玻璃微球表面化学镀银

研究了玻璃微球表面镀银过程中还原剂对镀层结合紧密程度、产品导电性的影响,并对银镀层的性能进行了测试。结果表明,用葡萄糖和酒石酸钾钠混合作还原剂改进了镀层的均匀度和结合强度。镀银玻璃微球有望用作高导电性聚合材料的导电填料。     

玻璃微珠化学镀银

本文以40μm的实心玻璃微珠为原料,直接采用[Ag(NH3)2]OH溶液进行活化处理,在其表面镀覆了一层致密、均匀的银层。探讨了温度、pH、银含量以及镀液添加顺序等因素对化学镀银的影响。其压实电阻、表面形貌的测试结果表明,本实验制备的镀银玻璃微珠具有较好的导电性和表面形貌,在导电填料中可替代部分银粉;当银含量为9%~15%时,D50为40μm的镀银玻璃微珠镀层最为致密、均匀。     

空心微珠化学镀银研究

使用钛酸酯偶联剂对空心微珠表面进行处理后再进行超声波辅助化学镀银,并借助SEM、EDX、XRD和XPS检测技术对镀层结构、表面形貌和成分进行了分析。研究结果表明,不同还原剂化学镀银微珠的导电性有所差异,其中葡萄糖镀银微珠导电性最好。不同还原剂化学镀银微珠表面形貌明显不同,由此引起表面反射光谱的不同。     

涤纶织物上化学镀银的晶体结构与性能

利用化学镀,在涤纶织物上制备了金属银薄膜.化学镀银液配方及工艺条件为:硝酸银3.0g/L,氢氧化钠2.0g/L,葡萄糖2.0 g/L,氨水适量,温度25℃,pH=11.采用扫描电镜和X射线衍射研究了薄膜的表面形貌和晶体结构,采用紫外分光光度计和静电伏特计分析了镀银涤纶的抗紫外及抗静电特性.结果表明,化学镀银后涤纶织物的抗紫外和抗静电性能有了很大提高.     

Development of electroless silver plating on Para‐aramid fibers and growth morphology of silver deposits

The development of a conductive fiber with flame resistance is an urgent concern particularly in national defense and other specialized fields. Aramid fibers (para‐ or meta‐) exihibit high strength and excellent fire resistance. Electroless silver plating on para‐aramid fibers and growth morphology of silver deposits was investigated in the present work. The surface of para‐aramid fibers was roughened using sodium hydride/dimethyl sulfoxide to guarantee successful electroless plating. Two complexing agents (ethylene diamine/ammonia) and two reducing agents (glucose/seignette salt) were used for the electroless silver plating bath design. Structure and properties of the resulting silver‐deposited para‐aramid fibers were evaluated based on scanning electron microscopy, silver weight gain percentage calculation, electrical resistance measurement, crystal structure analysis, and mechanical properties test. The results showed that a higher silver weight gain was advantageous to the improvement of conductivity for the silver‐deposited para‐aramid fibers. The obtained silver deposit was homogenous and compact. Electroless silver‐plating deposits were considered to be three‐dimensional nucleation and growth model (Volmer–Weber). Black, silver gray, and white deposits appeared sequentially with progressive plating. The breaking strength of silver‐deposited para‐aramid fibers remained at value up to 44 N. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

碳纤维布化学镀银工艺的优化

为制备新型无源干扰材料,采用化学镀方法在碳纤维布表面沉积金属银。研究了化学镀银液的配方组分及施镀温度、施镀时间等工艺参数对化学镀银碳纤维布增重率的影响,并研究了施镀时间与镀银碳纤维布导电性之间的关系。较理想的碳纤维布化学镀银工艺为10.5g/L硝酸银、100mL/L氨水、10g/L氢氧化钠、22.5g/L葡萄糖、50mL/L乙醇,施镀温度20°C,施镀时间10min。所得碳纤维布化学镀银镀覆均匀,光泽性好,镀层结合力强,导电性好。     

非金属粉体化学镀银的研究进展

介绍了非金属粉体化学镀银的发展趋势和特点。综述了非金属粉体如空心玻璃微珠、SnO2、A l2O3、纤维、碳纳米管、石墨、BaTiO3等粉体化学镀银的工艺研究现状及应用。讨论了非金属粉体化学镀银的影响因素,包括前处理、表面活性剂、主盐浓度、温度、银离子滴加的速度等。     

