Dopant-free GaN/AlN/AlGaN radial nanowire heterostructures as high electron mobility transistors

We report the rational synthesis of dopant-free GaN/AlN/AlGaN radial nanowire heterostructures and their implementation as high electron mobility transistors (HEMTs). The radial nanowire heterostructures were prepared by sequential shell growth immediately following nanowire elongation using metal-organic chemical vapor deposition (MOCVD). Transmission electron microscopy (TEM) studies reveal that the GaN/AlN/AlGaN radial nanowire heterostructures are dislocation-free single crystals. In addition, the thicknesses and compositions of the individual AlN and AlGaN shells were unambiguously identified using cross-sectional high-angle annular darkfield scanning transmission electron microscopy (HAADF-STEM). Transport measurements carried out on GaN/AlN/AlGaN and GaN nanowires prepared using similar conditions demonstrate the existence of electron gas in the undoped GaN/AlN/AlGaN nanowire heterostructures and also yield an intrinsic electron mobility of 3100 cm(2)/Vs and 21,000 cm(2)/Vs at room temperature and 5 K, respectively, for the heterostructure. Field-effect transistors fabricated with ZrO(2) dielectrics and metal top gates showed excellent gate coupling with near ideal subthreshold slopes of 68 mV/dec, an on/off current ratio of 10(7), and scaled on-current and transconductance values of 500 mA/mm and 420 mS/mm. The ability to control synthetically the electronic properties of nanowires using band structure design in III-nitride radial nanowire heterostructures opens up new opportunities for nanoelectronics and provides a new platform to study the physics of low-dimensional electron gases.     

AlGaN/GaN-heterostructures on (111) 3C-SiC/Si pseudo substrates for high frequency applications

We present the realization of high electron mobility transistors (HEMTs) based on AlGaN/GaN heterostructures, which were grown on silicon substrates using an ultrathin SiC transition layer. The growth of AlGaN/GaN heterostructures on 3C-SiC(111)/Si(111) was performed using metalorganic chemical vapour deposition (MOCVD). The 3C-SiC(111) transition layer was realized by low pressure CVD and prevented Ga-induced meltback etching and Si-outdiffusion in the subsequent MOCVD growth. The two-dimensional electron gas (2DEG) formed at the AlGaN/GaN interface showed an electron sheet density of 1.5 × 10¹³ cm^− 3 and a mobility of 870 cm²/Vs. The HEMTs DC and RF characteristics were analysed and showed a peak cut-off frequency as high as 29 GHz for a 250 nm gate length.     

Multilayer AlN/AlGaN/GaN/AlGaN heterostructures for high-power field-effect transistors grown by ammonia MBE

The results of the optimization of the ammonia MBE technology of AlN/AlGaN/GaN/AlGaN heterostructures for high-power microwave field-effect transistors (FETs) are presented. The creation of technological systems of the EPN type for the deposition of group III nitrides by ammonia MBE, in combination with the development of optimum growth and postgrowth processes, make it possible to obtain AlN/AlGaN/GaN/AlGaN based heterostructures for high-power microwave FETs with the output static characteristics on the world best level. One of the main fields of application of the semiconductor heterostructures based on group III nitrides is the technology of high electron mobility transistors (HEMTs). Most investigations in this field have been devoted to the classical GaN/AlGaN structures with a single heterojunction. An alternative approach based on the use of double heterostructures with improved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility as compared to that in the single-junction structures. We succeeded in optimizing the double heterostructure parameters and growth conditions so as to obtain conducting channels with a 2DEG carrier mobility of 1450, 1350, and 1000 cm²/(V s) and a sheet electron density of 1.3 × 10¹³, 1.6 × 10¹³, and 2.0 × 10¹³ cm^?2, respectively. Experimental HEMTs with 1-μm-long gates based on the obtained multilayer heterostructure with a doped upper barrier layer exhibit stable current-voltage characteristics with maximum saturation current densities of about 1 A/mm and a transconductance of up to 180 mS/mm.     

Undoped High-Resistance GaN Buffer Layer for AlGaN/GaN High-Electron-Mobility Transistors

Technical Physics Letters - It is shown that intentionally undoped high-resistance GaN buffer layers in AlGaN/GaN heterostructures with high electron mobility for transistors can be formed by...     

