Effect of molecular structures and mobility on the thermal and dynamical mechanical properties of thermally cured epoxy-bridged polyorganosiloxanes

The effects of molecular structures and mobility on the thermal properties of epoxy-bridged polyorganosiloxanes have been investigated by solid-state ²⁹Si and ¹³C solid state NMR in this study. Epoxy-bridged alkoxysilanes precursors with mono-(APDES), di-(APMDS), tri-(APTES) functional ethoxysilane terminal groups have been synthesized and thermally cured with or without the addition of catalysts to obtain epoxy-bridged polyorganosiloxanes. Three kinds of catalysts including acidic, basic, and organometalllic compounds have been used as the curing catalyst for the direct thermal curing of epoxy-bridged polyorganosiloxane precursors. The structures of epoxy-bridged polyorganosiloxanes with respect to the catalysts are quantitatively investigated. Acidic BF₃·MEA shows the best catalytic effects on the formation of T³ and D² structures in the epoxy-bridged polyorganosiloxanes from tri-functional epoxy-APTES and di-functional epoxy-APMDS precursors, but basic NBu₄·OH has better enhancement on the formation of M¹ structure in the epoxy-bridged polyorganosiloxanes from mono-functional epoxy-APDES precursor. TEM spectra show that the epoxy-bridged polysilsesquioxanes of epoxy-APTES precursors exhibit polysilsesquioxanes nano domain around 45-55 nm under the catalysis of dibutyltindilaurate (DBTDL), but show bigger polysilsesquioxanes nano domain around 50-150 nm under the catalysis of basic tetrabutylammonium hydroxide (NBu₄·OH) in epoxy matrix after direct thermal curing process.The coefficient of thermal expansion of the epoxy-bridged polyorganosiloxanes are affected by the functionality of terminated alkoxysilanes and the species of catalyst used during curing process. The epoxy-bridged polysilsesquioxanes of epoxy-APTES precursor possesses the lowest coefficient of thermal expansion compared with the other two epoxy-bridged polyorganosiloxanes from mono-, and di-functional epoxy-bridged polyorganosiloxanes precursors. There is no obvious T_g observed in the epoxy-bridged polysilsesquioxanes of epoxy-APTES precursor from the analysis of TMA and DMA. ¹³C solid state NMR has been used to investigate the molecular motion behaviors of epoxy-bridged polyorganosiloxanes structures with respect to the changes in T_g and CTE. The (the relaxation time of ¹³C after the spin lock process) of the epoxy-bridged polysilsesquioxanes of epoxy-APTES precursor is longer than that of epoxy-APMDS precursor, which indicates that the molecular mobility of epoxy-bridged polysilsesquioxanes of epoxy-APTES is highly restricted due to the strong intermolecular interaction of nano hybrid network.     

Physical and Mechanical Interfacial Properties of Epoxy Copolymers Initiated by Latent Thermal Catalysts

Summary: The epoxy copolymers containing sulfone groups, diglycidyl ether of bisphenol‐A – Bisphenol‐S (DGEBA‐S) were synthesized by a hot‐melt method. The thermal properties of the epoxy systems initiated by two cationic latent catalysts, i.e., N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH), were investigated by using a dynamic DSC, DMA, and TGA. The mechanical properties were measured by single‐edge‐notched (SEN) beam fracture toughness tests. As a result, the thermal stability and mechanical interfacial properties of the DGEBA‐S/catalyst system were found to be higher than those of the DGEBA/catalyst. This was probably due to the fact that the introduction of sulfone groups with a polar nature to the main chain of the epoxy resins led to an improvement of thermal stability and toughness of the cured epoxy copolymers.

Conversion of the epoxy/catalyst systems as a function of curing temperature.     

