Cure kinetics of a glass/epoxy prepreg by dynamic differential scanning calorimetry

Dicyandiamide (DICY)‐cured epoxy resins are important materials for structural adhesives and matrix resins for fiber‐reinforced prepregs. Dynamic differential scanning calorimetry (DSC) with heating rates of 2.5, 5, 10, and 15°C/min was used to study the curing behavior of the epoxy prepreg Hexply 1454 system, which consisted of diglycidyl ether of bisphenol A, DICY, and Urone reinforced by glass fibers. The curing kinetic parameters were determined with three different methods and compared. These were the Kissinger, Ozawa, and Borchardt–Daniels kinetic approaches. The lowest activation energy (76.8 kJ/mol) was obtained with the Kissinger method, whereas the highest value (87.9 kJ/mol) was obtained with the Borchardt–Daniels approach. The average pre‐exponential factor varied from 0.0947 × 10⁹ to 2.60 × 10⁹ s⁻¹. The orders of the cure reaction changed little with the heating rate, so the effect of the heating rate on the reaction order was not significant. It was interesting that the overall reaction order obtained from all three methods was nearly constant (≅2.4). There was good agreement between all of the methods with the experimental data. However, the best agreement with the experimental data was seen with the Ozawa kinetic parameters, and the most deviation was seen with the Borchardt kinetic parameters. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Cure kinetics of an epoxidized hemp oil based bioresin system

A novel epoxidized hemp oil (EHO) based bioresin was synthesized by epoxidation in situ with peroxyacetic acid. In this research the cure kinetics of an EHO based bioresin system cured with triethylenetetramine (TETA) was studied by differential scanning calorimetry using both isothermal and nonisothermal data. The results show that the curing behavior can be modeled with a modified Kamal autocatalytic model that accounts for a shift to a diffusion‐controlled reaction postvitrification. The total order of the reaction was found to decrease with an increase in temperature from ～ 5.2 at 110°C to ～ 2.4 at 120°C. Dynamic activation energies were determined from the Kissinger (51.8 kJ/mol) and Ozawa‐Flynn‐Wall (56.3 kJ/mol) methods. Activation energies determined from the autocatalytic method were 139.5 kJ/mol and ?80.5 kJ/mol. The observed negative activation energy is thought to be due to an unidentified competitive reaction that gives rise to the appearance of k₂ decreasing with increasing temperature. The agreement of fit of the model predictions with experimental values was satisfactory for all temperatures. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Cure kinetics of a diglycidyl ether of bisphenol a epoxy network (n = 0) with isophorone diamine

The study of the cure reaction of a diglycidyl ether of bisphenol A epoxy network with isophorone diamine is interesting for evaluating the industrial behavior of this material. The total enthalpy of reaction, the glass‐transition temperature, and the partial enthalpies at different curing temperatures have been determined with differential scanning calorimetry in dynamic and isothermal modes. With these experimental data, the degree of conversion and the reaction rate have been obtained. A kinetic model introduces the mechanisms occurring during an epoxy chemical cure reaction. A modification of the kinetic model accounting for the influence of the diffusion of the reactive groups at high conversions is used. A thermodynamic study has allowed the calculation of the enthalpy, entropy, and Gibbs free energy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Evaluation of the complex hygrothermal behaviors of epoxy–amine systems

In this study, the complex hygrothermal behavior of two epoxy systems used for strengthening applications was studied. In these systems, property loss by plasticization simultaneously occurred with property gain during additional curing. A comparison of the changes in the glass-transition temperature (T_g) and crosslink density with water immersion at different temperatures clearly showed that the two effects of additional curing by a postcuring reaction and plasticization by water absorption were in competition with each other during the exposure. The changes in the conversion with different exposure conditions suggested that water accelerated the postcuring reaction, even at low temperatures; this resulted in a significant difference in the postcuring reaction between unexposed and exposed epoxies. The construction of the plot of T_g versus conversion for the unexposed system and the placement of the T_g for exposed systems onto this master plot provided a method for evaluating the plasticization effect while excluding the influence of additional curing. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

