MOMBE法生长重碳掺杂p型GaAs/In_xGa_(1-x)As应变超晶格

,罗晋生,白■淳一,山田巧,野崎真次,高桥清,鹿岛秀夫,德光永辅,小长井诚 中文摘要 本文采用以TMG、固体In和固体As作为分子束源的MOMBE法,首次成功地生长了空穴浓度高达1×10~(20)/cm~3数量级的重碳掺杂p型GaAs/In_xGa_(1-x)As(x=0.3)应变超晶格(SLS)结构,用XRD、Raman、PL和Hall测量等方法分析了样品特性,讨论了结构参数对应变弛豫及SLS特性的影响,结果表明,所得样品不仅具有很高的空穴浓度,而且具有较窄的等效禁带宽度,可望用于GaAs系HBT基区的制作。     

基于异变缓冲层与应变层超晶格的InP/GaAs异质外延

利用低压金属有机化学气相沉积技术, 开展InP/GaAs异质外延实验。由450 ℃生长的低温GaAs层与超薄低温InP层组成双异变缓冲层, 并进一步在正常InP外延层中插入In1-xGaxP/InP(x=7.4%)应变层超晶格。在不同低温GaAs缓冲层厚度、应变层超晶格插入位置及应变层超晶格周期数等条件下, 详细比较了InP外延层(004)晶面的X射线衍射谱, 还尝试插入双应变层超晶格。实验中, 1.2 μm和2.5 μm厚InP外延层的ω扫描曲线半峰全宽仅370 arcsec和219 arcsec; 在2.5 μm厚InP层上生长了10周期In0.53Ga0.47As/InP 多量子阱, 室温PL谱峰值波长位于1625 nm, 半峰全宽为60 meV。实验结果表明, 该异质外延方案有可能成为实现InP-GaAs单片光电子集成的一种有效途径。     

InGaAs／GaAs自组织量子点光致发光特性研究

用PL谱测试研究了GaAs和不同In组份InxGa1-xAs(x=0.1,0.2,0.3)覆盖层对分子外延生长的InAs/GaAs自组织量子点发光特性的影响,用InxGa1-xAs外延层覆盖InAs/GaAs量子点,比用GaAs做 其发光峰能量向低有端移动,发光峰半高度变窄,量子点发光峰能量随温度的红移幅度较小,理论计算证实这是由于覆盖层InxGa1-xAs减小了InAs表面应力导致发光峰红移,而In元素有效抑制了InAs/GaAs界面组份的混杂,量子点的均匀性得到改善,PL谱半高宽变窄,用InGaAs覆盖的In0.5Ga0.5As/GaAs自组织量子点实现了1．3μm发光,室温下PL谱半高宽为19．2meV,是目前最好的实验结果。     

MBE In_xGa_(1-x)As/GaAs(001)系统晶格失配的研究

本文利用X射线双晶衍射和电子探针显微分析方法,研究了MBE In_xGa_(1-x)As/GaAs(001)系统的晶格失配与In含量x值的关系.在外延层厚度t_(?)～2μm的情况下,获得范性应变临界组份x_c=0.114.当xx_c时,外延层出现范性形变.     

碳掺杂In_xGa_(1-x)As的MOMBE生长与特性

本文研究了以TMG、固体In和固体As作为分子束源的碳掺杂In_xGa_(1-x)As(x=0-0.98)的MOMBE生长与特性,发现衬底温度和In分子束强度对样品的生长速率、In组分含量x及载流子浓度具有强烈影响。在x=0-0.8的范围内空穴浓度随x的增大而减小,当x>0.8时导电类型转变为n型。探讨了MOMBE法生长In_xGa_(1-x)As的掺碳机理及其对载流子浓度和导电类型的影响,并用X射线衍射(XRD)和光致发光谱(PL)等方法分析了外延层质量。     

利用GaAs基上InGaAs应变层制备有序排列的InAs量子点

在GaAs基In x Ga1-xAs( x =0.15)应变层上生长了InAs 量子点(QD)层,通过分析各层之间的应力状况和位错的演变过程,配合生长过程中对反射式高能电子衍射仪(RHEED)实时监测,并观察生长后的表面形貌,发现可以通过控制应变层厚度来控制应变层表面布纹结构的宽度,而且在应变层厚度低于位错增殖的临界厚度时布纹宽度较窄.如果同时控制QD层在刚刚出点,则QD主要沿着较窄的布纹结构排列,从而得到有序排列的QD.     