Cold‐cured epoxy‐silica hybrids: Effects of large variation in specimen thickness on the evolution of the Tg and related properties

Experimental organic–inorganic hybrid systems, based on silane functionalized difunctional and trifunctional epoxy resins and an alkoxysilane precursor mixture, containing small amounts of ammonium molybdate, are evaluated for potential use as adhesives cured at ambient temperatures. The precursor resin mixtures are found to exhibit a large increase in viscosity with a pseudoplastic behavior. Scanning electron microscopy (SEM) analysis shows the existence of siloxane domains with nanometric dimensions, except for the presence of microscopic molybdate particles. By monitoring the evolution of the glass transition temperature (T_g) during curing, varying the thickness of the specimens between 0.2 and 4.5 mm, it is found that the organic–inorganic hybrids display a significant increase in the final T_g over the parent unmodified epoxy resins, particularly in thin specimens and when ammonium molybdate is added. Small‐angle X‐ray scattering (SAXS) spectra show that the dimensions and typographic features of thick and thin specimens are similar, both containing an agglomeration of primary particles of 5–6 nm. POLYM. ENG. SCI., 2011. © 2010 Society of Plastics Engineers     

A new strategy for controlling shrinkage of DGEBA resins cured by cationic copolymerization with hydroxyl‐terminated hyperbranched polymers and ytterbium triflate as an initiator

We report a novel strategy for preparing epoxy thermosetting systems with low shrinkage and improved flexibility and degradability. Diglycidyl ether of bisphenol A (DGEBA) resin was cured with different proportions of hydroxyl‐terminated hyperbranched polymer (HBP), using ytterbium triflate as a cationic initiator. The curing process was studied using differential scanning calorimetry and thermomechanical analysis. Characterization of the resulting materials was evaluated using DSC, thermogravimetric analysis, and dynamic mechanical thermal analysis, and the fracture surface was studied using scanning electron microscopy (SEM). When DGEBA is modified with HBP, it shows a homogeneous morphology and the HBP is incorporated chemically into the network, because hydroxyl groups can react with epoxides under cationic conditions. Higher proportions of HBP reduce the glass transition temperature (T_g) and thermal stability and increase the flexibility. When the proportion of HBP in the curing mixture is increased, the degree of shrinkage is reduced significantly and expansion can be observed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Curing of diglycidyl ether of bisphenol‐A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agent

BACKGROUND: Reactive thermoplastics have received increasing attention in the field of epoxy resin toughening. This paper presents the first report of using a novel polyaryletherketone bearing one pendant carboxyl group per repeat unit to cure the diglycidyl ether of bisphenol‐A epoxy resin (DGEBA). The curing reactions of DGEBA/PEK‐L mixtures of various molar ratios and with different catalysts were investigated by means of dynamic differential scanning calorimetry and Fourier transform infrared (FTIR) spectroscopy methods. RESULTS: FTIR results for the DGEBA/PEK‐L system before curing and after curing at 135 °C for different times demonstrated that the carboxyl groups of PEK‐L were indeed involved in the curing reaction to form a crosslinked network, as evidenced by the marked decreased peak intensities of the carboxyl group at 1705 cm^?1 and the epoxy group at 915 cm^?1 as well as the newly emerged strong absorptions of ester bonds at 1721 cm^?1 and hydroxyl groups at 3447 cm^?1. Curing kinetic analysis showed that the value of the activation energy (E_a) was the highest at the beginning of curing, followed by a decrease with increasing conversion (α), which was attributed to the autocatalytic effect of hydroxyls generated in the curing reaction. CONCLUSION: The pendant carboxyl groups in PEK‐L can react with epoxy groups of DGEBA during thermal curing, and covalently participate in the crosslinking network. PEK‐L is thus expected to significantly improve the fracture toughness of DGEBA epoxy resin. Copyright © 2009 Society of Chemical Industry     