Performance of AlGaN/GaN high electron mobility transistors at nanoscale gate lengths

The DC and RF performance of AlGaN/GaN high electron mobility transistors with nanoscale gate lengths is presented. The layer structures were grown by either metal organic chemical vapor deposition or rf plasma-assisted molecular beam epitaxy. Excellent scaling properties were observed as a function of both gate length and width and confirm that these devices are well suited to both high speed switching and power microwave applications.     

AlGaN/GaN HEMTs grown by ammonia MBE

The experimental technology and characteristics of domestic AlGaN/GaN high electron mobility transistors are described. The results show good prospects for further development.     

High temperature assessment of nitride-based devices

The high temperature characterization of GaN-based devices, including high electron mobility transistors (HEMTs), p-i-n photodiodes and surface acoustic wave (SAW) filters is reported. Transmission line method (TLM) measurements reveal the reversible behaviour of both the ohmic contact resistance and the two-dimensional electron gas (2DEG) mobility. AlGaN/GaN HEMTs on sapphire and SiC substrates present a reduction of the drain current and the transconductance as temperature increases. The responsivity of InGaN/GaN photodiodes is enhanced and shifted to larger wavelengths with temperature, recovering its original value after the thermal cycle. The temperature coefficient of frequency of SAW filters on AlN epilayers on different substrates has been measured. The influence of temperature on the different surface acoustic modes is compared.     

Exploiting nanostructure-thin film interfaces in advanced sensor device configurations

In this report, we present a study on the exploitation of nanostructure-thin film interfaces. Here, the objective is to utilize such interfaces for developing nanostructures for advanced sensing devices, while using state-of-the-art microelectronic technology that enables batch production. In this context, growth of ZnO nanostructures on the GaN/AlGaN heterostructure layers was studied. A fabrication process, based on a hydrothermal growth method, was used for preparing the interfaces of nanostructured thin film. Samples were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM) and obtained results suggested near epitaxial quality of the hetero-interface. Field-effect transistors (FETs) based on ZnO nanorods/GaN heterostructures were fabricated and tested in a controlled gas environment. Thus, it was demonstrated that nanostructures could be exploited in unconventional ways by employing them in scalable and batch-producible conventional semiconductor devices.     

Multilayer AIN/AlGaN/GaN/AlGaN heterostructures with quantum wells for high-power field-effect transistors grown by ammonia MBE

High-power field-effect transistors (FETs) are among the main applications of heterostructures based on group III metal nitrides, which in most cases implement the classical GaN/AlGaN structure with a single junction. An alternative approach based on the use of double heterostructures with imporved two-dimensional electron gas (2DEG) confinement offers a number of advantages, but such structures are usually characterized by a lower carrier mobility and density (in GaN layers of reduced thickness) as compared to the values in the single-junction structures. Optimization of the heterostructure design and ammonia MBE growth conditions allowed us to obtain multilayer AlN/AlGaN/GaN/AlGaN heterostructures with quantum wells, which are characterized by a 2DEG carrier mobility of 1100–1300 cm²/(V s) and a sheet electron density of (1.1–1.3) × 10¹³ cm^-2. Experimental FETs based on the obtained multilayer heterostructures in a static regime exhibit working current densities up to 0.6 A/mm at a transconductance of up to 150 mS/mm and a breakdown voltage above 100 V.     

The relationship between the reliability of transistors with 2D AlGaN/GaN channel and organization type of nanomaterial

The first experimental results demonstrating that the carrier mobility in the AlGaN/GaN 2D channel of transistor structures (AlGaN/GaN-HEMT) is correlated with the manner in which the nanomaterial is organized and also with the operation reliability of transistor parameters are presented. It is shown that improving the nature of organization of the nanomaterials in AlGaN/GaN-HEMT structures, evaluated by the multifractal parameter characterizing the extent to which a nanomaterial is disordered (local symmetry breaking) is accompanied by a significant, several-fold increase in the electron mobility in the 2D channel and in the reliability of parameters of transistors fabricated from these structures.     

