The Analysis and Growth Mechanism of Core/Shell-type Ni/MnO Nanoparticls

以Ni和MnO2微米粉为原料,采用直流电弧等离子法在氢--氩混合气氛中合成了MnO包覆Ni纳米复合粒子.用XRD、TEM、TG--SDTA等方法分析了纳米粒子的相组成、形貌和热稳定性.结果表明: Ni/MnO 复合纳米粒子具有一致的“核/壳”微结构,尺寸分布在100--120 nm范围. 核和壳分别为Ni和MnO相.根据定量氧辅助V--L--S机制, Ni纳米核在复合粒子生长过程中的催化作用,是“核/壳”结构形成的重要因素.     

Ultrathin,flexible,and high-strength Ni/Cu/metallic glass/Cu/Ni composite with alternate magneto-electric structures for electromagnetic shielding

Electromagnetic interference (EMI) shielding materials with ultrathin,flexible,superior mechanical and thermal management properties are highly desirable for smart and wearable electronics.Here,ultrathin and flexible Ni/Cu/metallic glass/Cu/Ni (Ni/Cu/MG) multilayer composite with alternate magnetic and electrical structures was designed via facial electroless plating of Cu and Ni on an Fe-based metallic glass.The resultant 0.02 mm-thick Ni/Cu/MG composite displays a superior EMI shielding effectiveness (EMISE)of 35 dB and a great EMISE/t of 1750 dB/mm,which is greater than those of composites with monotonous multilayer or homogeneous structures.The improved EMI SE originates from the massive ohmic losses,the enhanced internal reflection/absorption,and the abundant interfacial polarization loss.Particularly,Ni/Cu/MG exhibits a high tensile strength of up to 1.2 GPa and outstanding mechanical stability,enabling the EMI SE remains unchanged after 10,000 times of bending.Moreover,Ni/Cu/MG has excellent Joule heating characteristics and thermal stability,which is very suitable for heating components of wearable hyperthermia devices.     

Ni and Cu incorporated mesoporous nanocomposite catalytic materials

Nickel and copper incorporated MCM-41-like mesoporous nanocomposite materials prepared by the direct hydrothermal synthesis and the impregnation procedures showed highly attractive pore structure and surface area results for catalytic applications. The XRD patterns showed that characteristic MCM-41 structure was preserved for the materials synthesized following an impregnation procedure before the calcination step. The surface area of the Cu impregnated material with a quite high Cu/Si atomic ratio (0.19) was 631 m2/g. Very narrow pore size distributions with an average pore diameter of about 2.7 nm were obtained as a result of plugging of some of the smaller pores by Cu nanoballs. For lower metal to Si ratios (for instance for Ni/Si = 0.06) much higher surface area values (1130 m2/g) were obtained. In the case of nanocomposite materials synthesized by the direct hydrothermal route, MCM-41 structure was not destroyed for samples containing metal to Si atomic ratios as high as 0.12. In the case of materials containing Cu/Si and Ni/Si ratios over 0.2 wider pore size distributions and some decrease of surface area were observed.     

SiO2 / Ni 核壳结构纳米粒子的制备及其磁性能

以硅酸钠为主要原料, 通过液相沉淀法在纳米镍粉表面包覆了一层SiO₂ 。应用XRD、FTIR、TEM、TGA、DSC 和VSM 对复合粉体的结构、形貌和磁性能进行了研究。结果表明, SiO₂ 以非晶态的形式包覆在纳米镍粒子表面, 形成了核壳结构, 降低了纳米粉体的团聚现象。TGA 和DSC 结果表明, SiO₂ 的包覆提高了纳米粉体的抗氧化性。磁性分析结果表明, 粉体包覆前由于表面氧化层(NiO) 的存在, 粉体的磁滞回线偏移; 包覆后的粉体由于SiO₂的存在, 饱和磁化强度降低, 矫顽力升高。      

Ultrasonic Welding of Ni and Cu Sheets

Ultrasonic metal welding is widely used in various fields due to its ability to weld a variety of materials such as new materials and sheet structures. In this study, a special horn with four-point tips was developed for the ultrasonic welding of Ni and Cu sheets used as electrode materials of the secondary cell. The effects of welding parameters (welding time, clamping pressure, and vibrational amplitude) on weldability were investigated using the developed horn. The weldability of Ni/Cu sheet was assessed via the tensile test, scanning electron microscope observation, and EDX-ray analysis of the weld zone. Experimental results showed that the optimal welding parameters were a welding time of 0.25 s, pressure of 0.20 MPa, and vibrational amplitude of 80%, with a welding strength of 87.45 N under these conditions. It was also confirmed that solid-state diffusion by vibrational and frictional heat was clearly generated at the welding interface under good welding conditions.     

