高速铣削中切削力的研究

在高速铣削试验的基础上，研究高速切削时切削速度对切削力的影响。结果表明，在切削速度较低的情况下，切削力随切削转速的增加而增大，但达到某一临界速度后，随着切削速度继续增大，剪切角增大，造成切向切削分力下降。不同刀具材料与工件材料的匹配在不同切削条件下有不同的临界切削速度。     

超精密切削氟化钙单晶金刚石刀具磨损研究

为了研究氟化钙（CaF2）单晶超精密切削过程中的金刚石刀具磨损及其对切削过程的影响,对CaF2晶体进行了超精密切削实验,系统观测了刀具磨损形貌随切削路程的变化趋势,分析了刀具磨损机理,同时通过分析不同切削路程下切削表面微观形貌和切削力的变化,对刀具磨损与切削模式之间的关系进行了探讨。研究表明,超精密切削CaF2晶体时刀具磨损模式为沟槽磨损和缺口破损,刀具磨损随切削路程的演变过程为后刀面沟槽磨损扩展到前刀面缺口破损,同时相应的切削模式由延性去除转变为脆性去除。该研究结果为大口径CaF2晶体纳米尺度延性域切削提供了技术支持。     

高比重钨合金超声椭圆振动切削去除机理研究

高比重钨合金作为一种难加工金属材料,其应用范围一直受限于其超精密加工水平。超声椭圆振动切削技术在高比重钨合金超精密切削加工中极具应用前景,通过切削去除机理研究,可推动其在高比重钨合金超精密切削领域中的应用。因此,首先对超声椭圆振动切削轨迹进行分析,结合瞬时剪切角变化,建立了超声椭圆振动切削弯矩及切削力模型,并基于上述模型,通过与常规车削相对比,对超声椭圆振动切削特性进行分析。然后,采用单晶金刚石刀具,进行高比重钨合金超声椭圆振动划擦实验和切削实验,并通过SEM、白光共聚焦显微镜、X射线残余应力分析仪等设备对材料塑脆特性、切屑厚度、切削表面残余应力及切削表面加工损伤等进行检测与分析。理论分析与切削实验表明,与常规车削相比,超声椭圆振动切削下材料去除尺度由微米量级减小为纳米量级,高比重钨合金表现出更强的塑性;随着剪切角变化,超声椭圆振动切削在材料去除过程中,会产生更大的向下的分力,在切削表面留下更大的残余应力;超声椭圆振动切削下,切削方向与材料断裂方向更为一致,结合锋利的单晶金刚石刀具,有利于实现高比重钨合金超精密切削。     

基于有限元法分析超精密切削中的摩擦问题

基于更新的拉格朗日公式,建立了热-机械耦合的平面应变大变形正交切削模型.根据此模型,对金刚石车削过程中的摩擦问题进行了仿真研究.对两种摩擦模型仿真所得的切削力与实验数据进行了比较,验证了前刀面上的摩擦状态应是粘结-滑移摩擦同时存在,并研究了刀具摩擦系数各向异性对超精密切削中切屑变形、切削力、剪切角的影响.     

切削深度对超精密切削过程影响的有限元分析

基于大变形有限元理论和更新的拉格朗日方程式 ,建立了热耦合的平面应变正交切削有限元仿真模型。采用通用的商业非线性有限元软件 ,对无氧铜超精密切削加工过程进行了仿真 ,研究超精密切削过程中切削深度对切削力、残余应力、等效应力、等效应变和切削温度的影响。通过对超精密切削有限元仿真结果的分析 ,可以优选出合理的切削参数。     

SPDT超精密切削时切削变形与切削力的研究

研究了超精密切削时，单晶金刚石刀具与工件间的摩擦系数、刀具锋锐度、切削厚度等对切削变形系数、切削力及加工表面质量的影响。作者认为在超精密切削时，要提烹加工表面质量，优选金刚石刀具的晶面方向、提高金刚石刀具的锋锐度是十分重要的，在超精密切削单晶材料时，工件晶面的选择也是十分重要的。     

基于刀具跳动的环形铣刀切削厚度模型的切削力计算

数控铣削过程中,切削变形引起的瞬时切削厚度是影响铣削加工切削力建模的重要参数之一,针对环形铣刀的切削特点,在考虑刀具跳动的情况下,对真实刀刃轨迹运动进行分析。将微细铣削的加工过程用宏观铣削来表示,从而建立了基于宏观铣削过程中刀具跳动下精密加工的瞬时切削厚度。通过仿真模拟和切削力试验来预测切削力,预测结果和试验结果具有一致性,表明该模型可以更好的预测加工过程中的切削力。     

晶粒对多晶材料超精密切削影响的研究进展

多晶材料是一类广泛应用于超精密切削加工的工件材料。在超精密切削中,每转进给量、切削深度等工艺参数与多晶材料的平均晶粒尺寸接近,而不同晶粒之间的力学性能存在显著差异,因此晶粒对超精密切削加工过程有重要影响,甚至成为影响多晶材料超精密切削表面加工质量的关键因素。围绕该问题,针对多晶材料超精密切削加工中晶粒的影响进行综述。首先评述了晶粒对表面粗糙度影响的研究进展,重点介绍了晶界台阶现象及其影响因素;其次评述了晶粒对切削力影响的研究进展,分析了几种考虑晶粒影响的切削力模型;最后总结了超精密切削中控制晶粒影响的方法,并简要分析了相关领域的发展趋势。上述研究进展对提高多晶材料超精密切削的加工质量具有参考意义。     

