60 GHz monolithic GaAs front-end circuit for receiver applications

A millimetre-wave planar mixer diode compatible with GaAs MESFET based integrated circuit fabrication has been developed. Selective ion implantation was used to optimise the diode and FET doping profiles. A novel feature reported here is the use of a deep implanted buried n+ layer to minimise diode series resistance, yielding diode cutoff frequencies in excess of 500 GHz. Monolithic balanced mixer diodes integrated with an MESFET IF amplifier fabricated by this technique have given 5dB conversion loss at 60 GHz.     

A 50 GHz GaAs FET MIC transmitter/receiver using hermetic miniatureprobe transitions

A very compact 50-GHz-band transmitter/receiver for a video link is described. The RF assemblies used in the system consist of 25/50-GHz frequency doublers, a 25-GHz dielectric-resonator oscillator, and a 25-GHz FM modulator. The circuits make extensive use of microwave integrated circuit (MIC) technology with all GaAs FETs as active elements. The frequency doublers exhibit a minimum conversion loss of 2.6 dB and a maximum output power of 11 dBm. The modulator is highly frequency stabilized by the dielectric resonator. Recently developed miniature probe microstrip-to-waveguide transitions permit the MIC assemblies to be installed compactly in hermetically sealed packages. Design considerations and experimental data for the transition are presented. Using these technologies a transmitting power of 10 dBm and a receiver noise figure of 13 dB have been obtained     

60 GHz multi-chip-module receiver with substrate integrated waveguide antenna and filter

A compact 60 GHz MCM receiver has been demonstrated by integrating millimetre-wave substrate-integrated waveguides and GaAs MMICs for the first time. The module includes a waveguide antenna and filter, MMIC LNA and mixer, and lumped elements for IF filtering embedded into the multilayer photo-imageable thick-film substrate. Cavities for MMIC attachment are photo-imaged as part of the standard process.     

Broadband integrated millimeter-wave up- and down-converter GaAs MMICs

The architecture and design of broadband, highly integrated up- and down-converters in GaAs pHEMT technology is described. Two up-converters and two down-converters have been designed to reduce the complexity and cost of broadband millimeter-wave systems by integrating a number of functions into compact MMICs. Broadband performance was achieved for approximately 17-35GHz (low band) and 30-45 GHz (high band) with up-conversion input-referred,third-order intercept point exceeding 12 and 10 dBm, respectively, with good 2/spl times/ local oscillator leakage and excellent gain control. To the best of the authors' knowledge,this is the highest level of integration achieved for up- and down-converters at these frequencies.     

Design of 35 GHz 1 Watt GaAs pHEMT Power Amplifier MMIC

By using 0.15μm GaAs pHEMT (pseudomorphic high electron mobility transistor)technology,a design of millimeter wave power amplifier microwave monolithic integrated circuit(MMIC)is presented.With careful optimization on circuit structure,this two-stage power amplifier achieves a simulated gain of 15.5dB with fluctuation of 1 dB from 33 GHz to 37GHz.A simulated output power of more than 30dBm in saturation can be drawn from 3 W DC supply with maximum power added efficiency(PAE)of 26%.Rigorous electromagnetic simulation is performed to make sure the simulation results are credible.The whole chip area is 3.99mm2 including all bond pads.     

Analog MMICs for millimeter-wave applications based on a commercial0.14-μm pHEMT technology

This paper describes recent results obtained from the monolithic-microwave integrated-circuit design activity at Chalmers University, Goteborg, Sweden. The goal is to design all circuits needed for the front end of a 60-GHz wireless local area network and to build various system demonstrators. Some recent experimental results from this activity like different 60-GHz amplifiers, a general-purpose IF amplifier, a 60-GHz resistive mixer, and frequency multipliers are reported in this paper. Parameters such as the gain, conversion loss, noise figure, dc-power dissipation, as well as the model used in the simulations are reported and discussed     