Wireless Detection System for Glucose and pH Sensing in Exhaled Breath Condensate Using AlGaN/GaN High Electron Mobility Transistors

Peltier element cooling of ungated AlGaN/GaN high electron mobility transistors (HEMTs) is shown to be an effective method for condensing exhaled breath, enabling the measurement of the pH and glucose of the exhaled breath condensate (EBC). By comparison with standard solutions, the current change measured in the HEMTs with EBC shows that the sensitivity of the glucose detection is lower than the glucose concentration in the EBC of healthy human subjects and the pH of the condensate from the exhaled breath is within the range of 7–8, typical of that for human blood. The HEMT sensors can be integrated into a wireless data transmission system that allows for remote monitoring. Details of the transmitter and receiver design for the transmission system are given. Our work demonstrates the possibility of using AlGaN/GaN HEMTs for extended investigations of airway pathology without the need for clinical visits.      

AlGaN/GaN-based diodes and gateless HEMTs for gas and chemical sensing

The characteristics of Pt/GaN Schottky diodes and Sc/sub 2/O/sub 3//AlGaN/GaN metal-oxide semiconductor (MOS) diodes as hydrogen and ethylene gas sensors and of gateless AlGaN/GaN high-electron mobility transistors (HEMTs) as polar liquid sensors are reported. At 25/spl deg/C, a change in forward current of /spl sim/6 mA at a bias of 2 V was obtained in the MOS diodes in response to a change in ambient from pure N/sub 2/ to 10% H/sub 2// 90% N/sub 2/. This is approximately double the change in forward current obtained in Pt/GaN Schottky diodes measured under the same conditions. The mechanism appears to be formation of a dipole layer at the oxide/GaN interface that screens some of the piezo-induced channel charge. The MOS-diode response time is limited by the mass transport of gas into the test chamber and not by the diffusion of atomic hydrogen through the metal/oxide stack, even at 25/spl deg/C. Gateless AlGaN/GaN HEMT structures exhibit large changes in source-drain current upon exposing the gate region to various polar liquids, including block co-polymer solutions. The polar nature of some of these polymer chains lead to a change of surface charges in gate region on the HEMT, producing a change in surface potential at the semiconductor/liquid interface. The nitride sensors appear to be promising for a wide range of chemicals, combustion gases and liquids.     

线性化AlGaN/GaN HEMT费米能级与二维电子气密度关系的解析模型

通过化简复杂非线性的费米能级EF与二维电子气密度ns关系,并利用化简后函数的一阶泰勒多项式建立了线性化AlGaN/GaN HEMT中EF与ns关系的解析模型。该模型可以根据二维电子气密度ns的范围及温度计算EF与ns非线性关系之线性近似的参数斜率a和截距EF0。计算结果表明,所述模型的线性EF-ns计算结果对非线性精确解近似效果较好,且基于该模型计算的ns-VG曲线与实验数据符合良好。     

Low-Energy Defectless Dry Etching of the AlGaN/AlN/GaN HEMT Barrier Layer

A method of defectless dry etching of an AlGaN barrier layer is proposed, which consists in repeated plasmachemical oxidation of AlGaN and removal of the oxide layer by means of reactive ion etching in inductively coupled BCl₃ plasma. Using the proposed etching technology, AlGaN/AlN/GaN high-electron-mobility transistors (HEMTs) with a buried gate have been successfully fabricated for the first time. It is shown that the currents of obtained HEMTs are independent of the number of etching cycles, while the gate operating point shifts toward positive voltages up to obtaining transistors operating in the enhancement mode.     

Improved DC performance of AlGaN/GaN high electron mobility transistors using hafnium oxide for surface passivation

Improved DC performance of AlGaN/GaN high electron mobility transistors (HEMTs) have been demonstrated using reactive-sputtered hafnium oxide (HfO₂) thin film as the surface passivation layer. Hall data indicate a significant increase in the product of sheet carrier concentration (n_s) and electron mobility (μ_n) in the HfO₂-passivated HEMTs, compared to the unpassivated HEMTs. This improvement in electron carrier characteristics gives rise to a 22% higher I_Dmax and an 18% higher g_mmax in HEMTs with HfO₂ passivation relative to the unpassivated devices. On the other hand, I_gleak of the HEMTs decreases by nearly one order of magnitude when HfO₂ passivation is applied. In addition, drain current is measured in the subthreshold regime. Compared to the unpassivated HEMTs, HfO₂-passivated HEMTs exhibit a much smaller off-state I_D, indicating better turn-off characteristics.     

