共查询到20条相似文献,搜索用时 31 毫秒
1.
Shuyun Zhang Madic J. Bretchko P. Mokoro J. Shumovich R. McMorrow R. 《Microwave Theory and Techniques》2003,51(11):2203-2210
This paper presents a novel power-amplifier module (PAM) designed for GSM850-, GSM900 MHz, DCS1800- and PCS1900-MHz handset applications. The module combines an InGaP HBT power-amplifier integrated circuit, two integrated couplers, a dual-band logarithmic RF power detector/controller, and some additional passive components. The logarithmic RF power detector was implemented in the module to accomplish linear-in-decibel output power dependency. This allows the handset manufacturers to calibrate output power (Pout) at one or two points, with error as low as +/-0.3 dB, thus reducing test time in mass production. Due to higher accuracy, our novel design significantly reduces the power consumption during normal operation. Our design is the first to include two integrated directional couplers in a handset RF PAM. It significantly improves power control accuracy over load variations. In this paper, we show that the directivity of the integrated couplers is critical for establishing accurate power control over phase variations at high values of load mismatch. In addition, the presented module features fully integrated impedance matching at input and output ports with DC blocks. The entire module is plastic encapsulated on a 10 mm /spl times/ 10 mm laminate substrate. The module offers higher accuracy of Pout control, smaller size, lower bill-of-materials, and a shorter Pout calibration time to handset manufacturers. It is a very desirable RF PAM to handset designers because of its unique features. Under a low single supply voltage of 3.2 V, the PAM provides 35-dBm output power, 55% power-added efficiency (PAE) in the GSM900 band, and 33 dBm and 50% PAE in the DCS1800 band. 相似文献
2.
We present a pseudorandom bit sequence (PRBS) generator that outputs a 27-1 bit pattern at rates up to 21 Gb/s. The circuit is implemented in a 40-GHz AlGaAs/GaAs heterojunction bipolar transistor (HBT) standard production process, operates from a single 3.3-V power supply, and consumes 1.1 W of power. We discuss variations of PRBS architecture and digital circuit topologies which exploit unique characteristics of AlGaAs/GaAs HBT devices. The work demonstrates the feasibility of using AlGaAs/GaAs HBT technology with low-voltage/low-power design techniques in complex high-speed circuits 相似文献
3.
The analog power amplifier (PA) control loop of a fully integrated GSM/GPRS quad-band transceiver, suitable for GSM 850, GSM 900, DCS 1800, PCS 1900, and GPRS class 12 applications is presented. The control loop is based on a fully integrated PA controller (PAC) which meets applicable 3GPP GSM/GPRS specifications. Both the gain and the bandwidth of the PA control loop are programmable as well as the standby voltage delivered to the external PA: these features, together with a high driving capability (8.4 mA at 2.5 V), make this solution capable of interfacing many combinations of PAs, couplers, and detectors. The PAC has been integrated in a BiCMOS SiGe 0.35-/spl mu/m process and measures 0.33 mm/sup 2/. The current consumption from a single 2.8-V power supply is 2.8 mA without load and 7.2 mA in the application using Hitachi's PF08109B PA. 相似文献
4.
A highly linear MMIC power amplifier for wideband code-division multiple-access (W-CDMA) portable terminals has been devised and implemented with a new integrated on-chip lineariser. The proposed lineariser, consisting of an InGaP/GaAs heterojunction bipolar transistor (HBT) active bias circuit partially coupled to RF input power together with a feedback capacitor, effectively improves gain compression with little insertion power loss and no additional die area. The optimised lineariser improves maximum output power (P1 dB) by 2 dB and adjacent channel leakage power ratio (ACLR) by 4 dB, and the implemented HBT MMIC power amplifier exhibits a P1 dB of 30 dBm, a power gain of 30 dB, a power added efficiency of 42% at the maximum output power under an operation voltage of 3.4 V, and an ACLR of -34 dBc at 27 dBm of output power. 相似文献
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6.