基于斜角切削理论的钛合金螺旋铣孔切削力建模

通过分析螺旋铣孔的加工原理和计算加工过程中的运动向量,结合侧刃和底刃对切削力的影响,建立了螺旋铣孔过程的切削力解析模型。提出了基于斜角切削的切削力系数辨识方法,并根据斜角切削过程几何关系推导出摩擦角、剪切角、剪切应力的约束方程。开展切削力系数辨识试验和钛合金螺旋铣孔试验对仿真值进行验证,结果表明,切削力的仿真值与试验值误差较小,平均误差为9.55%,从而验证了斜角切削系数辨识方法的有效性和切削力模型的正确性。     

考虑后刀面磨损条件下的正交切削模型分析

在试验研究基础上进行了有后刀面磨损的正交切削模型分析。经过正交切削试验及理论分析,发现后刀面磨损无论是定性上还是定量上都不影响刀具基本切削或剪切过程,即不改变剪切角和摩擦角,但是在磨损区的摩擦力及整个切削力都会增加。充分利用剪切区分析理论,确定了剪切区的切削力、后刀面磨擦力和后刀面磨损量的对应关系,从而建立了在后刀面磨损情况下的切削力模型。     

EFFECT OF CRYSTALLOGRAPHIC ORIENTATION ON CUTTING FORCES AND SURFACE FINISH IN DUCTILE CUTTING OF KDP CRYSTALS

In order to investigate the influence of material anisotropy in ductile cutting of Potassium Dihydrogen Phosphate (KDP) crystals, experiments of face cutting of (001) plane of KDP crystals are carried out by using an ultra-precision lathe with a single point diamond tool. The cutting forces, surface finish, and surface roughness in all crystallographic orientations of the machined surface are measured, and a power spectrum analysis method is used to reveal the cutting force patterns. The experimental results show that the cutting forces and surface roughness vary greatly with different crystallographic orientations of KDP crystal, and that amplitude variation of cutting forces and surface finish is closely related with the cutting parameter of the maximum undeformed chip thickness. With the maximum undeformed chip thickness below 30 nm, the amplitude variation of cutting force and surface finish is minimized, and a super-smooth surface with consistent surface finish in all the crystallographic orientations can be achieved. The surface roughness is 2.698 nm (Ra) measured by Atomic Force Microscope (AFM). These findings provide criteria for achieving a large-scale KDP crystal with consistent super-smooth surface using ductile cutting technology.     

A dynamic surface topography model for the prediction of nano-surface generation in ultra-precision machining

Materials induced vibration has its origin in the variation of micro-cutting forces caused by the changing crystallographic orientation of the material being cut. It is a kind of self-excited vibration which is inherent in a cutting system for crystalline materials. The captioned vibration results in a local variation of surface roughness of a diamond turned surface. In this paper, a dynamic surface topography model is proposed to predict the materials induced vibration and its effect on the surface generation in ultra-precision machining. The model takes into account the effect of machining parameters, the tool geometry, the relative tool–work motion as well as the crystallographic orientation of the materials being cut. A series of cutting experiments was performed to verify the performance of the model and good correlation has been found between the experimental and simulation results.     

A Taylor-based plasticity model for orthogonal machining of single-crystal FCC materials including frictional effects

The purpose of this study is to explain the experimentally observed variations in cutting parameters during the machining of single-crystal materials. Fundamental relationships between crystal plasticity and machining are developed. The workpiece anisotropy stem from crystallographic differences are explained with a rate-insensitive Taylor plasticity model. A brief discussion of the applicability of Schmid-based models to machining processes is also presented. The periodic variations with changing crystal orientations observed in experimental studies are explained with the results of the proposed model for machining. The friction between the rake face of the tool and the material is introduced to the existing model. The applicability of concepts like Texture Softening Factor and Effective Taylor Factor in previous works are discussed. The specific energy of cutting is related to Taylor factor for better understanding of crystallographic effects.     

Crystal anisotropy-dependent shear angle variation in orthogonal cutting of single crystalline copper

Shear deformation that dominates elementary chip formation in metal cutting greatly relies on crystal anisotropy. In the present work we investigate the influence of crystallographic orientation on shear angle in ultra-precision orthogonal diamond cutting of single crystalline copper by joint crystal plasticity finite element simulations and in-situ experiments integrated in scanning electron microscope. In particular, the experimental cutting conditions including a straight cutting edge are the same with that used in the 2D finite element simulations. Both simulations and experiments demonstrate a well agreement in chip profile and shear angle, as well as their dependence on crystallography. A series of finite element simulations of orthogonal cutting along different cutting directions for a specific crystallographic orientation are further performed, and predicated values of shear angle are used to calibrate an extended analytical model of shear angle based on the Ernst–Merchant relationship.     

