碳化硅颗粒增强铝基复合材料的无压浸透反应机理探讨

为探讨SiCp/Al基复合材料无压浸渗反应机理,利用XPS鉴定了SiC预制体浸渗前沿界面上的反应产物结构.采用HRTEM研究了SiCp/Al基复合材料的界面结构.结果表明,浸渗与未浸渗部分之间的界面上存在MgO.Al2O3和ZnO诸化合物,没有发现氮的化合物.在SiC相与铝相的界面上仅存在MgAl2O4相,MgAl2O4相几乎连续地包敷在SiC颗粒上.这表明,高温下SiC与熔Al合金接触后,SiC颗粒表面上的SiO2与Al,Mg,Zn诸元素发生了放热反应,从而降低了表面张力,提高了湿润性.促进了自发浸渗.     

碳化硅颗粒增强铝基复合材料的无压浸渗反应机理探讨

为探讨SiCp/Al复合材料无压浸渗反应机理,利用XPS鉴定了SiC预制体浸渗前沿界面上的反应产物结构,采用HRTEM研究了SiCp/Al基复合材料的界面结构。结果表明,浸渗与未浸渗部分之间的界面上存在MgO,Al2O3和ZnO诸化合物,没有发现氮的化合物,在SiC相与铝相的界面上仅存在MgAl2O4相,MgAl2O4相几乎连续地包敷在SiC颗粒上,这表明,高温下SiC与熔Al合金接触后,SiC颗粒表面上的SiO2与Al,Mg,Zn诸元素发生了放热反应,从而降低了表面张力,提高了湿润性,促进了自发浸渗。     

无压浸渗法制备氧化态SiC颗粒增强铝基复合材料

研究了SiC颗粒在1000~1200℃的氧化行为, 其氧化增重率与保温时间符合抛物线规律, 氧化增重受扩散过程控制, 氧化激活能为219 kJ/mol. 采用预氧化处理的SiC颗粒为增强体, 含Si、Mg的铝合金为基体, 通过无压浸渗方法制备了SiC_p/Al复合材料, 分析了复合材料的微观组织与界面形貌, 探讨了无压浸渗机理. 复合材料中颗粒分布均匀, 无偏聚现象. 材料制备过程中存在界面反应, SiC颗粒表面的氧化层与铝合金中的Mg、Al反应形成了一定数量的MgAl₂O₄. 界面反应的存在提高了润湿性, 促进了无压自发浸渗.     

无压渗透法制备SiCp/Al复合材料工艺优化研究

无压渗透法是制备SiCp/Al复合材料的重要技术.应用实验方法系统地研究了无压渗透法的工艺参数和添加元素对制备工艺的影响.结果表明,在无压渗透法制备SiCp/Al复合材料的工艺过程中,浸渗温度是浸渗过程顺利进行的重要因素,900℃的浸渗温度为最佳浸渗温度.适量加入Mg元素能提高熔融金属Al和增强体SiC颗粒之间的浸润性,获得结合强度好、孔洞和疏松较少的SiCp/Al复合材料,Mg元素的最佳含量约为1.2%(质量分数).适量添加Si元素能增强熔融铝液的流动性,降低SiC颗粒与Al液间的表面张力,改善其润湿性.     

Al合金无压熔渗多孔SiC预成形坯体的组织变化及机理EI北大核心

高体积分数SiCp/Al复合材料可以通过Al合金无压熔渗SiC多孔预成形坯体实现其近净形成形。本文通过观察无压熔渗过程中相关的显微组织变化,研究Al合金在SiC多孔坯体中的熔渗行为及机理。研究结果表明:实现Al合金对SiC预成形坯无压自发熔渗的关键是合金中必须存在Mg元素,并且须在氮气氛中进行;正是利用合金中Mg与氮气氛的相互反应在SiC颗粒的表面生成Mg3N2,并通过Mg3N2与Al的反应帮助Al合金顺利熔渗到SiC孔隙中去。     

网状结构Si3N4陶瓷增强金属基复合材料的研究

利用有机前驱体浸渍法制备了Si3N4网络陶瓷预制体,利用液态金属浸渗法制备出Al基、Mg基复合材料.分析了在浸渗过程中浸渗温度、润湿角、浸渗时间、浸渗高度的相互关系.在压力下金属液克服浸渗阻力,使浸渗得以完成.网络陶瓷骨架孔筋表面覆盖一层氧化膜有利于自发浸渗的进行.合金中适量镁元素的存在使界面上发生轻微化学放热反应,对浸渗有利.指出压力浸渗制备铝基复合材料与无压浸渗制备镁基复合材料的特点.探讨了这种复合材料抗压强度和摩擦磨损性能特点.指出Si3N4/Al复合材料,Si3N4/Mg复合材料抗磨擦性能明显优于基体,抗拉强度大大高于基体.     