The cure kinetics and mechanisms of an epoxy oligomer based on diglycidyl ether of bisphenol A (DGEBA), polymerized with a liquid aromatic diamine based on diethyl toluene diamine (DETDA 80), and its blends with poly(ether imide) (PEI) at concentrations of 0–15 wt % were studied with differential scanning calorimetry under dynamic and isothermal conditions. The kinetic analyses were performed with a phenomenological approach. The reaction mechanism of the blends remained the same as that of the neat epoxy. However, the addition of PEI had a marked effect on the cure kinetics in the DGEBA/DETDA 80 system. The rate of reaction decreased with an increase in the thermoplastic content. Diffusion control was incorporated to describe the cure behavior of the blends in the latter stages. Greater diffusion control was observed as the PEI concentration increased and the cure temperature decreased. Polymer blends based on this epoxy/liquid aromatic diamine had not been previously studied from a kinetic viewpoint. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 660–672, 2005     

Isothermal differential scanning calorimetry study of the cure kinetics of a novel aromatic maleimide with an acetylene terminal

An isothermal differential scanning calorimetry (DSC) study on the cure kinetics was performed on N-(3-acetylenephenyl)maleimide (3-APMI) monomer to determine a suitable cure model. The 3-APMI monomer reported in our prior article was a novel aromatic maleimide monomer with an acetylene terminal that would be an ideal candidate for heat-resistant composites. The isothermal DSC study was carried out in the temperature range 150–200°C. Although the cure temperatures were different, the shapes of the conversion curves were similar, and all of the cure reactions could be described by an nth-order kinetic model. In particular, the cure reaction at the initial stage was a first-order kinetic reaction. The cure kinetic parameters of the 3-APMI monomer, including the reaction model, activation energy, and frequency factor, were determined. This information was very useful for defining the process parameters, final properties, and quality control of the cured 3-APMI monomer. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Study of reaction kinetics of epoxy and a nickel(II) complex using dynamic DSC technique

The curing reaction kinetics of an epoxy based on the diglycidyl ether of bisphenol A (DGEBA) with an inorganic complex based on nickel(II) chelate with ethylenediamine (en) as a ligand were studied using DSC in dynamic mode. The complex curing agent was synthesized and characterized by the elemental analysis, FT‐IR, and ICP‐Plasma techniques. Thermal dissociation behavior of curing agent was also studied using thermogravimetric (TG) analysis in isolated form. Three kinetic models, Kissinger, Ozawa‐Flynn‐Wall, and Expanded Freeman‐Carrole, were used to determine the kinetic parameters. The effect of hardener concentration on the kinetic parameters and the shape of DSC thermograms of the DGEBA/Ni(en)₃Br₂ system were investigated. Finally, the previous proposed mechanism by another researcher was used to explain the DSC data in detail. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 265–271, 2005     

Cure kinetics of the cardanyl acrylate–styrene system using isothermal differential scanning calorimetry

The curing kinetics of styrene (30 wt %) and cardanyl acrylate (70 wt %), which was synthesized from cardanol and acryloyl chloride, was investigated by differential scanning calorimetry under isothermal condition. The method allows determination of the most suitable kinetic model and corresponding parameters. All kinetic parameters including the reaction order, activation energy E_a and kinetic rate constant were evaluated. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2034–2039, 2002     

Cure kinetics of epoxy resins by differential scanning calorimetry technique

The curing reactions of epoxy resins with aliphatic amine are investigated using the differential scanning calorimetry technique with a single dynamic scan. The rate of the reaction was followed over the temperature range 30–250°C, and the activation energy and the order of the reaction are determined using four different computational methods. The activation energy for the various epoxy systems is observed in the range 40–76 kJ mol^?1 and the order of the reaction is observed to be ? 1·0.     

