不同粒径氮化硼填充环氧树脂/玻璃纤维

以聚砜改性环氧树脂为基体,通过高温模压制备了环氧树脂/玻璃纤维/氮化硼复合材料,研究了不同粒径及不同氮化硼导热粒子用量对复合材料导热性能、力学性能和电性能的影响。结果表明,大粒径粒子有利于复合材料力学性能的提高,小粒径有利于导热性能的提高;随着氮化硼用量的增加,复合材料的导热性能升高,力学性能呈现先增后降趋势,当氮化硼用量为10 %（质量分数,下同）时,复合材料的冲击强度和弯曲强度均达到最佳,当氮化硼用量为20 %时,复合材料仍保持较好的电性能。     

环氧树脂/玻纤/BN导热绝缘复合材料制备研究

采用高温模压成型法制备环氧树脂/玻纤/BN导热复合材料,探讨了BN用量对复合材料力学性能、导热性能和电性能的影响,结果表明.当BN用量为10%时,复合材料的冲击强度和弯曲强度较佳;导热性能随BN用量的增加而提高,当BN用量为20%耐.热导率为0.7438 W/mk,此时复合材料仍保持较好的绝缘性能.     

环氧树脂/玻璃布/BN导热复合材料的制备与性能研究

采用高温模压成型法制备环氧树脂(EP)/玻璃布/氮化硼(BN)导热复合材料。探讨了BN用量和偶联剂处理对复合材料力学性能、导热性能和介电性能等影响。结果表明:当w(BN)=15%时,复合材料的冲击强度较高;导热性能随着BN用量的增加而增大;当w(BN)=25%时,改性复合材料的热导率为0.901 2 W/(m.K),此时复合材料仍保持较低的介电常数和介电损耗。当BN用量相同时,偶联剂表面处理可有效改善复合材料的力学性能和导热性能。     

环氧树脂/碳纤维/BN导热复合材料制备及研究

采用高温模压成型法制备环氧树脂/碳纤/BN导热复合材料.探讨了BN用量对复合材料导热性能和力学性能的影响.结果表明,当BN用量为6%(wt)时,复合材料的弯曲强度和剪切强度较佳,BN用量对复合材料的冲击强度影响不大;导热性能随BN用量的增加而增加,当BN用量为20%(wt)时,导热系数为0.8438W/m·K.     

碳化硅/环氧树脂导热复合材料的制备与性能

采用浇铸成型法制备碳化硅/环氧树脂(SiC/EP)导热复合材料,研究了SiC种类、粒径、用量和表面改性方法对SiC/EP复合材料的导热性能、力学性能和热性能等影响。结果表明:SiC/EP复合材料的导热系数随纳米级SiC用量增加而增大,当φ(纳米级SiC)=17.80%时,导热系数为0.954 6 W/(m.K);SiC/EP复合材料的弯曲强度和冲击强度随纳米级SiC用量增加均呈先升后降态势,当φ(纳米级SiC)=3.50%时,两者均达到最大值。SiC经表面改性后可有效提高复合材料的导热性能和力学性能,并且改性SiC的加入可有效降低EP的玻璃化转变温度。     

性能均衡的尼龙6基导热复合材料的结构设计

聚合物基导热复合材料以其独特的优势,如耐环境性和易于加工成型等特点而被广泛的关注和研究。将与尼龙6(PA6)具有部分相容性的尼龙11(PA11)引入尼龙6/氮化硼(PA6/BN)复合材料中,并对其导热性能和力学性能进行了研究。结果发现,在PA6/PA11/BN复合材料中,氮化硼选择性分布在PA6连续相中,PA11相起到体积排除的作用,使得BN在PA6中更有效地形成导热通路,可在较低粒子含量下显著提高复合材料热导率。同时,韧性较高的尼龙11亦起到改善复合材料力学性能的作用。当PA6/PA11体积比为7/3、氮化硼体积分数为20%时,PA6/PA11/BN复合材料热导率达到1.96 W/(m·K),与同等BN含量的PA6/BN复合材料的热导率相比提高了约13.7%,且复合材料的断裂伸长率和拉伸强度也同时得到提高,分别提高了86.72%和13.95%。该研究为制备兼具优异导热性能和力学性能的新型聚合物基导热复合材料提供了一种思路。     

