A 200-MHz 16-bit super high-speed signal processor (SSSP) LSI

A 200-MHz 16-b BiCMOS super high-speed signal processing (SSSP) circuit has been developed for high-speed digital signal processor (DSP) LSIs. In order to produce extremely fast LSI circuits, several novel techniques have been combined for integration of the SSSP. They include a redundant binary convolver architecture, a double-stage pipelined convolver architecture, and submicrometer BiCMOS drivers with large capacitive load drivability. The SSSP performs 200-MHz addition. The chip, which was fabricated with 0.8-μm BiCMOS and triple-layer metallization technology, has an area of 5.87 mm×5.74 mm and contains 20150 transistors. It operates at a clock frequency of 200 MHz with a single 5-V power supply and typically consumes 800 mW     

A 6-ns ECL 100 K I/O and 8-ns 3.3-V TTL I/O 4-Mb BiCMOS SRAM

The authors report a 4 M word×1 b/1 M word×4 b BiCMOS SRAM that can be metal mask programmed as either a 6-ns access time for an ECL 100 K I/O interface to an 8-ns access time for a 3.3-V TTL I/O interface. Die size is 18.87 mm×8.77 mm. Memory cell size is 5.8 μm×3.2 μm. In order to achieve such high-speed address access times the following technologies were developed: (1) a BiCMOS level converter that directly connects the ECL signal level to the CMOS level; (2) a high-speed BiCMOS circuit with low threshold voltage nMOSFETs; (3) a design method for determining the optimum number of decoder gate stages and the optimum size of gate transistors; (4) high-speed bipolar sensing circuits used at 3.3-V supply voltage; and (5) 0.55-μm BiCMOS process technology with a triple-well structure     

A 3.84 GIPS integrated memory array processor with 64 processingelements and a 2-Mb SRAM

An integrated memory array processor (IMAP) ULSI with 64 processing elements and a 2-Mb SRAM has been developed for image processing. The chip attains a 3.84 GIPS peak performance through the use of SIMD parallel processing and a 1.28 GByte/s on-chip processor-memory bandwidth. The IMAP is capable of parallel indirect addressing, which increases applications for parallel algorithms. Large power consumption with the wide memory bandwidth is avoided by reducing the number of active sense amplifiers and adopting dynamic power control. Fabricated with a 0.55-μm BiCMOS double layer metal process technology, the IMAP contains 11 million transistors in a 15.1×15.6 mm² die area     

A 120-MHz BiCMOS superscalar RISC processor

A superscalar RISC processor contains 2.8 million transistors in a die size of 16.2 mm×16.5 mm, and utilizes 3.3 V/0.5 μm BiCMOS technology. In order to take advantage of superscalar performance without incurring penalties from a slower clock or a longer pipeline, a tag bit is implemented in the instruction cache to indicate dependency between two instructions. A performance gain of up to 37% is obtained with only a 3.5% area overhead from our superscalar design     

A 12-b 750-ns subranging A/D converter with self-correcting S/H

The author presents results of a 12-b BiCMOS sampling analog-to-digital converter (ADC) IC. The ADC achieves full accuracy with an overall conversion time of 750 ns including sample acquisition. In addition, the design provides a 2.5-V reference output that can be used as the main reference for the ADC. A 2-μm feature size BiCMOS process with 3-GHz polysilicon emitter n-p-n transistors was used to implement the design. The resulting die is 29.2 mm² and nominally dissipates 600 mW     

A 300-MHz 16-b BiCMOS video signal processor

A 300-MHz 16-b full-programmable parallel-pipelined video signal processor ULSI has been developed. With multifunctional arithmetic units to achieve parallel vector processing, and with a phase-locked-loop (PLL) type clock generator to help attain the 300-MHz internal operating speed, this ULSI is able to attain, with only one chip, 30-frame-per-second full-CIF video data coding based on CCITT H.261. Two different types of pass-transistor BinMOS circuits have been developed to help achieve an access time of 3 ns for a 146-kb SRAM and for data buses. Fabricated with a 0.5-μm BiCMOS and triple-layer metallization process technology, the video signal processor ULSI contains 1.27-million transistors in a 16.5×17.0-mm² die area     

New full-voltage-swing BiCMOS buffers

Circuit techniques are presented for increasing the voltage swing of BiCMOS buffers through active charging and discharging using complementary bipolar drivers. These BiCMOS circuits offer near rail-to-rail output voltage swing, higher noise margins, and higher speed of operation at scaled-down power supply voltages. The circuits are simulated and compared to BiCMOS and CMOS buffers. The comparison shows that the conventional BiCMOS and the complementary BiCMOS buffers are efficient for power supply voltages greater than 3V and that if the power supply voltage is scaled down (<3 V) and the load capacitance is large (>1 pF), the complementary BiCMOS buffers would be the most suitable choice. They provide high speed and low delay to load sensitivity and high noise margins. The first implementation is favorable near a 2.5-V power supply for its smaller area     

A BiCMOS wideband operational amplifier with 900 MHz gain-bandwidth and 90 dB DC gain

