MOCVD生长不同Al组分AlGaN薄膜

本文研究了利用金属有机物化学汽相淀积系统(MOCVD)生长高质量不同Al组分AlxGa1-xN薄膜(0.13相似文献   

MOCVD生长不同Al组分AlGaN薄膜

本文研究了利用金属有机物化学汽相淀积系统(MOCVD)生长高质量不同Al组分AlxGa1-xN薄膜(0.13＜x＜0.8).扫面电子显微镜(SEM)照片表明生长的AlN插入层有效地调节了AlGaN层与GaN支撑层的应力,使AlGaN表面平整无裂纹,原子力显微镜(AFM)测量得到所有AlGaN薄膜粗糙度均小于1 nm.通过原位干涉谱发现,AlGaN薄膜生长速率主要由Ga流量大小控制,随Al组分升高逐渐降低.利用X射线衍射和卢瑟福背散射(RBS)两种方法确定AlGaN薄膜的Al组分,发现Al组分与摩尔比TMAl/(TMGa+TMAl)关系为线性,说明在优化的生长条件下,Al原子与NH3的寄生反应得到了有效的抑制.     

MOCVD生长不同Al组分AlGaN薄膜

本文研究了利用金属有机物化学汽相淀积系统（MOCVD）生长高质量不同Al组分AlxGa1-xN薄膜（0．13〈x〈0．8）。扫面电子显微镜（SEM）照片表明生长的AlN插入层有效地调节了AlGaN层与GaN支撑层的应力，使AlGaN表面平整无裂纹，原子力显微镜（AFM）测量得到所有AlGaN薄膜粗糙度均小于1nm。通过原位干涉谱发现，AlGaN薄膜生长速率主要由Ga流量大小控制，随Al组分升高逐渐降低。利用X射线衍射和卢瑟福背散射（RBS）两种方法确定AlGaN薄膜的Al组分，发现Al组分与摩尔比TMAl／（TMGa＋TMAl）关系为线性，说明在优化的生长条件下，Al原子与NH3的寄生反应得到了有效的抑制。     

高Al组分AlGaN材料优化生长与组分研究

研究了金属有机化合物化学气相沉积(MOCVD)系统外延高Al组分较厚AlGaN薄膜材料的生长技术。实验发现,AlGaN/GaN结构中的AlGaN材料的相分离现象可能是由于过低的生长V/III以及材料所受的张应力状态所致,而V/III过高时则会出现Al源的并入效率饱和。采用AlN过渡层技术,外延生长了表面无裂纹的45%Al组分较厚(100～200nm)AlGaN薄膜材料。所得材料的Al组分与气相Al组分相同,(0002)面X射线衍射(XRD)双晶摇摆曲线半高宽(FWHM)为376arcsec,并发现AlN过渡层的质量影响着其上AlGaN材料的Al组分与晶体质量。实验观察到AlGaN材料的表面形貌随着样品中Al组分的增加从微坑主导模式逐步转变为微裂主导模式,采用AlN过渡层可延缓这一转变。     

MOCVD系统中AlN生长速率的研究

文章研究了MOCVD系统中影响AlN生长速率的机制。我们通过在位监控曲线控制生长过程,改变了不同的生长条件,得到了AlN生长速率与生长温度、反应室压力、NH3 流量、TMAl流量等生长参数的关系。实验发现,AlN生长速率与生长温度、反应室压力、NH3 流量等参数之间表现出反常的依赖关系。我们认为,MOCVD系统中存在Al原子的寄生反应,导致了反常现象的发生。AlN生长速率与TMAl流量的关系进一步证明了这一点。实验结果表明,较低的生长温度、较小的反应室压力能够有效地提高AlN生长速率,同时也将有利于提高Al2GaN材料中的Al组分。     

基于MOCVD高/低温调制生长AlN模板材料方法

宽禁带半导体紫外光电器件和功率半导体器件的发展对AlN材料和高Al组分AlGaN材料有着迫切的需求.由于缺乏大尺寸AlN同质衬底,基于异质外延生长的AlN模板材料成为了宽禁带半导体器件制造的最佳选择.但是,由于Al原子表面迁移能力较差,AlN外延材料表面易呈现岛状生长模式,导致AlN模板材料的晶体质量和表面质量较差,严...     