二维MoS2(1-x)Se2x特性及其光电晶体管性能

表征了 MoS2(1-x)Se2x样品的Raman光谱和光致发光(PL)谱性质,验证了 MoS2(1-x)Se2x基于组分和厚度的带隙可调特性,并基于Raman光谱分析了单层及多层样品由于引入Se原子引起的结构变化及光谱特性.此外,受益于单层材料的直接带隙的电子结构,在405 nm激光波长、112.1 μW/cm2功率...     

基于InP衬底的晶格失配In0.68Ga0.32As的MOCVD生长及其特性研究

采用MOCVD生长技术在InP衬底上成功实现了晶格失配的3μm In0.68 Ga0.32As薄膜生长.通过As组分的改变,利用张应变和压应变交替补偿的InAsxP1-x应变缓冲层结构来释放由于晶格失配所产生的应力,在InP衬底上得到了与In0.68Ga0.32 As晶格匹配的InAsxP1-x“虚拟”衬底,通过对缓冲层厚度的优化,使应力能够在“虚拟”衬底上完全豫弛.通过原子力显微镜(AFM)、高分辨XRD、透射电镜(TEM)和光致发光(PL)等测试分析表明,这种释放应力的方法能够有效提高In0.68 Ga0.32 As外延层的晶体质量.     

Raman谱研究不同缓冲层结构对Si_(1-x)Ge_x应力弛豫的影响

应用 Raman散射谱研究超高真空化学气相淀积 ( UHV/CVD)生长的不同结构缓冲层对恒定组分上表层 Si1- x Gex 层应力弛豫的影响 .Raman散射的峰位不仅与 Ge组分有关 ,而且与其中的应力状态有关 .在完全应变和完全弛豫的情况下 ,Si1- x Gex 层中的 Si- Si振动模式相对于衬底的偏移都与 Ge组分成线性关系 .根据实测的 Raman峰位 ,估算了应力弛豫 .结果表明 :对组分渐变缓冲层结构而言 ,超晶格缓冲层中界面间应力更大 ,把位错弯曲成一个封闭的环 ,既减少了表面位错密度 ,很大程度上又释放了应力     

高应变In_xGa_(1-x)As薄膜的结晶质量及光学特性

通过分子束外延(MBE)生长技术,在GaAs(100)基片上生长出单晶In_xGa_(1-x)As薄膜,利用反射高能电子衍射仪(RHEED)实时监控薄膜生长情况。对In_xGa_(1-x)As薄膜进行了X射线衍射(XRD)测试,结果显示该薄膜为高质量薄膜,且In组分(原子数分数)为0.51。光致发光(PL)光谱测试结果表明,室温下发光峰位约为1.55μm;由于In_xGa_(1-x)As薄膜中存在压应变,光谱峰位出现蓝移。Raman光谱显示GaAs-like横向光学声子(TO)模式的峰出现了明显展宽,验证了In_xGa_(1-x)As薄膜中存在应变。     

Metal-organic vapor-phase epitaxy growth and characterization of thick (100) CdTe layers on (100) GaAs and (100) GaAs/Si substrates