Boosting Bifunctional Oxygen Electrocatalysis with 3D Graphene Aerogel‐Supported Ni/MnO Particles

Electrocatalysts for oxygen‐reduction and oxygen‐evolution reactions (ORR and OER) are crucial for metal–air batteries, where more costly Pt‐ and Ir/Ru‐based materials are the benchmark catalysts for ORR and OER, respectively. Herein, for the first time Ni is combined with MnO species, and a 3D porous graphene aerogel‐supported Ni/MnO (Ni–MnO/rGO aerogel) bifunctional catalyst is prepared via a facile and scalable hydrogel route. The synthetic strategy depends on the formation of a graphene oxide (GO) crosslinked poly(vinyl alcohol) hydrogel that allows for the efficient capture of highly active Ni/MnO particles after pyrolysis. Remarkably, the resulting Ni–MnO/rGO aerogels exhibit superior bifunctional catalytic performance for both ORR and OER in an alkaline electrolyte, which can compete with the previously reported bifunctional electrocatalysts. The MnO mainly contributes to the high activity for the ORR, while metallic Ni is responsible for the excellent OER activity. Moreover, such bifunctional catalyst can endow the homemade Zn–air battery with better power density, specific capacity, and cycling stability than mixed Pt/C + RuO₂ catalysts, demonstrating its potential feasibility in practical application of rechargeable metal–air batteries.     

Magnetization behaviour in ultrathin Co/Cu/Ni/Cu(001) trilayers

The magnetization of ultrathin multilayer systems depends in a very sensitive way on their composition. We consider the temperature dependence of magnetization and its orientation in three types of trilayers: 2ML Co/2ML Cu/4ML Ni/Cu(001), 1ML Co/2ML Cu/4ML Ni/Cu(001) and 1ML Co/2ML Cu/3ML Ni/Cu(001). The composition of each system leads to different interdependence of ordering temperatures characterizing the ferromagnetic films. It is shown that in all cases the sublayer magnetizations change gradually their directions as a function of temperature. The use of Néel sublattices concept in Valenta approach allows us to present all dependences in a layer resolved mode which leads to the conclusion that the spin reorientation process runs through non collinear magnetic superstructures.     

Cu surface segregation in Ni/Cu system

We report experimental evidence of Cu surface segregation in Ni/Cu system, during deposition of Ni film onto Cu substrate at room temperature and during heat treatment in vacuum. Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) by Tougaard's analysis results show that surface segregation defeats in competition with increase in Ni thickness and terminates when thickness of Ni increase to more than 4 nm. Surface energy and concentration were calculated using contact angle measurements and the results confirm that segregation reduces the surface energy. Surface segregation during heat treatment at 150-220 °C range as a function of time initially shows linear mass transfer. By solving Fick's equation and taking empirical diffusion coefficient, 125 ± 20 kJ/mol is obtained for activation enthalpy of effective diffusion.     

锂离子电池Li3-xMx N(M:Co,Ni,Cu)系列负极材料研究进展

Li3-xMxN(M:Co,Ni,Cu)具有首次脱锂容量大,良好的充放电可逆性等优点,是制备锂离子电池负极的优良材料.本文介绍了此系列材料的制备方法、结构、特性及其性能.     

Theoretical explanation of Ag/Cu and Cu/Ni nanoscale multilayers softening

Relationship between metallic multilayers hardness and monolayer thickness has been investigated and explained for electroplated Ag/Cu and Cu/Ni multilayers using a modified Thomas-Fermi-Dirac electron theory. Experiments reveal that the peak hardness of Ag/Cu multilayers occurs at the monolayer thickness of about 25 nm, while the peak hardness of Cu/Ni multilayers occurs at about 50 nm. Critical monolayer thickness corresponding to the peak hardness is approximated by the grain size limit of stable dislocations in Ag crystals for the Ag/Cu multilayers and in Cu crystals for Cu/Ni multilayers. Grains size limits are calculated based on a modified Thomas-Fermi-Dirac electron theory. Developed relationship between the critical monolayer thickness and the grains size limit helps understand nanoscale metallic multilayers softening.     