PB-1/BN导热复合材料的制备及性能研究

以聚丁烯-1(PB-1)为基体,二维片状氮化硼(BN)为导热填料,采用模压成型的方法制备了PB-1/BN导热复合材料。研究了BN用量对PB-1/BN导热复合材料导热性能、力学性能、流变性能以及结晶性能的影响。结果表明:BN的加入使复合材料的导热性能明显提高,当BN用量为50%时,复合材料的导热系数达到1.28 W/(m·K),与纯PB-1相比提高了266%;随着BN用量的增加,复合材料的力学性能明显下降;同时,其结晶温度和结晶度也有不同程度降低。     

Si3N4／环氧树脂导热复合材料制备和性能研究

采用硅烷偶联剂KH-550对氮化硅（β—Si3N4）进行表面处理,浇注制备氮化硅／环氧树脂（Si3N4／EP-828）复合材料,研究了Si3N4粒径、用量和表面改性对复合材料导热性能和力学性能的影响。结果表明,Si3N4／EP-828的导热性能随Si3N4用量的增加而提高,当Si3N4体积分数为30％时,热导率为0．83W／mK,为纯环氧树脂4倍多;力学性能则随Si3N4用量的增加先增大后降低。表面改性有助于进一步提高复合材料的导热性能和力学性能。初步分析表明,Si3N4／EP-828热导率与Si3N4形成的导热网链和Si-O-Si键导热骨架有关。     

偶联剂对PE-RT/Al_2O_3复合材料力学性能和导热性能的影响

以硅烷、铝酸酯、钛酸酯三种不同粉状偶联剂处理后的Al2O3作为导热填料,耐热聚乙烯(PE-RT)为基体树脂,采用熔融共混的方法,通过双螺杆挤出造粒、注塑成型制备了PE-RT/Al2O3导热复合材料。研究了偶联剂种类及用量对PE-RT/Al2O3复合材料力学性能和导热性能的影响。结果表明:当硅烷偶联剂用量为1.5%时,材料的导热性能与力学性能最佳,由硅烷偶联剂处理Al2O3得到复合材料的热导率比未处理的提高了25%;另两种偶联剂用量分别为2%时,复合材料的热导率达到最大值,而其用量为1%时,材料的力学性能最佳;Al2O3与粉状偶联剂在基体中易团聚,导致复合材料的冲击强度下降。     

聚乙烯/氮化铝纳米复合材料的制备与性能研究

制备了聚乙烯/氮化铝纳米复合材料,研究了氮化铝对聚乙烯纳米复合材料力学性能、导热性能和热性能的影响。研究结果表明,氮化铝可以显著提高聚乙烯纳米复合材料的力学性能和导热性能。随着氮化铝用量的增加纳米复合材料的力学性能先增加后降低,当添加质量分数为9%的氮化铝时,聚乙烯纳米复合材料的拉伸强度、弯曲强度和冲击强度比纯聚乙烯分别提高了47.16%、31.48%和51.68%。聚乙烯纳米复合材料的导热系数和热稳定性能随着氮化铝用量的增加而提高。利用SEM对复合材料增强机理进行了探讨。     

BN填充PA6基导热绝缘复合材料导热性能研究

以聚酰胺6（PA6）为基体, 氮化硼（BN）作为导热填料,经双螺杆挤出机熔融共混,模压成型制得导热绝缘复合材料。研究了BN含量、粒径、形状和不同BN粒径复配对复合材料导热性能的影响,并研究了BN含量和粒径对复合材料绝缘性能的影响。结果表明,在各种粒径下,复合材料热导率均随BN填充量的增加而增大;在BN粒径为5 μm、填充量为25 %（体积分数,下同）时,复合材料热导率达到1.2187 W/(m·K);在BN填充量相同时,填料粒径对复合材料热导率的影响不是简单的单调规律,呈现50、100 μm时较小,1、5、15 μm时较大,150 μm时最大的规律;片状BN填料比球状BN填料更有利于提高复合材料的热导率;2种不同粒径填料复配所填充的复合材料的热导率大于单一粒径填充的复合材料;5 μm与150 μm粒径BN复配,在填充量为20 %,配比为1:3时,复合材料的热导率最大,达到1.3753 W/(m·K),为纯PA6的4.9倍;在不同BN含量和粒径下,复合材料体积电阻率均能达到10000000000000 Ω·cm以上,满足绝缘性能。     