A MODEL-BASED ANALYSIS OF ORTHOGONAL CUTTING FOR SINGLE-CRYSTAL FCC METALS INCLUDING CRYSTALLOGRAPHIC ANISOTROPY

The anisotropy of workpiece crystals becomes prominent as the uncut chip thickness approaches to the grain size of the workpiece material. As such, in mechanical micromachining, precision machining, and diamond turning operations, the cutting forces exhibit significant variations with crystallographic orientations. In this work, a crystal-plasticity based model is used to analyze the effects of cutting geometry, friction and crystallographic anisotropy when machining face-centered cubic (fcc) single-crystals using ideally sharp cutting edges. The model adapts and combines Bishop and Hill's crystal plasticity theory with Merchant's machining force model. The total power, including the shearing and friction powers, is minimized over allowable shear angles to determine the shear angle solution and associated specific energies. The model is validated using data from the literature for both aluminum and copper single crystals; a good match is observed between the model predictions and experimental data, indicating the model's capability to capture crystallographic anisotropy and symmetry. The validated model is used to analyze the effects of rake angle, friction, and crystallographic orientation on specific energies and shear angles. Subsequently, a further simplification to the model is proposed through the use of Merchant's shear-angle formula.     

Anisotropy of machined surfaces involved in the ultra-precision turning of single-crystal silicon—a simulation and experimental study

A new method was proposed for simulating the anisotropic surface quality of machined single-crystal silicon. This represents the first time that not only the mechanical properties of silicon, but also the crystal orientation, which is closely linked to the turning process, have been given consideration. In this paper, the crystallographic relationship between machined crystal planes and slip planes involved in ultra-precision turning was analyzed. The elasticity, plasticity, and brittleness properties of silicon in different crystal orientations were calculated. Based on the brittle–ductile transition mechanism of ultra-precision turning of single-crystal silicon, the orientation dependence of the surface quality of (111), (110), and (100) crystal planes were investigated via computer simulation. According to the simulation results, the surface quality of all machined planes showed an obvious crystallographic orientation dependence while the (111) crystal plane displayed better machinability than the other planes. The anisotropic surface properties of the (111) plane resulted from the continuous change of the cutting direction, which causes a change of actual angle between the slip/cleavage plane and machined plane. Anisotropic surface properties of planes (100) and (110) result from anisotropy of mechanical properties and the continuous changes of the cutting direction, causing the actual angle between slip/cleavage plane and machined plane to change simultaneously. A series of cutting experiments were carried out on the (111) and (100) crystal planes to verify the simulation results. The experimental results showed that cutting force fluctuation features and surface roughness are consistent with the anisotropy characteristics of the machined surface as revealed in simulation studies.     

锗单晶的各向异性对单点金刚石切削的影响

锗单晶是一种各向异性材料,在切削的过程中,将使切削力随晶向和晶面发生变化。针对锗单晶各向异性对切削力的影响,在理论上计算出了切削力随不同晶面和晶向变化的波动范围,并且指出了最佳的切削方向。     

A study of the cutting performance of poly-crystalline oxygen free copper with single crystalline diamond micro-tools

A study was carried out to investigate the crystallographic effects on the performance of cutting poly-crystalline oxygen free copper C10200 (OFC) with single crystalline diamond (SCD) micro-tools. At both large cutting depth and cross-feed rate, as the micro-tool traversed a grain with a crystallographic orientation less favorable for a stable machining process, the work material in front of the rake face was found to be severely deformed. This may lead to a reduced shear angle, thick chip, striation at the back of the chip, high cutting forces, degraded machined surface and the possibility of burr formation. The results showed minimal variations in the machined surface integrity and cutting forces compared to cut amorphous NiP plating with micro-tools. For a high cutting depth, burrs were also observed due to material deformation and pile-up occurring at the groove edges since the localized stress probably built up in front of the rake face. Cutting strategies were demonstrated to improve the performance of cutting OFC with micro-tools and to generate high aspect ratio micro-pillar arrays.     

Effect of material anisotropy on shear angle prediction in metal cutting—a mesoplasticity approach

Material anisotropy plays an important role in the formation of shear angle in metal cutting. Crystallographic textures contribute to an important source of material anisotropy. A simplified mesoplasticity model is proposed in this paper to predict the effect of crystallographic orientations on the shear angle formation in machining a polycrystalline work material. The most likely shear angle is the one at which the Taylor factor is minimum. A good agreement is found between the predicted shear angle in machining a polycrystalline OFHC copper and the experimental data reported in the published literature. The assumptions made in the model approximate well the cutting conditions commonly encountered in single point diamond turning process.     

基于遗传算法工具箱的插铣切削力的预测模型

根据插铣核电材料A508-3钢各向最大切削力的正交实验数据,建立插铣过程的切削参数(切削速度、每齿进给量和径向切削宽度)各向最大切削力预测模型。把切削力预测值与实验值的残差平方和为适合度函数,采用谢菲尔大学研究的遗传算法工具箱实现各向最大切削力预测模型的各项参数。结果表明切削力预测模型与实验值吻合较好。本文目的是在特定插铣切削参数条件下预测切削力。