The Matrix Balun—A Transistor-Based Module for Broadband Applications

In this paper the analysis and design of a new active balun with very broadband performance, the matrix balun, are reported. Measured results show a common mode rejection ratio, CMRR, larger than 15 dB between 4 and 42 GHz while exhibiting 2 dB single-ended gain with a ripple of 1 dB. The balun was realized in a 0.15 mum GaAs mHEMT process. It occupies a chip area of 0.63 mm² and consumes a dc power of 20 mW. The same matrix balun circuit may also be biased for amplification and used as a matrix amplifier. The circuit then exhibits 10.5 dB gain up to 63 GHz with 1 dB ripple above 5.5 GHz and a power consumption of 67 mW.     

Algorithmic Design of CMOS LNAs and PAs for 60-GHz Radio

Sixty-gigahertz power (PA) and low-noise (LNA) amplifiers have been implemented, based on algorithmic design methodologies for mm-wave CMOS amplifiers, in a 90-nm RF-CMOS process with thick 9-metal-layer Cu backend and transistor f_T/f_MAX of 120 GHz/200 GHz. The PA, fabricated for the first time in CMOS at 60 GHz, operates from a 1.5-V supply with 5.2 dB power gain, a 3-dB bandwidth >13 GHz, a P _1dB of +6.4 dBm with 7% PAE and a saturated output power of +9.3 dBm at 60 GHz. The LNA represents the first 90-nm CMOS implementation at 60 GHz and demonstrates improvements in noise, gain and power dissipation compared to earlier 60-GHz LNAs in 160-GHz SiGe HBT and 0.13-mum CMOS technologies. It features 14.6 dB gain, an IIP ₃ of -6.8 dBm, and a noise figure lower than 5.5 dB, while drawing 16 mA from a 1.5-V supply. The use of spiral inductors for on-chip matching results in highly compact layouts, with the total PA and LNA die areas with pads measuring 0.35times0.43 mm² and 0.35times0.40 mm², respectively     

A Monolithic and Self-Referenced RF LC Clock Generator Compliant With USB 2.0

A monolithic and self-referenced radio frequency (RF) LC clock generator that is compliant with USB 2.0 is demonstrated in a system-on-chip (SoC). This work presents the first successful approach to replacing an external crystal (XTAL), the crystal oscillator (XO) and the phase-locked loop for clock generation in an IC supporting USB 2.0 using a standard CMOS fabrication process. It is shown that the primary design challenges with the implemented approach involve maintaining high frequency accuracy and low jitter. Techniques for addressing both are shown. In particular, the presented architecture exploits the effects of frequency division and low far-from-carrier phase noise to achieve low jitter. From a 1.536 GHz temperature-compensated LC reference oscillator, coherent clock signals are derived at 96MHz for the SoC logic and 12 MHz for an on-chip full-speed USB PHY. Though self-referenced, approximately plusmn400ppm total frequency accuracy is achieved over process variations, plusmn10% variation in the USB power supply voltage and temperature variation from -10 to +85degC. Measured period and cycle-to-cycle jitter are 6.78 ps_rms and 8.96 ps_rms, respectively. Fabricated in a 0.35 mum CMOS technology, the clock generator occupies 0.22 mm² and draws 9.5 mA from a 3.3-V supply, which is derived from the 5-V USB power supply     

A Low-Noise CMOS Distributed Amplifier for Ultra-Wide-Band Applications

To employ the distributed amplification technique for the design of ultra-wide-band low-noise amplifiers, the poor noise performance of the conventional distributed amplifiers (DAs) needs to be improved. In this work, the terminating resistor of the gate transmission line, a main contributor to the overall DA's noise figure, is replaced with a resistive-inductive network. The proposed terminating network creates an intentional mismatch to reduce the noise contribution of the terminating network. The degraded input matching at low frequencies can be tolerated for ultra-wide-band applications as they need to operate above 3 GHz. Implemented in a 0.13 mum CMOS process, the proposed DA achieves a flat gain of 12 dB with an average noise figure of 3.3 dB over the 3- to 9.4-GHz band, the best reported noise performance for a CMOS DA in the literature. The amplifier dissipates 30 mW from two 0.6-V and 1-V dc power supplies.     

A Ku-Band Interference-Rejection CMOS Low-Noise Amplifier Using Current-Reused Stacked Common-Gate Topology

A Ku-band CMOS low-noise amplifier (LNA) with high interference-rejection (IR), wide gain control range, and low dc power consumption is presented. The LNA consists of two common-gate metal-oxide-semiconductor field-effect transistors interconnected with an interstage parallel tank for the IR. The stacked common-gate stages share the same dc bias current to reduce power consumption and have controllable gain by changing this dc current. The implemented 0.13 mum CMOS LNA achieves measured power gain of 10.8 dB, noise figure of 4.2 dB, output P₁ dB of -4.3 dBm at 15 GHz, while rejecting interference down to a 38.5 dB level. The gain control range is 23.3 dB by varying the gate voltage from 0.2 to 1.2 V. The LNA consumes only 4 mA from a 1.3-V supply.     