A fully differential operational amplifier has been designed and fabricated for a novel high resolution and high frequency analog-to-digital converter(>12-bit). The amplifier mainly consists of folded cascode structure with current source as output loads and common-mode feedback circuits. The technique of feedforward compensation is used in order to improve the settling time and gain bandwidth (GBW) of this amplifier. This amplifier is integrated in 0.8 mm BiCMOS process with an active die area of 0.1 mm². The DC gain of this amplifier is 90 dB. The GBW and phase margin of this amplifier is 900 MHz and 47°, respectively. The power dissipation is minimized by using BiCMOS technology and is about 25 mW for 2 pF load capacitance. This level of performance is competitive with CMOS and BiCMOS operational amplifier circuits previously reported by nearly two orders of magnitude.Ecole Polytechnique of the University of Montreal     

A source degenerated LC quadrature VCO (SD-QVCO) using 0.18-μm SiGe BiCMOS

This letter presents a fully integrated BiCMOS quadrature voltage-controlled oscillator (QVCO). The QVCO consists of two nMOSFET cross-coupled oscillator stacked in series with source degenerated HBT transistors. SiGe HBT introduces low flicker noise compared to CMOS devices. To generate quadrature phase signals with strong coupling strength, the proposed design uses two MOS-coupled LC-tank cores instead of passive device-coupled cores. This source degeneration topology can improve the phase noise performance of the QVCO as compared to the sub-VCO. The proposed QVCO has been implemented with the TSMC 0.18 μm SiGe 3P6M BiCMOS process, can generate quadrature signals in the frequency range of 4.52–5.05 GHz with core power consumption of 5.76 mW at the dc bias of 1.8 V. At 4.53 GHz, phase noise at 1 MHz offset is ?124.52 dBc/Hz. The die area of the fabricated prototype is 0.453 × 0.898 mm².     

3.3-V BiCMOS circuit techniques for a 120-MHz RISC microprocessor

This paper describes 3.3-V BiCMOS circuit techniques for a 120-MHz RISC microprocessor. The processor is implemented in a 0.5-μm BiCMOS technology with 4-metal-layer structure. The chip includes a 240 MFLOPS fully pipelined 64-b floating point datapath, a 240-MIPS integer datapath, and 24 KB cache, and contains 2.8 million transistors. The processor executes up to four operations at 120 MHz and dissipates 17 W. Novel BiCMOS circuits, such as a 0.6-ns single-ended common base sense amplifier, a 0.46-ns 22-b comparator, and a 0.7-ns path logic adder are applied to the processor. The processor with the proposed BiCMOS circuits has a 11%-47% shorter delay time advantage over a CMOS microprocessor     

A sub-2.0 V BiCMOS logic circuit with a BiCMOS charge pump

A BiCMOS logic circuit with very small input capacitance has been developed, which operates at low supply voltages. A High-beta BiCMOS (Hβ-BiCMOS) gate circuit which fully utilizes the bipolar transistor features achieves 10 times the speed of a CMOS gate circuit with the same input capacitance and operating at 3.3 V supply voltage. In order to lower the minimum supply voltage of Hβ-BiCMOS, a BiCMOS circuit configuration using a charge pump to pull up the output high level of the BiCMOS gate circuit is proposed. By introducing a BiCMOS charge pump, Hβ-BiCMOS achieves very high speed operation at sub-2.0 V supply voltage. It has also been demonstrated that only a very small number of charge pump circuits are required to drive a large number of Hβ-BiCMOS gate circuits     

Circuit techniques for large CSEA SRAMs

The CMOS-storage emitter-access (CSEA) memory cell offers faster access than the MOS cells used in conventional BiCMOS SRAMs but using it in large memory arrays poses several problems. Novel BiCMOS circuit approaches to address the problems of decoding power, electronic noise, level translation, and write disturbance are described. Results on a 64-kb CSEA SRAM using these techniques are reported. The device, fabricated in an 0.8-μm BiCMOS technology, achieves read access and write pulse time of less than 4 ns while dissipating 1.7 W at a case temperature of 70°C     

Circuit and architecture trade-offs for high-speed multiplication

VLSI implementations of high-performance parallel multipliers are discussed. Circuit building blocks required for partial-product reduction are analyzed and two schemes leading to highly regular layouts are proposed. The circuit implementations related to the first-scheme in three different BiCMOS technologies are discussed. The die size and performance for nominal design rule values are compared, and the trend in scaling the feature sizes is studied. A silicon implementation of a prototype slice of an IEEE double-precision floating point multiplier in a 0.8-μm double-metal BiCMOS technology is presented     

A 1.5-ns 256-kb BiCMOS SRAM with 60-ps 11-K logic gates

A 1.5-ns address access time, 256-kb BiCMOS SRAM has been developed. To attain this ultra-high-speed access time, an emitter-coupled logic (ECL) word driver is used to access 6-T CMOS memory cells, eliminating the ECL-MOS level-shifter time delay. The RAM uses a low-power active pull down ECL decoder. The chip contains 11-K, 60-ps ECL circuit gates. It provides variable RAM configurations and general logic functions. RAM power consumption is 18 W; chip power consumption is 35 W. The chip is fabricated by using a 0.5-μm BiCMOS process. The memory cell size is 58 μm² and the chip size is 11×11 mm     

