚合和超声振荡法制得聚酰胺酸/聚苯胺-二氧化钛溶液,经热亚胺化制得聚酰亚胺/聚苯胺-二氧化钛(PI/PANI-TiO_2)复合薄膜。采用FTIR、SEM、TG-DTG、介电常数、电子万能试验机等对复合薄膜的结构、形貌和性能进行了表征与测试。结果表明:PI/PANI-TiO_2薄膜的热亚胺化完全,PANI-TiO_2粒子在PI基体中分布均匀。掺杂10%(以反应制得PI的质量为基准,下同)PANI-TiO_2的PI/PANI-TiO_2复合薄膜的综合性能优于纯PI,其拉伸强度由纯PI的14.8 MPa提高到43.8 MPa;初始分解温度由纯PI的435℃提高到518℃,800℃时的残炭量达到57.7%;介电常数由3.38提高到3.86,介电损耗由0.0013提高到0.0040。     

明胶改性聚酰胺酸薄膜的化学亚胺化

采用化学脱水剂对明胶改性聚酰胺酸薄膜进行不同时间的化学亚胺化.通过红外光谱、示差扫描量热、热重分析等手段对化学亚胺化过程中薄膜的业胺化程度、热性能和力学性能进行了测定.结果表明,在化学亚胺化初期,薄膜的亚胺化程度、玻璃化温度和拉伸强度随着化学亚胺化时间的延长而增加.当化学亚胺化时间超过12 h后,继续延长化学亚胺化时间,薄膜的亚胺化程度、玻璃化温度和拉伸强度基本不变,薄膜的化学亚胺化基本完成.这时可得到玻璃化温度为205 ℃左右、耐520 ℃高温、拉伸强度较高的薄膜.     

含酮柔性共聚型聚酰亚胺性能研究

为了考察柔性二酐共聚对聚酰亚胺(PI)薄膜性能的影响,用含柔性基团的酮酐单体3,3',4,4'-二苯酮四酸二酐(BTDA)、刚性二酐单体均苯四甲酸二酐(PMDA)和芳香二胺4,4'-二氨基二苯醚(ODA)共聚,制得共聚聚酰亚胺薄膜.分别用FT-IR(ATR)、TMA、TGA、万能试验机对薄膜的结构、热性能及力学性能进行了测定.结果表明,聚合物亚胺化程度完全,且随着柔性二酐的加入聚合物的热性能得到明显改善,同时力学性能数据也表明,共聚物柔性增强,材料的加工性得到提高.     

Effect of thermal history during drying and curing process on the chain orientation of rod-shaped polyimide

Chain orientation in polyimide (PI) film is influenced by the thermal history during drying and curing process. The amount of residual solvent and the degree of imidization, among other factors, play a major role in determining the chain orientation during the process. In the present study, poly(amic acid), the precursor of PI, coated on the glass substrate was imidized to PI through different drying and curing protocols. On the way of complete imidization, the residual solvent concentration and the degree of imidization were characterized using confocal Raman spectroscopy. The poly(amic acid) began to imidize quickly while retaining more solvent in the film as the initial drying temperature increased. The degree of in-plane chain orientation in fully imidized PI film made by different process protocols was compared using polarized Raman spectroscopy. The fully imidized PI showed the lowest degree of in-plane chain orientation when it was processed by the protocol with the highest drying temperature. The difference in the degree of in-plane chain orientation among different PI films significantly influenced the in-plane thermal expansion coefficient, while no significant change in crystallinity or glass transition temperature was observed.     

电位滴定法测定聚酰胺酸固相热环化动力学

针对二步法合成聚酰亚胺的固相热环化过程,采用改进的自动电位滴定法和GPC测定了反应的剩余聚酰胺酸含量及相对分子质量随反应时间及反应温度的变化。结果表明:聚合物平均相对分子质量随热处理时间和温度的增加而逐步增大,相对分子质量分布指数则呈现先增后降的变化趋势。聚合物剩余聚酰胺酸的质量分数随热处理时间增加而逐渐降低,并出现初期的快速和后期的慢速2个阶段。提高热处理温度,则环化速率明显增大,环化程度亦增大。采用两步一级动力学模型关联并得到了2个阶段的热环化动力学参数,快速和慢速阶段的活化能较为接近,而指前因子和过渡熵相差较大。     

Effect of film formation process on residual stress of poly(p-phenylene biphenyltetracarboximide) in thin films