Microwave noise performance of AlGaN-GaN HEMTs with small DC power dissipation

We report low microwave noise performance of discrete AlGaN-GaN HEMTs at DC power dissipation comparable to that of GaAs-based low-noise FETs. At 1-V source-drain (SD) bias and DC power dissipation of 97 mW/mm, minimum noise figures (NF/sub min/) of 0.75 dB at 10 GHz and 1.5 dB at 20 GHz were achieved, respectively. A device breakdown voltage of 40 V was observed. Both the low microwave noise performance at small DC power level and high breakdown voltage was obtained with a shorter SD spacing of 1.5 /spl mu/m in 0.15-/spl mu/m gate length GaN HEMTs. By comparison, NF/sub min/ with 2 /spl mu/m SD spacing was 0.2 dB greater at 10 GHz.     

A low-voltage and variable-gain distributed amplifier for 3.1-10.6 GHz UWB systems

A low-voltage and variable-gain distributed amplifier is presented in this letter. This microwave monolithic integrated circuit amplifier achieves 12-dB gain with a 3-dB frequency band of 1.6-12.1GHz and 6.5-dB noise figure under the bias condition of 0.8-V supply voltage and 6.4-mW total dc power consumption. The gain-control range is from -18dB to +20dB. Resistive metal-oxide-semiconductor field-effect transistors are used as termination resistors to compensate the mismatch due to different bias conditions. From 3.1 to 10.6GHz, the maximum gain ripple of this amplifier is only /spl plusmn/1dB for the gain level between -4 and 20dB.     

A 3.3 mW K-Band 0.18-μ m 1P6M CMOS Active Bandpass Filter Using Complementary Current-Reuse Pair

This letter presents a low-power active bandpass filter (BPF) at K-band fabricated by the standard 0.18 mum 1P6M CMOS technology. The proposed filter is evolved from the conventional half-wavelength resonator filter, using the complementary-conducting-strip transmission line (CCS TL) as the half-wavelength resonator. Furthermore, the complementary MOS cross-couple pair is proposed as a form of current-reuse scheme for achieving low-power consumption and high Q-factor simultaneously. The simulated results indicate that the Q-factor of the proposed half-wavelength resonator can be boosted from 9 to 513 at 25.65 GHz compared with the resonator enhanced by the nMOS cross-couple pair to Q-factor of merely 43 under the same power consumption. The proposed active BPF of order two occupies the chip area of 360 mum times 360 mum without contact pads. The measured results show that the center frequency of the active BPF is 22.70 GHz and a bandwidth of 1.68 GHz (7.39 %). The measured P_{1 dB} and noise figure at 22.70 GHz are -7.65 dBm and 14.05 dB, respectively. There is a 56.84 dB suppression between the fundamental tone and the second harmonic when the input power is -11.26 dBm. While showing 0 dB loss and some residual gain, the active BPF consumes 2.0 mA at 1.65 V supply voltage with maximum of 0.15 dB insertion loss and 9.96 dB return loss at pass band.     

A 750 Mb/s, 12 pJ/b, 6-to-10 GHz CMOS IR-UWB Transmitter With Embedded On-Chip Antenna

This paper presents a novel impulse radio based ultra-wideband transmitter. The transmitter is designed in 0.18 mum CMOS process realizing extremely low complexity and low power. It exploits the 6-to-10 GHz band to generate short duration bi-phase modulated UWB pulses with a center frequency of 8 GHz. No additional RF filtering circuits are required since the pulse generator circuit itself has the functionality of pulse shaping. Generated pulses comply with the FCC spectral emission mask. Measured results show that the transmitter consumes 12 pJ/b to achieve a maximum pulse repetition rate of 750 Mb/s. An optional embedded on-chip antenna and a power amplifier operating in 6-10 GHz band are also designed and investigated as a future low cost solution for very short distance IR-UWB communications.     

Three-Dimensional RF MEMS Switch for Power Applications

This paper introduces a new concept in 3-D RF microelectromechanical systems switches intended for power applications. The novel switch architecture employs electrothermal hydraulic microactuators to provide mechanical actuation and 3-D out-of-plane silicon cantilevers that have both spring action and latching mechanisms. This facilitates an off-state gap separation distance of 200 mum between ohmic contacts, without the need for any hold power. Having a simple assembly, many of the inherent problems associated with the more traditional suspension-bridge and cantilever-type-beam architectures can be overcome. A single-pole single-throw switch has been investigated, and its measured on-state insertion and return losses are less than 0.3 dB up to 10 GHz and greater than 15 dB up to 12 GHz, respectively, while the off-state isolation is better than 30 dB up to 12 GHz. The switch works well in both hot- and cold-switching modes, with 4.6 W of RF power at 10 GHz and without any signs of degradation to the ohmic contacts.     

