微观粘着测试技术研究进展

微构件粘附是造成微机电系统(MEMS)失效的主要原因,也是导致MEMS性能不稳定难以走向市场的关键所在.因此,对于MEMS粘着问题的研究,微观粘着测试技术显得极为重要.综述了国内外微观粘着测试技术的研究进展和现状,介绍了基于应变片、光学检测、电容式传感器、压电式力传感器和分析天平等原理的粘着测试装置,分析了它们的工作原理和特点.     

微机电系统的尺度效应及其影响

评述了MEMS系统中,尺度效应对材料性能、器件的机械特性、流体系统以及摩擦和粘附等方面的影响,微尺度效应是在微机电系统的设计过程必须考虑的问题,也是MEMS产品从实验室走向市场化商品的关键理论基础。     

电热微夹持器的结构设计与数值仿真分析

微型机械电子系统(MEMS)是近年来研究的热点,其中微夹持器的研究受到越来越多的关注.文中采用有限元软件ANSYS时平行梁结构电热微夹持器进行了数值仿真分析,模拟出微夹持器的输出位移、末端刚度、夹持力与响应时间等性能参数随结构尺寸的变化情况,并对仿真的结果进行了讨论.     

范德华力对硅基微悬臂梁抗粘附稳定性的影响

通过在硅微悬臂梁与基底表面上涂覆低表面能的憎水性OTS(CH3(CH2)17SiCl3)膜,以除去接触面间的表面张力;把梁与基底均接地,以除去接触面间的静电力,研究仅有范德华力作用时,硅微悬臂梁结构的抗粘附稳定性.根据两接触面均为粗糙表面的微观实际接触模型,在接触表面产生塑性变形的情况下,计算范德华粘附能大小,并分析表面形貌对其影响,得到粗糙表面接触的微梁抗粘附临界长度.     

基于MEMS粘附问题中关键表面力的分析

粘附是MEMS器件在加工、操作过程中特有的现象,根据微机械中作用力的尺度效应与表面效应,分析表面张力、范得瓦耳斯力、静电力对粘附的影响机理,同时给出了抗粘附的常用的技术方法.     

一种用于MEMS样品测试的六轴微力传感器

本文研制了一种用于MEMS样品测试的六轴微力传感器。首先采用有限元法对特定结构的传感器进行了静力学分析 ,确定了其布片方案 ;然后通过软件实现对传感器输出进行六轴力 /力矩的解耦 ,这大大简化了后置解耦电路的设计并降低了成本 ;最后本文给出了六轴微力传感器的标定曲线 ,证明其可用于MEMS做样品力学特性测试。     

微电子机械系统中典型构件的力电耦合分析及其应用研究

力电耦合是大多数微电子机械系统（尤其是以静电驱动的微机械）的重要特征。文中采用有限元（FEM）结合边界元（BEM）的方法来混合求解MEMS中的力电耦合问题,利用自行研制的程序给出了几种典型构件（平行板、悬臂梁和固支梁）的分析结果,并同其他商业软件（ANSYS和Intelisuite）的计算结果进行了比较。同时,还将这种分析方法应用到微继电器的设计和MEMS构件残余应力的检测中。     

一种基于MEMS技术的红外热探测器研究与设计

为了提高传统探测器的响应度和灵敏度,利用微机电系统(MEMS)的方法设计了一个微梁红外热探测器.对硅基微悬臂梁红外热探测器的工作原理进行了详尽的分析.设计了一个实验平台来测量微悬臂梁的变形,实验结果表明,基于MEMS技术的红外热探测器有良好的性能.     

多晶硅微机械抗粘附结构参数设计

讨论了在大气环境或有液体的环境下，表面张力对微加工悬臂梁结构粘附的影响，以及真空条件下Casimir量子力对微机械薄膜微腔结构的稳定性和粘附的影响。建立了Casimir量子力作用下粘附问题的实际粗糙模型理论。对不同表面力作用下的抗粘附结构研究结果表明，微悬臂梁和薄膜微腔结构的稳定性和粘附与材料的弹性特性，材料的表面特性、结构的长度、厚度以及构件与基本之间的间隙有关，而与结构的宽度无关。给出了抗粘附结构参数设计的对数坐标图。     

复合式MEMS微夹持器的研制

为实现对亚毫米微小构件稳定夹取及可靠释放等操作,研制了一种复合式微夹持器.采用有限元软件分析了微夹持器的机构及动力特性.应用MEMS体硅工艺将静电梳齿驱动与气动吸放集成构成复合式驱动,气动吸放的引入改善了微夹持器的操作性能,S形柔性梁结构的设计将梳齿驱动的直线运动转化成末端夹爪的转动实现了夹持操作.两种不同尺寸的微夹持器,有效扩展了微夹持器的夹持范围.根据微夹持器的操作控制需求,设计了微夹持器静电驱动控制系统以及气压控制系统.在80 V的驱动电压下,微夹持器末端夹爪位移可达25 μm.针对100～200 μm的小球进行了微操作实验,实验结果表明,静电梳齿驱动结合真空吸附能够使夹取操作更加稳定,基于闭环控制的气路正压力能有效克服小球与夹爪之间的粘附力,实现可靠的释放操作.微夹持器基本满足100～200 μm微小构件的操作需求.     