Phase Separation of Poly(ether sulfone imide) Modified Epoxy Resins

Amine terminated poly(ether sulfone imide) (PESI) with various imide and ethersulfone contents but similar polymer molecular weights were blended with diglycidyletherbisphenol-A (DGEBA) and cured with diaminodiphenylsulfone (DDS). The imide group, a tertiary amine, is a catalyst of the curing reaction of DGEBA with DDS, but it is poorly compatible with uncured epoxy resin. The ethersulfone group is not a catalyst of the curing reaction of DGEBA with DDS, but it has a similar chemical structure as DDS and is compatible with epoxy resin while it is at a low degree of curing. Since PESIs used in this study had similar molecular weights, increasing imide content of PESI would reduce ethersulfone content. The influence of imide and ethersulfone contents of PESI on the phase separation and curing reaction of DGEBA/DDS/PESI blend was investigated using differential scanning calorimetry (DSC), time-resolved light scattering (TRLS), and polarized optical microscopy (POM). Though the imide group has a catalysis effect on the curing reaction of DGEBA with DDS, however, its poor compatibility with epoxy resin retards the curing reaction. Our experimental results revealed the morphology of the cured blends and the curing behavior was a compromise result of catalysis and compatibility of PESI with epoxy resin.     

Novel anion‐exchange organic‐inorganic hybrid membranes prepared through sol‐gel reaction and UV/thermal curing

Anion‐exchange organic‐inorganic hybrid membranes were prepared through sol‐gel reaction and UV/thermal curing of positively charged alkoxysilane and the alkoxysilane containing acrylate or epoxy groups. Properties of prepared hybrid membranes were varied by control of the molar ratio of the precursors. It was shown that the thermal degradation temperatures (T_d) of the membranes were in the range of 212–226°C, water uptakes in the range of 9.6–14.6% and IEC values in the range of 0.9–1.6 mmol g^?1. The hybrid membranes show high permeability to anions, as reflected by the high static transport number (t_?) of the anion (Cl^?). © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008     

Phase separation of poly(ether sulfone imide) modified epoxy resin

Poly(ether sulfone imide)s (PEI) with molecular weight M_n ∼ 10⁴ were synthesized from 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and amine terminated poly(ether sulfone) having molecular weights ranging from M_n ∼ 400 to M_n ∼ 4000. Thus, the PEIs had the same molecular weight but various imide and ether sulfone contents. The PEIs were mixed with a stoichiometric mixture of diglycidyl ether bis-phenol-A (DGEBA)/diamino diphenyl sulfone (DDS). The effect of PEI on the curing reaction of DGEBA/DDS and the morphology of the polymer blend were studied by differential scanning calorimetry (DSC) and optical microscopy. In the DGEBA/DDS/PEI blend with a fixed PEI molecular weight and PEI concentration but with various imide content, the experimental data revealed the PEI with a higher content of ether sulfone had a lower T_g and a better compatibility with solvents and epoxy resins; the curing reaction rate of DGEBA/DDS/PEI was faster for PEI with a higher imide content; the DSC data of cured DGEBA/DDS/PEI showed two T_gs, indicating phase separation between PEI and cured epoxy resins; and the data of optical microscopy showed that the compatibility of PEI with epoxy resins increased with the content of ether sulfone in PEI. © 1996 John Wiley & Sons, Inc.     

Synthesis of a novel phosphorus‐containing dicyclopentadiene novolac hardener and its cured epoxy resin with improved thermal stability and flame retardancy

A novel phosphorus‐containing dicyclopentadiene novolac (DCPD‐DOPO) curing agent for epoxy resins, was prepared from 9,10‐dihydro‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) and n‐butylated dicyclopentadiene phenolic resin (DCPD‐E). The chemical structure of the obtained DCPD‐DOPO was characterized with FTIR, ¹H NMR and ³¹P NMR, and its molecular weight was determined by gel permeation chromatography. The flame retardancy and thermal properties of diglycidyl ether bisphenol A (DGEBA) epoxy resin cured with DCPD‐DOPO or the mixture of DCPD‐DOPO and bisphenol A‐formaldehyde Novolac resin 720 (NPEH720) were studied by limiting oxygen index (LOI), UL 94 vertical test and cone calorimeter (CCT), and differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA), respectively. It is found that the DCPD‐DOPO cured epoxy resin possess a LOI value of 31.6% and achieves the UL 94 V‐0 rating, while its glass transition temperature (T_g) is a bit lower (133 °C). The T_g of epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 increases to 137 °C or above, and the UL 94 V‐0 rating can still be maintained although the LOI decreases slightly. The CCT test results demonstrated that the peak heat release rate and total heat release of the epoxy resin cured by the mixture of DCPD‐DOPO and NPEH720 decrease significantly compared with the values of the epoxy resin cured by NPEH720. Moreover, the curing reaction kinetics of the epoxy resin cured by DCPD‐DOPO, NPEH720 or their mixture was studied by DSC. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44599.     