0.18 μm 3.1-10.6 GHz CMOS UWB LNA with 11.4±0.4 dB gain and 100.7± 17.4 ps group-delay

A3.1-10.6 GHz ultra-wideband low-noise amplifier (UWB LNA) with excellent phase linearity property (group-delay-variation is only plusmn17.4 ps across the whole band) using standard 0.18 mum CMOS technology is reported. To achieve high and flat gain and small group-delay-variation at the same time, the inductive peaking technique is adopted in the output stage for bandwidth enhancement. The UWB LNA dissipates 22.7 mW power and achieves input return loss (S₁₁) of -9.7 to -19.9 dB, output return loss (S22) of-8.4 to -22.5 dB, flat forward gain (S21) 11.4 plusmn0.4 dB, reverse isolation (S12) of -40 to -48 dB, and noise figure of 4.12-5.16 dB over the 3.1-10.6 GHz band of interest. A good 1 dB compression point (Pi dB) of -7.86 dBm and an input third-order intermodulation point (IIP3) of 0.72 dBm are achieved at 6.4 GHz. The chip area is only 681 x 657 mum excluding the test pads.     

Monolithic micro-coaxial power dividers

A three-port, 450 mum tall, monolithic rectangular coaxial power divider is introduced. The device is fabricated by a surface micromachining process with six sequentially deposited copper layers with thicknesses of 50 and 100 mum. The divider has an overall loss of 0.2 dB at 30 GHz, the input port return loss is better than 10 dB and the output amplitude and phase misbalances are plusmn0.35 dB and plusmn2.2deg, respectively, from 20 to 40 GHz. The device is designed in a way that permits straightforward realisation of a Wilkinson divider with integrated resistor.     

Design and Analysis of a Performance-Optimized CMOS UWB Distributed LNA

In this paper, the systematic design and analysis of a CMOS performance-optimized distributed low-noise amplifier (DLNA) comprising bandwidth-enhanced cascode cells will be presented. Each cascode cell employs an inductor between the common-source and common-gate devices to enhance the bandwidth, while reducing the high-frequency input-referred noise. The noise analysis and optimization of the DLNA accurately accounts for the impact of thermal noise of line terminations and all device noise sources of each CMOS cascode cell including flicker noise, correlated gate-induced noise and channel thermal noise on the overall noise figure. A three-stage performance-optimized wideband DLNA has been designed and fabricated in a 0.18-mum SiGe process, where only MOS transistors were utilized. Measurements of the test chip show a flat noise figure of 2.9 dB, a forward gain of 8 dB, and input and output return losses below -12 dB and -10 dB, respectively, across the 7.5 GHz UWB band. The circuit exhibits an average IIP3 of -3.55 dBm. The 872 mum times 872 mum DLNA chip consumes 12 mA of current from a 1.8-V DC voltage.     

Parallel-Fed Traveling Wave Photodetector for > 100-GHz Applications

A fully packaged traveling wave photodetector (TWPD) with monolithically integrated optical power splitter for high-speed high-power applications in excess of 100 GHz is demonstrated. The detector module provides a responsivity of 0.24 A/W with a polarization dependence of only 0.2 dB at 1.55 mum wavelength and is suitable for the detection of RZ data rates in excess of 80 Gbit/s with unsaturated peak voltages of >0.5 V. Chip-based measurements show a broadband impedance match, a 3 dB bandwidth of 80 GHz and a maximum electrical output power of -2.5 dBm at 150 GHz.     

Ring-Based Triple-Push VCOs With Wide Continuous Tuning Ranges

This paper proposes a new ring-based triple-push voltage-controlled oscillator (VCO) architecture to achieve a wide tuning range and high operating frequencies. Two ring-based triple-push VCOs, one with a continuous frequency tuning range of 0.2-34 GHz, fabricated in 0.13- mum CMOS, and the other with a range of 0.1-65.8 GHz, fabricated in 90-nm CMOS, are presented in this paper. These two VCOs demonstrate that the proposed VCO architecture can achieve a very wide continuous tuning range, up to millimeter-wave frequencies, without any device-switching operations. In addition to the wide tuning range, the chip area of the proposed VCO is very small, allowing integration into a phase-locked loop. The power consumptions of the 0.2-34- and 0.1-65.8-GHz VCOs are 2-70 mW from a 2-V supply voltage, and 1.2-26.4 mW from a 1.2-V supply voltage, respectively. The fundamental and second harmonic rejections are better than 15 dB for both VCOs.     