Isothermal and nonisothermal cure kinetics of an epoxy/poly(oxypropylene)diamine/octadecylammonium modified montmorillonite system

The effect of an octadecylammonium‐exchanged montmorillonite on the curing kinetics of a thermoset system based on a bisphenol A epoxy resin and a poly(oxypropylene)diamine curing agent were studied with differential scanning calorimetry (DSC) in isothermal and dynamic (constant‐heating‐rate) conditions. Montmorillonite and the prepared composites were characterized by X‐ray diffraction analysis and simultaneous DSC and thermogravimetric analysis. The analysis of the DSC data indicated that the intercalated octadecylammonium cations catalyzed the epoxy–amine polymerization. A kinetic model, arising from an autocatalyzed reaction mechanism, was applied to the DSC data. Fairly good agreement between the experimental data and the modeling data was obtained. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1765–1771, 2006     

Factors influencing the glass transition of DGEBA-anhydride epoxy resins

A number of chemical and physical factors influence the glass transition behaviour of anhydride-cured diglycidyl ether of bisphenol A (DGEBA) type epoxy resins. Several of these were investigated using differential scanning calorimetry to assess the nature of the glass transition, the transition temperature and the glass- and liquid-phase specific heats. The influence of molecular weight and chemical functionality, cooling rate and silica fillers were investigated for unreacted epoxy prepolymers. Two anhydride-cured systems were also considered and the influence of cure with and without silica fillers and the effect of phase separation and cooling rate were investigated.     

Online near‐infrared measurements of an epoxy cure process compared to mathematical modeling based on differential scanning calorimetry measurements

An epoxy resin containing diglycidyl ether of bisphenol A, dicyandiamide, and an accelerator (diurone) was investigated under different cure cycles. The mathematical prediction of the degree of cure in a thermoset as a function of time and temperature was investigated and compared to measured data. Near‐infrared analysis was used to measure the conversion of epoxy and primary amine and the production of hydroxyl. Modulated differential scanning calorimetry was used to measure the changes in the heat capacity during cure. The measurements revealed differences in the primary amine conversion and hydroxyl production, and close relations to the measurements of heat capacity were found. The measurements of the degree of cure revealed that cure cycles initiated at 80°C produced a lower degree of cure than cure cycles initiated at 90°C, although all cure cycles were postcured at 110°C. These findings were to some degree supported by measurements of the primary amine conversion and hydroxyl production. The characteristics found were attributed to differences in the cure mechanisms. The mathematical model did not incorporate these differences, and this may have led to discrepancies between the predicted and actual values of the degree of cure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Cure kinetics of epoxy resin and aromatic diamines

The kinetics of curing reaction of a diglycidyl ether of a bisphenol‐A based epoxy (DGEBA) with 4,4′‐diaminostillbene (DAS) and 4,4′‐diaminoazobenzene (DAAB) as curing agents are studied by differential scanning calorimetery (DSC) using the isothermal technique. The experimental data show that the cure reaction is autocatalytic in nature, and all kinetic parameters of the curing reaction are determined using a semiempirical equation. The reaction of DGEBA with DAS is faster than that with DAAB under the same conditions and the activation energies of both systems are higher than those reported for other aromatic diamines. With increasing isothermal temperature and concentration of curing agents the rate constants are increased by the increasing of probability collisions between epoxide and primary amine groups while the activation energies remain constant. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 1049–1056, 2004     

Understanding the effect of chain entanglement on the glass transition of a hydrophilic polymer

In this article, we report an interesting phenomenon of the glass transition temperature (T_g) deviation of a hydrophilic polymer. Polyacrylamide (PAL) samples with different extents of chain entanglement were prepared by spray drying and solution casting. We found that the glass transition temperature increases as the extent of chain entanglement decreases upon the sub‐T_g annealing. The water content in the PAL matrix is found with no direct correlation to T_g. However, the observation of a faster diffusion process of water in the disentangled PAL matrix offers an evidence of a faster relaxation process of disentangled PAL molecules. The T_g increase of the disentangled PAL samples is believed to be associated with the increased molecular interaction during the chain relaxation process upon the sub‐T_g annealing. A macroscopic evidence is the fact that the density of the hot‐laminated samples increases as the extent of chain entanglement decreases. A thermodynamic analysis suggests that enthalpy more than entropy favors an elevated T_g of a disentangled hydrophilic polymer upon the sub‐T_g annealing. We believe that this research provides new understanding of T_g of the hydrophilic polymers, which are being extensively used in bio‐related studies. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Carbon nanofiber paper and its effect on cure kinetics of low temperature epoxy resin