The boron trifluoride monoethyl amine complex cured epoxy resins

The curing exotherm pattern is affected by the equivalent ratio of curing agent, boron trifluoride monoethylamine complex (BF₃ · MEA), to epoxy resin. The diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) cures more slowly than the diglycidyl ether of bisphenol A (Epon 828). The glass transition temperatures (T_g's) of BF₃ · MEA cured Epon 828 are increased with inceasing concentration of curing agent (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450–0.1350 eq.) cured DGEBF. The activation energies for the thermal decomposition for BF₃ · MEA (0.0450 eq./epoxy eq.) cured Epon 828 and DGEBF are almost equivalent 43 and 44 kcal/mol, respectively. DGEBF when added to DGEBA improves the T_g and char yield with the BF₃ · MEA curing system. The T_g of both resin systems can be increased by longer post cure, whereas the char yield does not appear to change significantly. No ester group formation is found for the BF₃ · MEA-cured DGEBF, although this has been previously reported for the DGEBA system. The BF₃ · MEA cure at 120°C is better than at 140°C because of vaporization and degradation of the curing agent at the higher temperature. The rapid gelation of the epoxy resin may be another reason for the lower degree of cure at high temperature.     

Blends of epoxy resins and polyphenylene oxide as processing aids and toughening agents 2: Curing kinetics,rheology, structure and properties

The curing behaviour, chemorheology, morphology and dynamic mechanical properties of epoxy ? polyphenylene oxide (PPO) blends were investigated over a wide range of compositions. Two bisphenol A based di‐epoxides ? pure and oligomeric DGEBA ? were used and their cure with primary, tertiary and quaternary amines was studied. 4,4′‐methylenebis(3‐chloro‐2,6‐diethylaniline) (MCDEA) showed high levels of cure and gave the highest exotherm peak temperature, and so was chosen for blending studies. Similarly pure DGEBA was selected for blending due to its slower reaction rate because of the absence of accelerating hydroxyl groups. For the PPO:DGEBA340/MCDEA system, the reaction rate was reduced with increasing PPO content due to a dilution effect but the heat of reaction were not significantly affected. The rheological behaviour during cure indicated that phase separation occurred prior to gelation, followed by vitrification. The times for phase separation, gelation and vitrification increased with higher PPO levels due to a reduction in the rate of polymerization. Dynamic mechanical thermal analysis of PPO:DGEBA340/MCDEA clearly showed two glass transitions due to the presence of phase separated regions where the lower T_g corresponded to an epoxy‐rich phase and the higher T_g represented the PPO‐rich phase. SEM observations of the cured PPO:DGEBA340/MCDEA blends revealed PPO particles in an epoxy matrix for blends with 10 wt% PPO, co‐continuous morphology for the blend with 30 wt% PPO and epoxy‐rich particles dispersed in a PPO‐rich matrix for 40wt% and more PPO. © 2014 Society of Chemical Industry     

Synthesis of polysiloxane‐type multifunctional flame retardant and its application in epoxy systems

Polymethyl(3‐glycidyloxypropyl)siloxane (PMGS) was synthesized as a flame‐retardant additive, which were cocured with diglycidyl ether of bisphenol‐A (DGEBA) using 4,4′‐diaminodiphenylsulfone as a curing agent. The structure of PMGS was confirmed through Fourier transform infrared and ¹H‐NMR spectra. The cured products were characterized with dynamic mechanical thermal analysis, thermogravimetric analysis, and oxygen index analyzer. With PMGS incorporated, the cured epoxy resin showed better thermal stability, higher limited oxygen index, and higher char yield. At moderate loading of PMGS, the storage modulus and glass transition temperature of the cured epoxy resin based on neat DGEBA were obviously improved. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Synthesis and characterization of organic/inorganic epoxy nanocomposites from poly(aminopropyl/phenyl)silsesquioxanes