A 1.3-V 5-mW fully integrated tunable bandpass filter at 2.1 GHz in 0.35-/spl mu/m CMOS

A 2.1-GHz 1.3-V 5-mW fully integrated Q-enhancement LC bandpass biquad programmable in f/sub o/, Q, and peak gain is implemented in 0.35-/spl mu/m standard CMOS technology. The filter uses a resonator built with spiral inductors and inversion-mode pMOS capacitors that provide frequency tuning. The Q tuning is through an adjustable negative-conductance generator, whereas the peak gain is tuned through an input G/sub m/ stage. Noise and nonlinearity analyses presented demonstrate the design tradeoffs involved. Measured frequency tuning range around 2.1 GHz is 13%. Spiral inductors with Q/sub o/ of 2 at 2.1 GHz limit the spurious-free dynamic range (SFDR) at 31-34 dB within the frequency tuning range. Measurements show that the peak gain can be tuned within a range of around two octaves. The filter sinks 4 mA from a 1.3-V supply providing a Q of 40 at 2.19 GHz with a 1-dB compression point dynamic range of 35 dB. The circuit operates with supply voltages ranging from 1.2 to 3 V. The silicon area is 0.1 mm/sup 2/.     

A Low-Noise Amplifier With Tunable Interference Rejection for 3.1- to 10.6-GHz UWB Systems

An ultrawideband common-gate low noise amplifier with tunable interference rejection is presented. The proposed LNA embeds a tunable active notch filter to eliminate interferer at 5-GHz WLAN and employs a common-gate input stage and dual-resonant loads for wideband implementation. This LNA has been fabricated in a 0.18-$mu$m CMOS process. The measured maximum power gain is 13.2 dB and noise figure is 4.5–6.2 dB with bandwidth of 3.1–10.6 GHz. The interferer rejection is 8.2 dB compared to the maximum gain and 7.6 dB noise figure at 5.2 GHz , respectively. The measured input P1dB is ${-} $11 dBm at 10.3 GHz. It consumes 12.8 mA from 1.8-V supply voltage.      

165-GHz Transceiver in SiGe Technology

Two D-band transceivers, with and without amplifiers and static frequency divider, transmitting simultaneously in the 80-GHz and 160-GHz bands, are fabricated in SiGe HBT technology. The transceivers feature an 80-GHz quadrature Colpitts oscillator with differential outputs at 160 GHz, a double-balanced Gilbert-cell mixer, 170-GHz amplifiers and broadband 70-GHz to 180-GHz vertically stacked transformers for single-ended to differential conversion. For the transceiver with amplifiers and static frequency divider, which marks the highest level of integration above 100 GHz in silicon, the peak differential down-conversion gain is -3 dB for RF inputs at 165 GHz. The single-ended, 165-GHz transmitter output generates -3.5 dBm, while the 82.5-GHz differential output power is +2.5 dBm. This transceiver occupies 840 mum times 1365 mum, is biased from 3.3 V, and consumes 0.9 W. Two stand-alone 5-stage amplifiers, centered at 140 GHz and 170 GHz, were also fabricated showing 17 dB and 15 dB gain at 140 GHz and 170 GHz, respectively. The saturated output power of the amplifiers is +1 dBm at 130 GHz and 0 dBm at 165 GHz. All circuits were characterized over temperature up to 125degC. These results demonstrate for the first time the feasibility of SiGe BiCMOS technology for circuits in the 100-180-GHz range.     

A 65 nm CMOS fully-integrated dynamic reconfigurable differential power amplifier with high gain in both bands

A fully-integrated dual-band dynamic reconfigurable differential power amplifier with high gain in 65 nm CMOS is presented. A switchable shunt LC network is proposed to implement the dual-band reconfigurable operation and achieve high gain at both low and high frequency bands, and the high quality on-chip transformers are utilized to implement input/output impedance matching and single-ended to differential conversion. Measured results show that the dual-band dynamic reconfigurable power amplifier can provide 23 dB gain at 2.15 GHz and 21 dB gain at 4.70 GHz, and achieve more than 19 dBm saturated output power at 2.15 GHz and 13 dBm saturated output power at 4.70 GHz, respectively. The die area is about 1.7 mm×2.0 mm.     

A low power 12-bit 200-kS/s SAR ADC with a differential time domain comparator

A low power 12-bit 200-kS/s SAR ADC is proposed.This features a differential time domain comparator whose offset is cancelled by using a charge pump and a phase frequency detector instead of the preamplifiers usually needed in a high resolution comparator.The proposed ADC is manufactured in 0.18-μm CMOS technology and the measured SNR and SNDR are 62.5 dB and 59.3 dB,respectively,with a power consumption of 72μW at a 200-kS/s sampling rate.The device operates with a 1.8-V power supply and achieves a FOM of 477 fJ/conversion-step.