Influence of additional UV-light illumination on preparation of TiN by ion beam assisted deposition

Titanium nitride films were prepared by a newly developed photon and ion beam assisted deposition system at room temperature. Titanium was deposited on Si(111) in a controlled nitrogen environment and simultaneously bombarded with low-energy N ions or illuminated with UV-light. The influence of UV-light illumination during deposition is compared with the influence of ion bombardment on film properties like structure, topography and composition, measured by XRD, AFM and ERD, respectively. The results demonstrate that photon assisted deposition (PHAD) is also a good method to modify film characteristics like ion beam assisted deposition (IBAD).     

Positron annihilation and X-ray diffraction studies on tin oxide thin films

Positron annihilation spectroscopy along with glancing incidence X-ray diffraction have been used to investigate tin oxide thin films grown on Si by pulsed laser deposition. The films were prepared at room temperature and at 670 K under oxygen partial pressure. As-grown samples are amorphous and are found to contain large concentration of open volume sites (vacancy defects). Post-deposition annealing of as-grown samples at 970 K is found to drastically reduce the number of open volume sites and the film becomes crystalline. However, film grown under elevated temperature and under partial pressure of oxygen is found to exhibit a lower S-parameter, indicating lower defect concentration. Based on the analysis of experimental positron annihilation results, the defect-sensitive S-parameter and the overlayer thickness of tin oxide thin films are deduced. S-W correlation plots exhibit distinct positron trapping defect states in three samples.     

The low temperature growth of stable p-type ZnO films in HiPIMS

In this study,the influence of substrate temperature on properties of A1-N co-doped p-type ZnO films is explored.Benefitting from the high ionization rate in high-power impulsed magnetron sputtering,the concentration of ionized nitrogen N+ and ionized zinc Zn+ were increased,which promoted the formation of ZnO films and lowered the necessary substrate temperature.After optimization,a co-doped p-type ZnO thin film with a resistivity lower than 0.35 Ω cm and a hole concentration higher than 5.34 × 1018 cm-3 is grown at 280 ℃.X-ray diffraction results confirm that A1-N co-doping does not destruct the ZnO wurtzite structure.X-ray photoelectron spectroscopy demonstrates that the presence of A1 promotes the formation of acceptor (No)defects in ZnO films,and ensures the role of A1 in stabilizing p-type ZnO.     

离子束辅助沉积(IVD)方法制备Ag/Si薄膜

离子束辅助沉积(以下简称IVD)方法是将离子束技术与真空沉积薄膜技术相结合的一种新的制膜方法。它具有沉积速率高、薄膜吸附强度大、薄膜外延温度低并能消除膜应力等优点。因此,近年来在国际上受到重视和发展。     

C—N多晶的离子束合成及分析

介绍了用离子束合成法研制新型材料β－Ｃ３Ｎ４的条件及过程，用ＲＢＳ、ＸＲＤ等手段分析研究该方法生成物的配比、结构和物相，观察到ＣＮ化合物多晶。     

Reactive DC Magnetron Sputter Deposited Titanium-Copper-Nitrogen Nano-Composite Thin Films with an Argon/Nitrogen Gas Mixture

A sintered Ti13Cu87 target was sputtered by reactive direct current (DC) magnetron sputtering with a gas mixture of argon/nitrogen for different sputtering powers. Titanium-copper-nitrogen thin films were deposited on Si (111), glass slide and potassium bromide (KBr) substrates. Phase analysis and structural properties of titanium-copper-nitrogen thin films were studied by X-ray diffraction (XRD). The chemical bonding was characterized by Fourier transform infrared (FTIR) spectroscopy. The results from XRD show that the observed phases are nano-crystallite cubic anti rhenium oxide (anti ReO3) structures of titanium doped Cu3N (Ti:Cu3N) and nano-crystallite face centered cubic (fcc) structures of copper. Scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM/EDX) were used to determine the film morphology and atomic titanium/copper ratio, respectively. The films possess continuous and agglomerated structure with an atomic titanium/copper ratio ( 0.07) below that of the original target ( 0.15). The transmittance spectra of the composite films were measured in the range of 360 to 1100 nm. Film thickness, refractive index and extinction coefficient were extracted from the measured transmittance using a reverse engineering method. In the visible range, the higher absorption coefficient of the films prepared at lower sputtering power indicates more nitrification in comparison to those prepared at higher sputtering power. This is consistent with the formation of larger Ti:Cu3N crystallites at lower sputtering power. The deposition rate vs. sputtering power shows an abrupt transition from metallic mode to poisoned mode. A complicated behavior of the films’ resistivity upon sputtering power is shown.     