Effect of nanoparticles on the performance of thermally conductive epoxy adhesives

Microsized or nanosized α‐alumina (Al₂O₃) and boron nitride (BN) were effectively treated by silanes or diisocyanate, and then filled into the epoxy to prepare thermally conductive adhesives. The effects of surface modification and particle size on the performance of thermally conductive epoxy adhesives were investigated. It was revealed that epoxy adhesives filled with nanosized particles performed higher thermal conductivity, electrical insulation, and mechanical strength than those filled with microsized ones. It was also indicated that surface modification of the particles was beneficial for improving thermal conductivity of the epoxy composites, which was due to the decrease of thermal contact resistance of the filler‐matrix through the improvement of the interface between filler and matrix by surface treatment. A synergic effect was found when epoxy adhesives were filled with combination of Al₂O₃ nanoparticles and microsized BN platelets, that is, the thermal conductivity was higher than that of any sole particles filled epoxy composites at a constant loading content. The heat conductive mechanism was proposed that conductive networks easily formed among nano‐Al₂O₃ particles and micro‐BN platelets and the thermal resistance decreased due to the contact between the nano‐Al₂O₃ and BN, which resulted in improving the thermal conductivity. POLYM. ENG. SCI., 50:1809–1819, 2010. © 2010 Society of Plastics Engineers     

氮化硼/碳纳米管对乙烯基聚二甲基硅氧烷导热性能影响的研究

分别采用氮化硼和氮化硼/碳纳米管(CNTs)复配物制备导热乙烯基聚二甲基硅氧烷(PDMS)材料,并对其导热性能进行研究。结果表明:随着氮化硼和CNTs用量的增大,材料的热导率和热扩散系数逐渐增大;氮化硼用量足够大时,能够形成导热通路进而促进填料网络的形成;CNTs在填料中将氮化硼粒子之间形成的平面结构连接起来,从而形成三维网络结构;填料越多,形成的导热网络结构越强;氮化硼在网络中起主要作用,CNTs起到辅助增强的作用。     

Thermal conductivity improvement in electrically insulating silicone rubber composites by the construction of hybrid three-dimensional filler networks with boron nitride and carbon nanotubes

In this study, we constructed hybrid three-dimensional (3D) filler networks by simply incorporating a relatively low content of one-dimensional carbon nanotubes (CNTs; 0.0005–0.25 vol %) and a certain content of two-dimensional boron nitride (BN; 30 phr) in a silicone rubber (SIR) matrix. As indicated by transmission electron microscopy observation, flexible CNTs can serve as bridges to connect BN platelets in different layers to form hybrid 3D thermally conductive networks; this results in an increase in thermally conductive pathways, and the isolation between CNTs can prevent the formation of electrically conductive networks. Compared to the SIR–BN composite with the same BN content, the SIR–BN–CNT composites exhibited improved thermal conductivity, slightly increased volume resistivity, and comparable breakdown strength without a largely decreased flexibility. When 0.25 vol % CNTs were incorporated, the SIR–BN–CNT composite exhibited 75 and 25% higher thermal conductivities relative to the neat SIR and SIR–BN composite with 30 phr BN, respectively, and a thermal conductivity that was even comparable to SIR–BN composite with 40 phr BN. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 46929.     

LDPE/PEG插层剥离改性氮化硼导热复合材料的制备及其性能

以聚乙二醇(PEG)为插层剂,通过机械球磨法制备了PEG插层剥离改性氮化硼.以低密度聚乙烯(LDPE)为基体,PEG插层剥离改性氮化硼为导热填料,采用双辊开炼、压片成型制备LDPE/PEG插层剥离改性氮化硼导热复合材料,研究了改性氮化硼用量及粒径对复合材料导热性能、力学性能和电绝缘性能的影响.结果表明:随着PEG插层剥...     