Soluble poly(p-phenylene biphenyltetracarboxamine acid) (BPDA-PDA PAA) precursor, which was synthesized from biphenyltetracarboxylic dianhydride and p-phenylene diamine in N-methyl-2-pyrrolidone (NMP), was spin-cast on silicon substrates, followed by softbake at various conditions over 80–185°C. Softbaked films were converted in nitrogen atmosphere to be the polyimide films of ca. 10 μm thickness through various imidizations over 120–400°C. Residual stress, which is generated at the polymer/substrate interface by volume shrinkage, polymer chain ordering, thermal history, and differences between properties of the polymer film and the substrate, was measured in situ during softbake and subsequent imidization processes. Polymer films imidized were further characterized in the aspect of polymer chain orientation by prism coupling and X-ray diffraction. Residual stress in the polyimide film was very sensitive to all the film formation process parameters, such as softbake temperature and time, imidization temperature, imidization step, heating rate, and film thickness, but insensitive to the cooling process. Softbaked precursor films revealed 9–42 MPa at room temperature, depending on the softbake temperature and time. That is, residual stress in the precursor film was affected by the amount of residual solvent and by partial imidization possibly occurring during softbake above the onset of imidization temperature, ca. 130°C. A lower amount of residual solvent caused higher stress in the precursor film, whereas a higher degree of imidization led to lower stress. Partially imidized precursor films were converted to polyimide films revealing relatively high stresses. After imidization, polyimide films exhibited a wide range of residual stress, 4–43 MPa at room temperature, depending on the histories of softbake and imidization. Relatively high stresses were observed in the polyimide films which were prepared from softbaked films partially imidized and by rapid imidization process with a high heating rate. The residual stress in films is an in-plane characteristic so that it is sensitive to the degree of in-plane chain orientation in addition to the thermal history term. Low stress films exhibited higher degree of in-plane chain orientation. Thus, residual stress in the film would be controlled by the alignment of polyimide chains via the film formation process with varying process parameters. Conclusively, in order to minimize residual stress and to maximize in-plane chain orientation, precursor films should be softbaked for 30 min-2 h below the onset imidization temperature, ca. 130°C, and subsequently imidized over the range of 300–400°C for 1–4 h by a two-step or multi-step process with a heating rate of ? 5.0 K min⁻¹, including a step to cover the boiling point, 202°C, of NMP. In addition, the final thickness of the imidized films should be <20 μm. © 1997 Elsevier Science Ltd.     

Electron beam curing of polymer composites

Electron‐beam (E‐Beam) curing of an epoxy polymer matrix and its composite (reinforced with IM7 Carbon fibers) was studied using a cationic photoinitiator. Photoinitiator concentration, dose, and process temperature were varied to understand their influence on E‐beam curing. Optimal photoinitiator concentration was found to be 5 phr. The curing was due to a primary α reaction with a strong dependence on dose, and a secondary β reaction with a weak dependence on dose and a strong dependence on initiator concentration. The extent of cure increased rapidly with dose until 100 kGy and it approached a plateau value beyond 100 kGy. This plateau value corresponded to incomplete curing by 27% for resin and 22% for composite at a process‐temperature of 22°C. The causes for incomplete curing appear to be the secondary β reaction and diffusional limitation. Increase in process temperature resulted in higher extent of cure at a dose level. The material used in this study was also found to be thermally curable and the reaction onset temperature (measured in a DSC ramp experiment) reduced from about 150°C at 0 kGy to about 50°C at 30 kGy. This indicates that simultaneous thermal curing during E‐beam curing of resin and composite is possible. After thermal post‐curing, the T_g of the E‐beam cured resin increased from 130°C at 200 kGy to a value greater than 370°C and the modulus decreased by 10%. The service temperature and the modulus of the 100% thermally cured resin and the thermally post‐cured (after E‐Beam irradiation) resin were comparable.     

Physicochemical characterization of alloy of polyimide with varying degree of crosslinking through diisocyanates

Polyimide alloys are prepared by blending the crosslinked and uncrosslinked polyamic acid components and followed by thermal imidization. The blend components can be synthesized by the reaction of polyamic acid with the varying concentration of crosslinker [here methylene bis (4-phenyl isocyanate or MDI)] from 1.54 × 10^?2 mol/L (i.e. hypothetically calculated critical crosslinker concentration or CCC) to 1.54 × 10^?6 mol/L. This communication discusses the synthesis and characterization of polyimide (PI) blends and alloys prepared by varying degrees of crosslinking introduced via isocyanate-amic acid reaction. The polyimides were prepared by thermally imidizing the polyamic acid blends at different curing temperatures from 50°C to 350°C. The degree of imidization and residual solvent content for blends having varying mole fractions of crosslinked (or branched) and uncrosslinked components and two extreme conditions and at specified temperature-time profiles have been studied. The resultant PI-MDI blends have exhibited synergism on mechanical properties. The improvement in mechanical properties, however, was significantly higher at the lower imidization temperature (i.e. 50°C to 150°C). The feasibility of preparing polyimide alloys with synergistic combinations of crosslinked and uncrosslinked polyimide components was inferred.     