Phase structure of the CPD prepared CdS films before and after Ar^＋ ion irradiation

CdS films prepared with chemical pyrolysis deposition(CPD) at different temperature during film growth were characterized by XRD.Hexagon-like structrue appeared at the temperature of 350-500℃,while wurtzite phase was observed at temperature of 540℃ during film growth,Also CdS films prepared by CPD at 400℃ were undergone post annealing at different temperature of 200-600℃ or post Ar^ ion irradiation.It is found that wurtzite phase happened when the annealing temperature rose to 600℃.And hexagon-like structure existed at the annealing temperature from 25℃to near 500℃.Ar^ ion irradiation could not cause phase transformation,but induce some preferred orientations and an increase in grain size for the CdS films.     

衬底温度对蒸汽辅助沉积法制备钙钛矿薄膜微观结构的影响

通过调控薄膜生长衬底温度,提出了一种改良的蒸汽辅助沉积法制备有机-无机混合钙钛矿薄膜,可以更为可控优化薄膜生长条件。用同步辐射掠入射X射线衍射(Grazing Incidence X-ray Diffraction,GIXRD)结合扫描电镜(Scanning Electron Microscope,SEM)、紫外可见吸收谱(UV-Visible Absorption Spectrum)等表征方法证明衬底温度对制备的钙钛矿薄膜质量具有重要的作用:较低的衬底温度(约70?C)有助于钙钛矿晶粒的形成,其结晶性、晶面择优生长取向均较好,同时具有较高的光吸收性能;当衬底温度升高时(100?C、125?C),所制备的钙钛矿薄膜结晶性变弱,晶体择优生长取向明显变差,光吸收性能随之下降。研究结果有助于进一步优化蒸汽辅助沉积法制备钙钛矿薄膜工艺。     

Microwave Plasma Chemical Vapor Deposition of Diamond Films on Silicon From Ethanol and Hydrogen

Diamond films with very smooth surface and good optical quality have been deposited onto silicon substrate using microwave plasma chemical vapor deposition(MPCVD)from a gas mixture of ethanol and hydrogen at a low substrate temperature of 450℃.The effects of the substrate temperature on the diamond nucleation and the morphology of the diamond film have been investigated and observed with scanning electron microscopy(SEM).The microstructure and the phase of the film have been characterized using Raman spectroscopy and X-ray diffraction(XRD).The diamond nucleation density significantly decreases with the increasing of the substrate temperature.There are only sparse nuclei when the substrate temperature is higher than 800℃ although the ethanol concentration in hydrogen is very high.That the characteristic diamond peak in the Raman spectrum of a diamond film prepared at a low substrate temperature of 450℃ extends into broadban indicates that the film is of nanophase.No graphite peak appeared in the XRD pattern confirms that the film is mainly composed of SP^3 carbon.The diamond peak in the XRD pattern also broadens due to the nanocrystalline of the film.     

Deposition of polycrystalline Si thin films on glass substrates by direct negative Si ion beam deposition

Polycrystalline Si (Poly-Si) thin films were deposited on a glass substrate by direct negative Si (Si⁻) ion beam deposition. The glass substrate temperature was kept constant at 500 °C for all depositions. Prior to deposition, the ion energy spread and ion-to-atom arrival ratio were evaluated as a function of the ion beam energy.The Si⁻ ion energy spread was less than 10% regardless of the ion energy, while the ion-to-atom arrival ratio increased proportionally from 1.3 to 1.6 according to the ion beam energy.Atomic force microscopy images showed that a relatively rough surface was obtained at 50 eV of Si⁻ ion energy and it is also concluded that the Si⁻ ion beam irradiation at 50 eV is effective to deposit Si thin film with small grains as shown in Fig. 3.     