Electroless plating of moisture‐curable polyurethane undercoating films

The compatibility of using moisture‐curable polyurethane (MCPU) system as a thin undercoating layer with electroless plating process was evaluated. The characteristics of the MCPU before and after chemical etching treatment were analyzed using atomic force microscope (AFM), scanning electrode microscope (SEM), contact‐angle measurements, and (Fourier‐Transform Infrared) FTIR spectroscopy. We found that surface morphology and roughness of the MCPU is affected by curing period and etching times. A proper combination of curing period and etching times are critical for obtaining a fully metallized surface. All MCPU samples that were etched for 15 min show poor plating performance due to surface damage caused by mild etching treatment. A standard pull‐off testing method (ASTM 4541) was used to evaluate the adhesion strength of nickel–MCPU. Only samples that were postcured for 4 days show influence of surface roughness on adhesion strength. On average, samples that were postcured for 7 days before electroless plating showed better adhesion of nickel–MCPU compared with samples that were postcured for 2 or 4 days. The results show that MCPU system can be used as a thin undercoating layer for electroless plating. It also offers smooth metal–polymer interface and therefore has the potential to be exploited for use in many electroless plating applications including in the decorative such as ornaments and display items and also in electronic industries. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 1554–1565, 2007     

涤纶基铜层表面化学镀镍–磷合金工艺

以涤纶织物为基材,对其化学镀铜后再化学镀镍–磷合金镀层。探讨了化学镀Ni–P合金工艺各因素对镀金属织物导电性和增重率的影响,通过正交试验优化了化学镀Ni–P合金工艺,并对镀Cu/Ni–P合金织物的结合牢度、耐蚀性和电磁屏蔽效能进行了表征。结果表明,涤纶基铜层表面化学镀Ni–P合金镀层的最优配方和工艺为:NiS O4·6H2O 26 g/L,Na H2PO2·H2O 24 g/L,Na3C6H5O730 g/L,Na2B4O7·10H2O 6 g/L,温度80°C,p H 11,时间25 min。最优工艺下制备的镀铜/镍–磷织物的结合强度高,耐腐蚀性和电磁屏蔽性能良好。     

水钻表面镀银新工艺

本文提出了一种水钻表面化学镀银新工艺。并对镀层的结合力和抗变色性能的改善提出了有效措施。经粗化处理 ,可以提高镀层结合力 ,而又不影响镀层光泽。浸渍抗变色液 ,涂覆抗变色油漆、取代传统重铬酸盐钝化较好地提高了镀银层的抗变色性能。     

还原剂对涤纶织物化学镀银性能的影响

采用5种不同的还原剂对涤纶织物进行化学镀银.主要研究了还原剂对镀速的影响,测定了镀银织物的电磁波屏蔽、表面比电阻、耐磨性和结合力等性能,并借助扫描电镜、X射线衍射对镀层表面形貌和结构进行了分析.结果表明:不同还原荆镀银的镀速有所不同,镀层结构没有改变,晶粒大小有所不同;当增重率相同时,葡萄糖镀银织物的电磁波屏蔽性能最好...     

涤纶织物纳米碳化锆复合镀Ni-P镀层

采用化学复合镀技术,实现了涤纶织物纳米碳化锆酸性、碱性复合镀Ni-P.借助扫描电镜、X射线能谱仪、X射线衍射仪和热重分析仪对镀层表面形貌、成分、结构以及织物热性能进行了研究,并测试了化学镀织物的电磁波屏蔽效能和耐磨性能.结果表明:酸性化学镀Ni-P为无定形态,加入吐温80后向结晶态转变,为典型的纳米晶结构,加入纳米碳化...     

Properties investigation on electrically conductive adhesives based on acrylate resin filled with silver microsheets and silver plating carbon fibers

The introduction of highly electrically conductive fillers (Ag microsheets and silver plating carbon fiber) can functionally improve the electrical conductivity of acrylate resin. In this study, Ag microsheets and Ag/CF were thus introduced into acrylate polymer via solution blending method under ultrasonication in order to improve the electrical conductivity of the acrylate resin. The properties and microstructures of Ag microsheets, CF, Ag/CF and ECAs were performed by scan electron microscope (SEM), X-ray diffraction analysis (XRD), etc. SEM images and XRD results illustrated that the impurities in carbon fiber could be completely removed after the adequately alkali treatment. The SEM images showed that large numbers of metallic silver particles were uniformly and densely coated on the surface of the carbon fibers and hybrid fillers (silver microsheets and Ag/CF) could homogeneously disperse in acrylate resin. Electrical conductivity measurements demonstrated that the electrical conductivity of ECAs increased with the increasing content of hybrid fillers and the percolation threshold of ECAs was 5 wt%. The electrical conductivity of ECAs at its percolation threshold was 15.79 S/cm, which was two orders of magnitude higher than that of the ECAs based on acrylate resin filled with silver microsheets. The increment in Ag/CF contents may decrease 180° peel strength and raise shear strength with low content of Ag/CF. The overall performance of ECAs was optimum with 2 wt% Ag/CF. The TGA analysis indicated that ECAs possess excellent thermal stability.     