The growth characteristics and crystalline quality of thick (100) CdTe-epitaxial layers grown on (100) GaAs and (100) GaAs/Si substrates in a metal-organic vapor-phase epitaxy (MOVPE) system for possible applications in x-ray imaging detectors were investigated. High-crystalline-quality epitaxial layers of thickness greater than 100 μm could be readily obtained on both types of substrates. The full width at half maximum (FWHM) values of the x-ray double-crystal rocking curve (DCRC) decreased rapidly with increasing layer thickness, and remained around 50–70 arcsec for layers thicker than 30 μm on both types of substrates. Photoluminescence (PL) measurement showed high-intensity excitonic emission with very small defect-related peaks from both types of epilayers. Stress analysis carried out by performing PL as a function of layer thickness showed the layers were strained and a small amount of residual stress, compressive in CdTe/GaAs and tensile in CdTe/GaAs/Si, remained even in the thick layers. Furthermore, the resistivity of the layers on the GaAs substrate was found to be lower than that of layers on GaAs/Si possibly because of the difference of the activation of incorporated impurity from the substrates because of the different kinds of stress existing on them. A heterojunction diode was then fabricated by growing a CdTe epilayer on an n⁺-GaAs substrate, which exhibited a good rectification property with a low value of reverse-bias leakage current even at high applied biases.     

Growth and optical characterization of strained CdZnTe/ CdTe quantum wells

We have grown strained Cd_1-xZn_xTe(x ≈ 0.2)/CdTe single and multiple quantum wells by molecular beam epitaxy. GaAs was used as a substrate. The well widths were systematically increased until the critical thickness was exceeded. Low-temperature (liquid helium) photoluminescence (PL) spectroscopy was used to characterize the films. Two prominent PL peaks were observed: one arising from the quantum well and the other from the barrier material. The energy of the quantum well luminescence is consistent with theory when strain is included. The critical layer thickness for the CdTe quantum wells was found to be between 150 and 175 å, in agreement with the model of Matthews and Blakeslee.     

Raman scattering in (111) strained heterostructures

III–V based strained heterostructures grown along [hhk] directions are considered. The proportionality coefficients between the in-plane strain and the shift in the TO and LO phonon frequencies have been calculated from the elastic constants and phonon deformation potentials. GaAs/GaP (111) and GaAs/InP (111) systems, where the GaAs epitaxial layers are in compressive or tensile strain, respectively, have been grown by MOVPE at different times on A and B substrates and investigated by Raman scattering. The corresponding red or blue shifts of the frequencies of the LO and TO phonons are measured and the residual strain parallel to the interface is estimated. The Raman results are discussed on the basis of the morphology of the epilayer investigated by atomic force microscopy.     

Influence of the cap layer thickness on photoluminescence properties in strained InGaAs/GaAs single quantum wells

The influence of the GaAs cap layer thickness on the luminescence properties in strained In_0.20Ga_0.80As/GaAs single quantum well (SQW) structures has been investigated using temperature-dependent photoluminescence (PL) spectroscopy. The luminescence peak is shifted to lower energy as the GaAs cap layer thickness decreases, which demonstrates the effect of the GaAs cap layer thickness on the strain of InGaAs/GaAs single quantum wells (SQW). We find the PL quenching mechanism is the thermal activation of electron hole pairs from the wells into the GaAs cap layer for the samples with thicker GaAs cap layer, while in sample with thinner GaAs cap layer exciton trapping on misfit dislocations is dominated.     

Si衬底上MBE长成的GaAs中剩余应力起源的研究(英文)

<正> High qualities of GaAs layers directly grown on Si substrates have been obtained by MBE. The residual stress in those MBE grown GaAs layers on     

Photoluminescence line width of self-assembled Ge(Si) islands arranged between strained Si layers

The effect of variations in the strained Si layer thicknesses, measurement temperature, and optical excitation power on the width of the photoluminescence line produced by self-assembled Ge(Si) nanoislands, which are grown on relaxed SiGe/Si(001) buffer layers and arranged between strained Si layers, is studied. It is shown that the width of the photoluminescence line related to the Ge(Si) islands can be decreased or increased by varying the thickness of strained Si layers lying above and under the islands. A decrease in the width of the photoluminescence line of the Ge(Si) islands to widths comparable with the width of the photoluminescence line of quantum dot (QD) structures based on direct-gap InAs/GaAs semiconductors is attained with consideration of diffusive smearing of the strained Si layer lying above the islands.     