高导热金属基复合材料的热物理性能

分别采用无压浸渗、气压浸渗、内氧化技术制备了高导热Al/SiC、Al/C、Cu/Al2O3复合材料.研究了增强相和界面对这三种复合材料的热导率和热膨胀系数的影响,并对这些性能进行了理论分析和数值模拟.当颗粒尺寸与界面层厚度之比固定时,颗粒尺寸对Al/SiC复合材料热导率影响很小,但界面热导率对其影响很大;Al/SiC复合材料的CTE随温度的升高而增加,随SiO2层厚度的增加而减小;碳纤维中混杂3%SiC颗粒有利于改善纤维的分布,降低Al/C复合材料的缺陷,并提高其热导率;压力加工增加了Cu/Al2O3的致密度,也提高了其热导率;可用Schapery和Kerner模型计算复合材料的热膨胀系数,用Hasselman-Johnson模型计算热导率.     

熔体浸渗法制备镁/氧化铝复合材料

采用熔体浸渗法制备了Mg/Al2O3复合材料,利用X射线衍射、扫描电镜、金相显微镜等测试手段对其微观组织结构和力学性能进行了表征,并对试样断裂韧性和耐磨性进行了研究.结果表明:熔体浸渗法制备的Mg/Al2O3复合材料具有双连续相网络结构,且界面结合良好;随着Mg含量的减少,复合材料断裂韧性降低、耐磨性大幅度提高.     

无压浸渗制备的SiC/Al复合材料的微观组织研究

利用SRD,OM,SEM,TEM等微观结构分析手段,对无压浸渗制备的SiCp/Al复合材料的微观结构进行了研究。结果表明,SiCp/Al复合材料中存在SiC,Al,MgAl2O4,Si和Mgi2Si诸相。在组织中没有粗大的铝硅共晶体针条,铝基体被众多SiC颗粒分割,成为细小的连续的空间网络。在铝基体中分布着Si相及Mg2Si相。透射电子显微镜高分辨像表明,在SiC与铝合金的界面上存在镁铝尖晶石（MgAl2O4）相,没有出现Al4C3相。     

高体分SiCp/Mg复合材料真空气压浸渗工艺及其热膨胀性能

采用真空气压浸渗法制备了高体分小尺寸SiCp/Mg复合材料,研究了真空压力对小尺寸SiCp多孔体浸渗的影响规律及SiCp/Mg复合材料的热膨胀性能.实验表明,在浸渗温度为983K,压力0.3MPa,保压5min的条件下,其中,能有效浸渗的振实堆积的单一尺寸SiCp多孔体的最小粒径达到了13μm;而32μm的SiCp/Mg复合材料的密度为2.625g/cm3,SiC颗粒体积分数达到了58.2%.OM、XRD分析表明镁液渗透均匀,无明显的气孔、缩松和熔剂夹杂等铸造缺陷;Mg基体、α型SiC是复合材料的主要组成相,同时还含有少量的MgO、Mg2Si相.此外,32μm SiCp/Mg复合材料在30～200℃温度范围内的平均热膨胀系数为6.5×10-6/K,表现出了优异的热膨胀性能.     

无压浸渗制备SiC/Al电子封装材料的结构与性能

将粒度为F280的SiC颗粒振实后直接无压浸渗液态AlSi12Mg8铝合金,制备出高SiC含量的铝基复合材料,并对其结构和性能进行了研究。结果表明:采用该方法制备的SiC/A1复合材料内部组织结构均匀致密,无明显气孔等缺陷,界面产物主要为Mg₂Si,MgO,MgAl₂O₄;平均密度为2.93 g·cm^-3,抗弯强度在320 MPa以上,热膨胀系数为6.14×10^-6～9.24×10^-6 K^-1,导热系数为173 W·m^-1·K^-1,均满足电子封装材料要求。     

浸渗时间对无压浸渗制备Al/SiCp陶瓷基复合材料的影响

本文采用无压浸渗法,研究浸渗时间对Al/SiCp陶瓷基复合材料组织、致密度、硬度的影响。浸渗保温时间1h,能浸透,但致密度差,硬度低。保温时间3h,发生粉化现象。结果表明浸渗保温时间2h是无压浸渗较好的工艺参数。     