In this study, the preparation, properties, and characterization of thin films or “nanopapers” of carbon nanofibers (CNFs) were studied. Specifically, a layer-by-layer nanopaper preparation method was used, which significantly improved the mechanical properties of nanopapers. The effect of CNF nanopaper on the cure kinetics of a low temperature epoxy resin was studied. A modified autocatalytic model was used to represent the reaction kinetics. It was found that the presence of CNF nanopaper substantially increased the resin reaction rate and final conversion. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Curing kinetics,thermal property,and stability of tetrabromo-bisphenol-A epoxy resin with 4,4′-diaminodiphenyl ether

The curing reaction of tetrabromo-bisphenol-A epoxy resin (TBBPAER) with 4,4′-diaminodiphenyl ether (DDE) was studied by isothermal differential scanning calorimetry (DSC) in the temperature range of 110–140°C. The results show that the isothermal cure reaction of TBBPAER–DDE in the kinetic control stage is autocatalytic in nature and does not follow simple nth-order kinetics. The autocatalytic behavior was well described by the Kamal equation. Kinetic parameters, including 2 rate constants, k₁ and k₂, and 2 reaction orders, m and n, were derived. The activation energies for these rate constants were 83.32 and 37.07 kJ/mol, respectively. The sum of the reaction orders is around 3. The glass transition temperatures (T_gs) were measured for the TBBPAER–DDE samples cured partially in isothermal temperature. With the degree of cure varies, different glass transition behaviors were observed. By monitoring the variation in these T_gs, it is illustrated that the network of the system is formed via different stages according to the sequence reactions of primary and second amines with epoxides. It is due to the presence of the 4 bromine atoms in the structure of TBBPAER that this curing process can be clearly observed in DSC curves. The thermal stability of this system studied by differential thermal analysis–thermogravimetric analysis illustrates that the TBBPAER–DDE material can automatically debrominate and takes the effect of flame retarding when the temperature reaches 238.5°C. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 70: 1991–2000, 1998     

Curing kinetics and chemorheology of epoxy/anhydride system

The curing kinetics and chemorheology of a low‐viscosity laminating system, based on a bisphenol A epoxy resin, an anhydride curing agent, and a heterocyclic amine accelerator, are investigated. The curing kinetics are studied in both dynamic and isothermal conditions by means of differential scanning calorimetry. The steady shear and dynamic viscosity are measured throughout the epoxy/anhydride cure. The curing kinetics of the thermoset system is described by a modified Kamal kinetic model, accounting for the diffusion‐control effect. A chemorheological model that describes the system viscosity as a function of temperature and conversion is proposed. This model is a combination of the Williams–Landel–Ferry equation and a conversion term originally used by Castro and Macosko. A good agreement between the predicted and experimental results is obtained. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 3012–3019, 2003     

Effects of graphene oxide and chemically reduced graphene oxide on the curing kinetics of epoxy amine composites

The curing kinetics of epoxy nanocomposites prepared by incorporating graphene oxide (GO) and chemically reduced graphene oxide (rGO) have been studied using isothermal and nonisothermal differential scanning calorimetry. The kinetic parameters of the curing processes in these systems have been determined by a Kamal and Sourour phenomenological model expanded by a diffusion factor. The predicted curves determined using the kinetic parameters fit well with the isothermal DSC thermograms revealing the proposed kinetic equation clearly explains the curing kinetics of the prepared epoxy amine nanocomposites. Experimental and modeling results demonstrate the presence of an accelerating effect of the GO on the cure of the resin matrix. The use of rGO instead of GO resulted in a slight acceleration reaction rate due to the reduced presence of oxidation groups in rGO. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44803.