11 GHz bandwidth optical integrated receivers using GaAs MESFET andMSM technology

State-of-the-art performance of GaAs-FET-based monolithic optoelectronic integrated circuit (OEIC) receivers is reported. The OEIC receiver achieves -3-dB bandwidth as high as 11 GHz for optical signals at a wavelength of 850 nm. The feedback resistance of the receiver is 1000 Ω and the effective transimpedance into a 50 Ω load is 565 Ω. The effective transimpedance-bandwidth (TZBW) product is 6.1 THz-Ω. This ultra-high-performance receiver was implemented via a high-yield, low-cost direct ion implanted GaAs MESFET technology with a 0.6-μm gate length and a metal-semiconductor-metal (MSM) detector with 2-μm lines×3-μm spacings     

Experimental characterisation of 38 GHz micromachined GaAs receiver

The experimental characterisation of a 38 GHz micromachined GaAs receiver is presented. The structure monolithically integrates a double-folded slot antenna and a Schottky diode on the same GaAs thin membrane. The measurements demonstrate that this approach has the potential for innovative circuit architecture development.     

GaAs IMPATT diodes for 60 GHz

High-performance GaAs double-drift Read IMPATT diodes have been demonstrated at 60 GHz. 1.24-W CW output power at 11.4-percent dc to RF conversion efficiency was obtained with a junction temperature rise of 225°C. The doping profiles and test circuits have not yet been optimized and we expect that still higher power and efficiency should be achievable.     

全离子注入C波段功率单片放大器及内匹配功率单片放大器

报道了全平面C波段功率单片放大器及四单片合成放大器研究结果。单片放大器采用全离子注入工艺，均匀性好，平均成品率40％，可靠性高。工作频率4．7—5．2GHZ，中心频率5．0GHz处输出功率2．5W，增益15dB，功率附加效率31．5％。单片放大器芯片面积2．8mm×2．0mm，四路合成的4×MMIC频率范围不变，中心频率4．95GHz处输出功率8．2W，增益13dB，功率附加效率26％，四路合成效率接近80％。实验结果与理论预测基本吻合。     

12~18 GHz GaAs MMIC低噪声放大器设计

采用GaAs工艺设计了一个12~18 GHz毫米波单片集成电路(MMIC)低噪声放大器(LNA)。采用三级单电源供电放大结构,运用最小噪声匹配设计、共轭匹配技术和负反馈结构,同时满足了噪声系数、增益平坦度和输出功率等要求。仿真表明：在12~18 GHz的工作频带内,噪声系数为1.15~1.41 dB,增益为27.9~29.1 dB,输出1 dB压缩点达到15 dBm,输入、输出电压驻波比(VSWR)系数小于1.72。     

120 GHz millimetre-wave antenna for integrated photonic transmitter

A planar slot antenna on an Si substrate for a photonic millimetre-wave transmitter that operates at a frequency of 120 GHz has been designed and characterised. By integrating a uni-travelling-carrier photodiode with the antenna, emission of millimetre-wave signals with a power of 250 μW has been demonstrated experimentally     

GaAs pHEMT工艺6～18GHz有源倍频器MMIC

基于GaAs pHEMT工艺,设计了一个6～18 GHz宽带有源倍频器MM IC,最终实现了较高的转换增益和谐波抑制特性。芯片内部集成了输入匹配、有源巴伦、对管倍频器和输出功率放大器等电路。外加3.5 V电源电压下的静态电流为80 mA;输入功率为6 dBm时,6～18 GHz输出带宽内的转换增益为6 dB;基波和三次谐波抑制30 dBc。当输出频率为12 GHz时,100 kHz频偏下的单边带相位噪声为-143 dBc/Hz。芯片面积为1 mm×1.5 mm。     

一种采用砷化镓pHEMT工艺的超宽带DC-40 GHz 4位单片数字衰减器

介绍了一种超宽带DC-40GHz的4位单片数字衰减器。该衰减器采用0.25μm砷化镓pHEMT工艺制造。据我所知,这种衰减器是至今国内文献报道中带宽最宽的。它通过采用适当的结构来得到超宽的带宽、低插入损耗以及高衰减精度。该衰减器具有1 dB的衰减步进和15 dB的衰减动态范围,插入损耗在40 GHz时小于5 dB,全衰减态及全频带内的输入输出回波损耗大于12 dB。     