Molecular beam epitaxy growth and characterization of InGaP/InGaAspseudomorphic high electron mobility transistors (HEMTs) having achannel layer over critical layer thickness

In_0.5Ga_0.5P/In_xGa_1-xAs (x=0.33 and 0.40), pseudomorphic high electron mobility transistors (p-HEMTs) having a channel layer over the critical layer thickness were grown on patterned and nonpatterned GaAs substrates by using a compound-source molecular beam epitaxy (MBE). Characteristics of the highly strained InGaP/In_xGa_1-xAs (x=0.33 and 0.40) p-HEMTs grown on patterned substrates were compared with those of conventional InGaP/In_0.22Ga_0.78As p-HEMTs grown on a nonpatterned substrate. The highly strained InGaP/In_0.33Ga _0.67As p-HEMT showed substantial improvements in device performances including DC (drain saturation current and transconductance), microwave (f_T and f_max), low-frequency noise (Hooge parameter), and high-frequency noise (minimum noise figure and associated gain) characteristics compared with those of the conventional InGaP/In_0.22Ga_0.78As p-HEMT. The improvements in device performances of the highly strained InGaP/In_0.33Ga_0.67As p-HEMT are attributed to the improved transport property of the high-quality highly strained In_0.33Ga_0.67As channel layer achieved by the use of the patterned substrate growth. The results indicate the potential of highly strained InGaP/In_xGa_1-xAs p-HEMTs having a channel layer in excess of the critical layer thickness grown on patterned GaAs substrates for use in high-performance microwave device applications     

Strain effects in CdTe (111) epitaxial layers grown on GaAs (100) substrates by molecular beam epitaxy

Spectroscopic ellipsometry and photoreflectance measurements on CdTe/GaAs strained heterostructures grown by moleculclr beam epitaxy were carried out to investigate the effect of the strain and the dependence of the lattice parameter on the CdTe epitaxial layer thicknesses. Compressive strains exist in CdTe layers thinner than 2 μm. As the strain increases, the value of the critical-point energy shift increases linearly. These results indicate that the strains in the CdTe layers grown on GaAs substrates are strongly dependent on the CdTe layer thickness. Author to whom all correspondence should be addressed.     

利用GaAs基上InGaAs应变层制备有序排列的InAs量子点

在GaAs基InxGa1-xAs(x=0.15)应变层上生长了InAs量子点(QD)层,通过分析各层之间的应力状况和位错的演变过程,配合生长过程中对反射式高能电子衍射仪(RHEED)实时监测,并观察生长后的表面形貌,发现可以通过控制应变层厚度来控制应变层表面布纹结构的宽度,而且在应变层厚度低于位错增殖的临界厚度时布纹宽度较窄.如果同时控制QD层在刚刚出点,则QD主要沿着较窄的布纹结构排列,从而得到有序排列的QD     

Transverse optical phonon splitting in GaAs/AlAs superlattices grown on the GaAs(311) surface studied by the method of Raman light scattering

GaAs_n/AlAs_m superlattices grown on the GaAs (311)A and (311)B surfaces by molecular-beam epitaxy were studied by Raman light scattering. The form of the Raman scattering tensor allowed the TO _y and TO _x modes to be separately observed using various scattering geometries (the y and x axes correspond to atomic displacements along and across facets formed on the (311)A surface, respectively). The TO1_y and TO1_x modes exhibited splitting in superlattices grown on a faceted GaAs(311)A surface. The degree of splitting increased for superlattices with an average GaAs layer thickness of 6 monoatomic layers and less. No splitting was observed for superlattices grown under the same conditions on the (311)B surface, which indicates that the splitting effect is probably due to the formation of GaAs quantum wires on the faceted (311)A surface.