Effect of processing and thickness on the structure in a polyimide film of poly(pyromellitic dianhydride-oxydianiline)

It is well known that poly(pyromellitic dianhydride-oxydianiline) (PMDA-ODA), orders at curing temperature well below its Tg with chains oriented parallel to the film plane. Structure analysis using X-ray scattering reveals two structural features: (a) The ordered structure range from biaxial-nematic-like to crystalline; (b) the symmetry of orientation of the ordered regions change from a fiber, to planar to isotropic as a function of depth. Both of these structural features are attributed to surface effects and solvent retention during curing. The solvent profile is estimated during the imidization process using a theoretical model. The model considers the change in temperature, imidization rate, diffusivity, and film thickness with time during the curing. The model indicates that solvent content after most of the imidization is complete is crucial in determining the order and texture in the film. At the air/film interface, a thin skin formation due to solvent depletion and surface ordering is suggested from the model. Depending on the process condition the overall structure of the film can vary from crystalline to mesomorphic. The biaxial nematic and smectic like structure are probably not equilibrium structures but are frustrated order due to limited solvent-induced mobility. The process condition affect the quality and quantity of order, and the texture due to chain's anisotropic cross-section is affected primarily by film thickness. By replacing a single component precursor with a blend of precursors of the same polyimide, both higher isotropy and order can be obtained in thin PMDA-ODA films. The order and extended chain conformation is better than that observed in the top 10 nm nearsurface-structure.     

Synthesis and processing of PMR-15/LaRC-TPI semi-IPN systems

To improve the fracture toughness of PMR-15 polyimide and to alleviate its high susceptibility to microcracking induced by thermal cycling, a thermoplastic polyimide, LARC-TPI, was incorporated to form a sequential semi-interpenetrating polymer network (semi-2 IPN). The imidization kinetics of LARC-TPI in the semi-IPNs were studied using a thermal gravimetric analyzer. Both the solvent and the glass transition temperature of the semi-IPN were found to have significant effects on the imidization kinetics. The kinetics could be modeled by a two-step reaction: the first step being a second-order reaction followed by a second step, which is a first-order diffusion-controlled reaction. Differential scanning calorimetry was chosen to investigate the curing of PMR-15 and PMR-15/LARC-TPI semi-IPNs. The curing process was well correlated by a first-order reaction kinetics, which suggested that the reverse Diels-Alder reaction of the Norbornene end group was the rate controlling step. The glass transition temperatures of these semi-IPNs were again found to play important an important role in dictating the curing kinetics. A higher proportion of LARC-TPI or a higher glass transition temperature of the semi-IPN prepolymer tended to result in a slower curing reaction. The optimum molding cycle of PMR-15 and PMR-15/LARC-TPI semi-IPNs were then determined from the obtained kinetics. © 1995 John Wiley & Sons, Inc.     

Ion beam-induced positive imaging of polyimide via two step imidization

The preparation of ion track membranes of thermally stable polyimide films has been performed by ion beam irradiation of partially imidized polyamic acid (PAA) films followed by alkaline etching and final imidization. No discernible positive hole patterns were observed on the irradiated films of partially imidized PAA containing sulfonyl linkages, although sulfonyl group is known to be highly sensitive to ion beams. In contrast, positive hole patterns appeared on the irradiated films of the partially imidized PAA with 68-89% imidization degrees that contains sulfonyl linkages along with a methylene group in the main chain. The most contrasty hole patterns with 0.3 μm diameter were observed on the irradiated PAA films of 89% imidization degree. The irradiated PAA film with the hole patterns was then transformed to the corresponding polyimide film with curing at 350 °C for 1 h. From the structural comparison of the polyimides, the possible mechanism for the hole pattern formation is suggested.     

热塑性聚酰亚胺微电子薄膜的制备

以微电子业所急需的聚酰亚胺薄膜为背景,采用一种热塑性聚酰亚胺树脂(TPI),实验测定了聚合物溶液特性、干燥工艺及热拉伸性能。在化学环化过程中聚合物溶液粘度随时间逐步增大;15 h后粘度和重均相对分子质量及分布趋于稳定。薄膜溶剂含量在干燥初期急剧下降,干燥速率随干燥温度升高而增大。TPI树脂表现出良好的热塑拉伸性能,当温度高于其玻璃化温度时,最大拉伸比随升温速率降低而增大,而随拉伸载荷增加呈现出先增后降。TPI薄膜经拉伸处理后其力学性能得到明显提高,综合性能与日本钟渊TP E薄膜相当。