A model of work of adhesion for reactive metal/ceramic systems

A simple model to estimate the work of adhesion in reactive metal/ceramic systems was developed based on the basic physicochemical principle. The work of adhesion in this model is composed of two terms. One is the Gibbs free energy change per unit area released by the reaction between the surface phases of the metal and the substrate ceramic. The other is the contribution of the work of adhesion for the metal on the initial substrate or on the reaction product formed during reaction. The present model is generally valid for not only the systems with a new phase formed at the interface, but also the ones with localized chemical bonds at the interface, and can unravel some confusion in the literature.     

反应等离子喷涂制备原位TiC颗粒增强Fe基金属陶瓷涂层

以钛铁粉、铁粉和蔗糖(碳的前驱体)为原料,采用前驱体热分解复合技术制备了Fe-Ti-C系反应热喷涂粉末,并通过普通等离子喷涂技术原位合成并沉积了TiC/Fe金属陶瓷复合涂层.利用XRD、SEM和EDS研究了喷涂粉末和复合涂层的相组成和显微结构.结果表明:前驱体热分解复合技术制备的Fe-Ti-C反应喷涂粉末粒径均匀,原料粉末颗粒间的结合强度高;所制备的TiC/Fe复合涂层主要由不同含量TiC颗粒分布于金属Fe基体内部而形成的复合片层叠加而成;TiC颗粒大致呈球形,粒径呈纳米级;TiC理论质量分数53%的TiC/Fe金属陶瓷涂层的耐磨粒磨损性能较好,SRV磨损实验中涂层的磨损面积为基体(45钢)的1/25左右.     

Wettability of SnCuNi-xEu solders and mechanical properties of solder joints

Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of Sn Cu Ni-x Eu, and the optimal content was 0.039%.For Sn Cu Ni-0.039 Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for Sn Cu Ni and mixture fracture for Sn Cu Ni-0.039 Eu could be demonstrated.And thermal fatigue behavior of Sn Cu Ni solder joints could be enhanced obviously with the 0.039%Eu addition.     

Cyclic fatigue-crack propagation along ceramic/metal interfaces

The integrity of ceramic/metal joints is investigated under mechanically applied cyclic stresses using double-cantilever-beam, and compact-tension, sandwich test specimens. Specifically, fatigue-crack propagation rates for interfacial cracks are characterized over a range of velocities from 10⁻⁹ to 10⁻⁴m/s for glass/copper and alumina/aluminum-alloy interfaces tested in moist air. Compared to corresponding (stress-corrosion) results under sustained loading, it is found that true interfacial cracks in glass-copper joints are significantly accelerated under cyclic loads. In addition, crack extension force (G) thresholds for interfacial crack growth under cyclic loads are some 46% lower than under sustained loads and are typically over six times lower than the interface toughness (G_c). For the alumina/aluminum-alloy system, conversely, fracture never occurs in the interface; under monotonic loading cracking progresses near the interface in the ceramic layer whereas under cyclic loading failure may occur either in the ceramic or in the metal. Based on a comparison with fatigue-crack growth data in bulk alumina and bulk aluminum alloys, it is found that near interfacial crack-growth rates in the metal are much lower than those of the bulk ceramic and show a far higher dependency on the range of G than behavior in the bulk metal.     

Cracking and damage mechanisms in ceramic/metal multilayers

Investigations of cracking in multilayered ceramic/metal composites are presented. Two aspects are considered: crack renucleation across intact single metal layers and subsequent crack extension. Crack renucleation criteria are determined and compared with predictions. High-resolution strain-mapping techniques are employed to determine the surface strain fields surrounding cracks. Good agreement is found between these experimental measurements and the predictions of a small-scale yielding model. Subsequent crack progression occurs either by the extension of a dominant, nearly planar crack or by the formation of a zone of periodically spaced cracks. Both patterns are analyzed. The dominant cracking behavior is found to depend on the volume fraction and yield strength of the metal.     

The strength and fracture of metal/ceramic bonds

The fracture strength of ceramics bonded with metals is limited by the presence of stress concentrations that arise around the bond, especially near edges. Yet, in some cases, fracture can be induced to occur in the ceramic away from the bond. Analysis of the combined effect of elastic mismatch, plasticity and thermal expansion misfit is presented in this paper, to provide understanding of the trends in bond strength. Important influences of plastic relaxation and thermal expansion misfit are identified and some general fracture characteristics are described.     