Yamamoto K. Moriwaki T. Fujii T. Otsuji J. Miyashita M. Miyazaki Y. Nishitani K. 《Solid-State Circuits, IEEE Journal of》1999,34(4):502-512
A 2.2-V operation, single-chip GaAs MMIC transceiver has been successfully developed for 2.4-GHz-band wireless applications such as wireless local area network terminals. The chip is fabricated using a planar self-aligned gate field-effect transistor. To generate sufficient negative voltage for gate-biasing and to enhance switch power handling capability under a 2.2-V supply, a newly designed negative voltage generator with a voltage doubler (NVG-VD) and a switch control logic circuit are integrated on the chip, together with a power amplifier, a transmit/receive switch, and a low-noise amplifier. The NVG-VD is designed to produce both a 3.3-V positive step-up voltage and a -2.1-V negative voltage under 2.2 V in operation voltage. Biased with these outputs, the logic circuit accommodates high power outputs of over 25 dBm with a low operating voltage of 2.2 V in transmit mode, With a 2.45-GHz modulated signal based on IS-95 standards, a 21-dBm output power and a 33% efficiency are obtained at a ±1.25-MHz-offset adjacent channel power rejection of -45 dBc. In receive mode, a low-noise amplifier achieves a 1.8-dB noise figure and an 11-dB gain with a 3.0-mA current. This transceiver enables significant size and weight reductions in 2.4-GHz-band wireless application terminals 相似文献
7.
Scuderi A. La Paglia L. Carrara F. Palmisano G. 《Solid-State Circuits, IEEE Journal of》2005,40(3):611-621
This paper presents the design and measured performance of a 1.8-GHz power amplifier featuring load mismatch protection and soft-slope power control. Load-mismatch-induced breakdown can be avoided by attenuating the RF power to the final stage during overvoltage conditions. This was accomplished by means of a feedback control system, which detects the peak voltage at the output collector node and clamps its value to a given threshold by varying the circuit gain. The issue of output power control has been addressed as well. To this end, a temperature-compensated bias network is proposed, which allows a moderate power control slope (dB/V) to be achieved by varying the circuit quiescent current according to an exponential law. The nonlinear power amplifier was fabricated using a low-cost silicon bipolar process with a 6.4-V breakdown voltage. It delivers a 33.5-dBm saturated output power with 46% maximum power-added efficiency and 36-dB gain at a nominal 3.5-V supply voltage. The device is able to tolerate a 10:1 load standing-wave ratio up to a 5.1-V supply voltage. Power control slope is lower than 80 dB/V between -15 dBm and the saturated output power level. 相似文献
8.
We report the first large-signal power result from a double heterojunction bipolar transistor (DHBT) based on the GaInP/GaAs/GaInP material system. A CW output power of 1.51 W and a power added efficiency of 52% were achieved at 3 GHz. Because the GaInP collector has a relatively high bandgap of 1.89 eV, high DC bias voltage operation with collector bias extending to 20 V (for a 40-V swing) is possible in this GaInP/GaAs/GaInP DHBT. This high DC bias voltage operation represents a unique advantage over the more conventional AlGaAs/GaAs HBT 相似文献
9.
Jin-Hi Shin Joonwoo Lee Yujin Chung Byoung-Uk Ihn Bumman Kim 《Electron Device Letters, IEEE》1997,18(2):60-62
It is shown that the use of an electrically abrupt emitter-base junction considerably reduces the 1/f noise of self-aligned AlGaAs/GaAs heterojunction bipolar transistor (HBT). Although this device does not have depleted AlGaAs ledge passivation layer, the low-frequency noise spectra show a very low 1/f noise corner frequency of less than 10 kHz, which is much lower than previously reported value of about 100 kHz from conventional passivated or unpassivated AlGaAs/GaAs HBT's. Except for a residual generation-recombination (g-r) noise component, the noise power is comparable to that of Si BJT. It is also found that the low-frequency noise power of the AlGaAs/GaAs HBT is proportional to the extrinsic GaAs base surface recombination current square. Unlike the other HBT's reported, the noise sources associated with interface state and emitter-base (E-B) space charge region recombination are not significant for our device 相似文献
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11.