Molecular Dynamics Study on Interfacial Energy and Atomic Structure of Ag/Ni and Cu/Ni Heterophase System

The results of molecular dynamics calculations on the interfacial energies and atomic structures of Ag/Ni and Cu/Ni interfaces are presented. Calculation on Ag/Ni interfaces with low-index planes shows that those containing the (111) plane have the lowest energies, which is in agreement with the experiments. Comparing surface energy with interfacial energy, it is found the order of the interfacial energies of Ag/Ni and Cu/Ni containing the planes fall in the same order as solid-vapor surface energies of Ag, Cu and Ni. In this MD simulation, the relaxed atomic structure and dislocation network of (110)Ag||(110)Ni interface are coincident to HREM observations.     

Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging

The effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu (SAC) and SnPb solders with Au/Ni/Cu substrate during aging was investigated in this study. AuSn₄ needle-like intermetallic compound (IMC) formed at the interfaces of both SAC and SnPb solder joints after laser reflow. In SnPb solder joints, a layer-type ternary IMC, (Au,Ni)Sn₄, formed over a thin layer quaternary IMC (Au,Ni,Cu)₃Sn₄ after aging at 150 °C for 4 days, in which Cu came from the Cu pad below the Ni layer through diffusion. This (Au,Ni,Cu)₃Sn₄ IMC evolved into a new kind of quaternary IMC (Au,Ni,Cu)₆Sn₅ with further aging at 150 °C for 8 days because more Cu diffused through Ni and was involved into the IMC formation. For SAC solder joints, needle-like binary AuSn₄ IMC in as-soldered state changed into a layer-type quaternary IMC (Au,Ni,Cu)Sn₄. The quaternary IMC (Au,Ni,Cu)₆Sn₅, which has the same composition as those found in SnPb solder joints, was developed below the (Au,Ni,Cu)Sn₄ layer after aging at 150 °C for 8 days. It was found that Cu diffusion played a key role in the interfacial reaction and compound formation.     

Auger electron spectroscopy of high-speed-deformed Ni/Cu layers

Ni/Cu double- and multilayers subjected to high-speed deformation were investigated by Auger electron spectroscopy (AES) using depth profiling. Ni and Cu thin films were alternately deposited on a 0.3 mm thick Ni substrate using RF magnetron sputtering. The thickness of the double-layer was 90 nm, while that of the multilayer was 160 nm. High-speed compression was performed using bullet masses from 30.0 to 57.4 g at varying bullet speeds between 16.8 and 48.5 m s⁻¹. The strain rate ranged from 6.7×10⁴ to 8.4×10⁵ s⁻¹. Upon high-speed deformation, the thickness of the Ni/Cu double-layer was reduced to about 80% of its original value. The Cu thin film was compressed to a greater extent relative to the Ni thin film (by about 15%), which may be due to the difference in malleability between the two metals. At a strain rate of 8.4×10⁵ s⁻¹, the Ni/Cu double-layer virtually disappeared. Ni/Cu interdiffusion was enhanced by high-speed deformation. The degree of interdiffusion appeared to be greater at lower strain rates. Cu_0.5Ni_0.5 and Cu_0.75Ni_0.25 thin film alloys formed in the high-speed-deformed multilayer sample, indicating that high-speed compression could potentially be used to prepare thin film metal alloys.     

Highly enhanced mechanical properties in Cu matrix composites reinforced with graphene decorated metallic nanoparticles

This study investigated the preparation and mechanical performance of graphene/metal composites using Ni nanoparticles decorated graphene nanoplatelets (Ni-GPLs) as a reinforcing component in Cu matrix (Ni-GPL/Cu). Ni-GPLs consisting of well-dispersed Ni nanoparticles strongly attached on GPLs were successfully synthesized by chemically reducing Ni ions on the surface of GPLs. The Ni-GPL/Cu composites with only 0.8 vol% Ni-GPLs exhibited a significant improvement in ultimate tensile strength (UTS), being 42 % higher than that of monolithic Cu. The significant strength enhancement is attributed to the unique structure of Ni-GPLs, which was expected to generate a good dispersion and strong GPL–Cu interfacial bonding. The UTS of 0.8 vol% GPL/Cu composites was even lower than that of the monolithic Cu due to the GPL aggregates. The obtained results indicated that Ni-GPLs are novel and effective reinforcing components for greatly improving the mechanical properties of the graphene/metal composites.     