45号钢表面化学镀镍磷合金

在45号钢表面化学镀镍磷合金，获得含磷10％（质量分数）的镍磷合金镀层，比较了其与2Cr13不锈钢的耐磨性及在不同腐蚀介质中的耐蚀性，结果表明，含磷10％的镍磷合金层的耐磨，耐蚀性均优于2Cr13不锈钢。     

化学镀法制备镀银云母

采用敏化–活化两步法对云母粉进行预处理后再化学镀银。研究了镀液p H、银含量和云母粉与Ag NO3质量比对镀银云母粉导电性的影响。通过红外光谱仪和X射线衍射仪表征了镀银云母粉的组织结构。通过表面形貌分析,研究了粗化预处理对云母粉化学镀银效果的影响。结果表明,粗化可提高粉体表面的粗糙度,使后续银镀层更致密。当Ag NO3投加量为15 g/L,云母粉与Ag NO3质量比为2.5∶1,p H为12时,银沉积率最高,镀银云母粉的表面形貌和导电性最好(体积电阻率约0.088?·cm)。化学镀银云母粉有望替代部分银粉作为导电填料,并在涂料或塑料等高分子材料中应用。     

涤纶织物化学镀银纳米Al2O3复合镀层

用不同分散剂进行涤纶织物纳米Al2O3颗粒化学复合镀银.镀银液配方为:硝酸银5.1g/L,葡萄糖8g/L,氢氧化钾3.5 g/L,氨水适童.结果发现:使用纯水分散时镀速最快;用聚乙烯吡啶烷酮和海藻酸钠混合物分散时镀层表面粗糙,但耐磨性能和结合力有所提高.加入纳米Al2O3颗粒对镀层结构没有影响,但会使晶粒尺寸增大.与普...     

涤纶织物化学镀Ni-Co-Fe-P的制备及性能表征

基于化学镀技术在涤纶织物表面进行了化学镀Ni-Co-Fe-P处理.在单因素实验的基础上对化学镀工艺进行了正交实验设计,筛选出沉积速率高、稳定性好的工艺配方.采用扫描电子显微镜(SEM)、X射线能谱仪(EDS)对镀层形貌、组分进行表征,并对镀后织物的电磁波屏蔽效能进行测定.结果表明:在缓冲剂的质量浓度为14 g/L,镀覆...     

空心玻璃微珠无钯活化化学镀银的研究

基于银镜反应原理,不经过粗化和活化直接对空心玻璃微珠进行化学镀银。采用单因素分析法,研究了硝酸银、葡萄糖、装载量、氢氧化钠和无水乙醇对银的利用率以及镀层的增重率、导电性能和结合强度等的影响,并借助扫描电镜和X射线衍射仪对镀层的表面形貌和结构进行了分析。结果表明:与胶体钯活化工艺相比,无钯活化化学镀银工艺的银的利用率高,镀层均匀、致密,导电性好,结合强度高。     

杨木板材表面化学镀镍

实验研究了普通杨木单板表面化学镀镍的操作方法、工艺条件,讨论了各种操作因素对镀层质量的影响,试验了化学镀层与镀件基体的结合力,确定了化学镀镍的工艺流程和工艺条件。实验结果表明,杨木板材经过预处理及敏化、活化处理后,化学镀镍溶液的pH值控制在8.5,镀镍温度控制在65℃,反应时间50min,杨木板材表面可以得到较好的化学镀层。     

表面活性剂对空心玻璃微珠化学镀银影响的研究

采用不同的表面活性剂对化学镀液进行分散、润湿,用AgNO3活化剂代替传统的PdC12进行化学镀银包覆空心玻璃微珠,并对所得银包粉体进行粒径分析、煅烧。研究了表面活性剂对化学镀银的影响。结果显示:包覆均匀的颗粒煅烧效果好,而且用PVP作为表面活性剂化学镀银能得到低于4×10-3Ω·cm的体积电阻的导电填料。