Organic/inorganic epoxy nanocomposites containing diglycidyl ether of bisphenol A (DGEBA), 4‐methylhexahydrophthalic anhydride (MHHPA) and poly(aminopropyl/phenyl) silsesquioxanes (PAPPS) were prepared and characterized. PAPPS were synthesized via fluoride‐catalyzed cage formation from random‐structured poly(phenyl)silsesquioxane (PPS) and 3‐aminopropyltriethoxysilane (APTES) in tetrahydrofuran (THF) using tetrabutylammonium fluoride (TBAF) catalyst containing substantial water. The PPS/APTES stoichiometric ratios were varied. The FTIR, ¹H, solid‐state 29 Si‐NMR studies show that PAPPS probably consists of cages, partial cages, and some linear structures containing phenyl and aminopropyl functional groups. The amine content was determined by back titration and elemental analysis. In comparison with neat epoxy, incorporation of these materials can improve the resultant thermal stabilities, raise glass transition temperatures (T_gs), and reduce coefficients of thermal expansion (CTEs) of epoxy nanocomposites as confirmed by TG/DTA, DMA and TMA tests, respectively. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Organically modified inorganic sol‐gel materials for second‐order nonlinear optics

A series of the organically modified inorganic NLO sol‐gel materials based on the prepolymer of alkoxysilanes and an alkoxysilane dye (ASD) have been investigated. Optically clear samples exhibit large second‐order optical nonlinearity (d₃₃ = ∼10.8–54.0 pm/V at 1064 nm) after poling and curing at 220°C for 1 h. The thermal behavior of these NLO sol‐gel materials was studied by temperature‐dependent dielectric relaxation. The results indicate that the crosslinking density of cured NLO sol‐gel materials was increased with increasing alkoxysilane content. Subsequently, better temporal stabilities were obtained for the poled/cured NLO sol‐gel materials with a higher alkoxysilane content. Moreover, the structural influence of alkoxysilanes on the thermal behavior and second‐order nonlinearity was also studied for these NLO sol‐gel materials. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 79: 1852–1859, 2001     

New epoxy resins. II. The preparation,characterization, and curing of epoxy resins and their copolymers

A polymer having high aromaticity and/or cyclic ring structures in the chain backbone usually gives high heat resistance and flame resistance. Five glycidyl ether-type epoxy resins are prepared from bisphenol A (DGEBA), 9,9-bis(4-hydroxyphenyl)fluorene (DGEBF), 3,6-dihydroxyspiro-[fluorene-9,9′-xanthane] (DGEFX), 10,10-bis(4-hydroxyphenyl) anthrone (DGEA), and 9,9,10,10-tetrakis(4-hydroxyphenyl)anthracene (TGETA) in order to study structure–thermal stability–flame resistance property relationships. In this study, trimethoxyboroxine (TMB) and diaminodiphenylsulfone (DDS) are employed as the curing agents. The char yield at 700°C under a nitrogen atmosphere and the glass transition temperature (T_g) for the uncured resins decrease according to the sequence TGETA > DGEFX > DGEA > DGEBF > DGEBA. The Tg values for these cured epoxy resins are DGEBA < DGEBF < DGEFX < DGEA. A T_g for the TGETA is not obtainable but would be expected to be the highest. The char yields at 700°C of these cured epoxy resins have the same trend as the uncured resins. DGEBF, DGEFX, DGEA, and TGETA added to the DGEBA system show increases in the char yield, T_g, and oxygen index with increasing concentration of these novel epoxy resins.     