环氧树脂/氧化锌晶须/氮化硼导热绝缘复合材料的研究

以环氧树(脂EP)为基体,分别以氧化锌晶(须ZnOw)和ZnOw/氮化硼(BN)混合物为导热填料,制备了EP导热绝缘复合材料。研究了填料含量对复合材料导热性能、电绝缘性能及力学性能的影响,并利用扫描电镜对复合材料的断面形貌进行了观察。结果表明:随着导热填料含量的增大,复合材料的导热系数和介电常数增大,体积电阻率下降,而拉伸强度呈先增大后减小的趋势;在填料含量相同的情况下,EP/ZnOw/BN复合材料比EP/ZnOw复合材料具有更好的导热性能;当填料体积分数为15%时,EP/ZnOw/BN复合材料的热导率为1.06W/(mK)而,EP/ZnOw复合材料的热导率仅为0.98W/(mK)。     

Study on thermal conductive PA6 composites with 3-dimensional structured boron nitride hybrids

To develop thermally conductive PA6 composites with the aim of decreasing filler content, structure-complexed fillers were fabricated. This research presented an effective approach by noncovalent functionalization of poly(dopamine) (PDA) followed by silver nanoparticles decoration to fabricate 3-dimensional (3-D) structured boron nitride hybrids (BN@PDA@AgNPs). BN hybrids were then introduced into PA6 to prepare thermally conductive PA6 composites. The results demonstrated that PA6/BN hybrids (PMB) composites exhibited higher thermal conducivity compared with PA6/BN composites, which revealed more effective construction of thermal conductive network in the composites with the addition of 3-D structured fillers. The effects of BN hybrids with different loadings on thermal stability, mechanical property, as well as electrical resistance of the composites were also analyzed. Overall, the prepared PMB composites exhibited outstanding performance in thermal conductivity, thermal stability, mechanical property, while retaining good electrical insulating property, which showed a potential application in electronic packaging fields. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47630.     

Novel heat‐conductive composite silicone rubber

The silicone rubber with good thermal conductivity and electrical insulation was obtained by taking vinyl endblocked polymethylsiloxane as basic gum and thermally conductive, but electrically insulating hybrid Al₂O₃ powder as fillers. The effects of the amount of Al₂O₃ on the thermal conductivity, coefficient of thermal expansion (CTE), heat stability, and mechanical properties of the silicone rubber were investigated, and it was found that the thermal conductivity and heat stability increased, but the CTE decreased with increasing Al₂O₃ fillers content. The silicone rubber filled with hybrid Al₂O₃ fillers exhibited higher thermal conductivity compared with that filled with single particle size. Furthermore, a new type of thermally conductive silicone rubber composites, possessing thermal conductivity of 0.92 W/mK, good electrical insulation, and mechanical properties, was developed using electrical glass cloth as reinforcement. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 2478–2483, 2007     

LED用低热阻硅脂的制备

选用合适粒径的氮化铝和氧化铝为混杂导热填料、使用自制的硅烷低聚物为表面处理剂,以溶液插层法对混杂导热填料进行表面改性;然后与甲基苯基硅油混合制备了LED用低热阻导热硅脂。研究了导热填料的种类、粒径、表面处理剂种类及用量对导热硅脂的热导率和黏度的影响。采用LED灯作为实际测试平台表征了导热硅脂的导热性能。结果表明,当填料总质量分数为90.9%,粒径为5μm的氮化铝与粒径为1μm的氧化铝作混合填料且质量比为2.8∶1时,导热硅脂的热导率和黏度有较好的平衡;使用填料质量0.5%的硅烷低聚物对氮化铝和氧化铝混合填料进行表面处理有较好的处理效果;自制10号硅脂样品的黏度（25℃）为174 Pa·s,热阻为1.94℃/W,热导率为4.31 W/m·K。