Yamamoto K. Maemura K. Kasai N. Yoshii Y. Miyazaki Y. Nakayama M. Ogata N. Takagi T. Otsubo M. 《Solid-State Circuits, IEEE Journal of》1996,31(12):1964-1973
A 1.9-GHz single-chip GaAs RF transceiver has been successfully developed using a planar self-aligned gate FET suitable for low-cost and high-volume production. This IC includes a negative voltage generator for 3-V single voltage operation and a control logic circuit to control transmit and receive functions, together with RF front-end analog circuits-a power amplifier, an SPDT switch, two attenuators for transmit and receive modes, and a low-noise amplifier. The IC can deliver 22-dBm output power at 30% efficiency with 3-V single power supply, The new negative voltage generator operates with charge time of less than 200 ns, producing a low level of spurious outputs below -70 dBc through the power amplifier. The generator also suppresses gate-bias voltage deviations to within 0.05 V even when gate current of -144 μA flows. The IC incorporates a new interface circuit between the logic circuit and the switch which enables it to handle power outputs over 24 dBm with only an operating voltage of 3 V. This transceiver will be expected to enable size reductions in telephones for 1.9-GHz digital mobile communication systems 相似文献
12.
Kuriyama Y. Akagi J. Sugiyama T. Hongo S. Tsuda K. Iizuka N. Obara M. 《Solid-State Circuits, IEEE Journal of》1995,30(10):1051-1054
In this paper, we report two types of broad-band amplifiers implemented with AlGaAs/GaAs HBT's. One is a Darlington feedback amplifier and the other is a transimpedance amplifier. In the former circuit, a dc gain of 9.5 dB and a -3-dB bandwidth of 40 GHz were achieved. In the latter circuit, a transimpedance gain of 50 dBΩ and a -3-dB bandwidth of 27 GHz were achieved. To our best knowledge, they are the highest speed in each circuit configuration 相似文献
13.
Tsung-Hsien Lin Chin-Kung Wu Ming-Chung Tsai 《Circuits and Systems II: Express Briefs, IEEE Transactions on》2007,54(2):131-135
A low-voltage low-power CMOS operational transconductance amplifier (OTA) with near rail-to-rail output swing is presented in this brief. The proposed circuit is based on the current-mirror OTA topology. In addition, several circuit techniques are adopted to enhance the voltage gain. Simulated from a 0.8-V supply voltage, the proposed OTA achieves a 62-dB dc gain and a gain-bandwidth product of 160 MHz while driving a 2-pF load. The OTA is designed in a 0.18-mum CMOS process. The power consumption is 0.25 mW including the common-mode feedback circuit 相似文献
14.
Dong Yi Zeng Qingming Cai Keli Zhang Keqiang 《Solid-State Circuits, IEEE Journal of》1995,30(10):1131-1135
We report the design, fabrication, and test results of a wide band and high slew-rate voltage-mode operational amplifier using AlGaAs/GaAs HBT's. To select higher carbon doping concentration is more effective in reducing base resistance, and lower emitter doping concentration possess a smaller input capacitance to improve the device speed. The HBT operational amplifier has provided 500 V/μs high slew-rate, only 8 ns setting time and about 2 GHz unity-gain frequency. Common mode rejection ratio (CMRR) values of this operational amplifier are in the order of 70 dB with a small DC input voltage offset 5 mV, and the open-loop gain is about 40 dB 相似文献
15.