Al0.5Ga0.5N/GaN/Al0.5Ga0.5N量子阱中依赖于表面载流子浓度的Rashba自旋劈裂

通过自洽求解薛定谔和泊松方程,计算了不同表面载流子浓度的Al0.5Ga0.5N/GaN/Al0.5Ga0.5N 量子阱中第一子带的Rashba系数和Rashba自旋劈裂。第一子带在费米能级处的Rashba自旋劈裂可观并且随Ns明显增加,因为Rashba系数特别是费米波矢增加很快。随着Ns的增加,第一子带波函数的峰朝着左异质结界面移动,且阱层的平均电场增加,所以来自阱层和异质结界面的这两个主要贡献部分增加。因而,III族氮化物异质结构中的强极化电场和高浓度的二维电子气对α至关重要,使AlGaN/GaN量子阱的Rashba自旋劈裂同窄带隙的III-V族材料可比。结果表明Ns是影响AlGaN/GaN量子阱中的Rashba系数和Rashba自旋劈裂的一个重要参数,表明这种材料可以应用到自旋电子学器件中。     

蓝宝石衬底上AlGaN外延材料的低压MOCVD生长

采用低温AlN成核层在1180℃温度下在(0001)蓝宝石衬底上用低压MOCVD设备生长了AlGaN外延层.Al组分高达0.6、厚度大于1μm的AlGaN外延层表面光亮,晶体质量较好,(0002)X射线衍射回摆曲线半峰宽FWHM为853弧秒.当反应室气压从5×103Pa降到2×103Pa后, AlGaN 外延层的生长速率和固相Al组分都显著提高.     

Mg掺杂的AlGaN的MOCVD生长

文章主要研究利用金属有机物化学汽相沉积(MOCVD)方法制备的Mg掺杂AlGaN薄膜.根据Raman光谱对Mg掺杂AlGaN薄膜应力和X射线摇摆曲线对晶体质量的研究表明引入高温AlN插入层能有效调节应力,并提高薄膜质量,降低位错密度.实验发现在保持Mg掺杂量不变的情况下,随着Al组分的上升,材料中出现大量岛状晶核,粗糙度变大,晶体质量下降,由三维生长向二维生长的转变更加困难.同时研究发现Al组分的上升和Mg掺杂量的增加都会使得螺位错密度上升;Mg的掺杂对于刃位错有显著影响,而Al组分的上升对刃位错无明显影响.经过退火温度对空穴浓度影响的研究,发现对于P型Al0.1Ga0.9N样品,900℃为比较理想的退火温度.     

Mg掺杂的AlGaN的MOCVD生长

文章主要研究利用金属有机物化学汽相沉积(MOCVD)方法制备的Mg掺杂AlGaN薄膜。根据Raman光谱对Mg掺杂AlGaN薄膜应力和X射线摇摆曲线对晶体质量的研究表明引入高温AlN插入层能有效调节应力，并提高薄膜质量，降低位错密度。实验发现在保持Mg掺杂量不变的情况下，随着Al组分的上升，材料中出现大量岛状晶核，粗糙度变大，晶体质量下降，由三维生长向二维生长的转变更加困难。同时研究发现Al组分的上升和Mg掺杂量的增加都会使得螺位错密度上升;Mg的掺杂对于刃位错有显著影响，而Al组分的上升对刃位错无明显影响。经过退火温度对空穴浓度影响的研究，发现对于P型Al0.1Ga0.9N样品，900℃为比较理想的退火温度。     

A study of parasitic reactions between NH3 and TMGa or TMAI

The growth of AlGaN using organometallic vapor phase epitaxy has been studied as a function of reactor pressure in a horizontal reactor. At atmospheric pressure, GaN with growth efficiency comparable to that of GaAs in the same reactor is obtained. In addition, the GaN growth efficiency changes little at different reactor pressures. These results indicate that the parasitic reaction between TMGa and NH₃ is not substantial in the reactor used in this study. On the other hand, A1N growth at atmospheric pressure has not been possible. By lowering the reactor pressure below 250 Torr, A1N deposition is achieved. However, the growth efficiency decreases at higher reactor pressures and higher growth temperatures, indicating that a strong parasitic reaction occurs between TMAI and NH₃. For the ternary AlGaN, lower pressure also leads to more Al incorporation. The results indicate that parasitic reactions are much more severe for TMAI+NH3 than for TMGa+NH₃.     

GaN薄膜表面形貌与AlN成核层生长参数的关系

采用金属有机物化学气相淀积技术生长了以AlN为成核层的GaN薄膜,研究了成核层生长时三甲基铝(TMAl)流量对最终GaN薄膜表面形貌的影响.研究结果表明,高质量GaN薄膜只能在高TMAl流量下获得,采用充足的TMAl源才能形成满足需要的AlN成核点,这是生长高质量GaN薄膜的一个先决条件.     

Vapor pressures of the adducts formed during AlGaN organometallic vapor-phase epitaxy

We have measured the vapor pressure of the adducts of trimethylgallium (TMGa) and trimethylaluminum (TMAl) with ammonia near room temperature. The vapor pressures of the mixtures of the adducts were also measured and found to obey Raoult’s law. Both the gallium and aluminum adduct have a relatively low vapor pressure (410 mtorr and 74 mtorr, respectively, at 19°C), which places limits on the design and operation of AlGaN organometallic vapor-phase epitaxy (OMVPE) reactors. Adduct condensation may also be the explanation for numerous observations of powders and crystals inside OMVPE reactors.     