Ion-beam irradiation effects on reactively sputtered CrN thin films

The present study deals with CrN/Si bilayers irradiated at room temperature (RT) with 120 keV Ar ions. The CrN layers were deposited by d.c. reactive sputtering on Si(1 0 0) wafers, at different nitrogen partial pressures (2 × 10⁻⁴, 3.5 × 10⁻⁴ and 5 × 10⁻⁴ mbar), to a total thickness of 240-280 nm. The substrates were held at room temperature (RT) or 150 °C during deposition. After deposition the CrN/Si bilayers were irradiated up to fluences of 1 × 10¹⁵ and 1 × 10¹⁶ ions/cm². Structural characterization was performed with Rutherford backscattering spectroscopy (RBS), cross-sectional transmission electron microscopy (XTEM) and grazing angle X-ray diffraction (XRD). For the highest nitrogen pressure (5 × 10⁻⁴ mbar) a pure stoichiometric CrN phase was achieved. The results showed that Ar ion irradiation resulted in the variation of the lattice constants, micro-strain and mean grain size of the CrN layers. The observed microstructural changes are due to the formation of the high density damage region in the CrN thin film structure.     

单晶硅表面钝化层在低能电子辐照前后的SIMS和XPS分析

为了研究低能电子辐照对单晶硅器件表面钝化材料中产生的化学微结构的变化,在轻掺杂P型单晶硅基底上制作了三种表面钝化膜,分别是单一SiO₂钝化膜、SiO₂/Si₃N₄复合钝化膜、硼硅玻璃/Si₃N₄复合钝化膜,开展了表面钝化单晶硅在最大能量70 keV的加速器电子束下的辐照实验。样品在空气气氛下辐照6 h,用二次离子质谱(SIMS)测试了辐照前后三种表面钝化膜中Si、N、B的纵深变化,同时用Ar离子刻蚀X射线表面光电子能谱(XPS)对Si元素的化学结合状态进行测试分析。结果表明:对单一SiO₂钝化的轻掺杂P型材料,辐照在SiO₂/Si界面产生明显的材料结构变化,界面附近的SiO₂不再是完整化学计量比,而是SiO_x(x<2);对SiO₂/Si₃N₄复合钝化的轻掺杂P型材料,辐照对SiO₂     

衬底材料及基底温度对Sc膜形貌、结构的影响

在不同基底温度下,用电子束蒸镀法在未抛光Mo、抛光Mo及Si〈111〉基片上制备了Sc膜,并用XRD、SEM及AFM对薄膜的微观结构和表面形貌进行了分析测试。结果表明：衬底材料、基底温度对Sc膜结构、形貌的影响极大。物相结构相同的Mo基底,抛光Mo上的Sc膜表面较平整,倾向于混合生长;而粗糙Mo基底上Sc膜凸凹不平,为岛状生长。提高基底温度有利于抛光Mo基底上Sc膜的(002)方向择优生长,但高温时会导致Si基底上膜表面的物相由单质Sc变为ScSi化合物,作为吸氢材料,ScSi化合物的形成不利于吸氢,应尽量避免其生成。     

Sheet Resistance and Gas-Sensing Properties of Tin Oxide ThinFilms by Plasma Enhanced Chemical Vapor Deposition＊

Tin oxide (SnO2) thin films are prepared at different temperatures by plasmaenhanced chemical vapor deposition (PECVD). The structural characterizations of the films are investigated by various analysis techniques. X-ray diffraction patterns (XRD) show that the phase of SnO2 films are different at different deposition temperatures. The sheet resistance of the films decreases with increase of deposition temperature. X-ray photoelectron spectroscopy (XPS) shows that the SnO2 thin film is non-stoichiometric. The sheet resistance increases with increase in oxygen flow. Sb-doped SnO2 thin films are more sensitive to alcohol than carbon monoxide, and its maximum sensitivity is about 220％.     

基于单一气源的PECVD方法制备SiC薄膜及其微观结构研究

为制备出满足惯性约束聚变（ICF）实验要求的SiC薄膜,本文采用等离子体增强化学气相沉积（PECVD）法,以四甲基硅（TMS）作为唯一反应气源,在不同工作压强下制备SiC薄膜。利用扫描电子显微镜、表面轮廓仪、原子力显微镜、精密电子天平、X射线光电子能谱、傅里叶变换红外光谱对薄膜进行表征与分析。结果表明：SiC薄膜的成分与工作压强密切相关,随着工作压强的增加,薄膜中Si含量整体呈下降趋势;随着工作压强的增加,薄膜沉积速率先增大后减少,密度先减小后增大;与其他制备工艺相比,采用单一气源制备SiC薄膜,其表面粗糙度极低（1.25～1.85 nm）,薄膜粗糙度随工作压强的增加呈先增大后减小的趋势。     

Determination of stoichiometry in silicon carbide materials using elastic backscattering spectrometry