Smart Phased Array SoCs: A Novel Application for Advanced SiGe HBT BiCMOS Technology

As BiCMOS IC technology continues to advance in scaling and performance, new applications are continually enabled. One such concept is a smart phased array system on a chip (SoC). The combination of high-performance SiGe heterojunction bipolar transistor (HBT) bipolar devices, well-characterized RF/analog passive components, and dense CMOS digital technology provides the capability to create large multielement, electronically tunable phased arrays with onboard processing intelligence, inside a single die. This SoC will have superior characteristics of lower cost, weight, and size as compared to the large multichip, multitechnology, and multipackage systems in deployment today. Furthermore, using reconfigurable logic and embedded memory, this SoC has the advantage of dynamic software and digital signal processing engine updates, without expensive redesigns of the chip. This publication will describe the necessary ingredients to create such an SoC as well as relevant applications of smart phased arrays that require an SiGe HBT BiCMOS technology. Potential markets for this technology include communications systems, weather tracking, radio astronomy, automotive radar, cellular basestation capacity improvement, satellite and aerial resource imaging, ground-level airplane collision avoidance, as well as military tracking and guidance systems.     

A Sub-1-V Low-Noise Bandgap Voltage Reference

A new sub-1-V bandgap voltage reference is presented in this paper, which has advantages over the prior arts in terms of output noise and compatibility with several fabrication processes. The topology allows the reference to operate with a supply voltage as low as 1 V by employing the reverse bandgap voltage principle (RBVP). It also has an attractive low-noise output without the use of a large external filtering capacitor. The design was fabricated with a 0.5-mum BiCMOS process, but it is compatible with most CMOS and BiCMOS fabrication processes. The entire die area is approximately 0.4 mm², including all test pads and dummy devices. Theoretical analysis and experimental results show that the output noise spectral density is 40 nV/radicHz with a bias current of 20 muA. Moreover, the peak-to-peak output noise in the 0.1-10 Hz band is only 4 muV. The untrimmed reference has a mean output voltage of 190.9 mV at room temperature, and it has a temperature coefficient in the -40degC to +125degC range of 11 ppm/degC (mean) with a standard deviation of 5 ppm/degC.     

A Tail-Injected Divide-by-4 SiGe HBT Injection Locked Frequency Divider

This letter presents a silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) divide-by-4 injection locked frequency divider (ILFD). The ILFD is based on a single-stage voltage-controlled oscillator with active-inductor, and was fabricated in the 0.35 mu m SiGe 3P3M BiCMOS technology. The divide-by-4 function is performed by injecting a signal to the base of the tail HBT. Measurement results show that when the supply voltage V_DD is 3.1 V and the tuning voltage is tuned from 2.0 to 2.8 V, the divider free-running oscillation frequency is tunable from 2.12 to 2.76 GHz, and at the incident power of 0 dBm the operation range is about 1.15 GHz, from the incident frequency 8.55 to 9.7 GHz. The die area is 0.65 times 0.435 mm².     

An ADSL-RT full-rate analog front end IC with integrated linedriver

An analog front end IC for ADSL systems compliant with ANSI, ITU, and ETSI standards is presented. The IC contains all analog functions on one silicon die, including programmable gain amplifiers, highly linear continuous-time filters, 14-bit DAC and ADC for up to 1.1-MHz signal bandwidth, digitally controlled crystal oscillator, and a line driver capable of delivering +13 dBm to the line. The IC has been fabricated in a mixed-signal 0.6-μm DPTM BiCMOS technology with a chip area of 29 mm² and a power consumption of only 800 mW, using 3.3-V supply for all blocks, except 12-V supply for the line driver. The high level of integration together with the low power consumption can be considered a benchmark for full-rate ADSL analog front end ICs     

A 2.4-GHz SiGe HBT power amplifier with bias current controlling circuit

A 2.4-GHz SiGe HBT power amplifier (PA) with a novel bias current controlling circuit has been realized in IBM 0.35-μm SiGe BiCMOS technology, BiCMOS5PAe. The bias circuit switches the quiescent current to make the PA operate in a high or low power mode. Under a single supply voltage of 3.5 V, the two-stage mode-switchable power amplifier provides a PAE improvement up to 56.7% and 19.2% at an output power of 0 and 20 dBm, respectively, with a reduced quiescent current in the low power mode as compared to only operating the PA in the high power mode. The die size is only 1.32 × 1.37 mm2.     

A Monolithic High-Efficiency 2.4-GHz 20-dBm SiGe BiCMOS Envelope-Tracking OFDM Power Amplifier

A monolithic SiGe BiCMOS envelope-tracking power amplifier (PA) is demonstrated for 802.11g OFDM applications at 2.4 GHz. The 4-mm² die includes a high-efficiency high-precision envelope amplifier and a two-stage SiGe HBT PA for RF amplification. Off-chip digital predistortion is employed to improve EVM performance. The two-stage amplifier exhibits 12-dB gain, <5% EVM, 20-dBm OFDM output power, and an overall efficiency (including the envelope amplifier) of 28%.