Specific features of proton interaction with transistor structures having a 2D AlGaN/GaN channel

It has been shown that the interaction of 1 MeV protons at doses of (0.5–2) × 10¹⁴ cm^–2 with transistor structures having a 2D AlGaN/GaN channel (AlGaN/GaN HEMTs) is accompanied not only by the generation of point defects, but also by the formation of local regions with a disordered nanomaterial. The degree of disorder of the nanomaterial was evaluated by multifractal analysis methods. An increase in the degree of disorder of the nanomaterial, manifested the most clearly at a proton dose of 2 × 10¹⁴ cm^–2, leads to several-fold changes in the mobility and electron density in the 2D channel of HEMT structures. In this case, the transistors show a decrease in the source–drain current and an order-of-magnitude increase in the gate leakage current. In HEMT structures having an enhanced disorder of the nanomaterial prior to exposure to protons, proton irradiation results in suppression of the 2D conductivity in the channel and failure of the transistors, even at a dose of 1 × 10¹⁴ cm^–2.     

Screening effect in contactless electroreflectance spectroscopy observed for AlGaN/GaN heterostructures with two dimensional electron gas

AlGaN/GaN heterostructures with a two dimensional electron gas (2DEG) at the interface have been investigated by contactless electroreflectance (CER) and photoreflectance (PR) spectroscopies. It has been shown that the 2DEG effectively screens the GaN layer and hence no signal related to a bandgap transition in the GaN layer is observed in CER spectra whereas the CER signal related to a bandgap transition in the AlGaN layer is very strong. The screening phenomenon is unimportant for PR spectroscopy due to different mechanism of the electromodulation. As a result both GaN and AlGaN related transitions are clearly observed in PR spectra. It has been proposed that the screening phenomena observed in CER can find application in contactless detection of the 2DEG in AlGaN/GaN heterostructures.     

Multilayer AlN/AlGaN/GaN/AlGaN heterostructures for high-power field-effect transistors grown by ammonia MBE on silicon substrates

We report preliminary results on the transfer of the ammonia MBE technology of AlN/AlGaN/GaN/AlGaN heterostructures to silicon substrates. Optimization of the growth conditions allowed the number of macroscopic cracks in the epilayers to be reduced and ensured the growth of heterostructures with two-dimensional electron gas, which are suitable for the creation of field-effect transistors. The saturation current of prototype devices based on the heterostructures grown on silicon substrates are comparable with the analogous parameter of devices grown on sapphire and exhibits no decrease related to thermal scattering at high bias voltages.     

Isolated photosystem I reaction centers on a functionalized gated high electron mobility transistor

In oxygenic plants, photons are captured with high quantum efficiency by two specialized reaction centers (RC) called Photosystem I (PS I) and Photosystem II (PS II). The captured photon triggers rapid charge separation and the photon energy is converted into an electrostatic potential across the nanometer-scale (~6 nm) reaction centers. The exogenous photovoltages from a single PS I RC have been previously measured using the technique of Kelvin force probe microscopy (KFM). However, biomolecular photovoltaic applications require two-terminal devices. This paper presents for the first time, a micro-device for detection and characterization of isolated PS I RCs. The device is based on an AlGaN/GaN high electron mobility transistor (HEMT) structure. AlGaN/GaN HEMTs show high current throughputs and greater sensitivity to surface charges compared to other field-effect devices. PS I complexes immobilized on the floating gate of AlGaN/GaN HEMTs resulted in significant changes in the device characteristics under illumination. An analytical model has been developed to estimate the RCs of a major orientation on the functionalized gate surface of the HEMTs.     

GaN Electronics

An overview is presented of progress in GaN electronic devices for high‐power, high‐temperature applications. The wide bandgaps of the nitride materials, their excellent transport properties, and the availability of heterostructures (e.g., GaN/AlGaN) make them ideal candidates for these applications. In the past few years a wide range of devices have been reported, including heterostructure field effect transistors (HFETs), heterojunction bipolar transistors (HBTs), bipolar junction transistors (BJTs), Schottky and p–i–n rectifiers, and metal–oxide–semiconductor field effect transistors (MOSFETs). Some of the unexpected features of GaN‐based electronics include the ability to use piezoelectrically induced carriers for current transport in heterostructures and the sensitivity of the GaN surface to preferential loss of nitrogen during device processing.