Elastic backscattering spectrometry (EBS) was performed on SiC materials, using ⁴He particles at energies ranging from 2 to 4 MeV, in order to establish the energy values that lead to an accurate measurement of the Si/C ratio. Analysis of the random yield of “bulk” SiC single crystals indicates that energy values of 3.25 and 3.75 MeV are the most suitable for chemical composition determination; backscattering yield of carbon is enhanced compared to the yield measured at 2 MeV, while the excitation of strong resonances above 3.75 MeV are suppressed. Random backscattering yield measurements were then carried out at an energy of 3.25 MeV on unhydrogenated SiC thin films grown on Si(1 0 0), by pulsed laser deposition, at different substrate temperatures. The Si and C atomic concentrations in the films were determined with an uncertainty of 1% and little interference from the underlying substrate. The films were found to be stoichiometric with a Si/C ratio of 1.03 ± 0.05, independent of deposition temperature, which indicates that the films were grown under congruent ablation conditions. The analysis proved to be applicable to both amorphous and crystalline SiC layers, as confirmed by the results obtained for films deposited at 400 and 950 °C, respectively.     

Physical Properties of Titanium Oxide Thin Films Prepared by DC Magnetron Sputtering: Influence Substrate Temperature and O2/Ar in the Gas Mixture

Titanium oxide thin film compounds were grown on p-type Si (100) and BK7 glass as substrate using reactive DC magnetron sputtering. The effect of temperature growth on structural, optical and morphological properties was investigated. By means of X-ray diffraction (XRD) the phase composition was characterized. UV–Vis-NIR spectroscopy was used for reflection and transmission measurements of deposited thin film layers. Atomic force microscopy was used to evaluate and compute the surface roughness changes for different temperatures growth. The XRD results show that the temperature growth effects on the phase formation and structure. Increasing the substrate growth temperature would result in change of film thickness due to different phase and structure formation. The calculated band gap from optical measurements of the thin films shows a decrease at higher substrate temperature growth.     

离子束辅助沉积制备TiN/Si3N4纳米超硬膜的工艺研究

采用离子束辅助沉积法(Ion beam assisted deposition,IBAD)在单晶硅片上进行沉积制备了TiN/Si3N4纳米复合超硬薄膜;研究了辅助束流、轰击能量和Ti:Si靶面积比等工艺参数对TiN/Si3N4超硬纳米复合薄膜性能的影响.此外采用纳米硬度计、光电子能谱(X-ray photoelectron spectrum,XPS)和x射线衍射分析(X-raydiffraction,XRD)方法研究了纳米复合薄膜的性能、成分与组织结构;采用原子力显微镜(Atomic forcemicroscopy,AFM)分析了薄膜的表面形貌,并初步探讨了TiN/Si3N4纳米复合超硬薄膜的生长机理.     

基于高温抗辐照SOI CMOS工艺的器件特性研究

绝缘体上硅（SOI）技术因其独特的优势而广泛应用于辐射和高温环境中,研究不同顶层硅膜厚度（tSi）的器件特性,对进一步提升高温抗辐照SOI CMOS器件的性能至关重要。本工作首先通过工艺级仿真构建了N沟道金属氧化物半导体场效应晶体管（NMOSFET）的模型,并对其进行了分析,基于仿真结果,采用015 μm抗辐照SOI CMOS工艺制备出具有不同硅膜厚度的实际器件,该工艺针对高温应用引入了设计与材料的优化。结果表明,薄硅膜和厚硅膜NMOSFET在150 krad(Si) 总剂量辐射下表现出相近的抗辐照加固性能,而前者在225 ℃高温下具有较小的漏电流,因此具有较薄硅膜的NMOSFET更适用于高温电子器件的制造。     

高温超导外延薄膜YBα_2Cu_3O_(7-x)中空位型缺陷的低能正电子寿命研究

利用脉冲低能正电子束系统测量了脉冲激光沉积法、磁控溅射法和多源共蒸法制备的高温超导外延薄膜ＹＢａ２Ｃｕ３Ｏ７－ｘ的低能正电子寿命谱。结果表明。除块材中普遍存在的正电子浅捕获中心外，还大量含有块材中缺乏的正电子探捕获中心，并且其尺度随温度的降低而长大。脉冲激光沉积法制备高温超导外延薄膜ＹＢａ２Ｃｕ３Ｏ７－ｘ的正电子寿命和沉积条件（衬底温度及空气分压）的关系研究表明，这种深捕获缺陷的种类与沉积条件无关，而缺陷浓度随衬底温度的降低及空气分压增高而增加