The effects of polyamic acid on curing behavior,thermal stability,and mechanical properties of epoxy/DDS system

A thermoplastic modification method was studied for the purpose of improving the toughness and heat resistance and decreasing the curing temperature of the cured epoxy/4, 4′‐diaminodiphenyl sulfone resin system. A polyimide precursor‐polyamic acid (PAA) was used as the modifier which can react with epoxy. The effects of PAA on curing temperature, thermal stability and mechanical properties were investigated. The initial curing temperature (T_i) of the resin with 5 wt % PAA decreased about 50°C. The onset temperature of thermal decomposition and 10 wt %‐weight‐loss temperature for the resin system containing 2 wt % PAA increased about 60°C and 15°C respectively. Besides, the value of impact toughness and plain strain fracture toughness for the modified epoxy resin increased ～ 190% and 55%, respectively. Those changes were attributed to the outstanding thermal and mechanical properties of polyimide, and more importantly to formation of semi‐interpenetrating polymer networks composed by the epoxy network and linear PAA. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Influence of rubber on the curing kinetics of DGEBA epoxy and the effect on the morphology and hardness of the composites

The influence of the end groups of two liquid rubbers on curing kinetics, morphology, and hardness behavior of diglycidyl ether of bisphenol-A based epoxy resin (DGEBA) has been studied. The rubbers are silyl-dihydroxy terminated (PDMS-co-DPS-OH) and silyl-diglycidyl ether terminated (PDMS-DGE). Crosslinking reactions, investigated by shear rheometry, ranged 90–110 °C, using a constant concentration (5 phr) of liquid rubbers and 1,2-Diamino cyclohexane (1,2-DCH) as hardener agent. The gel time, t _gel, of the neat epoxy significantly decreased when adding the elastomers, more so for the silyl-dihydroxy terminated elastomer; at 110 °C the reaction was nearly complete before rheological test started. The results suggest that the elastomers induced a catalytic effect on the curing reaction. Scanning electron microscopy revealed phase separation of the elastomer during the curing reaction with rubber domains about 5 μm size. However, the DGEBA/dihydroxy terminated elastomer composite cured at 110 °C exhibited a homogenous morphology, that is, the rapid reaction time would not allow for phase separation. Water contact angle tests evidenced either more hydrophilic (silyl-diglycidyl ether terminated rubber) or more hydrophobic (silyl-dihydroxy terminated rubber) behavior than the neat epoxy. The latter effect is attributed to the presence of aromatic rings in the backbone structure of PDMS-co-DPS-OH. Microindentation measurements show that the elastomers significantly reduced the hardness of the epoxy resin, the DGEBA/ether terminated composite exhibiting the lowest hardness values. Moreover, hardness increased as reaction temperature did, correlating with a reduction of microdomains size thus enabling the tuning of mechanical properties with reaction temperature.     

Synthesis of rosin‐based flexible anhydride‐type curing agents and properties of the cured epoxy

BACKGROUND: Although rosin acid derivatives have received attention in polymer synthesis in recent years, to the best of our knowledge, they have rarely been employed as epoxy curing agents. The objective of the study reported here was to synthesize rosin‐based flexible anhydride‐type curing agents and demonstrate that the flexibility of a cured epoxy resin can be manipulated by selection of rosin‐based anhydride‐type curing agents with appropriate molecular rigidity/flexibility. RESULTS: Maleopimarate‐terminated low molecular weight polycaprolactones (PCLs) were synthesized and studied as anhydride‐type curing agents for epoxy curing. The chemical structures of the products were confirmed using ¹H NMR spectroscopy and Fourier transform infrared spectroscopy. Mechanical and thermal properties of the cured epoxy resins were studied. The results indicate that both the epoxy/anhydride equivalent ratio and the molecular weight of PCL diol play important roles in the properties of cured resins. CONCLUSION: Rosin‐based anhydride‐terminated polyesters could be used as bio‐based epoxy curing agents. A broad spectrum of mechanical and thermal properties of the cured epoxy resins can be obtained by varying the molecular length of the polyester segment and the epoxy/curing agent ratio. Copyright © 2009 Society of Chemical Industry