Implementation of a piezoresistive MEMS cantilever for nanoscale force measurement in micro/nano robotic applications

The nanoscale sensing and manipulation have become a challenging issue in micro/nanorobotic applications. In particular, a feedback sensor-based manipulation is necessary for realizing an efficient and reliable handling of particles under uncertain environment in a micro/ nano scale. This paper presents a piezoresistive MEMS cantilever for nanoscale force measurement in microrobotics. A piezoresistive MEMS cantilever enables sensing of gripping and contact forces in nanonewton resolution by measuring changes in the stress-induced electrical resistances. The calibration of a piezoresistive MEMS cantilever is experimentally carried out. In addition, as part of the work on nanomanipulation with a piezoresistive MEMS cantilever, the analysis on the interaction forces between a tip and a material, and the associated manipulation strategies are investigated. Experiments and simulations show that a piezoresistive MEMS cantilever integrated into a microrobotic system can be effectively used in nanoscale force measurements and a sensor-based manipulation.     

基于MEMS技术硅微悬臂梁制作工艺研究

针对非制冷红外热成像中的双材料硅微悬臂梁阵列的结构要求,在MEMS常见加工工艺的基础上,提出了单个硅微悬臂梁的制作工艺路线。工艺中使用高浓度HF溶液释放牺牲层磷硅玻璃（PSG）。探讨了双层材料氮化硅和铝之间的断裂及氮化硅和硅基底之间的粘连问题,对工艺中影响成品率的关键因素残余应力进行了分析。     

Mechanical and dynamic characteristics of double and single beam cantilevers for MEMS manipulation

Micro and millimeter-scaled cantilever beams are commonly used to apply and measure microforce and manipulate micro-objects, biological cells, and tissues. In manipulating micro-objects and actuating micro-devices by cantilever beams, sudden application and release of forces are typical, and subject to static and dynamic modes of operation. Therefore, the cantilever’s mechanical behavior and vibration characteristics are vital since they are also used in force sensors and probes. The dynamic behavior of the double beam cantilever (DBC) in micro and millimeter-scaled is explored by varying the length without changing the stiffness and compared with the single beam cantilever (SBC). The dynamic attributes such as mode shape, natural frequency, resonance, and response under the impulse force and Coulomb friction are evaluated numerically. This study will assist in selecting the appropriate type and length of cantilevers in micro and millimeter-scale to manipulate micro-objects, biological cells and tissues, and use in MEMS sensors.

     

新型集成三维微力检测微夹持器

提出了一种以压阻检测技术为基础,压电陶瓷为微驱动元件,具有两级位移放大且集成三维微力传感器的微夹持器。采用有限元软件对微操持器放大机构和传感器弹性体进行分析,并给出了传感器的标定方法。实验证明,该传感器具有无耦合、测量分辨率高、线性度好、标定简单的优点,满足了预计的设计要求,传感器最大量程为10 mN,X向与Y向的分辨率均为2.4 μN,Z向的分辨率为4.2 μN;同时也验证了所设计的微夹持器的合理性和实用性,当压电陶瓷驱动电压取200 V时,微夹持器的张合量达到最大值274 μm。     

一种单稳态微电磁继电器的研究

优化设计出一种微电磁继电器,介绍了其驱动原理,通过对微电磁继电器的电磁驱动力及活动衔铁的位移进行分析计算,设计了微电磁继电器的三维结构,以增大磁路效率,减小漏磁通,从而增加电磁驱动力。采用MEMS加工工艺,试制了该新型微电磁继电器的样件,其尺寸为5 mm×5 mm×1 mm,它由上磁路、下磁路、平面励磁线圈、固定触点和活动衔铁等部分组成。微电磁继电器的平面励磁线圈电阻约20 Ω,外加5 V电压时,微电磁继电器可实现吸合动作。吸合后,微电磁继电器的导通电阻为14.5 Ω,继电器的响应时间为1 ms。     

基于静电力的可溯源微悬臂梁刚度标定方法

许多研究机构都建立了微纳力值测量系统,并达到了非常高的测量精度。但是,对微纳力值的传递却很少研究。采用无源悬臂梁作为微纳力值传递标准,提出基于静电力原理的"类参考梁法"悬臂梁刚度测量方法。该方法可准确且便捷地测量悬臂梁刚度,并将其溯源至长度、电压、电容等国际单位(SI)。应用类参考梁法,对刚度范围在1.45~91 N/m的悬臂梁刚度进行测试,相对方差均小于0.6%,结果表明,类参考梁法具有很好的稳定性。许多因素将影响测量结果,对导致测量误差的因素进行逐一分析。类参考梁法悬臂梁刚度测量合成不确定度低于5%,表明该方法具有可行性。类参考梁法有效改善了悬臂梁刚度测试的不确定度,在AFM高精度微纳力值测量中具有重要的意义。     