Characterization of AlGaN/GaN structures on various substrates grown by radio frequency-plasma assisted molecular beam epitaxy

The structural properties and surface morphology of AlGaN/GaN structures grown on LiGaO₂ (LGO), sapphire, and hydride vapor phase epitaxy (HVPE)-grown GaN templates are compared. AlGaN grown on LGO substrates shows the narrowest x-ray full width at half maximum (FWHM) for both symmetric 〈00.4〉 and asymmetric 〈10.5〉 reflections. Atomic force microscopy (AFM) analysis on AlGaN surfaces on LGO substrates also show the smoothest morphology as determined by grain size and rms roughness. The small lattice mismatch of LGO to nitrides and easily achievable Ga-polarity of the grown films are the primary reasons for the smoother surface of AlGaN/GaN structure on this alternative substrate. Optimizations of growth conditions and substrate preparation results in step flow growth for an AlGaN/GaN structure with 300 Å thick Al_0.25Ga_0.75N on 2.4 μm thick GaN. A high III/V flux ratio during growth and recently improved polishing of LGO substrates aids in promoting two dimensional step flow growth. The GaN nucleation layer directly on the LGO substrate showed no evidence of mixed phase cubic and hexagonal structure that is typically observed in the nucleation buffer on sapphire substrates. Cross-sectional high-resolution transmission electron microscopy (HRTEM) was performed on an AlGaN/GaN heterostructure grown on LGO. The atomic arrangement at the AlGaN/GaN interface was sharp and regular, with locally observed monolayer and bilayer steps.     

Gallium nitride materials - progress, status, and potential roadblocks

Metal-organic vapor phase epitaxy (MOVPE) and molecular beam epitaxy (MBE) are the principal techniques for the growth and n-type (Si) and p-type (Mg) doping of III-nitride thin films on sapphire and silicon carbide substrates as well as previously grown GaN films. Lateral and pendeoepitaxy via MOVPE reduce significantly the dislocation density and residual strain in GaN and AlGaN films. However tilt and coalescence boundaries are produced in the laterally growing material. Very high electron mobilities in the nitrides have been realized in radio-frequency plasma-assisted MBE GaN films and in two-dimensional electron gases in the AlGaN/GaN system grown on MOVPE-derived GaN substrates at the crossover from the intermediate growth regime to the droplet regime. State-of-the-art Mg doping profiles and transport properties have been achieved in MBE-derived p-type GaN. The Mg-memory effect, and heterogeneous growth, substrate uniformity, and flux control are significant challenges for MOVPE and MBE, respectively. Photoluminescence (PL) of MOVPE-derived unintentionally doped (UID) heteroepitaxial GaN films show sharp lines near 3.478 eV due to recombination processes associated with the annihilation of free-excitons (FEs) and excitons bound to a neutral shallow donor (D/spl deg/X).     

Improvement of Breakdown Characteristics of a GaN HEMT with AlGaN Buffer Layer

High-electron-mobility transistors (HEMTs) with a highly resistive two-layer buffer layer (AlGaN/GaN) were grown on 6H-SiC substrates by metalorganic chemical vapor deposition. The characteristics were compared with those of conventional HEMTs utilizing GaN as the high-resistivity buffer. The results of x-ray diffraction and atomic force microscopy indicate that the crystal quality of the HEMT heterostructure is not deteriorated by the AlGaN buffer layer. The direct-current (DC) characteristics of the HEMTs with the two different structures are similar, while the off-state breakdown voltage is enhanced and the mobility of the two-dimensional electron gas is improved by the AlGaN buffer layer. The reasons for the effects of the AlGaN buffer layer are discussed systematically.     

Surface morphology and electronic properties of dislocations in AlGaN/GaN heterostructures

Scanning force microscopy was used to examine the surfaces of AlGaN/GaN heterostructures grown by molecular beam epitaxy (MBE) on GaN templates prepared by hydride vapor phase epitaxy (HVPE). Away from dislocations, the MBE growth replicates the surface morphology of the HVPE film, with monolayer steps clarly visible in topographic images. However, the surface morphology near dislocations depends strongly on the MBE growth conditions. Under Ga rich growth the dislocations appear as hillocks, while under stoichiometric growth they appear as pits. A dependence on Al concentration is also observed. Surface contact potential variation near dislocations is consistent with excess negative charges surrounding by a depletion region, but this was observed only for the film grown under stoichiometric conditions.     

不同AlGaN层厚度的AlGaN/GaN高电子迁移率晶体管的静态特性

利用金属有机化合物气相外延技术研究了AlGaN/GaN高电子迁移率晶体管(HEMT)结构的外延生长及器件制作,重点比较了具有不同AlGaN层厚度的HEMT器件的静态特性.实验发现具有较薄AlGaN隔离层的结构表现出较好的器件特性.栅长为1μm的器件获得了650mA/mm的最大饱和电流密度和100mS/mm的最大跨导.