The fracture resistance of a model metal/ceramic interface

Crack propagation has been measured for the Al₂O₃/Au interface subject to conditions that exclude stress corrosion. Crack growth has been shown to occur with a rising resistance, governed by intact metal ligaments in the crack wake. The level of resistance also increases as the metal layer thickness increases. Crack extension occurs by a combination of plastic void growth and interface debonding. The fracture energies are much larger than the work of adhesion, but appreciably smaller than those expected for ductile interface fracture. The fracture energy is nevertheless dominated by plastic dissipation, which increases at larger metal layer thicknesses.     

The role of metal plasticity and interfacial strength in the cracking of metal/ceramic laminates

Two models based on elastic-plastic fracture mechanics and fiber bridging are developed to study the role of plastic yielding in metals and the interfacial strength of metal/ceramic laminates. There are two types of damage observed in metal/ceramic laminates: multiple cracking and macroscopic crack propagation. The former occurs around the macroscopic crack tip and thus distributes the damage and enhances the composite's toughness. The present models establish that there exists a critical metal/ceramic layer thickness ratio above which multiple cracking dominates and that this ratio decreases (hence increasing the possibility of multiple cracking) as the ratios of metal yield stress over ceramic strength, metal modulus over ceramic modulus, and metal/ceramic interfacial strength over ceramic strength increase. Good agreement between the present models and experimental results is observed for both damage modes, i.e. multiple cracking vs macroscopic crack propagation, and for critical stress intensity factors. The elastic-plastic fracture mechanics and fiber-bridging models predict that multiple cracking is ensured if the metal layer thickness is 2.5 times larger than the ceramic layer thickness, regardless of the metal/ceramic properties.     

Models for plastic constraint in brazed or diffusion-bonded joints between ceramic components

Slip line field theory and the upper bound theorem are used to analyze the problem of two monolithic ceramic components bonded by a ductile metal interlayer. The presence of even a small fraction of debonded region is shown to have a significant effect on the performance of the joint. The required integrity and dimensions of the interlayer material are then found, to obtain a particular load-carrying capacity.     

碘量法测定锡基轴承合金中铜的改进

叙述了在主体锡、锑金属离子存在下 ,以盐酸为介质 ,用酒石酸掩蔽锡 (Ⅳ )、锑 (Ⅴ ) ,使之形成稳定的络合物 ,并在醋酸介质中进行碘量滴定分析。手续简便 ,结果准确 ,节省试剂 ,提高工效。本法已应用于锡基轴承合金、巴氏合金及含有锡或锑的粗铜中铜的测定 ,效果良好。     

SiC陶瓷与Ni基高温合金连接件应力的有限元分析

陶瓷与金属连接具有重要的工程应用背景,然而却面临诸多技术难关,连接件的热应力缓解便是其中之一。本文作者采用弹性有限元方法,对采用不同材料作为中间层得到的实际连接尺寸的SiC陶瓷与Ni基高温合金连接件的应力进行计算,并结合各种材料的塑性对连接件的应力进行定性分析。计算结果表明,SiC陶瓷与Ni基高温合金直接连接产生的热应力很大。最大轴向拉应力位于陶瓷近缝区,导致连接件强度偏低或断裂。采用功能梯度中间层或软金属中间层能在一定程度上缓解热应力;硬金属中间层虽然不能缓解应力,但能改善应力分布状态,使最大轴向拉应力迁移出比较薄弱的陶瓷一侧,有利于连接强度的提高;采用软、硬金属复合中间层具有较好的缓解应力和改善应力分布的效果,但却较多地增加了连接件的界面,有可能导致负面效应,在实际工程应用中需要根据具体情况,权衡利弊,综合考虑。     

锂离子电池锡基负极材料研究进展

介绍了锂离子电池锡基负极材料的研究进展。重点介绍了锡基负极材料的合成方法、电极反应机理及其电化学性能。指出锡基负极材料由于其高的可逆容量，若能克服目前存在的问题，将有望成为新一代锂离子电池负极材料。     

Stress relaxation and bonding in Si3N4/MA6000 joints by reactive interlayers

Diffusion bonding of Si₃N₄ to the new generation of ODS-superalloys, such as MA6000, may yield strongly joined metal-ceramic systems for high temperature applications. Si₃N₄ has been diffusion bonded to MA6000 during HIP at 100 MPa at 1100-1300°C. Stresses caused by the large thermal mismatch were reduced by multiphase interlayers. To promote the chemical adhesion, reactive and adhesive interlayers were used at the metal-ceramic interface which in the absence of such layers fail at low stresses. It has been shown that during reactive bonding brittle phases are frequently formed at the interfaces which may lead to a failure of the joint. The reduce of thermal stresses by thin soft interlayers is very limited but can be obtained by a microcrack induced stress relaxation mechanism. During adhesive diffusion bonding the mechanical strength of the bond is limited by the stress state and the strength of the ceramic component.