Failure Mechanisms of Capacitive MEMS RF Switch Contacts

Microelectromechanical systems (MEMS) radio frequency (RF) switches hold great promise in a myriad of commercial, aerospace, and military applications. In particular, capacitive type switches with metal-to-dielectric contacts (typically Au- on-silicon nitride) are suitable for high frequency (≥10 GHz) applications. However, there is little fundamental understanding of the factors determining the performance and reliability of these devices. To address this void in understanding, we conducted fundamental studies of Au-on-Si₃N₄ contacts at various bias voltages using a micro/nanoadhesion apparatus as a switch simulator. The experiments were conducted in air at 45% relative humidity. The switch simulator allows us to measure fundamental parameters such as contact force and adhesion, which cannot be directly measured with actual MEMS switches. Adhesion was found to be the primary failure mechanism. Both a mechanical and electrical effect contributed to high adhesion. The mechanical effect is adhesion growth with cycling due to surface smoothening, which allows increased van der Waals interaction. The electrical effect on adhesion is due to electrostatic force associated with excess charge trapped in the dielectric, and was only observed at 40 V bias and above. The two effects are additive, but the electrical effect was not present until surfaces were worn smooth by cycling. Surface smoothening increases the electric field in the dielectric, which leads to trapped charge and higher adhesion. Excessive adhesion can explain decreased lifetime at high bias voltage previously reported with actual capacitive MEMS switches. Aging of open contacts in air was found to reduce adhesion. Surface analysis data show the presence and growth (in air) of an adventitious film containing carbon and oxygen. The adventitious film is responsible for aging related adhesion reduction by increasing surface separation and/or reducing surface energy. No junction growth and force relaxation with time were observed in capacitive switch contacts, as was previously observed with Au–Au contacts at low current in direct current MEMS switches.     

Prototype cantilevers for quantitative lateral force microscopy

Prototype cantilevers are presented that enable quantitative surface force measurements using contact-mode atomic force microscopy (AFM). The "hammerhead" cantilevers facilitate precise optical lever system calibrations for cantilever flexure and torsion, enabling quantifiable adhesion measurements and friction measurements by lateral force microscopy (LFM). Critically, a single hammerhead cantilever of known flexural stiffness and probe length dimension can be used to perform both a system calibration as well as surface force measurements in situ, which greatly increases force measurement precision and accuracy. During LFM calibration mode, a hammerhead cantilever allows an optical lever "torque sensitivity" to be generated for the quantification of LFM friction forces. Precise calibrations were performed on two different AFM instruments, in which torque sensitivity values were specified with sub-percent relative uncertainty. To examine the potential for accurate lateral force measurements using the prototype cantilevers, finite element analysis predicted measurement errors of a few percent or less, which could be reduced via refinement of calibration methodology or cantilever design. The cantilevers are compatible with commercial AFM instrumentation and can be used for other AFM techniques such as contact imaging and dynamic mode measurements.     

Fast on-wafer electrical, mechanical, and electromechanical characterization of piezoresistive cantilever force sensors

Validation of a technological process requires an intensive characterization of the performance of the resulting devices, circuits, or systems. The technology for the fabrication of micro and nanoelectromechanical systems (MEMS and NEMS) is evolving rapidly, with new kind of device concepts for applications like sensing or harvesting are being proposed and demonstrated. However, the characterization tools and methods for these new devices are still not fully developed. Here, we present an on-wafer, highly precise, and rapid characterization method to measure the mechanical, electrical, and electromechanical properties of piezoresistive cantilevers. The setup is based on a combination of probe-card and atomic force microscopy technology, it allows accessing many devices across a wafer and it can be applied to a broad range of MEMS and NEMS. Using this setup we have characterized the performance of multiple submicron thick piezoresistive cantilever force sensors. For the best design we have obtained a force sensitivity Re(F) = 158μV/nN, a noise of 5.8 μV (1 Hz-1 kHz) and a minimum detectable force of 37 pN with a relative standard deviation of σ(r) ≈ 8%. This small value of σ(r), together with a high fabrication yield >95%, validates our fabrication technology. These devices are intended to be used as bio-molecular detectors for the measurement of intermolecular forces between ligand and receptor molecule pairs.     

Large Deformation Analysis and Synthesis of Elastic Closed-loop Mechanism Made of a Certain Spring Wire Described by Free Curves

Recently novel mechanisms with compact size and without many mechanical elements such as bearing are strongly required for medical devices such as surgical operation devices. This paper describes analy...