Role of Mg and Mg+Si as external dopants in production of pure Al–SiC metal matrix composites by pressureless infiltration

Abstract

Metal matrix composites have been produced by pressureless infiltration of pure Al into Mg doped SiC preforms after 1 h at 900°C. Aluminium has been found to infiltrate preforms containing between 2 and 14 wt-%Mg, however Al did not infiltrate a preform containing 1 wt-%Mg. Preforms doped with 1 wt-%Mg and Si did result in infiltration. Increasing the Mg content or increasing the Si content in the preform resulted in more extensive infiltration. The effect of Mg and Mg mixed with Si on pressureless infiltration of pure Al, microstructure of MMC as well as mechanical properties are discussed. Although the dopant was uniformly distributed throughout the preform microstructural analysis and hardness measurements indicate that the resultant composite may not be uniform due to infiltration inwards from the edge to the centre of preform.     

无压浸渗法制备不同体积分数及梯度SiCp/Al复合材料

选用不同粒径大小的SiC颗粒,并通过对颗粒分布的有效控制,采用无压浸渗工艺制备了不同体积分数(15%～65%)的SiCp/Al复合材料,并在此基础上试制了梯度SiCp/Al复合材料.运用OM,XRD等手段对所制备的复合材料进行了显微组织观察与成分分析,并对选定体积分数的复合材料进行了密度以及力学测试.研究结果表明,无压浸渗工艺下不同体积分数的SiCp/Al复合材料组织均匀、致密,力学性能良好;具有梯度结构的SiCp/Al复合材料层间结合良好,没有层间剥离现象.     

The production of Al-Mg alloy/SiC metal matrix composites by pressureless infiltration

Metal matrix composites have been produced by pressureless infiltration of Al-Mg alloys into SiC preforms at 900°C under N₂ for different infiltration times. The wettability of the ceramic reinforcement by the Al-Mg alloy is crucial in determining whether an MMC can be produced by pressureless infiltration. Sessile drop results show that Al alloys with Mg contents greater than 8 wt% had a contact angle lower than 90°C after 5 minutes contact time. This was in agreement with the pressureless infiltration results as MMCs have been produced after 30 minutes with these alloys. Sessile drop experiments also show that SiC is similarly wetted by Al-Mg alloys under both N₂ and Ar. It is concluded that the infiltration process does not involve the intermediate nitride phase suggested by other authors.     

Superior high-temperature resistance of aluminium nitride particle-reinforced aluminium compared to silicon carbide or alumina particle-reinforced aluminium

Aluminium-matrix composites containing AlN, SiC or Al₂O₃ particles were fabricated by vacuum infiltration of liquid aluminium into a porous particulate preform under an argon pressure of up to 41 MPa. Al/AlN had similar tensile strengths and higher ductility compared to Al/SiC of similar reinforcement volume fractions at room temperature, but exhibited higher tensile strength arid higher ductility at 300–400 °C and at room temperature after heating at 600 °C for 10–20 days. The ductility of Al/AIN increased with increasing temperature from 22–400 °C, while that of Al/SiC did not change with temperature. At 400 °C, Al/AlN exhibited mainly ductile fracture, whereas Al/SiC exhibited brittle fracture due to particle decohesion. Moreover, Al/AlN exhibited greater resistance to compressive deformation at 525 °C than Al/SiC. The superior high-temperature resistance of Al/AlN is attributed to the lack of a reaction between aluminium and AlN, in contrast to the reaction between aluminium and SiC in Al/SiC. By using Al-20Si-5Mg rather than aluminium as the matrix, the reaction between aluminium and SiC was arrested, resulting in no change in the tensile properties after heating at 500 °C for 20 days. However, the use of Al-20Si-5Mg instead of aluminium as the matrix caused the strength and ductility to decrease by 30% and 70%, respectively, due to the brittleness of Al-20Si-5Mg. Therefore, the use of AIN instead of SiC as the reinforcement is a better way to avoid the filler-matrix reaction. Al/Al₂O₃ had lower room-temperature tensile strength and ductility compared to both Al/AlN and Al/SiC of similar reinforcement volume fractions, both before and after heating at 600 °C for 10–20 days. Al/Al₂O₃ exhibited brittle fracture even at room temperature, due to incomplete infiltration resulting from Al₂O₃ particle clustering.