A fully integrated V-band PLL MMIC using 0.15-/spl mu/m GaAs pHEMT technology

A fully integrated V-band phase-locked loop (PLL) MMIC with good phase noise and low-power consumption is developed using 0.15-/spl mu/m GaAs pHEMTs. For V-band frequency division,a wideband divide-by-3 frequency divider is proposed using cascode FET-based harmonic injection locking. The fourth subharmonic mixer using anti-parallel diode pair is employed as a high-frequency phase detector. In this way, the required frequency of the reference oscillator is lowered to one twelfth of V-band output signal. An RC low-pass filter and DC amplifier are also integrated to effectively suppress the spurious and harmonic signals, and to increase the loop gain. To reduce the circuit interactions and frequency pulling effect, buffer amplifiers are used at the output of VCO and frequency divider. The fabricated V-band PLL MMIC shows the locking range of 840 MHz around 60.1GHz under a very low power dissipation of 370 mW. Good phase noise of -95.5 dBc/Hz is measured at 100 kHz offset. The chip size is as small as 2.35/spl times/1.80 mm/sup 2/. To the best of our knowledge, the PLL MMIC of this work is one of the highest frequency monolithic PLLs that integrates all the required elements on a single chip.     

60 GHz Single-Chip Front-End MMICs and Systems for Multi-Gb/s Wireless Communication

Single-chip 60 GHz transmitter (TX) and receiver (RX) MMICs have been designed and characterized in a 0.15mum (f_T~ 120 GHz/f _MAX> 200 GHz) GaAs mHEMT MMIC process. This paper describes the second generation of single-chip TX and RX MMICs together with work on packaging (e.g., flip-chip) and system measurements. Compared to the first generation of the designs in a commercial pHEMT technology, the MMICs presented in this paper show the same high level of integration but occupy smaller chip area and have higher gain and output power at only half the DC power consumption. The system operates with a LO signal in the range of 7-8 GHz. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO multiplier chain, resulting in an IF center frequency of 2.5 GHz. Packaging and interconnects are discussed and as an alternative to wire bonding, flip-chip assembly tests are presented and discussed. System measurements are also described where bit error rate (BER) and eye diagrams are measured when the presented TX and RX MMICs transmits and receives a modulated signal. A data rate of 1.5 Gb/s with simple ASK modulation was achieved, restricted by the measurement setup rather than the TX and RX MMICs. These tests indicate that the presented MMICs are especially well suited for transmission and reception of wireless signals at data rates of several Gb/s     

330GHz砷化镓单片集成分谐波混频器

在太赫兹频段,二极管尺寸与波长相比已不能忽略,二极管的封装会引入很大的寄生参量,因此需建立二极管三维模型提取寄生参数.同时人工装配难度增大,会增加电路不确定性.采用12μm砷化镓单片集成悬置微带线结构,基于电子科技大学与中国电子科技集团第十三研究所自主联合设计的肖特基二极管研制330 GHz砷化镓单片集成分谐波混频器.实测结果显示在5 mW本振功率的驱动下,在328 GHz可得到最小变频损耗10.4 dB,在320~340 GHz范围内,单边带变频损耗小于14.7 dB.     

A 4–41 GHz Singly Balanced Distributed Mixer Using GaAs pHEMT Technology

A broadband singly balanced distributed mixer is developed using a 0.15-mum GaAs pHEMT foundry process. It is the first time that the charge-injection approach is applied to a distributed mixer. With the advantage of charge-injection, the mixer achieves a high conversion gain with low dc consumption. The fabricated distributed mixer with an integrated broadband transformer has a compact chip size of 2mmtimes1mm. Measurement results show that the mixer achieves a conversion gain of better than 3.5dB over a broadband frequency from 4-41GHz, with a relatively low dc power consumption of 100mW     

Highly integrated 20 Mbit/s GaAs optical receiver for use in TPON network termination equipment

The performance and application of a 20 Mbit/s PIN-GaAs IC optical receiver is described. Designed for TPON, the receiver combines high sensitivity, -50 dBm, with CMOS logic level and peak detector outputs in a single package consuming less than 190 mW.<>