三价铈离子掺杂氯化钾的光致发光性能

采用水热蒸发法制备了KCl∶Ce3+荧光粉。测量并分析了材料在室温下的真空紫外激发光谱及相应的发射光谱。结果表明激发谱显示6个峰,峰位分别为149、194、206、219、233和251nm。其中149nm的激发峰是基质吸收引起的;194、206、219、233和251nm是Ce3+离子的4f→5d跃迁引起的。发射峰显示双峰结构,峰位分别是311和326nm。此峰对应于Ce3+离子的5d→4f(2F5/2,2F7/2)跃迁。     

Si3N4／Ti／Cu／Ni二次部分瞬间液相连接

在用Ｔｉ／Ｎｉ／Ｔｉ中间层进行Ｓｉ３Ｎ４陶瓷部分瞬间液相连接试验的基础上，设计了Ｔｉ／Ｃｕ／Ｎｉ中间层，提出二次部分瞬液相连接的新方法。认为二次部分瞬间液相连接能避免脆性Ｎｉ－Ｔｉ化合物层的形成，提高连接接头强度。     

A Composite Structure of Cu3Ge/Ge/C Anode Promise Better Rate Property for Lithium Battery

Much effort has been made to search for high energy and high power density electrode materials for lithium ion batteries. Here, a composite structure among Ge, C and Cu3Ge in Cu3Ge/Ge/C materials with a high rate performance of lithium batteries has been reported. Such Cu3Ge/Ge/C composite is synthesized through the in‐situ formation of Ge, C and Cu3Ge by one‐pot reaction. Density function theory (DFT) calculations and electrochemical impedance spectroscopy (EIS) suggest a higher electron mobility of the hibrid Cu3Ge/Ge/C composites through the in‐situ preparation. As a result, remarkable charge rate over 300 C (fast delithiated capability) and outstanding cycling stability (≈0.02% capacity decay per cycle for 500 cycles at 0.5 C) are achieved for the Cu3Ge/Ge/C composites anode. These Cu3Ge/Ge/C composites demonstrate another perspective to explore the energy storage materials and should provide a new pathway for the design of advanced electrode materials.     

CuO(CoO,MnO)/SiO_2纳米复合气凝胶催化剂载体的溶胶-凝胶法制备与表征

以正硅酸乙酯(tetraethyl orthosilicate,TEOS)、乙酸铜、乙酸钴、乙酸锰为原料,采用溶胶-凝胶法、常压干燥制备了CuO(CoO,MnO)/SiO2纳米复合气凝胶.分析了过渡金属氧化物MO与Sio2的质量比、温度和pH值对凝胶形成的影响.采用场致发射扫描电镜(FE-SEM)、BET、傅里叶变换红外分析(FTIR)、热重-差热分析(TG-DTA)、电子散射能谱分析(EDS)和化学分析等对CuO(CoO,MnO)/SiO2纳米复合气凝胶的微观结构和组成进行了研究.结果表明,纳米复合气凝胶的颗粒约在20～100nm,比表面积为344～733m2/g,孔径范围为2～22nm,而且过渡金属Cu、Co和Mn能够与氧形成部分一O-M-O-桥键连接,并与Si通过化学键形成三维网络结构;纳米复合气凝胶试样中的多元过渡金属氧化物含量可控制在3%～75%(质量分数).这种结构和组成既有利于提高催化剂负载量,又可充分发挥过渡金属氧化物的助催化作用.     

Preparation of super-hydrophobic Cu/Ni coating with micro-nano hierarchical structure

Micro-nano hierarchical structured Cu/Ni multilayer coating was prepared by a simple two-step method combined with electroless and electro deposition. Structure and morphology of the as-prepared Cu/Ni multilayer coating were analyzed by X-ray diffractometer and field emission scanning electron microscopy. Results show that micro-nano Cu/Ni coating is well-crystallized and exhibits sea cucumber-like microstructure with Ni nanocone arrays uniformly dispersed perpendicular to the circular conical surface of Cu cone. Static contact angles were measured to investigate the surfaces' wettability. The result reveals that the Cu/Ni multilayer coating is super-hydrophobic, of which the static contact angle with test liquid (water) was 156°(> 150°).Due to its super-hydrophobic property and unique shape, Cu/Ni multilayer coating is expected to have extensive practical applications.