Communication systems require linear power amplifiers with high efficiency and very low intermodulation distortion. AlGaAs/GaAs heterojunction bipolar transistors (HBT's) were found to have very low intermodulation distortion in power operation. Two-tone tests were carried out on both common-emitter (CE) and common-base (CB) power HBT's. At 7 GHz, the CE HBT showed -20 dBc IM3 (third-order intermodulation ratio) and 12% power added efficiency (PAE) per tone at the 1 dB gain compression point; IM3 dropped to -30 dBc at 1.5 dB output power backoff. The CE HBT has lower intermodulation distortion than CB HBT. Load pull data were collected to aid the understanding of the intermodulation. Parameters of the Gummel-Poon model (as used in SPICE) were derived for HBT's based on dc data and small-signal S parameters at various bias points. The accuracy and validity of the model were confirmed by comparison to experimental two-tone results. SPICE predicts that the emitter and base resistances linearize the HBT and reduce the third-order intermodulation distortion. The excellent third-order intermodulation performance of the CE HBT makes it a very attractive choice for linear power amplifiers 相似文献
16.
提出一种自适应线性化偏置的电路结构,通过调节控制电压改变偏置管的工作状态,提高功率放大电路的线性度,降低偏置电流对参考电压和环境温度的敏感度.利用双反馈环结构抑制输入阻抗随频率的变化,实现了宽带匹配,拓展了放大器的带宽.采用微波电路仿真软件AWR进行仿真,验证了带宽范围内的相位偏离度在2°以内.基于2μm InGaP/GaAs HBT工艺,设计了集成电路版图并成功流片.测试结果表明:在3.5V电压供电下,该放大器在1~2.5 GHz频带范围内,输入反射系数均在-10 dB以下,功率增益为23 dB,输出功率大于30 dBm,误差向量幅度在2.412 GHz时为.2.7%@24 dBm,最大功率附加效率达40%. 相似文献
17.
In order to design a robust electrostatic discharge (ESD) protected RF amplifier in InGaP/GaAs HBTs, a comprehensive assessment of device vulnerability to ESD events in both active transistors and passive components of the HBT technology is presented in this paper. The results include not only the intrinsic HBT's ESD robustness performance, but also its dependence on device layout, ballast resistor, and process. Acknowledging the ESD constraints imposed on InGaP/GaAs HBT technology, a 5.4-6.0-GHz power amplifier (PA) with a compact 2000 V/sub ESD/ (human body model) on-chip ESD protection circuit that has a low loading capacitance of less than 0.1 pF and that does not degrade RF and output power performance is developed for wireless local area network application. A diode triggered Darlington pair is implemented as the ESD protection circuit instead of the traditional diode string. Its operation principle, ESD protection performance, and PA performance are also illustrated in this paper. 相似文献
18.
Kobayashi K.W. Kasody R. Oki A.K. Streit D.C. 《Solid-State Circuits, IEEE Journal of》1996,31(10):1412-1418
The authors describe an AlGaAs/GaAs heterojunction bipolar transistor (HBT) X-band down-converter monolithic microwave integrated circuit (MMIC) which integrates a double double-balanced Schottky mixer and five stages of HBT amplification to achieve greater than 30 dB conversion gain over an RF bandwidth from 5 to 10 GHz. In addition, an output IP3 as high as +15 dBm has been achieved. The Schottky diodes are constructed from the existing N$collector and N+ subcollector layers of the HBT molecular beam epitaxy (MBE) device structure. A novel HBT amplifier topology employing active feedback which provides wide bandwidth in a compact area is used for the RF, LO, and IF amplifier stages. The complete down-converter MMIC is realized in a 3.6×3.4 mm2 area, is self-biased through a 6 V supply, and consumes 530 mW. This MMIC represents the highest complexity X-band down-converter MMIC demonstrated using GaAs HBT-Schottky diode technology 相似文献
19.
Bartusiak P.J. Henderson T. Kim T. Bayraktaroglu B. 《Electron Device Letters, IEEE》1992,13(11):584-586
A Ku -band monolithic HBT power amplifier was developed using a metal-organic chemical vapor deposition (MOCVD)-grown AlGaAs/GaAs heterojunction bipolar transistor (HBT) operating in common-emitter mode. At a 7.5 V collector bias, the amplifier produced 0.5 W CW output power with 5.0 dB gain and 42% power-added efficiency in the 15-16 GHz band. When operated at a single frequency (15 GHz), 0.66 W CW output power and 5.2 dB of gain were achieved with 43% PAE 相似文献